JP3296752B2 - Mounting method and mounting structure between boards - Google Patents
Mounting method and mounting structure between boardsInfo
- Publication number
- JP3296752B2 JP3296752B2 JP16073797A JP16073797A JP3296752B2 JP 3296752 B2 JP3296752 B2 JP 3296752B2 JP 16073797 A JP16073797 A JP 16073797A JP 16073797 A JP16073797 A JP 16073797A JP 3296752 B2 JP3296752 B2 JP 3296752B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding piece
- insertion hole
- narrow portion
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器等におい
て、回路基板どうしを略垂直に又は所定角度で取り付け
る方法及びその取付け構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching circuit boards to each other substantially vertically or at a predetermined angle in an electronic device and the like, and to an attachment structure thereof.
【０００２】[0002]
【従来の技術】電子機器において、回路基板の占有面積
を狭めるために、回路基板を積層したり、回路基板に対
して別の回路基板を立設することにより、回路基板を立
体的に構成することが従来から行なわれている。図８に
示すように、第１基板(１)に対して第２基板(２)を立設
した組立品には、両基板(１)(２)を電気的に接続するコ
ネクタ(４)と、第２基板(２)を保持する保持片(３)とが
配備される。該コネクタ(４)は、第１基板(１)と第２基
板(２)を電気的に接続するリード線群(40)を具える。ま
た、保持片(３)は、強度の点からブリキ等の金属材料が
一般に使用される。前記組立品の組立てに際して、図７
に示すように、第２基板(２)にコネクタ(４)および保持
片(３)が配備され、コネクタ(４)のリード線群(40)およ
び保持片(３)の下端(７)は、第２基板(２)から下方へ突
出している。また、保持片(３)が第１基板(１)から抜け
出ることを防止するために、保持片(３)の下端(７)には
抜止め爪(70)が突設されている。一方、第１基板(１)に
は、コネクタ(４)のリード線群(40)と嵌合する受け孔群
(11)と、保持片(３)の下端(７)が差し込まれる差込み孔
(15)とが形成される。2. Description of the Related Art In electronic equipment, a circuit board is three-dimensionally formed by stacking circuit boards or placing another circuit board on the circuit board in order to reduce the area occupied by the circuit board. This has been done in the past. As shown in FIG. 8, a connector (4) for electrically connecting both substrates (1) and (2) is provided in an assembly in which the second substrate (2) is erected on the first substrate (1). And a holding piece (3) for holding the second substrate (2). The connector (4) includes a lead wire group (40) for electrically connecting the first board (1) and the second board (2). The holding piece (3) is generally made of a metal material such as tinplate from the viewpoint of strength. When assembling the assembly, FIG.
As shown in the figure, the connector (4) and the holding piece (3) are provided on the second substrate (2), and the lead wire group (40) of the connector (4) and the lower end (7) of the holding piece (3) are It protrudes downward from the second substrate (2). In order to prevent the holding piece (3) from coming off the first substrate (1), a retaining claw (70) is protrudingly provided at the lower end (7) of the holding piece (3). On the other hand, the first substrate (1) has a group of receiving holes to be fitted with the group of lead wires (40) of the connector (4).
(11) and the insertion hole into which the lower end (7) of the holding piece (3) is inserted
(15) is formed.
【０００３】第２基板(２)を第１基板(１)に立設するた
めに、第２基板(２)のコネクタ(４)のリード線群(40)が
第１基板(１)の受け孔群(11)に挿入されるとき、保持片
(３)の下端(７)または抜止め爪(70)は、撓みながら差込
み孔(15)に挿入され、下端(７)または抜止め爪(70)の弾
性復帰により、図８および図９のように、抜止め爪(70)
が第１基板(１)の裏面を押さえて固定され、保持片(３)
により、第２基板(２)の第１基板(１)への立設が保持さ
れる。そして、図９のように、第１基板(１)の裏面から
突出したリード線群(40)が、ディップ半田付けにより第
１基板(１)と電気的に接続される。In order to erect the second board (2) on the first board (1), the lead wire group (40) of the connector (4) of the second board (2) is received by the first board (1). When inserted into hole group (11),
The lower end (7) or the retaining claw (70) of (3) is inserted into the insertion hole (15) while flexing, and the lower end (7) or the retaining claw (70) is elastically restored, so that the lower end (7) or the retaining claw (70) of FIGS. Like, retaining claw (70)
Is fixed by pressing the back surface of the first substrate (1), and the holding piece (3)
Thus, the standing of the second substrate (2) on the first substrate (1) is maintained. Then, as shown in FIG. 9, a lead wire group (40) projecting from the back surface of the first substrate (1) is electrically connected to the first substrate (1) by dip soldering.
