JPH118031A - Mounting method and mounting structure between substrates - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting method and a mounting structure capable of fixing a holding piece to a first substrate without performing soldering. SOLUTION: In this structure, a second substrate 2 is erected on a first substrate 1, a lead wire group 40 of a connector 4 on the second substrate 2 is fitted into a receiving hole group 11 of the first substrate 1, a holding piece 3 protruded on the second substrate 2 is plugged into a plug-in hole 10 of the first substrate 1, and the second substrate 2 is mounted to the first substrate 1. In this case, at the side rim of a lower end 6 of the holding piece 3, a notch 62 is openly provided in a direction parallel to the first substrate 1, a narrow part 60 of the holding piece 3 is formed, the plug-in hole 10 of the first substrate 1 is successive in line with a wide part W1 with which the lower end 6 is fitted and a narrow part W2 with which the narrow part 60 of the holding piece 3 is fitted, in a state in which the lead wire group 40 is fitted into a receiving hole 11, the narrow part 60 of the holding piece 3 is fitted into the narrow part W2 of the plug-in hole 10, and the holding piece 3 has deflection capable of deforming to the wide part W1 of the plug-in hole 10 when an external force is applied.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching circuit boards to each other substantially vertically or at a predetermined angle in an electronic device or the like, and a structure for attaching the circuit boards.

[0002]

2. Description of the Related Art In electronic equipment, a circuit board is three-dimensionally formed by stacking circuit boards or placing another circuit board on the circuit board in order to reduce the area occupied by the circuit board. This has been done in the past. As shown in FIG. 8, a connector (4) for electrically connecting both substrates (1) and (2) is provided in an assembly in which the second substrate (2) is erected on the first substrate (1). And a holding piece (3) for holding the second substrate (2). The connector (4) includes a lead wire group (40) for electrically connecting the first board (1) and the second board (2). The holding piece (3) is generally made of a metal material such as tinplate from the viewpoint of strength. When assembling the assembly, FIG.
As shown in the figure, the connector (4) and the holding piece (3) are provided on the second substrate (2), and the lead wire group (40) of the connector (4) and the lower end (7) of the holding piece (3) are It protrudes downward from the second substrate (2). In order to prevent the holding piece (3) from coming off the first substrate (1), a retaining claw (70) is protrudingly provided at the lower end (7) of the holding piece (3). On the other hand, the first substrate (1) has a group of receiving holes to be fitted with the group of lead wires (40) of the connector (4).
(11) and the insertion hole into which the lower end (7) of the holding piece (3) is inserted
(15) is formed.

In order to erect the second board (2) on the first board (1), the lead wire group (40) of the connector (4) of the second board (2) is received by the first board (1). When inserted into hole group (11),
The lower end (7) or the retaining claw (70) of (3) is inserted into the insertion hole (15) while flexing, and the lower end (7) or the retaining claw (70) is elastically restored, so that the lower end (7) or the retaining claw (70) of FIGS. Like, retaining claw (70)
Is fixed by pressing the back surface of the first substrate (1), and the holding piece (3)
Thus, the standing of the second substrate (2) on the first substrate (1) is maintained. Then, as shown in FIG. 9, a lead wire group (40) projecting from the back surface of the first substrate (1) is electrically connected to the first substrate (1) by dip soldering.

[0004]

Generally, a retaining claw (70)
Is formed by being cut and raised from the lower end (7) in the mold bending step, as shown in FIGS. Therefore, as shown in FIG. 10, at the lower end (7) of the holding piece (3), the height A from the base end to the tip of the retaining claw (70) is the angle α at which the retaining claw (70) is cut. It is difficult to get the dimensions because it is determined by Therefore, even if the retaining claws (70) can prevent the removal from the first substrate (1), they cannot sufficiently fix the second substrate (2). Therefore, when an external load is further applied to the second substrate (2), the retaining claw (70) is deformed and the second substrate (2) is deformed.
The swing of (2) is further increased. Due to this shaking, the dip solder (50) that fixed the lead wire group (40) of the connector (4) to the first substrate (1) is changed to the first substrate (1) or the lead wire group (4).
0), resulting in poor contact. Therefore, conventionally, as shown in FIG. 9, the lower end (7) of the holding piece (3)
And the first substrate (1) are fixed by soldering.
However, the solder (51) connecting the lower end (7) of the holding piece (3) and the first substrate (1) is difficult to remove. It becomes difficult to remove the second substrate (2) from the substrate (1), and it becomes difficult to replace the second substrate (2) due to, for example, a failure of the second substrate (2). SUMMARY OF THE INVENTION An object of the present invention is to provide a mounting method and a mounting structure capable of sufficiently fixing a holding piece to a first substrate without soldering, and improving serviceability in the case of repair or failure. And

