JP5519377B2 - Rotational force transmission mechanism and grinding device - Google Patents

Description

  The present invention relates to a rotational force transmission mechanism that transmits a rotational force from one rotational shaft having a different rotational axis to the other rotational shaft, and a grinding apparatus to which the rotational force transmission mechanism is applied.

  In a semiconductor device manufacturing process, a semiconductor wafer on which a plurality of circuits such as ICs and LSIs are formed is formed to have a predetermined thickness by grinding the back surface thereof with a grinding device before being divided into individual chips. In a grinding apparatus for grinding a back surface of a semiconductor wafer, a turntable rotatably disposed along a workpiece attaching / detaching area and a grinding area, and disposed on the turntable and sequentially moved to the grinding area. A plurality of chuck tables, and a grinding means provided with a grinding wheel that is disposed in the grinding zone and grinds a workpiece held on the chuck table positioned in the grinding zone (for example, a patent) Reference 1).

  In such a grinding apparatus, when the turntable is repeatedly rotated, the chuck table driving motor and the like are repeatedly rotated together with the turntable, so that the electric cable connected thereto is twisted. Be drawn around. As a result, there is a possibility that the device installed around the turntable may be entangled to damage the device or the electric cable may be disconnected. In order to solve these problems, the present applicant has proposed a grinding apparatus configured such that a chuck table portion rotated by a turntable and a drive motor of the chuck table can be attached and detached (for example, Patent Documents). 2).

Japanese Patent Laid-Open No. 10-086048 Japanese Patent Laid-Open No. 10-235558

  However, also in the grinding apparatus configured so that the chuck table portion described above and the chuck table drive motor and the like can be attached and detached, the rotation axis of the drive motor and the rotation axis of the chuck table are both fixed in the apparatus. Therefore, when the positions of the rotating shafts do not match, the rotational force generated by the drive motor is not smoothly transmitted to the chuck table (for example, not only the rotational force but also the horizontal force acts on the chuck table). ), Which has a problem of adversely affecting the processing.

  The present invention has been made in view of this point, and an object of the present invention is to provide a rotational force transmission mechanism and a grinding device that can smoothly transmit the rotational force of a drive motor to a chuck table.

The rotational force transmission mechanism according to the present invention has a first rotational axis extending in the Z-axis direction and an XY coordinate position where the first rotational axis exists when a plane perpendicular to the Z-axis direction is an XY plane. A second rotating shaft extending in the Z-axis direction at the XY coordinate position, and a connecting means for detachably connecting the first rotating shaft and the second rotating shaft, the first rotating shaft Or a rotational force transmission mechanism for transmitting the rotational force generated in one of the second rotational shafts to the other rotational shaft, wherein the connecting means is formed continuously at the tip of the first rotational shaft. A fixed plate, a movable plate disposed on the fixed plate so as to be slidable in the X-axis direction, and a connecting plate disposed on the movable plate so as to be slidable in the Y-axis direction perpendicular to the X-axis direction. And the tip of the second rotating shaft facing the connecting plate And the connecting plate which is formed continuously with said at least one coupling plate or the connection plate by moving in the Z axis direction possess a desorption unit to desorb each other, any of the coupling plate or the connecting plate One has an engaging pin, and the other has a plurality of recesses with which the engaging pins engage, and the positions of the connecting plate and the movable plate are adjusted by the engagement of the engaging pins with the recess. It is characterized by.

  According to the rotational force transmission mechanism, the connecting plate can be slid in the X-axis and Y-axis directions with respect to the fixed plate continuous with the first rotating shaft, and is configured to be detachable from the connected plate. Therefore, the first rotary shaft and the second rotary shaft can be coupled while absorbing the deviation amount between the axis of the first rotary shaft and the axis of the second rotary shaft. It becomes possible to transmit the rotational force from the rotating shaft to the other rotating shaft. By applying such a rotational force transmission mechanism to, for example, a semiconductor wafer grinding apparatus in which a chuck table portion and a chuck table drive motor are detachable, the axis of the passive shaft on the chuck motor side is temporarily assumed. Even if it is misaligned with the axis of the drive shaft on the drive motor side, it is possible to connect the drive shaft and the passive shaft while absorbing the shift amount, so that the rotational force of the drive motor can be smoothly applied to the chuck table. Can be communicated to.