【０００４】[0004]
【発明が解決しようとする課題】一般に、抜止め爪(70)
は、図７および図９に示すように、金型の曲げ工程にお
いて、下端(７)から切り起こされることにより形成され
ている。従って、図１０に示すように、保持片(３)の下
端(７)において、基端から抜止め爪(70)の先端までの高
さＡは、抜止め爪(70)を切り起こす角度αによって決ま
るので、寸法が出し難い。よって、抜止め爪(70)は、第
１基板(１)からの抜出を防止できても、第２基板(２)を
十分には固定できない。従って、第２基板(２)に外部負
荷が更に加わると、抜止め爪(70)が変形して、第２基板
(２)の揺れが更に大きくなる。この揺れにより、コネク
タ(４)のリード線群(40)を第１基板(１)に固定していた
ディップ半田(50)が、第１基板(１)またはリード線群(4
0)から剥離して、接触不良を起こすことになる。このた
め、従来は、図９に示すように、保持片(３)の下端(７)
と第１基板(１)とをこて半田付けにより固定していた。
しかしながら、保持片(３)の下端(７)と第１基板(１)を
結合するこて半田(51)は、除去が難しく、例えば修理等
のために、第２基板(２)を第１基板(１)から取り外すこ
とが困難となり、例えば第２基板(２)の故障等のため
に、第２基板(２)を交換することが困難となる。本発明
は、こて半田付けを行なうことなく、第１基板に保持片
を十分に固定でき、且つ、修理、故障等の際のサービス
性を向上できる取付け方法および取付け構造を提供する
ことを目的とする。Generally, a retaining claw (70)
Is formed by being cut and raised from the lower end (7) in the mold bending step, as shown in FIGS. Therefore, as shown in FIG. 10, at the lower end (7) of the holding piece (3), the height A from the base end to the tip of the retaining claw (70) is the angle α at which the retaining claw (70) is cut. It is difficult to get the dimensions because it is determined by Therefore, even if the retaining claws (70) can prevent the removal from the first substrate (1), they cannot sufficiently fix the second substrate (2). Therefore, when an external load is further applied to the second substrate (2), the retaining claw (70) is deformed and the second substrate (2) is deformed.
The swing of (2) is further increased. Due to this shaking, the dip solder (50) that fixed the lead wire group (40) of the connector (4) to the first substrate (1) is changed to the first substrate (1) or the lead wire group (4).
0), resulting in poor contact. Therefore, conventionally, as shown in FIG. 9, the lower end (7) of the holding piece (3)
And the first substrate (1) are fixed by soldering.
However, the solder (51) connecting the lower end (7) of the holding piece (3) and the first substrate (1) is difficult to remove. It becomes difficult to remove the second substrate (2) from the substrate (1), and it becomes difficult to replace the second substrate (2) due to, for example, a failure of the second substrate (2). SUMMARY OF THE INVENTION An object of the present invention is to provide a mounting method and a mounting structure capable of sufficiently fixing a holding piece to a first substrate without soldering, and improving serviceability in the case of repair or failure. And
【０００５】[0005]
【課題を解決するための手段】本発明では、保持片の下
端側縁に、第１基板に差し込む際の第１基板と平行な方
向に切込みを開設して、保持片の幅狭部が形成される。
該切込みは、第１基板の厚さに等しいか又は稍広い高さ
となるように形成される。また、第１基板において、保
持片が差し込まれる差込み孔は、保持片の先端が嵌まる
幅広部Ｗ1と、保持片の幅狭部が嵌まる幅狭部Ｗ2とが並
んで連続した形状に開設される。第２基板を第１基板に
立設するために、第２基板のコネクタのリード線群を第
１基板の受け孔群に挿入する際には、保持片の先端を、
差込み孔(10)の幅狭部Ｗ2から幅広部Ｗ1側へ撓ませなが
ら、差込み孔の幅広部Ｗ1に嵌め、保持片の弾性復帰に
より、保持片の幅狭部が差込み孔の幅狭部Ｗ2に嵌めら
れる。According to the present invention, a notch is formed at a lower end side edge of the holding piece in a direction parallel to the first substrate when inserted into the first substrate to form a narrow portion of the holding piece. Is done.
The cut is formed to have a height equal to or slightly larger than the thickness of the first substrate. In the first substrate, the insertion hole into which the holding piece is inserted is formed in a continuous shape in which a wide portion W1 where the tip of the holding piece fits and a narrow portion W2 where the narrow portion of the holding piece fits. Is done. When inserting the lead wire group of the connector of the second board into the receiving hole group of the first board so as to erect the second board on the first board, the tip of the holding piece is
While being bent from the narrow portion W2 of the insertion hole (10) to the wide portion W1 side, it is fitted into the wide portion W1 of the insertion hole, and the elastic portion of the holding piece returns the narrow portion of the holding piece to the narrow portion W2 of the insertion hole. It is fitted to.