[0005]

According to the present invention, a notch is formed at a lower end side edge of the holding piece in a direction parallel to the first substrate when inserted into the first substrate to form a narrow portion of the holding piece. Is done.
The cut is formed to have a height equal to or slightly larger than the thickness of the first substrate. In the first substrate, the insertion hole into which the holding piece is inserted is formed in a continuous shape in which a wide portion W1 where the tip of the holding piece fits and a narrow portion W2 where the narrow portion of the holding piece fits. Is done. When inserting the lead wire group of the connector of the second board into the receiving hole group of the first board so as to erect the second board on the first board, the tip of the holding piece is
While being bent from the narrow portion W2 of the insertion hole (10) to the wide portion W1 side, it is fitted into the wide portion W1 of the insertion hole, and the elastic portion of the holding piece returns the narrow portion of the holding piece to the narrow portion W2 of the insertion hole. It is fitted to.

[0006]

[Operation and Effect] The cut of the holding piece to be fitted to the first substrate is more easily dimensioned and is less likely to be deformed than a retaining claw formed by cutting and raising. Therefore, the holding piece can be easily fixed to the first substrate by fitting the narrow part of the holding piece into the narrow part W2 of the insertion hole. As a result, it is not necessary to bond the holding piece to the first substrate by soldering, and the second substrate can be easily removed or replaced, thereby improving serviceability.

[0007]

Embodiments of the present invention will be described below. As shown in FIG. 1, the first substrate (1) has the second substrate
The assembled product of this embodiment in which (2) is vertically set includes both substrates.
(1) Connector (4) for electrically connecting (2) and second board
A holding piece (3) for holding (2) is provided. Second substrate
(2) is set up on the first substrate (1) after attaching the connector (4) and the holding piece (3) in advance. Connector (4)
An angular member (41) for vertically fixing the second substrate (2) to the first substrate (1), and a group of lead wires (40) (42) protruding from both sides of the angular member and arranged in the longitudinal direction. ). Holding piece (3)
Is a base (30) and a leg (3) projecting from the center of the base (30), extending downward, and having a lower end (6) inserted into the first substrate (1).
1) and projections (32) and (32) projecting from both sides of the base (30) in the opposite direction to the legs (31) and inserted into the second substrate (2). The holding piece (3) is integrally formed by punching and bending a metal plate such as a tin plate. Also, holding pieces
Since (3) is for fixing the second substrate (2) to the first substrate (1), in the present embodiment, the direction perpendicular to the first substrate (1) and the second substrate (2) is used. Deployed to. At the lower end (6) of the leg (31), a cut (62) is made from one side edge in a direction parallel to the first substrate (1) when inserted into the first substrate (1), and has a narrow width. A part (60) is formed. In the present embodiment, since the second substrate (2) is vertically erected on the first substrate (1), the cut (62) is formed from one side edge of the lower end (6) in a direction perpendicular to the insertion direction. It will be established in. Cut (62)
Is formed to have a height equal to or slightly wider than the thickness t1 of the first substrate (1). Also, the narrow portion (60) of the leg (31)
A guide slope (61) is formed below the bottom. The guide slope (61)
Is a direction in which the leg (31) can bend, and the holding piece (3) is attached in a direction perpendicular to the second substrate (2) as described above. Is the second substrate
The direction is parallel to (2). The protrusions (32) and (32) are
In order to prevent it from coming out of (2), protrusions (33) (33)
Is formed. The protrusions (33) and (33) are formed at positions slightly away from the base (30) than the thickness t2 of the second substrate (2).

