JP5522462B2 - 発光装置及び照明装置 - Google Patents
発光装置及び照明装置 Download PDFInfo
- Publication number
- JP5522462B2 JP5522462B2 JP2010138766A JP2010138766A JP5522462B2 JP 5522462 B2 JP5522462 B2 JP 5522462B2 JP 2010138766 A JP2010138766 A JP 2010138766A JP 2010138766 A JP2010138766 A JP 2010138766A JP 5522462 B2 JP5522462 B2 JP 5522462B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- light
- substrate
- phosphor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 104
- 239000000758 substrate Substances 0.000 claims description 57
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 126
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 239000004020 conductor Substances 0.000 description 14
- 229920002050 silicone resin Polymers 0.000 description 11
- 239000010949 copper Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010138766A JP5522462B2 (ja) | 2010-04-20 | 2010-06-17 | 発光装置及び照明装置 |
EP11162869.9A EP2381157A3 (en) | 2010-04-20 | 2011-04-18 | Luminaire and light-emitting apparatus with light-emitting device |
CN201110102112.4A CN102237350B (zh) | 2010-04-20 | 2011-04-19 | 照明装置以及包括发光元件的发光装置 |
US13/090,645 US8872198B2 (en) | 2010-04-20 | 2011-04-20 | Luminaire and light-emitting apparatus with light-emitting device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010096744 | 2010-04-20 | ||
JP2010096744 | 2010-04-20 | ||
JP2010138766A JP5522462B2 (ja) | 2010-04-20 | 2010-06-17 | 発光装置及び照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011243935A JP2011243935A (ja) | 2011-12-01 |
JP5522462B2 true JP5522462B2 (ja) | 2014-06-18 |
Family
ID=44305041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010138766A Expired - Fee Related JP5522462B2 (ja) | 2010-04-20 | 2010-06-17 | 発光装置及び照明装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8872198B2 (zh) |
EP (1) | EP2381157A3 (zh) |
JP (1) | JP5522462B2 (zh) |
CN (1) | CN102237350B (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012204510A1 (de) * | 2011-11-18 | 2013-05-23 | Tridonic Jennersdorf Gmbh | Rohrförmige LED-Lampe |
EP2634480B1 (en) * | 2011-11-21 | 2016-09-28 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting apparatus and illuminating apparatus |
CN102543983A (zh) * | 2011-12-09 | 2012-07-04 | 安徽莱德光电技术有限公司 | 一种led集成光源 |
CN102738349A (zh) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | 一种封装基板 |
CN102738320A (zh) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | 一种封装框架 |
CN102734698A (zh) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | 一种led路灯 |
JP2013125808A (ja) * | 2011-12-14 | 2013-06-24 | Koito Mfg Co Ltd | 発光モジュール |
JP2015092519A (ja) * | 2012-02-27 | 2015-05-14 | シャープ株式会社 | 発光装置 |
JP5216948B1 (ja) * | 2012-03-13 | 2013-06-19 | パナソニック株式会社 | 基板、発光装置及び照明装置 |
CN103430339B (zh) * | 2012-03-13 | 2014-09-10 | 松下电器产业株式会社 | 基板、发光装置以及照明装置 |
GB2501758B (en) * | 2012-05-04 | 2016-05-25 | Thorpe F W Plc | Improvements in or relating to LED lighting |
JP5995541B2 (ja) * | 2012-06-08 | 2016-09-21 | Idec株式会社 | 光源装置および照明装置 |
DE102012214887A1 (de) * | 2012-08-22 | 2014-02-27 | Ridi - Leuchten Gmbh | LED-Flächenstrahler |
CN203932097U (zh) * | 2012-08-23 | 2014-11-05 | 松下电器产业株式会社 | 发光装置、照明用光源以及照明装置 |
JP2014049625A (ja) * | 2012-08-31 | 2014-03-17 | Panasonic Corp | Ledモジュール |