【０００６】[0006]
【作用及び効果】第１基板に嵌合する保持片の切込み
は、切起しによる抜止め爪に比べて、寸法が出し易く且
つ変形し難い。従って、保持片の幅狭部が差込み孔の幅
狭部Ｗ2に嵌合することにより、第１基板に保持片を容
易に固定できる。その結果、こて半田付けにて第１基板
に保持片を結合する必要は無くなり、第２基板の取外し
や交換が容易に行なうことができ、サービス性が向上す
る。[Operation and Effect] The cut of the holding piece to be fitted to the first substrate is more easily dimensioned and is less likely to be deformed than a retaining claw formed by cutting and raising. Therefore, the holding piece can be easily fixed to the first substrate by fitting the narrow part of the holding piece into the narrow part W2 of the insertion hole. As a result, it is not necessary to bond the holding piece to the first substrate by soldering, and the second substrate can be easily removed or replaced, thereby improving serviceability.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施形態について
説明する。図１に示すように、第１基板(１)に第２基板
(２)を垂直に立設した本実施形態の組立品には、両基板
(１)(２)を電気的に接続するコネクタ(４)と、第２基板
(２)を保持する保持片(３)とが配備される。第２基板
(２)は、コネクタ(４)および保持片(３)を予め取り付け
てから、第１基板(１)に立設される。コネクタ(４)は、
第１基板(１)に第２基板(２)を垂直に固定するための角
状部材(41)と、該角状部材から両側に突出し、長手方向
に並んだリード線群(40)(42)とを具える。保持片(３)
は、基部(30)と、該基部(30)の中央から突出し、下方へ
伸びて、下端(６)が第１基板(１)に差し込まれる脚部(3
1)と、基部(30)の両側部から、脚部(31)とは反対向きに
突出し、第２基板(２)に差し込まれる突出部(32)(32)と
からなる。前記保持片(３)は、ブリキ等の金属板の打抜
きと曲げ加工により一体に成形される。また、保持片
(３)は、第１基板(１)に第２基板(２)を固定するための
ものであるから、本実施形態では、第１基板(１)および
第２基板(２)と垂直な方向に配備される。脚部(31)の下
端(６)には、一方の側縁から、第１基板(１)に差し込む
際の第１基板(１)と平行な方向に切込み(62)が開設さ
れ、幅狭部(60)が形成される。本実施形態では、第１基
板(１)に第２基板(２)を垂直に立設するから、該切込み
（６２）は、下端（６)の一方の側縁から、差込み方向
と直交する方向に開設されることになる。切込み(62)
は、第１基板(１)の厚さｔ1に等しいか又は稍広い高さ
となるように形成される。また、脚部(31)の幅狭部(60)
の下方には案内斜面(61)が形成される。該案内斜面(61)
の屈曲方向は、脚部(31)が撓むことのできる方向であ
り、保持片(３)は、上述のように、第２基板(２)に垂直
な方向に取り付けられるから、該屈曲方向は、第２基板
(２)に平行な方向となる。突出部(32)(32)は、第２基板
(２)から抜け出ることを防止するために、突起(33)(33)
が形成される。突起(33)(33)は、基部(30)から、第２基
板(２)の厚さｔ2よりも稍離れた位置に形成される。Embodiments of the present invention will be described below. As shown in FIG. 1, the first substrate (1) has the second substrate
The assembled product of this embodiment in which (2) is vertically set includes both substrates.
(1) Connector (4) for electrically connecting (2) and second board
A holding piece (3) for holding (2) is provided. Second substrate
(2) is set up on the first substrate (1) after attaching the connector (4) and the holding piece (3) in advance. Connector (4)
An angular member (41) for vertically fixing the second substrate (2) to the first substrate (1), and a group of lead wires (40) (42) protruding from both sides of the angular member and arranged in the longitudinal direction. ). Holding piece (3)
Is a base (30) and a leg (3) projecting from the center of the base (30), extending downward, and having a lower end (6) inserted into the first substrate (1).
1) and projections (32) and (32) projecting from both sides of the base (30) in the opposite direction to the legs (31) and inserted into the second substrate (2). The holding piece (3) is integrally formed by punching and bending a metal plate such as a tin plate. Also, holding pieces
Since (3) is for fixing the second substrate (2) to the first substrate (1), in the present embodiment, the direction perpendicular to the first substrate (1) and the second substrate (2) is used. Deployed to. At the lower end (6) of the leg (31), a cut (62) is made from one side edge in a direction parallel to the first substrate (1) when inserted into the first substrate (1), and has a narrow width. A part (60) is formed. In the present embodiment, since the second substrate (2) is vertically erected on the first substrate (1), the cut (62) is formed from one side edge of the lower end (6) in a direction perpendicular to the insertion direction. It will be established in. Cut (62)
Is formed to have a height equal to or slightly wider than the thickness t1 of the first substrate (1). Also, the narrow portion (60) of the leg (31)
A guide slope (61) is formed below the bottom. The guide slope (61)
Is a direction in which the leg (31) can bend, and the holding piece (3) is attached in a direction perpendicular to the second substrate (2) as described above. Is the second substrate
The direction is parallel to (2). The protrusions (32) and (32) are
In order to prevent it from coming out of (2), protrusions (33) (33)
Is formed. The protrusions (33) and (33) are formed at positions slightly away from the base (30) than the thickness t2 of the second substrate (2).
