JP2010188488A - Double-side grinding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double-side grinding device normally stably transmitting the rotational force to a holding carrier while reducing the possibility of breakage (fracture). <P>SOLUTION: Both grinders 19, 39 are freely rotatably provided around the axes of rotation 10A, 20A located on the same line, and a pair of grinder driving means 14, 25 for respectively rotating the grinders around the axes of rotation are provided in an individually drive-controllable manner. A holding carrier 80 is freely detachably connected to a ring-shaped rotating body 50 around the offset axis 50A which is support-guided on a body frame 1 side and displaced with respect to the axes of rotation via a connector 70, and a rotating body driving means 60 for rotating the rotating body is provided. The rotation of the rotating body around the offset axis 50A can be reliably executed through the rigidity without any breakage. Further, the rotational force to the holding carrier is integrally transmitted with the rotating body via the connector in a constant and consistent manner by reducing breakage (fracture) of the holding carrier. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a double-side polishing apparatus used for polishing both surfaces of various workpieces such as glass plates for liquid crystals, metal plates, semiconductor silicon substrates, ceramic substrates, and the like.

  Conventionally, in a state of sandwiching both surfaces of a workpiece held by a holding carrier, a pair of polishing discs and a double-side polishing apparatus provided with an approaching / separating means for relatively moving these polishing discs, As a form for rotating (rotating) the holding carrier, the following configuration is provided.

  That is, a pair of rotating surface plates for polishing both surfaces of the workpiece, a plurality of gear-type carriers that are arranged around the rotation center between the pair of rotating surface plates, each holding the workpiece eccentrically, and a pair of rotating surface plates A center gear that is arranged at the center of rotation between the boards, meshes with a plurality of carriers arranged around and rotates the plurality of carriers synchronously, and distributed around the plurality of carriers corresponding to each carrier, Each has a plurality of rotation means that mesh with the inner carrier and rotate the carrier while holding the carrier in a fixed position together with the center gear. Each rotating means meshes with the carrier at one position or two or more positions, and the tooth traces are configured to rotate the carrier with one or a plurality of rotating gears along the rotation axis (see, for example, Patent Document 1). ).

JP 2000-237953 A (Page 3, FIG. 1, FIG. 2, FIG. 4, FIG. 7) Japanese Patent Laid-Open No. 2000-237954 Japanese Patent Laid-Open No. 2005-205585

  However, according to the above-described conventional configuration, each carrier is configured to transmit the rotational force by the planetary gear type that directly meshes with the center gear and the rotation means inside and outside, and therefore the tooth portion breaks with the progress of use. There is a fear. Especially when the carrier is made of a low-strength resin material to protect the workpiece, or when the carrier is thinly formed to correspond to a thin workpiece, the tooth part will easily break (break), and the resin material Thin carriers made of metal are difficult to adopt.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a double-side polishing apparatus capable of constantly and stably reducing the breaking (breaking) of the rotational force transmitted to the holding carrier. It is.

  In order to achieve the above-mentioned object, a double-side polishing apparatus according to claim 1 of the present invention is arranged with a pair of polishing disks in a state where both surfaces of a workpiece held by a holding carrier are sandwiched, A double-side polishing apparatus provided with an approaching / separating means for relatively moving toward and away from each other, wherein both polishing discs are provided so as to be rotatable around a rotation axis located on the same line, and both polishing discs are provided as rotary shafts. A pair of polishing disk driving means for rotating each around the core is provided so as to be individually controllable, and the holding carrier is supported and guided on the main body frame side and displaced with respect to the rotation axis. A rotating body driving means for rotating the rotating body and a ring-shaped rotating body rotatable around the rotating body is provided.