The second board (2) has a receiving hole group (21) fitted to the lead wire group (42) of the connector (4), and projections (32) (32) of the holding piece (3). Insertion holes (20) and (20) to be inserted are formed. The receiving hole group (21) and the insertion holes (20) (20) are connected to the lead wire group (40) of the connector (4) and the legs (3) of the holding piece (3).
The lower end (6) of (1) is formed at a position protruding downward from the lower end of the second substrate (2). In the connector (4),
The group of lead wires (42) connected to the second substrate (2) is bent vertically. When attaching the connector (4) to the second board (2), the lead wire group (42) of the connector (4) is attached to the second board (2).
The connector (4) is inserted into the receiving hole group (21), and is attached so that the lower end of the square member (41) of the connector (4) is aligned with the lower end of the second substrate (2). And although not shown in the figure, the square member
(41) and the second substrate (2) are fixed with an adhesive, and the second substrate
The lead wire group (42) projecting from the back surface of (2) is fixed to and electrically connected to the second substrate (2) by dip soldering. In the holding piece (3), both sides of the base (30) are vertically bent, and the protrusions (32) and (32) are
Inserted into the insertion holes (20) and (20) of (2). At this time, the protrusions (33) and (33) of the protruding portions (32) and (32) are inserted into the insertion holes (20) and (20) while being recessed, and the second substrate is elastically restored.
Hold down the back of (2) and fix. Then, although not shown in the figure, the projecting portion (3) projecting from the back surface of the second substrate (2) is formed.
2) (32) is fixed to the second substrate (2) by dip soldering.

As described above, the connector (4) and the holding piece (3) attached to the second board (2) are connected to the lead wire group (40) of the connector (4) and the holding piece ( The lower end (6) of the leg portion (31) in (3) projects downward from the lower end of the second substrate (2), and by moving the second substrate (2) downward, the lead wire group ( 40) and the lower end (6) is the first substrate (1).
Is inserted into. The first board (1) has a receiving hole group (11) fitted to the lead wire group (40) of the connector (4) and a lower end (6) of the leg (31) of the holding piece (3) inserted therein. Insertion hole (10) is formed. As shown in FIGS. 1 and 3 (a), the insertion hole (10) is provided with a receiving hole of the first substrate (1) in order to erect the second substrate (2) on the first substrate (1). When the lead wire group (40) of the connector (4) is arranged just above the group (11), the holding piece (3)
A narrow portion W2 is formed at a position directly below the leg portion (31),
A wide portion W1 is formed immediately below the tip of the guide slope 61 on the leg portion 31 so as to be continuous with the narrow portion W2.

The first board (1) is arranged so that the lead wire group (40) of the connector (4) comes directly above the receiving hole group (11) of the first board (1).
When the second substrate (2) is disposed above the substrate and the second substrate (2) is moved downward, as shown in FIG.
Is inserted into the receiving hole group (11), and at the same time, the legs of the holding piece (3)
The guide slope (61) of (31) is inserted into the wide portion W1 of the first substrate (1), and the lower end (6) of the leg (31) is inserted into the wide portion W1 while the leg (31) bends. Is done. When the lower end of the second substrate (2) comes into contact with the first substrate (1) by moving the second substrate (2) further downward, as shown in FIG. Are in contact with the first substrate (1), and the lead wire group (40) projects from the back surface of the first substrate (1). The narrow portion (60) at the lower end (6) of the leg (31) reaches the first substrate (1), and the cut (62) is
The leg (31) resiliently returns to the lower end (6) by fitting with the substrate (1).
Of the insertion hole (10) is fitted into the narrow portion (60) of the insertion hole (10).
Then, as shown in FIG. 4, the lead wire group (40) projecting from the back surface of the first substrate (1) is first
It is electrically connected to the substrate (1). 4 and 5
As shown in the figure, the insertion hole is formed on the back surface of the first substrate (1).
Dip solder (50) is formed in a region sandwiched between the wide portion W1 of (10) and the leg (31) of the holding piece (3), and the leg (31) is bent and the lower end (6) is bent. It prevents movement to the wide portion W1 of the insertion hole (10). Thus, the first substrate (1) of the second substrate (2)
Standing is completed.