【０００８】第２基板(２)には、コネクタ(４)のリード
線群(42)と嵌合する受け孔群(21)と、保持片(３)の突出
部(32)(32)が差し込まれる差込み孔(20)(20)とが形成さ
れる。受け孔群(21)および差込み孔(20)(20)は、コネク
タ(４)のリード線群(40)と、保持片(３)における脚部(3
1)の下端(６)とが、第２基板(２)の下端から下方へ突出
するような位置に形成される。コネクタ(４)において、
第２基板(２)側へ接続するリード線群(42)は、垂直に折
り曲げられる。コネクタ(４)を第２基板(２)に取り付け
る際には、コネクタ(４)のリード線群(42)が第２基板
(２)の受け孔群(21)に挿入され、コネクタ(４)の角状部
材(41)の下端が第２基板(２)の下端と揃うように取り付
けられる。そして、図には示していないが、該角状部材
(41)と第２基板(２)とが接着剤にて固定され、第２基板
(２)の裏面から突出した該リード線群(42)が、ディップ
半田付けにより、第２基板(２)に固定され且つ電気的に
接続される。保持片(３)において、基部(30)の両側部
は、垂直に折り曲げられ、突出部(32)(32)は、第２基板
(２)の差込み孔(20)(20)にそれぞれ挿入される。このと
き、突出部(32)(32)の突起(33)(33)は、凹みながら該差
込み孔(20)(20)に挿入され、弾性復帰により第２基板
(２)の裏面を押さえて固定する。そして、図には示して
いないが、第２基板(２)の裏面から突出した該突出部(3
2)(32)が、ディップ半田付けにより、第２基板(２)に固
定される。The second board (2) has a receiving hole group (21) fitted to the lead wire group (42) of the connector (4), and projections (32) (32) of the holding piece (3). Insertion holes (20) and (20) to be inserted are formed. The receiving hole group (21) and the insertion holes (20) (20) are connected to the lead wire group (40) of the connector (4) and the legs (3) of the holding piece (3).
The lower end (6) of (1) is formed at a position protruding downward from the lower end of the second substrate (2). In the connector (4),
The group of lead wires (42) connected to the second substrate (2) is bent vertically. When attaching the connector (4) to the second board (2), the lead wire group (42) of the connector (4) is
The connector (4) is inserted into the receiving hole group (21), and is attached so that the lower end of the square member (41) of the connector (4) is aligned with the lower end of the second substrate (2). And although not shown in the figure, the square member
(41) and the second substrate (2) are fixed with an adhesive, and the second substrate
The lead wire group (42) projecting from the back surface of (2) is fixed and electrically connected to the second substrate (2) by dip soldering. In the holding piece (3), both sides of the base (30) are bent vertically, and the protrusions (32) and (32) are
Inserted into the insertion holes (20) and (20) of (2). At this time, the projections (33) and (33) of the protruding portions (32) and (32) are inserted into the insertion holes (20) and (20) while being recessed, and the second substrate is elastically restored.
Hold down the back of (2) and fix. Then, although not shown in the figure, the projecting portion (3) projecting from the back surface of the second substrate (2).
2) (32) is fixed to the second substrate (2) by dip soldering.
【０００９】上記のように第２基板(２)に取り付けられ
たコネクタ(４)および保持片(３)は、前述のように、コ
ネクタ(４)のリード線群(40)と、保持片(３)における脚
部(31)の下端(６)とが、第２基板(２)の下端から下方へ
突出しており、第２基板(２)を下方に移動することによ
り、該リード線群(40)および該下端(６)が第１基板(１)
に挿入される。第１基板(１)には、コネクタ(４)のリー
ド線群(40)と嵌合する受け孔群(11)と、保持片(３)にお
ける脚部(31)の下端(６)が差し込まれる差込み孔(10)と
が形成される。図１および図３（ａ）に示すように、該
差込み孔(10)は、第１基板(１)に第２基板(２)を立設す
るために、第１基板(１)の受け孔群(11)の真上にコネク
タ(４)のリード線群(40)を配置したときに、保持片(３)
の脚部(31)の真下となる位置に幅狭部Ｗ2が形成され、
該脚部(31)における案内斜面(61)の先端の真下となる位
置に、該幅狭部Ｗ2に並んで連続して、幅広部Ｗ1が形成
される。As described above, the connector (4) and the holding piece (3) attached to the second board (2) are connected to the lead wire group (40) of the connector (4) and the holding piece ( The lower end (6) of the leg portion (31) in (3) projects downward from the lower end of the second substrate (2), and by moving the second substrate (2) downward, the lead wire group ( 40) and the lower end (6) is the first substrate (1).
Is inserted into. The first board (1) has a receiving hole group (11) fitted to the lead wire group (40) of the connector (4) and a lower end (6) of the leg (31) of the holding piece (3) inserted therein. Insertion hole (10) is formed. As shown in FIGS. 1 and 3 (a), the insertion hole (10) is provided with a receiving hole of the first substrate (1) in order to erect the second substrate (2) on the first substrate (1). When the lead wire group (40) of the connector (4) is arranged just above the group (11), the holding piece (3)
A narrow portion W2 is formed at a position directly below the leg portion (31),
A wide portion W1 is formed immediately below the tip of the guide slope 61 on the leg portion 31 so as to be continuous with the narrow portion W2.