  Therefore, according to the first aspect of the present invention, the workpiece is set on the holding carrier in a state where the two polishing discs are relatively separated by the approaching / separating means, and in this state, the two polishing discs are relatively moved by the approaching / separating means. By bringing them closer, each polishing disk can be brought into contact with both surfaces of the workpiece. Before and after such contact, both polishing disc drive means are operated to rotate both polishing discs around the rotation axis, and the rotary body drive means is operated to eccentric the rotation body about the eccentric axis. Rotate. Therefore, by applying a load by the approaching / separating means in this state, the drive rotation around the rotation axis of the polishing disc and the drive rotation around the eccentric axis of the workpiece can be applied to both surfaces of the workpiece. Polishing can be performed. At that time, by controlling (adjusting) the rotation speed (drive) separately, the polishing speed of the upper polishing machine and the workpiece and the polishing speed of the lower polishing machine and the workpiece are made constant. obtain. The rotation (rotation) around the eccentric shaft center of the rotating body can be made rigid without causing breakage, and the rotational force can be transmitted to the holding carrier integrally with the rotating body via a connector. .

  According to the first aspect of the present invention described above, after the two polishing disks are relatively separated by the approaching / separating means, the two polishing disks are relatively moved by the approaching / separating means in a state where the workpiece is set on the holding carrier. By bringing them closer, each polishing disk can be brought into contact with both surfaces of the workpiece, and before and after such contact, both polishing disks are operated to rotate both polishing disks around the rotation axis. In addition, the rotating body driving means can be operated to rotate the rotating body eccentrically around the eccentric axis. Therefore, by applying a load by the approaching / separating means in this state, the drive rotation around the rotation axis of the polishing disc and the drive rotation around the eccentric axis of the workpiece can be applied to both surfaces of the workpiece. Polishing can be performed. At that time, by controlling (adjusting) the rotation speed (drive) separately, the polishing speed between the upper polishing machine and the workpiece and the polishing speed between the lower polishing machine and the workpiece are made constant. Thus, the contact of the polishing disk can be performed uniformly over the entire surface and at a constant polishing rate, so that a uniform polishing process with no polishing residue can be performed.

  The rotation (rotation) around the eccentric shaft center of the rotating body can be reliably performed by making it rigid without causing breakage, and the transmission of the rotational force to the holding carrier is performed via the coupling tool. Can be carried out as a single piece, and the holding carrier can be broken (broken) and the like can be reduced and always carried out stably. As a result, even if the holding carrier is made of a low-strength resin material to protect the workpiece, or if it is thinly formed corresponding to a thin workpiece, the tooth portion is easily broken (broken). Therefore, a thin holding carrier made of a resin material can be easily adopted.

BRIEF DESCRIPTION OF THE DRAWINGS It is Embodiment 1 of this invention, and is a vertical side view of a double-side polish apparatus. It is a partially cutaway front view of the double-side polishing apparatus. It is a top view of the double-side polishing apparatus. It is a cross-sectional plan view of the double-side polishing apparatus. It is a vertical side view of the principal part of the double-side polishing apparatus. It is a vertical side view of the rotary body support part of the double-side polishing apparatus. FIG. 5 is a cross-sectional plan view of a double-side polishing apparatus according to a second embodiment of the present invention.

[Embodiment 1]
Below, Embodiment 1 of this invention is demonstrated based on FIGS.
1 to 3, reference numeral 1 denotes a main body frame, which is a box frame-shaped upper frame 2, a box frame-shaped lower frame 3, and a rear portion (between one side portion) of the upper frame 2 and the lower frame 3. The lower frame 3 has an opening 5 formed at the center of the upper plate 3a. An elevating body 6 is provided on the front side of the upper frame 2, and the elevating body 6 is supported by a sliding guide body 7 provided on the front surface of the upper frame 2 and a vertical rail body 8 provided on the rear surface. Thus, the upper frame 2 is configured to be movable up and down. The main body frame 1 is provided with a vertical upper rotary shaft 10 and a lower rotary shaft 20, and these rotary shafts 10, 20 are rotary axes 10 A, 10 A, It is configured to be rotatable around 20A.

  That is, the upper rotary shaft 10 is rotatably supported by the upper cylinder 11 via the bearing 12, and the upper cylinder 11 is connected to the lower part of the elevating body 6. An upper polishing disc (an example of a polishing disc) 19 is linked to the lower end of the upper rotary shaft 10 via a connecting member 13, and an upper polishing disc drive means (polishing) is connected to the upper end of the upper rotary shaft 10. An example of the panel driving means 14 is connected. That is, the upper polishing disk drive means 14 includes a rotation drive device (motor) 15 disposed in the elevating body 6, a transmission device 16 integrated with the rotation drive device 15, and an output shaft 17 from the transmission device 16. And a connecting member 18 that interlocks and connects the upper end of the upper rotary shaft 10.