In the rotational force transmission mechanism , it is preferable that the engagement pin is in a retracted state in a state where the engagement pin is not opposed to the concave portion, and is in a protruding state in a state opposed to the concave portion .

  In the grinding apparatus of the present invention, a holding mechanism having a holding surface for holding a workpiece, the first rotating shaft is a driving shaft that generates a rotating force by a driving source, and the second rotating shaft is the first rotating shaft. A rotational force transmission mechanism of the above aspect which is a passive shaft that rotates the holding surface in response to transmission of rotational force from one rotating shaft, and a grinding mechanism that grinds the workpiece held on the holding surface. It is characterized by.

  According to the above grinding apparatus, even if the axis of the passive shaft and the axis of the driving shaft are misaligned, the driving shaft and the passive shaft can be coupled while absorbing the shift amount by the rotational force transmission mechanism. Since the rotational force of the driving shaft can be smoothly transmitted to the passive shaft, the rotational force of the drive source (for example, drive motor) can be smoothly transmitted to the holding member (for example, chuck table). Become.

  According to the present invention, the connecting plate can be slid in the X-axis and Y-axis directions with respect to the fixed plate continuous to the first rotating shaft, and is configured to be detachable from the connected plate. The first rotary shaft and the second rotary shaft can be connected while absorbing the deviation amount between the axis of the first rotary shaft and the axis of the second rotary shaft. Can be transmitted to the other rotating shaft. By applying such a rotational force transmission mechanism to, for example, a semiconductor wafer grinding apparatus in which a chuck table portion and a chuck table drive motor are detachable, the axis of the passive shaft on the chuck motor side is temporarily assumed. Even if it is misaligned with the axis of the drive shaft on the drive motor side, it is possible to connect the drive shaft and the passive shaft while absorbing the shift amount, so that the rotational force of the drive motor can be smoothly applied to the chuck table. Can be communicated to.

1 is an external perspective view of a grinding apparatus to which a rotational force transmission mechanism according to an embodiment of the present invention is applied. It is a sectional side view in AA shown in FIG. It is a disassembled perspective view of the rotational force transmission mechanism which concerns on the said embodiment. It is a perspective view of the rotational force transmission mechanism which concerns on the said embodiment. It is a bottom view of the passive axis | shaft of the rotational force transmission mechanism which concerns on the said embodiment. It is a sectional side view in BB shown in FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The rotational force transmission mechanism according to the embodiment of the present invention is coupled while absorbing the amount of deviation of the rotational axis between two rotational shafts having different rotational axes, whereby the rotational force from one rotational shaft is coupled to the other. Is smoothly transmitted to the rotating shaft.

  Below, the example which applied the rotational force transmission mechanism which concerns on this Embodiment to the grinding device which grinds the back surface of a semiconductor wafer is demonstrated. However, the target to which the rotational force transmission mechanism according to the present embodiment is applied is not limited to this, and includes two rotational shafts having different rotational axes, and the rotational force from one rotational shaft is obtained. It is possible to apply to any device that transmits to the other rotating shaft.

  FIG. 1 is an external perspective view of a grinding apparatus 1 to which a rotational force transmission mechanism according to an embodiment of the present invention is applied. In the following, the −X direction on the X axis shown in FIG. 1 will be referred to as the front side of the grinding apparatus 1 and the X direction will be referred to as the rear side of the grinding apparatus 1 as appropriate. In the following, the Z-axis direction shown in FIG. 1 will be referred to as the vertical direction of the grinding apparatus 1 as appropriate.

  As shown in FIG. 1, the grinding apparatus 1 has a base 2 having a generally rectangular parallelepiped shape. On the front side of the upper surface of the base 2, an operation panel 3 that receives instructions for the grinding device 1 is provided. On the rear side of the operation panel 3, a turntable 4 on which two chuck tables 41 (41a, 41b) are arranged is provided. A support column 5 is provided on the rear side of the turntable 4. A grinding unit 6 is supported on the front surface of the support column 5 so as to be movable in the vertical direction. The grinding apparatus 1 is configured to process the semiconductor wafer by relatively rotating the grinding unit 6 and the chuck table 41 holding the semiconductor wafer.