【００１０】第１基板(１)の受け孔群(11)の真上にコネ
クタ(４)のリード線群(40)が来るように、第１基板(１)
の上方に第２基板(２)を配置して、第２基板(２)を下方
へ移動させると、図３（ｂ）のように、リード線群(40)
が受け孔群(11)に挿入され、同時に、保持片(３)の脚部
(31)の案内斜面(61)が第１基板(１)の幅広部Ｗ1に挿入
されて、脚部(31)が撓みながら、脚部(31)の下端(６)が
幅広部Ｗ1に挿入される。第２基板(２)をさらに下方へ
移動して、第２基板(２)の下端が第１基板(１)と接触す
ると、図４のように、コネクタ(４)の角状部材(41)が第
１基板(１)と接触し、リード線群(40)が第１基板(１)の
裏面から突出する。また、脚部(31)の下端(６)における
幅狭部(60)が第１基板(１)に到達し、切込み(62)が第１
基板(１)と嵌合し、脚部(31)が弾性復帰して、下端(６)
の幅狭部(60)が差込み孔(10)の幅狭部Ｗ2と嵌合する。
そして、図４に示すように、第１基板(１)の裏面から突
出したリード線群(40)が、ディップ半田(50)により第１
基板(１)と電気的に接続される。また、図４および図５
に示すように、第１基板(１)の裏面において、差込み孔
(10)の幅広部Ｗ1と保持片(３)の脚部(31)とに挟まれた
領域に、ディップ半田(50)が形成されて、脚部(31)が撓
んで下端(６)が差込み孔(10)の幅広部Ｗ1に移動するこ
とを防止する。以上により第２基板(２)の第１基板(１)
への立設が完成する。The first board (1) is arranged so that the lead wire group (40) of the connector (4) comes directly above the receiving hole group (11) of the first board (1).
When the second substrate (2) is disposed above the substrate and the second substrate (2) is moved downward, as shown in FIG.
Is inserted into the receiving hole group (11), and at the same time, the legs of the holding piece (3)
The guide slope (61) of (31) is inserted into the wide portion W1 of the first substrate (1), and the lower end (6) of the leg (31) is inserted into the wide portion W1 while the leg (31) bends. Is done. When the lower end of the second substrate (2) comes into contact with the first substrate (1) by moving the second substrate (2) further downward, as shown in FIG. Are in contact with the first substrate (1), and the lead wire group (40) projects from the back surface of the first substrate (1). The narrow portion (60) at the lower end (6) of the leg (31) reaches the first substrate (1), and the cut (62) is
The leg (31) resiliently returns to the lower end (6) by fitting with the substrate (1).
Of the insertion hole (10) is fitted into the narrow portion (60) of the insertion hole (10).
Then, as shown in FIG. 4, the lead wire group (40) projecting from the back surface of the first substrate (1) is first
It is electrically connected to the substrate (1). 4 and 5
As shown in the figure, the insertion hole is formed on the back surface of the first substrate (1).
Dip solder (50) is formed in a region sandwiched between the wide portion W1 of (10) and the leg (31) of the holding piece (3), and the leg (31) is bent and the lower end (6) is bent. It prevents movement to the wide portion W1 of the insertion hole (10). Thus, the first substrate (1) of the second substrate (2)
Standing is completed.
【００１１】本実施形態では、下端(６)の切込み(62)が
第１基板(１)に嵌合することにより、保持片(３)が第１
基板(１)に固定される。該切込み(62)は、従来の切起し
による抜止め爪(70)（図７〜図１０参照）に比べて、寸
法が出し易く且つ変形し難いから、外部負荷による第２
基板(２)の揺れは少ない。従って、第１基板(１)に保持
片(３)をこて半田(51)にて結合する必要は無く、その結
果、第２基板(２)の取外しや交換が容易となり、作業も
簡略化される。また、保持片(３)の下端(６)に、従来と
同様に案内斜面(61)を設けることにより、差込み孔(10)
に挿入するために、外力によって下端(６)を撓ませる必
要は無くなり、従って、組立て工程の自動化を損なわな
い。また、脚部(31)が差込み孔(10)の幅広部Ｗ1側に撓
んで、差込み孔(10)から抜け出ることを防止するために
は、第１基板(１)の裏面において、差込み孔(10)の幅広
部Ｗ1と保持片(３)の脚部(31)とに挟まれた領域に、デ
ィップ半田(50)を形成すればよく、第１基板(１)と脚部
(31)とをこて半田(51)にて結合する必要は無い。従っ
て、第２基板(２)の取外しや交換の際には、前記ディッ
プ半田(50)を除去すればよく、作業が容易となる。ま
た、前記ディップ半田(50)は、コネクタ(４)のリード線
群(40)と第１基板(１)とをディップ半田付けする工程に
おいて行なうから、作業工程を増やすことが無い。In this embodiment, the notch (62) of the lower end (6) is fitted to the first substrate (1), so that the holding piece (3) is in the first position.
It is fixed to the substrate (1). The cuts (62) are easier to obtain in size and are less likely to be deformed as compared with the conventional retaining and stopping claws (70) by cutting and raising (see FIGS. 7 to 10).