  Therefore, the upper polishing disc 19 can be rotated around the rotation axis 10 </ b> A through the output shaft 17, the upper rotation shaft 10, and the like by driving the rotation driving device 15. At this time, the upper polishing disk drive means 14 is set so as to drive and rotate the upper polishing disk 19 with the clockwise direction as the rotation direction 19K in plan view. The rotational speed of the upper polishing disk 19 is set by the transmission 16. It is configured to adjust (control). The above 15 to 18 and the like constitute one example of the upper polishing disc driving means 14.

  1 to 6, the lower rotary shaft 20 has a cylindrical shape, and a liquid supply pipe 21 is fitted in the central portion thereof so as to be integrally rotatable. The lower rotary shaft 20 is rotatably supported by the lower cylindrical body 22 via a bearing 23. The lower cylindrical body 22 is inserted through the opening 5 and fixed to the upper plate 3a of the lower frame 3. . A lower polishing disc (an example of a polishing disc) 39 is connected to the upper end of the lower rotary shaft 20 via a connecting member 24, and a lower polishing disc driving means (a polishing disc) is connected to the lower end of the lower rotary shaft 20. An example of driving means) 25 is interlocked. That is, the lower polishing disk drive means 25 includes a rotation drive device (motor) 26 disposed in the lower frame 3, a transmission device 28 linked to the rotation drive device 26 via an endless linkage mechanism 27, and A drive wheel 30 provided on an output shaft 29 from the transmission 28, a passive wheel 31 fitted and fixed to the lower end of the lower rotary shaft 20, and an endless rotation hung between the two wheels 30,31. It consists of a moving body (timing belt, chain, etc.) 32 and the like.

  Accordingly, the lower polishing disk 39 can be rotated around the rotation axis 20A via the output shaft 29, the lower rotation shaft 20 and the like by driving the rotation driving device 26. At that time, the lower polishing disk drive means 25 is set so as to drive and rotate the lower polishing disk 39 with the counterclockwise rotation direction as the rotation direction 39K in a plan view. It is comprised so that it may adjust (control) by. The above-described 26 to 32 and the like constitute an example of the lower polishing disc driving means 25.

  With the above-described configuration, both polishing discs 19 and 39 can be rotatably provided around the rotation axes 10A and 20A positioned on the same line, and both polishing discs 19 and 39 can be provided on the rotation axes 10A and 20A. The pair of polishing disk drive means 14 and 25 that are rotated around each other can be configured to be freely drive-controllable. A cleaning body 33 that is slidable in contact with the upper surface of the upper plate 3a is provided at an appropriate position on the outer surface of the lower polishing board 39.

  The liquid supply pipe 21 has an upper end opened to the upper surface of the lower polishing disc 39, and a liquid supply device (not shown) connected to the lower end via a rotary joint 35. Further, the lower surface side of the lower polishing board 39 is received by a slide receiving base 9 provided on the upper plate 3 a of the lower frame 3. In the slide cradle 9, an oil supply path 36 for supplying oil is formed between the lower surface of the lower polishing board 39 and the upper surface of the slide cradle 9, and an oil supply device 37 connected to the oil supply path 36. Is provided on the lower frame 3.

An approaching / separating means 40 for relatively moving the both polishing discs 19 and 39 closer to and away from each other is provided. The approaching / separating means 40 includes a pair of left and right cylinder devices 41, the cylinder body 42 is connected to the upper frame 2, and the downward piston rod 43 is connected to the elevating body 6 via a connecting member 44. An example of this is configured. Therefore, both the cylinder devices 41 are synchronously expanded and contracted, the guide rail 8 is supported and guided via the sliding guide body 7 and the lifting body 6 is moved up and down, so that the upper polishing disk is moved relative to the lower polishing disk 39. 19 can be moved close to and away from.