  In the present embodiment, a semiconductor wafer such as a silicon wafer or GaAs is described as an example of a workpiece (workpiece), but the present invention is not limited to this configuration, and is not limited to ceramic, glass, sapphire type. The workpiece may be an inorganic material substrate, a ductile material such as a plate-like metal or resin, or various processed materials that require flatness on the order of micron to submicron.

  The turntable 4 is formed in a large-diameter disk shape, and two chuck tables 41a and 41b are arranged on the upper surface at intervals of 180 degrees in the circumferential direction. The turntable 4 is connected to a rotation drive mechanism (not shown), and is intermittently rotated at 180 ° intervals in the direction D1 by the rotation drive mechanism. Accordingly, the two chuck tables 41a and 41b are provided between a grinding position where the semiconductor wafer is opposed to the grinding unit 6 and a repositioning position where the semiconductor wafer before processing is supplied while the semiconductor wafer after processing is recovered. Moved.

  The chuck table 41 constitutes a holding mechanism, is formed in a disc shape, and is formed with a holding surface 42 on which a semiconductor wafer is held. An adsorption surface is formed of a porous ceramic material at the central portion of the holding surface 42. The chuck table 41 is connected to a suction source (not shown) disposed in the base 2, and sucks and holds the semiconductor wafer on the suction surface of the holding surface 42. The chuck table 41 is connected to a rotational force transmission mechanism disposed in the base 2, and holds the semiconductor wafer on the holding surface 42 by the rotational driving force transmitted from the driving source via the rotational force transmission mechanism. It is rotated. This rotational force transmission mechanism will be described later.

  The support column 5 is provided in a rectangular parallelepiped shape, and a grinding unit moving mechanism 51 for moving the grinding unit 6 above the chuck table 41 is provided on the front surface thereof. The grinding unit moving mechanism 51 has a Z-axis table 52 that moves in the vertical direction with respect to the support column 5 by a ball screw type moving mechanism. The grinding unit 6 is supported on the Z-axis table 52 via a support portion 53 attached to the front side thereof.

  The grinding unit 6 constitutes a grinding mechanism, and has a grinding wheel 61 that is detachably attached to a lower end of a spindle (not shown). The grinding wheel 61 is composed of, for example, a diamond grinding stone in which diamond abrasive grains are hardened with a binder such as metal bond or resin bond.

  Here, the rotational force transmission mechanism 7 for rotationally driving the chuck table 41 will be described with reference to FIG. FIG. 2 is a side sectional view taken along line AA shown in FIG. As shown in FIG. 2, the rotational force transmission mechanism 7 is connected to a drive source such as a drive motor M, and generates a rotational force. The rotational force is transmitted from the rotational shaft 71 to the chuck table 41. A passive shaft 72 (72a, 72b) that rotates the holding surface 42 and a connecting mechanism 73 that removably connects the driving shaft 71 and the passive shaft 72 are configured. 2A shows a state where the driving shaft 71 and the passive shaft 72 are connected, and FIG. 2B shows a state where the connection between the driving shaft 71 and the passive shaft 72 is released. Show.

  The driving shaft 71 constitutes a first rotation shaft, and is disposed on the lower side of the chuck table 41 disposed at the grinding position. The passive shaft 72 constitutes a second rotation shaft, and is continuously provided on the lower surface of the chuck tables 41a and 41b, respectively, and together with the chuck tables 41a and 41b as the turntable 4 is repeatedly rotated. Rotate to. The connection mechanism 73 constitutes connection means, and connects the driving shaft 71 to the passive shaft 72 corresponding to the chuck table 41 arranged at the grinding position so as to be detachable.

  The coupling mechanism 73 includes a fixed plate 731 continuously formed at the tip (upper end) of the drive shaft 71, a movable plate 732 slidably disposed on the fixed plate 731 in the X-axis direction, and the movable plate. A connecting plate 733 slidably disposed in the Y-axis direction intersecting at right angles to the X-axis direction on the 732, and a cover plate formed opposite to the connecting plate 733 and continuously at the tip (lower end) of the passive shaft 72. The connecting plate 734 includes a connecting plate 734, and a connecting / disconnecting portion 735 that moves the connecting plate 733 in the vertical direction (Z-axis direction) and attaches / detaches the connecting plate 734.