The swing of the substrate (2) is small. Therefore, it is not necessary to bond the holding piece (3) to the first substrate (1) with the solder (51), and as a result, the second substrate (2) can be easily removed and replaced, and the operation can be simplified. Is done. By providing a guide slope (61) at the lower end (6) of the holding piece (3) as in the conventional case, the insertion hole (10)
It is no longer necessary to bend the lower end (6) by an external force in order to insert it into the device, so that the automation of the assembling process is not impaired. In order to prevent the leg portion (31) from bending toward the wide portion W1 side of the insertion hole (10) and coming out of the insertion hole (10), the insertion hole ( Dip solder (50) may be formed in a region between the wide portion W1 of (10) and the leg (31) of the holding piece (3), and the first substrate (1) and the leg
It is not necessary to join (31) with the solder (51). Therefore, when the second substrate (2) is removed or replaced, the dip solder (50) may be removed, and the work becomes easy. Further, the dip soldering (50) is performed in the step of dip soldering the lead wire group (40) of the connector (4) and the first substrate (1), so that the number of working steps is not increased.
【００１２】上記実施形態の説明は、本発明を説明する
ためのものであって、特許請求の範囲に記載の発明を限
定し、或いは範囲を減縮する様に解すべきではない。
又、本発明の各部構成は上記実施形態に限らず、特許請
求の範囲に記載の技術的範囲内で種々の変形が可能であ
ることは勿論である。例えば、本実施形態では、保持片
(３)の脚部(31)における下端(６)の一方の側縁に切込み
(62)を設けたが、図６のように、両側に切込み(62)(62)
を設けることもできる。この場合、第１基板(１)の差込
み孔(10)は、幅狭部Ｗ2が幅広部Ｗ1の中央部と接続する
形状に開設されることになる。The description of the above embodiments is for the purpose of explaining the present invention, and should not be construed as limiting the invention described in the claims or reducing the scope thereof.
Further, the configuration of each part of the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made within the technical scope described in the claims. For example, in the present embodiment, the holding piece
Cut in one side edge of the lower end (6) of the leg (31) of (3)
(62), but cuts (62) and (62) on both sides as shown in FIG.
Can also be provided. In this case, the insertion hole (10) of the first substrate (1) is formed so that the narrow portion W2 is connected to the central portion of the wide portion W1.
【図１】本実施形態において、第１基板に第２基板を立
設する状態を示す組立図である。FIG. 1 is an assembly view showing a state in which a second substrate is erected on a first substrate in this embodiment.
【図２】本実施形態において、第１基板に第２基板を立
設した状態を示す斜視図である。FIG. 2 is a perspective view showing a state in which a second substrate is erected on a first substrate in the present embodiment.
【図３】図１をＡ−Ａ線にて断面し、矢印方向に見た図
であり、（ａ）は第１基板に第２基板を挿入する前の状
態を示し、（ｂ）は第１基板にコネクタのリード線群と
保持片の先端を挿入している状態を示す。FIGS. 3A and 3B are cross-sectional views taken along line AA of FIG. 1 and viewed in a direction of an arrow, where FIG. 3A shows a state before a second substrate is inserted into a first substrate, and FIG. The state where the lead wire group of the connector and the tip of the holding piece are inserted into one substrate is shown.
【図４】図２をＢ−Ｂ線にて断面し、矢印方向に見た図
である。FIG. 4 is a sectional view taken along line BB of FIG. 2 and viewed in the direction of the arrow.
【図５】第１基板の裏面から見た差込み孔付近の拡大図
である。FIG. 5 is an enlarged view of the vicinity of the insertion hole as viewed from the back surface of the first substrate.
【図６】本発明の別の実施形態における保持片の脚部の
下端と第１基板の差込み孔とを示す要部拡大図である。FIG. 6 is an enlarged view of a main part showing a lower end of a leg of a holding piece and an insertion hole of a first substrate in another embodiment of the present invention.
【図７】従来の保持片を用いて、第１基板に第２基板を
立設する状態を示す組立図である。FIG. 7 is an assembly view showing a state where a second substrate is erected on a first substrate using a conventional holding piece.
【図８】従来の保持片を用いて、第１基板に第２基板を
立設した状態を示す斜視図である。FIG. 8 is a perspective view showing a state in which a second substrate is erected on a first substrate using a conventional holding piece.
【図９】図８をＣ−Ｃ線にて断面し、矢印方向に見た図
である。FIG. 9 is a cross-sectional view taken along line CC of FIG. 8 and viewed in the direction of the arrow.
【図１０】従来の保持片の下端を拡大した図である。FIG. 10 is an enlarged view of a lower end of a conventional holding piece.