  A ring-shaped rotating body 50 is provided so as to be fitted on the lower polishing disc 39, and the rotating body 50 is supported and guided on the main body frame 1 side and displaced with respect to the rotating shafts 10A and 20A. It is configured to be rotatable around the core 50A. That is, the rotating body 50 has a cylindrical ring shape, and an outward flange portion 50a is integrally formed on the outer surface side, and an inward flange portion 50b is integrally formed on the inner surface side. In addition, rotation support portions 51 are provided at a plurality of locations in the circumferential direction outside the rotating body 50. These rotation support portions 51 are provided on a support body 52 provided on the upper plate 3a of the lower frame 3, and are provided on the side of the support body 52 so as to be freely rotatable via a horizontal shaft 53. A receiving roller 54 which can be supported from below, a guide roller 56 which is provided on the side of the support 52 so as to be freely rotatable via a longitudinal axis 55 and which can be in contact with the outward flange 50a from the outside, and this guide An example is configured by an adjustment unit 57 that can adjust the contact position of the roller 56.

  Rotating body driving means 60 for rotating the rotating body 50 around the eccentric axis 50A is provided. That is, an annular passive gear 61 that is externally fitted to the rotating body 50 and placed on the outward flange 50a is connected to the outward flange 50a. A rotation drive device (motor) 62 is provided on the upper plate 3 a of the lower frame 3, and is always meshed with the passive gear 61 by an upward output shaft 64 from a transmission 63 integrated with the rotation drive device 62. A driving gear 65 is provided.

  Therefore, by driving and rotating the drive gear 65 by the rotation drive device 62, the rotating body 50 can be rotated (rotated) around the eccentric axis 50A via the passive gear 61, and the rotation can be performed by the receiving roller 54 or the guide. It can always be stably performed by the support guide of the rotation support portion 51 group composed of the rollers 56. At this time, the rotating direction 50K of the rotating body 50 is set to be the same as the rotating direction 39K of the lower polishing board 39, and is set to the counterclockwise rotating direction in a plan view. It is comprised so that it may adjust (control) by. An example of the rotating body driving means 60 is configured by the above 61-65 and the like.

  In this way, the workpiece (polishing object) 85 is provided on the rotary body 50 that is supported and guided on the main body frame 1 side and can be rotated around the eccentric axis 50A displaced with respect to the rotary axes 10A and 20A. A holding carrier 80 that can be freely inserted and removed is detachably connected via a connector 70. That is, the connecting holes 50c are formed at a plurality of locations in the circumferential direction of the inward flange portion 50b of the rotating body 50. The coupling tool 70 is provided corresponding to each coupling hole 50c. The coupling tool 70 is screwed into a positioning pin 71 inserted into the coupling hole 50c from above and a lower screw portion of the positioning pin 71 to be inward. A nut body 72 fixed to the flange portion 50b, a spacer 73 that is externally fitted to the upper pin portion of the positioning pin 71 and is positioned on the inward flange portion 50b, and an upper pin portion of the positioning pin 71. The pressing body 74 is opposed to the spacer 73, and the pressing bolt body 75 is inserted into the pressing body 74 from above and can be screwed into the upper screw hole portion of the positioning pin 71.

  The holding carrier 80 has a disc shape, and a rectangular fitting hole 81 is formed in the center portion (setting position), and a rectangular plate-like workpiece 85 can be freely inserted into the fitting hole 81. Yes. The holding carrier 80 is integrally formed of a resin material in a state where connection holes 82 corresponding to the connection tool 70 are formed at a plurality of locations in the circumferential direction at the peripheral portion. Accordingly, the holding carrier 80 is externally fitted to the upper pin portion of the positioning pin 71 group via the connecting hole 82 group in a state in which the presser body 74 is removed by detachment of the presser bolt body 75, and then pressed to the upper pin portion. The body 74 can be externally fitted and the holding bolt body 75 can be tightened and screwed to hold the rotating body 50 via the connector 70 group. Accordingly, the pair of polishing discs 19 and 39 can be disposed in a state where both surfaces of the workpiece 85 held by the holding carrier 80 are sandwiched. An example of the connector 70 is configured by the above 71 to 75 and the like. A cover body 58 is provided at the peripheral edge of the upper plate 3a so as to cover the side and upper side of the rotation support section 51 group.

