JP5530261B2 - 被検査体の通電試験方法 - Google Patents

被検査体の通電試験方法 Download PDF

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Publication number
JP5530261B2
JP5530261B2 JP2010133539A JP2010133539A JP5530261B2 JP 5530261 B2 JP5530261 B2 JP 5530261B2 JP 2010133539 A JP2010133539 A JP 2010133539A JP 2010133539 A JP2010133539 A JP 2010133539A JP 5530261 B2 JP5530261 B2 JP 5530261B2
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probe
needle tip
probes
card
inspected
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Japanese (ja)
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JP2010204122A5 (enExample
JP2010204122A (ja
Inventor
義栄 長谷川
光 増田
勝男 安田
賢一 鷲尾
昌志 長谷川
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Micronics Japan Co Ltd
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Micronics Japan Co Ltd
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2010133539A 2010-06-11 2010-06-11 被検査体の通電試験方法 Active JP5530261B2 (ja)

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JP2010133539A JP5530261B2 (ja) 2010-06-11 2010-06-11 被検査体の通電試験方法

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JP2010133539A JP5530261B2 (ja) 2010-06-11 2010-06-11 被検査体の通電試験方法

Related Parent Applications (1)

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JP2006002177A Division JP2007183193A (ja) 2006-01-10 2006-01-10 プロービング装置

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JP2010204122A JP2010204122A (ja) 2010-09-16
JP2010204122A5 JP2010204122A5 (enExample) 2011-11-10
JP5530261B2 true JP5530261B2 (ja) 2014-06-25

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013125001A (ja) * 2011-12-16 2013-06-24 Mitsubishi Electric Corp プローブクリーニング装置
DE102012014812A1 (de) * 2012-07-26 2014-01-30 Etel S.A. Vorrichtung zum Testen von Wafern
JP7421990B2 (ja) 2020-04-08 2024-01-25 株式会社日本マイクロニクス 電気的接続装置および検査方法
CN113805025B (zh) * 2020-06-01 2024-10-11 均豪精密工业股份有限公司 光电检测系统与检测晶粒方法
CN119644232B (zh) * 2025-02-11 2025-06-24 杭州长川科技股份有限公司 探针卡的调平方法、装置、设备及存储介质

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3163221B2 (ja) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
JPH08306747A (ja) * 1995-04-28 1996-11-22 Matsushita Electric Ind Co Ltd 半導体装置の検査方法及びその検査に用いるプローブカード
JP4163365B2 (ja) * 1999-04-14 2008-10-08 株式会社日本マイクロニクス プローブカードの検査装置

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