  The detachable portion 735 is constituted by, for example, an elevating mechanism that raises and lowers the driving shaft 71 in the vertical direction (Z-axis direction), and raises the connection plate 733 to the connection position shown in FIG. 2A, while FIG. The connecting plate 733 is lowered to the connection release position shown in FIG. For example, the elevating mechanism includes a rack and pinion type elevating mechanism, and includes an elevating motor (not shown), a power transmission mechanism that transmits a driving force of the elevating motor, and a pinion and a rack that are coupled to the power transmission mechanism. . When the pinion is rotated via the power transmission mechanism, the rack that meshes with the pinion and is fixed to the driving shaft 71 is driven in the vertical direction (Z-axis direction) so that the driving shaft 71 can be moved up and down. In addition, the raising / lowering timing of the drive shaft 71 in this attaching / detaching portion 735 is controlled by a control portion (not shown) that controls the rotation of the turntable 4. The rotational force transmission mechanism 7 has such a configuration, and is connected to the passive shaft 72 of the chuck table 41 arranged at the grinding position by repeated rotation of the turntable 4 from the driving shaft 71 via the coupling mechanism 73. Transmits rotational force.

  Next, the configuration of the fixed plate 731, the movable plate 732, the connection plate 733, and the connected plate 734 included in the connection mechanism 73 will be described with reference to FIGS. 3 and 4 are an exploded perspective view and a perspective view of the rotational force transmission mechanism 7 according to the present embodiment, respectively. FIG. 5 is a bottom view of the passive shaft 72 of the rotational force transmission mechanism 7 according to the present embodiment. 3 and 4, the detaching portion 735 of the coupling mechanism 73 is omitted. In FIG. 5, for convenience of explanation, the engagement pin 733 b of the connection plate 733 is shown.

  The fixed plate 731, the movable plate 732, the connecting plate 733 and the connected plate 734 are provided in a disk shape having the same diameter. In addition, the flat portions (upper surface or lower surface) of the fixed plate 731, the movable plate 732, the connecting plate 733, and the connected plate 734 are flat surfaces, and all of them are provided in parallel. In the connection mechanism 73 according to the present embodiment, these plates 731 to 734 have the same shape for the convenience of design for engaging the guide portions, guide grooves, engagement pins, or engagement grooves provided on the respective plates 731 to 734. However, it is not limited to this. As long as the guide portions, guide grooves, engagement pins, or engagement grooves provided on the respective plates 731 to 734 can be appropriately engaged with each other, any different shapes may be used.

  The fixed plate 731 is continuously provided on the upper end of the driving shaft 71 so that the center thereof coincides with the axis of the driving shaft 71. A pair of guide portions 731 a is provided on the upper surface of the fixed plate 731 at a position equidistant from the center thereof. These guide portions 731a have the same length, and are provided extending along the X-axis direction.

  On the lower surface of the movable plate 732, a pair of guide grooves 732a are provided at positions equidistant from the center. These guide grooves 732a have the same length and are provided extending along the X-axis direction. The guide grooves 732a are provided so as to accommodate the guide portions 731a of the fixed plate 731 and are longer than the guide portions 731a. On the other hand, a pair of guide portions 732 b is provided on the upper surface of the movable plate 732 at a position equidistant from the center. These guide portions 732b have the same length and are provided extending along the Y-axis direction.

  A pair of guide grooves 733 a are provided on the lower surface of the connecting plate 733 at positions equidistant from the center. These guide grooves 733a have the same length and are provided extending along the Y-axis direction. The guide grooves 733a are provided so as to accommodate the guide portions 732b of the movable plate 732, and are longer than the guide portions 732b. On the other hand, a plurality (four in the present embodiment) of engagement pins 733b are provided on the upper surface of the connection plate 733 at positions equidistant from the center thereof. These engagement pins 733b are provided so as to slightly protrude from the upper surface of the connecting plate 733, and a tapered surface 733c is provided at the upper end portion thereof.