Hereinafter, the operation of the first embodiment will be described.
As shown in the solid line of FIG. 1 and FIG. 2, the lifting body 6 is raised by the contraction movement of the cylinder device 41 in the approaching / separating movement means 40, and the upper polishing disk 19 is lifted and separated from the lower polishing disk 39. The rectangular workpiece 85 can be set by fitting into the fitting hole 81 of the holding carrier 80. At this time, the workpiece 85 is brought into contact with the lower polishing disc 39 via its lower surface. Before fitting, the product (workpiece 85) polished in the previous process is taken out.

  In this state, the cylinder device 41 is extended and moved to lower the upper polishing plate 19 via the elevating body 6, so that the upper polishing plate 19 is moved relative to the upper surface of the workpiece 85 as shown by the phantom line in FIG. Can be abutted lightly. Before and after such contact, the rotary drive devices 15 and 26 of both polishing disc drive means 14 and 25 are operated to rotate both polishing discs 19 and 39 around the rotation axes 10A and 20A, and to rotate the rotating body. The rotation driving device 62 of the driving means 60 is operated to rotate the rotating body 50 eccentrically around the eccentric axis 50A, thereby performing desired polishing.

  That is, the rotation of the rotation driving device 15 in the upper polishing disk driving means 14 can be transmitted to the upper rotation shaft 10 via the transmission 16 and the output shaft 17, and the rotation of the upper rotation shaft 10 causes the upper polishing disk 19 to move. It can be driven to rotate around the rotation axis 10A. Further, the rotation of the rotation driving device 26 in the lower polishing disk driving means 25 can be transmitted to the transmission 28 via the endless interlocking mechanism 27, and the rotation of the output shaft 29 can be transmitted to the lower rotation shaft via the endless rotating body 32 or the like. 20, and the rotation of the lower rotary shaft 20 can drive and rotate the lower polishing disc 39 around the rotary axis 20 </ b> A. Further, the rotation of the rotary drive device 62 in the rotary body drive means 60 can be transmitted to the drive gear 65 via the transmission device 63, and further transmitted to the rotary body 50 via the passive gear 61, and the rotation of the rotary body 50 can be transmitted. Thus, the holding carrier 80 (workpiece 85) can be driven and rotated around the eccentric axis 50A.

  Therefore, in this state, by applying a load by the extension of the cylinder device 41, the driving rotation of the polishing discs 19 and 39 around the rotation axes 10A and 20A and the rotation of the workpiece 85 around the eccentric axis 50A are performed. By the driving rotation, polishing on both surfaces of the workpiece 85 can be performed. At this time, since the rotation direction 19K of the upper polishing disk 19 and the rotation direction 39K of the lower polishing disk 39 are opposite (reverse directions), the frictional force in the double-side polishing of the workpiece 85 can be offset.

  Further, the rotational speed (drive) of the output shafts 17, 29, 64 is controlled (adjusted) by the transmissions 16, 28, 63 separately, whereby the rotation direction 19K of the upper polishing disc 19 which is the opposite direction (reverse direction). And the polishing speed of the upper polishing disc 19 and the workpiece 85 in the rotation direction 50K of the holding carrier 80, the rotation direction 39K of the lower polishing disc 39 in the same direction, and the lower polishing disc 39 in the rotation direction 50K of the holding carrier 80 The polishing rate with the workpiece 85 can be made constant, so that the abutment of the polishing discs 19 and 39 can be made uniform across the entire surface and at a constant polishing rate, so that no polishing residue occurs. Uniform polishing can be performed. Furthermore, since both surfaces of the workpiece 85 are polished simultaneously, in the case of polishing a plate-like object, the distorted plate-like object can be polished into a flat surface.