ITTO20120841A1 (it) * | 2012-09-27 | 2014-03-28 | Osram Ag | Procedimento per montare moduli di illuminazione e relativo equipaggiamento |
JP5942263B2 (ja) * | 2012-11-29 | 2016-06-29 | パナソニックIpマネジメント株式会社 | 発光モジュールおよび当該発光モジュールを用いた照明用光源 |
JP2014107495A (ja) * | 2012-11-29 | 2014-06-09 | Seiwa Electric Mfg Co Ltd | 発光装置 |
JP2014116526A (ja) * | 2012-12-12 | 2014-06-26 | Puratekku:Kk | 基板、ledユニット及び当該基板、ledユニットを備えた照明器具 |
US20140264423A1 (en) * | 2013-03-15 | 2014-09-18 | Grote Industries, Llc | Flexible lighting device including a protective conformal coating |
TWI564505B (zh) * | 2013-08-28 | 2017-01-01 | 隆達電子股份有限公司 | 燈條結構 |
KR102430999B1 (ko) * | 2015-06-24 | 2022-08-10 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 광원 모듈 |
US20170268752A1 (en) * | 2016-03-17 | 2017-09-21 | Amerillum LLC | Illumination Systems with LED-Based Extension Light Source |
US11359797B1 (en) * | 2020-11-20 | 2022-06-14 | Advanced Lighting Concepts, LLC | Chip-on-board LED lighting devices |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0294673A (ja) * | 1988-09-30 | 1990-04-05 | Toshiba Lighting & Technol Corp | 発光ダイオードアレイ |
JP2002299694A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | 照明用led光源デバイス及び照明器具 |
EP2149906A3 (en) * | 2002-08-29 | 2014-05-07 | Seoul Semiconductor Co., Ltd. | Light-emitting device having light-emitting diodes |
CN2572501Y (zh) * | 2002-09-29 | 2003-09-10 | 王国忠 | 无反射腔的发光二极管点阵显示器 |
JP4479357B2 (ja) * | 2003-06-26 | 2010-06-09 | 富士ゼロックス株式会社 | レンズ付き発光素子、レンズ付き発光素子アレイ、自己走査型発光素子アレイ、書込みヘッドおよび光プリンタ |
US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
JP4923408B2 (ja) * | 2005-01-26 | 2012-04-25 | パナソニック株式会社 | 発光装置の製造方法 |
JP2008053571A (ja) * | 2006-08-28 | 2008-03-06 | Nichia Chem Ind Ltd | 発光装置およびそれを用いた面状発光装置 |
JP4678391B2 (ja) | 2006-08-29 | 2011-04-27 | 東芝ライテック株式会社 | 照明装置 |
US8148746B2 (en) * | 2006-09-29 | 2012-04-03 | Rohm Co., Ltd. | Semiconductor light emitting device |
KR20080038878A (ko) * | 2006-10-31 | 2008-05-07 | 삼성전자주식회사 | 광원장치와 이를 포함하는 액정표시장치 |
JP2008166081A (ja) | 2006-12-27 | 2008-07-17 | Toshiba Lighting & Technology Corp | 照明装置及びこの照明装置を備えた照明器具 |
JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
JP2009054989A (ja) | 2007-07-31 | 2009-03-12 | Sharp Corp | 発光装置、照明装置及び当該照明装置を備えたクリーンルーム |
JP2009088054A (ja) * | 2007-09-28 | 2009-04-23 | Toyoda Gosei Co Ltd | 線状発光装置及びその製造方法 |
WO2009141982A1 (ja) * | 2008-05-19 | 2009-11-26 | 株式会社 東芝 | 線状白色光源ならびにそれを用いたバックライトおよび液晶表示装置 |
US9634203B2 (en) * | 2008-05-30 | 2017-04-25 | Sharp Kabushiki Kaisha | Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device |
US20100181582A1 (en) * | 2009-01-22 | 2010-07-22 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof |
-
2010
- 2010-06-17 JP JP2010138766A patent/JP5522462B2/ja not_active Expired - Fee Related
-
2011
- 2011-04-18 EP EP11162869.9A patent/EP2381157A3/en not_active Withdrawn
- 2011-04-19 CN CN201110102112.4A patent/CN102237350B/zh not_active Expired - Fee Related
- 2011-04-20 US US13/090,645 patent/US8872198B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011243935A (ja) | 2011-12-01 |
CN102237350B (zh) | 2014-07-09 |
EP2381157A3 (en) | 2013-10-16 |
US8872198B2 (en) | 2014-10-28 |
US20110254023A1 (en) | 2011-10-20 |
EP2381157A2 (en) | 2011-10-26 |
CN102237350A (zh) | 2011-11-09 |
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