  These engagement pins 733b are accommodated in recesses 733e provided in the connection plate 733 via coil springs 733d (see FIG. 6). Thus, the engaging pin 733d is configured to retract into the recess 733e in accordance with the contact with the lower surface of the coupled plate 734, and to enter an engaging groove 734a of the coupled plate 734 described later.

  In the coupling mechanism 73, as shown in FIG. 4, the movable plate 732 is superimposed on the fixed plate 731 so that the guide portion 731a is accommodated in the guide groove 732a, and is coupled so that the guide portion 732b is accommodated in the guide groove 733a. The plate 733 is overlaid on the movable plate 732. Accordingly, the movable plate 732 is arranged on the fixed plate 731 so as to be slidable in the X-axis direction together with the connecting plate 733, and the connecting plate 733 is arranged on the movable plate 732 so as to be slidable in the Y-axis direction. In other words, in the coupling mechanism 73, the coupling plate 733 is configured to be slidable in the X-axis direction within a movable range of the guide portion 731a, and to be slidable in the Y-axis direction within a movable range of the guide portion 732b. Yes.

  The guide portion 731a of the fixed plate 731 and the guide groove 732a of the movable plate 732 are provided in a shape that can be engaged with each other in the vertical direction. This prevents the movable plate 732 from falling off the fixed plate 731. Similarly, the guide portion 732b of the movable plate 732 and the guide groove 733a of the connecting plate 733 are provided in a shape that can be engaged with each other in the vertical direction. Thereby, the connection plate 733 is prevented from falling off from the movable plate 732.

  On the other hand, the connected plate 734 is continuously provided at the lower end of the passive shaft 72 so that the center thereof coincides with the axis of the passive shaft 72. As shown in FIG. 5, a plurality of engaging grooves 734 a are provided in the vicinity of the outer peripheral edge portion on the lower surface of the coupled plate 734. These engagement grooves 734 a constitute recesses that engage with the engagement pins 733 b of the connecting plate 733, have an elliptical shape, and are provided radially from the center of the connected plate 734. Further, these engagement grooves 734 a are arranged at equal intervals, and are provided so as to accommodate the four engagement pins 733 b of the connection plate 733.

  In the rotational force transmission mechanism 7 according to the present embodiment, the coupling mechanism 73 is configured so that the coupling plate 733 is slidable in the X-axis and Y-axis directions. Even if they are deviated from the axis of the activation shaft 71, they can be coupled while absorbing the deviation by the coupling mechanism 73. Thereby, it becomes possible to smoothly transmit the rotational force of the driving shaft 71 to the passive shaft 72 arranged at a position where the axis is displaced.

  Hereinafter, a specific example in which the coupling mechanism 73 performs coupling while absorbing the shift amount between the axis of the passive shaft 72 and the axis of the driving shaft 71 will be described. 6 is a side cross-sectional view taken along line BB shown in FIG. 6 shows a state in which the axis of the passive shaft 72 is deviated in the −X direction from the axis of the driving shaft 71 for convenience of explanation. 6A shows a state in which the coupling between the driving shaft 71 and the passive shaft 71 is released, and FIG. 6B shows a state in which the driving shaft 71 and the passive shaft 71 are connected. Yes.

  As shown in FIG. 6A, when the shaft center of the passive shaft 72 is shifted in the −X direction from the shaft center of the drive shaft 71, the drive shaft 71 is moved upward by the attachment / detachment portion 735 of the coupling mechanism 73. When moved to the side, the engaging pin 733 b of the connecting plate 733 reaches the lower surface of the connected plate 734. As shown in FIG. 6A, when the engagement pin 733b is slightly shifted from the position where it is accommodated in the engagement groove 734a of the connected plate 734, the engagement pin 733b is provided at the upper end of the engagement pin 733b. The positions of the connecting plate 733 and the movable plate 732 are adjusted by the contact between the tapered surface 733c and the side surface of the engaging groove 734a. In this case, the position of the movable plate 732 is adjusted in the direction of the arrow D2 shown in FIG. 6B by the contact between the tapered surface 733c of the engagement pin 733b and the side surface of the engagement groove 734a. The

  When the movable plate 732 and the connecting plate 733 are adjusted to the position where they enter the engaging groove 734a, the engaging pin 733b is accommodated in the engaging groove 734a, and the connecting plate 733, the connected plate 734, and the like. Are connected. When the driving shaft 71 rotates in this state, the engaging pin 733 b and the engaging groove 734 a are engaged, and the rotational force is transmitted to the passive shaft 72.