  Then, the rotation (rotation) around the eccentric shaft 50A of the rotating body 50 is reliably performed through the passive gear 61 which is rigidized without causing breakage or the like by driving and rotating the driving gear 65 by the rotation driving device 62. Further, the rotation can be always stably performed by the support guide of the rotation support portion 51 group including the receiving roller 54 and the guide roller 56. Further, the transmission of the rotational force to the holding carrier 80 can be performed integrally with the rotating body 50 via the coupler 70, and the holding carrier 80 is prevented from being broken (broken), and is always stable. It can be carried out. As a result, even if the holding carrier 80 is made of a low-strength resin material to protect the workpiece 85 or is thinly formed corresponding to the thin workpiece 85, the tooth portion is easily broken. Therefore, the thin holding carrier 80 made of a resin material can be easily employed.

The polishing by the polishing machines 19 and 39 described above is performed on the upper surface of the lower polishing board 39 (the lower surface of the upper polishing board 19 in the same manner) from the liquid supply device via the rotary joint 35 and the liquid supply pipe 21. This is performed while supplying (polishing) oil polishing liquid. The rotation of the lower polishing plate 39 is caused by the oil supplied between the lower surface of the lower polishing plate 39 and the upper surface of the slide cradle 9 from the oil supply device 37 via the oil supply path 36. Can be supported more stably.
[Embodiment 2]
Next, a second embodiment of the present invention will be described with reference to FIG.

  That is, the disc-shaped holding carrier 80 is formed with rectangular fitting holes 81 at two places (a plurality of places) in the circumferential direction, and a small group of workpieces 85 are inserted through each. According to this, both surfaces of the group of workpieces 85 can be polished at the same time with more reliable elements for uniformly polishing. The number of workpieces 85 to be polished simultaneously and the size of the workpiece 85 are arbitrarily set.

  In the first embodiment described above, a roller type including the receiving roller 54 and the guide roller 56 is shown as the rotation support portion 51 of the rotating body 50, but this may be a bearing type.

In the first embodiment described above, a pressing clamp type through the pressing body 74 is shown as the connecting tool 70, but this may be a tightening type using only a screw body.
In the first embodiment described above, the gear transmission type is shown as the rotary body driving means 60 for rotating the rotary body 50, but this may be a chain transmission type or a belt transmission type.

  In the first and second embodiments described above, the rectangular plate-shaped workpiece 85 is polished, but this can handle workpieces of various shapes such as a round plate shape, and fits accordingly. The shape of the joint hole 81 is determined.

  In the first and second embodiments described above, a plurality of double-side polishing apparatuses may be installed, and various operations such as supply and extraction of the workpiece 85 may be performed by a common (one) robot. .

DESCRIPTION OF SYMBOLS 1 Main body frame 6 Lifting body 9 Slide receiving stand 10 Upper rotating shaft 10A Rotating shaft center 14 Upper polishing disk drive means (polishing disk drive means)
15 Rotation drive device 16 Transmission device 19 Upper polishing disk (polishing disk)
19K Rotating direction 20 Lower rotating shaft 20A Rotating axis 25 Lower polishing disk driving means (polishing disk driving means)
26 Rotating drive device 28 Transmission device 39 Lower polishing machine (polishing machine)
39K Rotation direction 40 Approaching / separating means 50 Rotating body 50a Outward flange portion 50b Inward flange portion 50c Connection hole 50A Eccentric shaft center 50K Rotation direction 51 Rotation support portion 60 Rotation body drive means 62 Rotation drive device 63 Transmission device 70 Connection tool 71 Positioning Pin 74 Holding Body 75 Holding Bolt Body 80 Holding Carrier 81 Fitting Hole 82 Connection Hole 85 Workpiece (Workpiece)

Claims (1)

  A double-side polishing apparatus in which a pair of polishing discs are arranged with both sides of a workpiece held by a holding carrier being sandwiched, and an approaching / separating means for moving these polishing discs relatively close to each other is provided. A disc is rotatably provided around a rotation axis centered on the same line, and a pair of polishing disc driving means for rotating both polishing discs individually around the rotation axis can be driven and controlled separately. The holding carrier is detachably connected via a connector to a ring-shaped rotating body that is supported and guided on the main body frame side and can be rotated around an eccentric shaft center that is displaced with respect to the rotation shaft center. In addition, a double-side polishing apparatus provided with a rotating body driving means for rotating the rotating body.

Images