In this embodiment, the notch (62) of the lower end (6) is fitted to the first substrate (1), so that the holding piece (3) is in the first position.
It is fixed to the substrate (1). The cuts (62) are easier to obtain in size and are less likely to be deformed as compared with the conventional retaining and stopping claws (70) by cutting and raising (see FIGS. 7 to 10).
The swing of the substrate (2) is small. Therefore, it is not necessary to bond the holding piece (3) to the first substrate (1) with the solder (51), and as a result, the second substrate (2) can be easily removed and replaced, and the operation can be simplified. Is done. By providing a guide slope (61) at the lower end (6) of the holding piece (3) as in the conventional case, the insertion hole (10)
It is no longer necessary to bend the lower end (6) by an external force in order to insert it into the device, so that the automation of the assembling process is not impaired. In order to prevent the leg portion (31) from bending toward the wide portion W1 side of the insertion hole (10) and coming out of the insertion hole (10), the insertion hole ( Dip solder (50) may be formed in a region between the wide portion W1 of (10) and the leg (31) of the holding piece (3), and the first substrate (1) and the leg
It is not necessary to join (31) with the solder (51). Therefore, when the second substrate (2) is removed or replaced, the dip solder (50) may be removed, and the work becomes easy. Further, the dip soldering (50) is performed in the step of dip soldering the lead wire group (40) of the connector (4) and the first substrate (1), so that the number of working steps is not increased.

The description of the above embodiments is for the purpose of explaining the present invention, and should not be construed as limiting the invention described in the claims or reducing the scope thereof.
Further, the configuration of each part of the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made within the technical scope described in the claims. For example, in the present embodiment, the holding piece
Cut in one side edge of the lower end (6) of the leg (31) of (3)
(62), but cuts (62) and (62) on both sides as shown in FIG.
Can also be provided. In this case, the insertion hole (10) of the first substrate (1) is formed so that the narrow portion W2 is connected to the central portion of the wide portion W1.

[Brief description of the drawings]

FIG. 1 is an assembly view showing a state in which a second substrate is erected on a first substrate in this embodiment.

FIG. 2 is a perspective view showing a state in which a second substrate is erected on a first substrate in the present embodiment.

FIGS. 3A and 3B are cross-sectional views taken along line AA of FIG. 1 and viewed in a direction of an arrow, where FIG. 3A shows a state before a second substrate is inserted into a first substrate, and FIG. The state where the lead wire group of the connector and the tip of the holding piece are inserted into one substrate is shown.

FIG. 4 is a sectional view taken along line BB of FIG. 2 and viewed in the direction of the arrow.

FIG. 5 is an enlarged view of the vicinity of the insertion hole as viewed from the back surface of the first substrate.

FIG. 6 is an enlarged view of a main part showing a lower end of a leg of a holding piece and an insertion hole of a first substrate in another embodiment of the present invention.

FIG. 7 is an assembly view showing a state where a second substrate is erected on a first substrate using a conventional holding piece.

FIG. 8 is a perspective view showing a state in which a second substrate is erected on a first substrate using a conventional holding piece.

FIG. 9 is a cross-sectional view taken along line CC of FIG. 8 and viewed in the direction of the arrow.

FIG. 10 is an enlarged view of a lower end of a conventional holding piece.