  Here, FIG. 6 illustrates the case where the axis of the passive shaft 72 is deviated in the −X direction from the axis of the activation shaft 71. Similarly, the axis of the passive shaft 72 is activated. Even when the axis 71 is displaced in the X direction, Y direction, or -Y direction, or when these directions are combined and shifted, the engaging pin 733b is appropriately connected to the movable plate 732 and the connecting plate. The connecting plate 733 and the connected plate 734 can be brought into a connected state by adjusting the position of 733, and the rotational force of the driving shaft 71 can be transmitted to the passive shaft 72.

  As described above, in the rotational force transmission mechanism 7 according to the present embodiment, the connecting plate 733 is slidable in the X-axis and Y-axis directions with respect to the fixed plate 731, and is attached to and detached from the connected plate 734. Since the configuration is possible, even if the axis of the passive shaft 72 is deviated from the axis of the activation shaft 71, these can be coupled while absorbing the deviation amount by the coupling mechanism 73. Therefore, the force acting in the horizontal direction on the passive shaft 72 can be relaxed, and the rotational force of the driving shaft 71 can be smoothly transmitted to the passive shaft 72. As a result, the rotational force of the drive motor M can be smoothly transmitted to the chuck table 41.

  In particular, in the rotational force transmission mechanism 7 according to the present embodiment, the engagement pin 733b that engages with the engagement groove 734a is provided on the connection plate 733 that can slide in the X-axis direction and the Y-axis direction. The movable plate 732 and the connecting plate 733 can be adaptively slid according to the amount of deviation between the axis of the passive shaft 72 and the axis of the driving shaft 71, and the connecting plate 733 and the connected plate 734 can be appropriately moved. It becomes possible to connect.

  Further, in the rotational force transmission mechanism 7 according to the present embodiment, since the tapered surface 733c is provided at the tip of the engaging pin 733b, the engaging pin 733b is brought into contact with the side surface of the engaging groove 734a. It is possible to facilitate entry into the engagement groove 734a. As a result, the connecting plate 733 and the connected plate 734 can be easily connected.

  In addition, when the driving shaft 71 is moved upward by the detachable portion 735, there may occur a case where the engaging pin 733b abuts on the lower surface between the engaging grooves 734a of the connected plate 734 and cannot enter the engaging groove 734a. . However, also in this case, by rotating the driving shaft 71, the engaging pin 733b can be entered into the engaging groove 734a, and the connecting plate 733 and the connected plate 734 can be connected. That is, when it cannot enter the engaging groove 734a, the engaging pin 733b is retracted to the recess 733e against the urging force of the coil spring 733d. Then, when the activation shaft 71 is rotated, the engagement shaft 734a is opposed to the engagement groove 734a and protrudes from the recess 733e according to the urging force of the coil spring 733d, and enters the engagement groove 734a. Thus, the engagement pin 733b can be advanced into the engagement groove 734a, and the connecting plate 733 and the connected plate 734 are connected.

  As described above, in the rotational force transmission mechanism 7 according to the present embodiment, not only when a part of the engagement pin 733b is disposed to face the engagement groove 734a, but also the engagement groove 734a in the coupled plate 734. Even in the case of abutting against the lower surface, the connecting plate 733 and the connected plate 734 can be connected. As a result, it is possible to connect the activation shaft 71 and the passive shaft 72 flexibly so as to correspond to the positional relationship between the activation shaft 71 and the passive shaft 72 without requiring alignment of the activation shaft 71 and the passive shaft 72.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the rotational force transmission mechanism 7 of the above embodiment, the case where the detaching portion 735 of the connecting mechanism 73 moves the connecting plate 733 in the Z-axis direction and attaches / detaches to the connected plate 734 has been described. The configuration of the mechanism 73 is not limited to this, and can be changed as appropriate. For example, the attaching / detaching portion 735 may be provided on the passive shaft 72 side, and the connected plate 734 may be moved in the Z-axis direction to be attached to and detached from the connecting plate 733.