(１) 第１基板 (２) 第２基板 (３) 保持片 (４) コネクタ (６) 保持片の下端 (10) 差込み孔 (11) 受け孔群 (40) リード線群 (50) ディップ半田 (60) 幅狭部 (61) 案内斜面 (62) 切込み (1) First board (2) Second board (3) Holding piece (4) Connector (6) Lower end of holding piece (10) Insert hole (11) Receiving hole group (40) Lead wire group (50) Dip solder (60) Narrow part (61) Guide slope (62) Notch
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01R 12/16 H01R 13/73 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01R 12/16 H01R 13/73
Claims (8)
直に又は所定角度で立設し、第２基板(２)上のコネクタ
(４)のリード線群(40)を第１基板(１)の受け孔群(11)に
嵌めると共に、第２基板(２)に突設した保持片(３)を第
１基板(１)の差込み孔(10)に差し込んで、第１基板(１)
に第２基板(２)を取り付ける方法に於て、 保持片(３)の下端(６)の側縁において、第１基板(１)に
差し込む際の第１基板(１)と平行な方向に、第１基板
(１)の厚さに等しいか又は稍広い高さの切込み(62)を開
設して、保持片(３)の幅狭部(60)を形成し、 第１基板(１)の差込み孔(10)は、保持片(３)の下端(６)
が嵌まる幅広部Ｗ1と、保持片(３)の幅狭部(60)が嵌ま
る幅狭部Ｗ2とが並んで連続した形状をなし、 第２基板(２)のコネクタ(４)のリード線群(40)を第１基
板(１)の受け孔群(11)に挿入する際に、保持片(３)の下
端(６)を、差込み孔(10)の幅狭部Ｗ2から幅広部Ｗ1側へ
撓ませながら、差込み孔(10)の幅広部Ｗ1に嵌め、保持
片(３)の弾性復帰により、保持片(３)の幅狭部(60)を差
込み孔(10)の幅狭部Ｗ2に嵌めることを特徴とする、基
板どうしの取付け方法。1. A second substrate (2) is erected substantially vertically or at a predetermined angle on a first substrate (1), and a connector on the second substrate (2) is provided.
The lead wire group (40) of (4) is fitted into the receiving hole group (11) of the first substrate (1), and the holding piece (3) projecting from the second substrate (2) is attached to the first substrate (1). Into the insertion hole (10) of the first substrate (1).
In the method of attaching the second substrate (2) to the first substrate (1), at the side edge of the lower end (6) of the holding piece (3), in a direction parallel to the first substrate (1) when inserted into the first substrate (1). , First substrate
A notch (62) having a height equal to or slightly wider than the thickness of (1) is formed to form a narrow portion (60) of the holding piece (3), and an insertion hole (1) of the first substrate (1) is formed. 10) is the lower end (6) of the holding piece (3)
A wide portion W1 in which the connector fits and a narrow portion W2 in which the narrow portion (60) of the holding piece (3) fits are arranged side by side and continuous, and the lead of the connector (4) of the second substrate (2) is formed. When the wire group (40) is inserted into the receiving hole group (11) of the first substrate (1), the lower end (6) of the holding piece (3) is moved from the narrow portion W2 of the insertion hole (10) to the wide portion. While bending to the W1 side, it is fitted in the wide portion W1 of the insertion hole (10), and the elastic portion of the holding piece (3) returns the narrow portion (60) of the holding piece (3) to the narrow width of the insertion hole (10). A method of attaching substrates to each other, characterized by being fitted into a portion W2.
込み孔(10)の幅狭部Ｗ2から幅広部Ｗ1側へ屈曲した案内
斜面(61)が形成されており、 第２基板(２)のコネクタ(４)のリード線群(40)を第１基
板(１)の受け孔群(11)に挿入する際に、保持片(３)の案
内斜面(61)が差込み孔(10)の幅広部Ｗ1に挿入され、保
持片(３)の下端(６)が撓みながら差込み孔(10)の幅広部
Ｗ1に嵌まることを特徴とする、請求項１に記載の基板
どうしの取付け方法。2. Below the narrow portion (60) of the holding piece (3), a guide slope (61) bent from the narrow portion W2 of the insertion hole (10) toward the wide portion W1 is formed. When inserting the lead wire group (40) of the connector (4) of the second board (2) into the receiving hole group (11) of the first board (1), the guide slope (61) of the holding piece (3) is inserted. 2. The insertion hole (10) is inserted into the wide portion (W1) of the insertion hole (10), and the lower end (6) of the holding piece (3) is fitted into the wide portion W1 of the insertion hole (10) while flexing. How to attach each other.
の幅狭部Ｗ2に嵌めた後に、第１基板(１)の裏面におい
て、差込み孔(10)の幅広部Ｗ1と保持片(３)とに挟まれ
た領域に、ディップ半田(50)を施す、請求項１または請
求項２に記載の基板どうしの取付け方法。3. A narrow hole (60) of the holding piece (3) is inserted into the insertion hole (10).
After being fitted to the narrow portion W2, the dip solder (50) is applied to a region between the wide portion W1 of the insertion hole (10) and the holding piece (3) on the back surface of the first substrate (1). 3. The method of attaching substrates according to claim 1 or claim 2.