[Explanation of symbols]

 (1) First board (2) Second board (3) Holding piece (4) Connector (6) Lower end of holding piece (10) Insert hole (11) Receiving hole group (40) Lead wire group (50) Dip solder (60) Narrow part (61) Guide slope (62) Notch

Claims (8)

[Claims] 1. A second substrate (2) is erected substantially vertically or at a predetermined angle on a first substrate (1), and a connector on the second substrate (2) is provided.
The lead wire group (40) of (4) is fitted into the receiving hole group (11) of the first substrate (1), and the holding piece (3) projecting from the second substrate (2) is attached to the first substrate (1). Into the insertion hole (10) of the first substrate (1).
In the method of attaching the second substrate (2) to the first substrate (1), at the side edge of the lower end (6) of the holding piece (3), in a direction parallel to the first substrate (1) when inserted into the first substrate (1). , First substrate
A notch (62) having a height equal to or slightly wider than the thickness of (1) is formed to form a narrow portion (60) of the holding piece (3), and an insertion hole (1) of the first substrate (1) is formed. 10) is the lower end (6) of the holding piece (3)
A wide portion W1 in which the connector fits and a narrow portion W2 in which the narrow portion (60) of the holding piece (3) fits are arranged side by side and continuous, and the lead of the connector (4) of the second substrate (2) is formed. When the wire group (40) is inserted into the receiving hole group (11) of the first substrate (1), the lower end (6) of the holding piece (3) is moved from the narrow portion W2 of the insertion hole (10) to the wide portion. While bending to the W1 side, it is fitted in the wide portion W1 of the insertion hole (10), and the elastic portion of the holding piece (3) returns the narrow portion (60) of the holding piece (3) to the narrow width of the insertion hole (10). A method of attaching substrates to each other, characterized by being fitted into a portion W2. 2. Below the narrow portion (60) of the holding piece (3), a guide slope (61) bent from the narrow portion W2 of the insertion hole (10) toward the wide portion W1 is formed. When inserting the lead wire group (40) of the connector (4) of the second board (2) into the receiving hole group (11) of the first board (1), the guide slope (61) of the holding piece (3) is inserted. 2. The insertion hole (10) is inserted into the wide portion (W1) of the insertion hole (10), and the lower end (6) of the holding piece (3) is fitted into the wide portion W1 of the insertion hole (10) while flexing. How to attach each other. 3. A narrow hole (60) of the holding piece (3) is inserted into the insertion hole (10).
After being fitted to the narrow portion W2, the dip solder (50) is applied to a region between the wide portion W1 of the insertion hole (10) and the holding piece (3) on the back surface of the first substrate (1). 3. The method of attaching substrates according to claim 1 or claim 2. 4. A second board (2) is erected substantially vertically or at a predetermined angle on the first board (1), and a connector on the second board (2) is provided.
The lead wire group (40) of (4) is fitted into the receiving hole group (11) of the first substrate (1), and the holding piece (3) projecting from the second substrate (2) is attached to the first substrate (1). In the structure in which the second substrate (2) is attached to the first substrate (1) by inserting the first substrate (1) into the insertion hole (10), the first substrate (1) is attached to the side edge of the lower end (6) of the holding piece (3). ), A cut (62) having a height equal to or slightly wider than the thickness of the first substrate (1) is opened, and the narrow portion (6) of the holding piece (3) is opened.
0), and the insertion hole (10) of the first substrate (1) is formed at the lower end (6) of the holding piece (3).
And a narrow portion W2 where the narrow portion (60) of the holding piece (3) fits and is continuous, side by side, and leads of the connector (4) on the second substrate (2). Line group (40) is first
The holding piece (3) is fitted in the receiving hole group (11) of the substrate (1).
Of the insertion hole (10) fits into the narrow portion W2 of the insertion hole (10), and when the external force is applied, the holding piece (3)
An attachment structure between substrates having a deformable bending. 5. A guide slope (61) bent from the narrow portion (W2) of the insertion hole (10) toward the wide portion (W1) is formed below the narrow portion (60) of the holding piece (3). The mounting structure of substrates according to claim 4. 6. The mounting structure for substrates according to claim 4, wherein cuts at lower ends of the holding pieces (3) are formed on both sides. 7. The arrangement according to claim 4, wherein the wide portion W1 and the narrow portion W2 of the insertion hole (10) are aligned in the direction of the second substrate (2). Mounting structure between boards. 8. An insertion hole on the back surface of the first substrate (1).
The mounting structure according to any one of claims 4 to 7, wherein a dip solder (50) is formed in an area between the wide portion (W1) and the holding piece (3). .