  Further, in the rotational force transmission mechanism 7 of the above embodiment, the case where the coupling pin 73 is provided with the engagement pin 733b that engages with the engagement groove 734a of the coupled plate 734 in the coupling mechanism 73 is described. The configuration of the coupling mechanism 73 is not limited to this, and can be changed as appropriate. For example, an engaging pin may be provided on the connected plate 734 while an engaging groove with which the engaging pin is engaged may be provided on the connecting plate 733.

  Further, in the rotational force transmission mechanism 7 of the above embodiment, the connection plate 733 and the connection target plate 734 are connected by engaging the engagement pin 733b and the engagement groove 734a in the connection mechanism 73. Although described, the structure for connecting the connecting plate 733 and the connected plate 734 is not necessarily limited to this. Any connection structure can be adopted as long as the movable plate 732 and the connection plate 733 can be slid according to the amount of deviation between the axis of the drive shaft 71 and the axis of the passive shaft 72.

  As described above, according to the present invention, the rotational force from one rotating shaft is smoothly applied to the other rotating shaft by connecting the two rotating shafts having different rotating shafts while absorbing the shift amount of the rotating shaft center. In particular, the present invention is useful for a rotational force transmission mechanism and a grinding apparatus that transmit rotational force detachably to a chuck table when a semiconductor wafer is ground.

DESCRIPTION OF SYMBOLS 1 Grinding device 2 Base 3 Operation panel 4 Turntable 41, 41a, 41b Chuck table (holding mechanism)
42 Holding surface 5 Supporting part 51 Grinding unit moving mechanism 52 Z-axis table 53 Supporting part 6 Grinding unit (grinding mechanism)
7 Rotational force transmission mechanism 71 Driving shaft (first rotating shaft)
72, 72a, 72b Passive shaft (second rotation shaft)
73 Connection mechanism (connection means)
731 Fixed plate 731a Guide portion 732 Movable plate 732a Guide groove 732b Guide portion 733 Connection plate 733a Guide groove 733b Engagement pin 733c Tapered surface 733d Coil spring 733e Recess 734 Connected plate 734a Engagement groove (recess)
735 Desorption part

Claims (3)

When the first rotation axis extending in the Z-axis direction and the plane perpendicular to the Z-axis direction are the XY plane, the XY coordinate position deviates from the XY coordinate position where the first rotation axis exists in the Z-axis direction. A second rotating shaft extending; and a connecting means for detachably connecting the first rotating shaft and the second rotating shaft, wherein either the first rotating shaft or the second rotating shaft A rotational force transmission mechanism for transmitting the generated rotational force to the other rotational shaft;
The connecting means includes a fixed plate formed continuously at a tip of the first rotating shaft, a movable plate disposed on the fixed plate so as to be slidable in the X-axis direction, and an X on the movable plate. A connecting plate arranged to be slidable in the Y-axis direction intersecting at right angles to the axial direction; a connected plate formed opposite to the connecting plate and continuously formed at the tip of the second rotating shaft; and the connecting plate or at least one of connected plates were movable in the Z-axis direction possess a desorption unit desorbing each other, an engagement pin on one of the coupling plate or the connecting plate, the engagement with the other A rotational force transmission mechanism having a plurality of recesses with which pins are engaged, and adjusting the positions of the connecting plate and the movable plate by engaging the engagement pins with the recesses . The rotational force transmission mechanism according to claim 1, wherein the engagement pin is in a retracted state in a state where the engagement pin is not opposed to the concave portion, and is in a protruding state in a state opposed to the concave portion. A holding mechanism having a holding surface for holding a work; and the first rotating shaft is a driving shaft that generates a rotating force by a driving source, and the second rotating shaft transmits a rotating force from the first rotating shaft. The rotational force transmission mechanism according to claim 1 or 2 and a grinding mechanism for grinding the work held on the holding surface. Grinding equipment.

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