直に又は所定角度で立設し、第２基板(２)上のコネクタ
(４)のリード線群(40)を第１基板(１)の受け孔群(11)に
嵌めると共に、第２基板(２)に突設した保持片(３)を第
１基板(１)の差込み孔(10)に差し込んで第１基板(１)に
第２基板(２)を取り付けた構造に於て、 保持片(３)の下端(６)の側縁において、第１基板(１)と
平行な方向に、第１基板(１)の厚さに等しいか又は稍広
い高さの切込み(62)を開設して、保持片(３)の幅狭部(6
0)を形成し、 第１基板(１)の差込み孔(10)は、保持片(３)の下端(６)
が嵌まる幅広部Ｗ1と、保持片(３)の幅狭部(60)が嵌ま
る幅狭部Ｗ2とが並んで連続しており、 第２基板(２)上のコネクタ(４)のリード線群(40)が第１
基板(１)の受け孔群(11)に嵌まった状態で、保持片(３)
の幅狭部(60)が差込み孔(10)の幅狭部Ｗ2に嵌まり、保
持片(３)は、外力を加えると差込み孔(10)の幅広部Ｗ1
へ変形可能な撓みを有している、基板どうしの取付け構
造。4. A second board (2) is erected substantially vertically or at a predetermined angle on the first board (1), and a connector on the second board (2) is provided.
The lead wire group (40) of (4) is fitted into the receiving hole group (11) of the first substrate (1), and the holding piece (3) projecting from the second substrate (2) is attached to the first substrate (1). In the structure in which the second substrate (2) is attached to the first substrate (1) by inserting the first substrate (1) into the insertion hole (10), the first substrate (1) is attached to the side edge of the lower end (6) of the holding piece (3). ), A cut (62) having a height equal to or slightly wider than the thickness of the first substrate (1) is opened, and the narrow portion (6) of the holding piece (3) is opened.
0), and the insertion hole (10) of the first substrate (1) is formed at the lower end (6) of the holding piece (3).
And a narrow portion W2 where the narrow portion (60) of the holding piece (3) fits and is continuous, side by side, and leads of the connector (4) on the second substrate (2). Line group (40) is first
The holding piece (3) is fitted in the receiving hole group (11) of the substrate (1).
Of the insertion hole (10) fits into the narrow portion W2 of the insertion hole (10), and when the external force is applied, the holding piece (3)
An attachment structure between substrates having a deformable bending.
込み孔(10)の幅狭部Ｗ2から幅広部Ｗ1側へ屈曲した案内
斜面(61)が形成されている、請求項４に記載の基板どう
しの取付け構造。5. A guide slope (61) bent from the narrow portion (W2) of the insertion hole (10) toward the wide portion (W1) is formed below the narrow portion (60) of the holding piece (3). The mounting structure of substrates according to claim 4.
れている、請求項４又は請求項５に記載の基板どうしの
取付け構造。6. The mounting structure for substrates according to claim 4, wherein cuts at lower ends of the holding pieces (3) are formed on both sides.
並び方向は、第２基板(２)の向きに揃っている、請求項
４乃至請求項６の何れかに記載の基板どうしの取付け構
造。7. The arrangement according to claim 4, wherein the wide portion W1 and the narrow portion W2 of the insertion hole (10) are aligned in the direction of the second substrate (2). Mounting structure between boards.
(10)の幅広部Ｗ1と保持片(３)とに挟まれた領域に、デ
ィップ半田(50)が形成されている、請求項４乃至請求項
７の何れかに記載の基板どうしの取付け構造。8. An insertion hole on the back surface of the first substrate (1).
The mounting structure according to any one of claims 4 to 7, wherein a dip solder (50) is formed in an area between the wide portion (W1) and the holding piece (3). .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16073797A JP3296752B2 (en) | 1997-06-18 | 1997-06-18 | Mounting method and mounting structure between boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16073797A JP3296752B2 (en) | 1997-06-18 | 1997-06-18 | Mounting method and mounting structure between boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH118031A JPH118031A (en) | 1999-01-12 |
| JP3296752B2 true JP3296752B2 (en) | 2002-07-02 |
Family
ID=15721374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16073797A Expired - Fee Related JP3296752B2 (en) | 1997-06-18 | 1997-06-18 | Mounting method and mounting structure between boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3296752B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200137814A (en) * | 2019-05-31 | 2020-12-09 | 주식회사 솔루엠 | Board structure with a different power supply circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183935A (en) * | 2014-08-22 | 2014-12-03 | 中国北方发动机研究所(天津) | Shockproof connection device for child-mother circuit board |
-
1997
- 1997-06-18 JP JP16073797A patent/JP3296752B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200137814A (en) * | 2019-05-31 | 2020-12-09 | 주식회사 솔루엠 | Board structure with a different power supply circuit board |
| KR102356672B1 (en) | 2019-05-31 | 2022-01-28 | 주식회사 솔루엠 | Board structure with a different power supply circuit board |
| KR20220016236A (en) * | 2019-05-31 | 2022-02-08 | 주식회사 솔루엠 | Board structure with a different power supply circuit board |
| KR102456939B1 (en) | 2019-05-31 | 2022-10-21 | 주식회사 솔루엠 | Board structure with a different power supply circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH118031A (en) | 1999-01-12 |
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