JP5510226B2 - IC card manufacturing method and IC card by this manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing an IC card with external terminals and an IC card manufactured by the manufacturing method.

The IC card includes an IC card with an external terminal and an IC card without an external terminal specified by JIS.
An IC card with an external terminal is produced by forming a base for an IC card, forming a recess for embedding an IC module in the card base (hereinafter also referred to as mounting), and embedding the IC module to produce an IC card with an external terminal. .
Since the thickness of the substrate and the resin sealing portion of the IC module varies, the depth of the concave portion does not accurately match the thickness of the IC module, and as a result, at least the IC module mounting portion of the IC card with external terminals can be physically It will reduce the strength.

For example, as shown in FIG. 3, when the IC module 2 to be mounted on the second recess 12 formed in the card base 1 is thin, a gap is generated between the card base 1 and the IC module 2, so that the card base As a result, stress is easily applied to the gap portion of the IC module, and a crack occurs in the card base behind the IC module. For example, as shown in FIG. 4, when the IC module 2 mounted on the second recess 12 formed on the card base 1 is thick, an excessive pressure is applied to the IC module 2 when the IC module is mounted. Chip breakage or adhesion failure occurs.
In the example shown in FIG. 3, the depth of the first recess 11 for bonding the IC module 2 is the same as h1 in FIG. 6, but the depth of the second recess is h2-h1 (sealing resin 23 in FIG. 6). Is thicker). As a result, a gap is generated between the bottom of the second recess 12 and the sealing resin 23, and when the card base 1 is curved, the remaining card base portion of the second recess 12 is likely to crack.

  In the example shown in FIG. 4, the depth of the second recess 12 is shallower than h2-h1 in FIG. As a result, the entire IC module 2 protrudes from the surface of the card base 1, and the bonding state of the first recess 11 is incomplete. When the IC module 2 protrudes from the surface of the card base 1, the contacts of the IC card reader scrape the external terminal surface and damage the external terminal surface. It also induces poor contact and shortens the life of the external terminals.

  Therefore, in an IC card having an IC module having an IC chip that performs contact-type data communication with an external data read / write device via an external terminal, the IC module has an IC chip in the recess of the card base. In the IC card, the external terminals are embedded so as to be disposed on the outer surface of the card, and an elastic sheet is disposed at least between the IC chip and the card substrate in the recess (see, for example, Patent Document 1). .

JP 2006-18371 A

  In the invention of Patent Document 1, an elastic sheet is disposed between the IC chip in the recess formed on the card base and the card base. In this method, the card base is curved so that the elastic sheet is on the inside. Sometimes a force is applied to the card base on the back side of the IC module in the direction of pushing up the elastic sheet, and the card base in this portion is likely to crack.

  In order to solve the above-described problems, a first aspect of the IC card manufacturing method of the present invention is an IC card manufacturing method in which an IC module is mounted on a card base for an IC card in which a recess is formed. And a resin-sealed portion that covers at least the IC chip on the side on which the IC chip is mounted, the external terminal being formed on one surface of the substrate of the IC module, the IC chip being mounted on the other surface Forming a bonding portion on the surface of the substrate exposed on the side where the resin sealing portion of the IC module substrate is formed, and the thickness of the bonding portion including the substrate as a thickness A step of measuring and storing, a step of measuring and storing the thickness of the resin sealing portion of the IC module as a thickness including the substrate, and a card base on which the IC module is mounted. A first recess is formed with the thickness of the adhesive portion of the tape, a second recess is formed with the thickness of the resin sealing portion inside the first recess, and a bottom surface of the first recess, The IC module is fitted and bonded so that the bonding portions of the IC module face each other.

  In the second aspect, the thickness of the IC module is measured and the thickness information is stored in the storage unit at the stage where the concave portion is formed in the card base and the IC module is mounted. The thickness information of the IC module is read from the storage unit on the line to be formed, a recess is formed in the card base at a depth corresponding to the thickness, and the IC module is mounted on the card base in the next unit. It is characterized by that.

  In the third aspect, the module code printed on the IC module is read at the stage where the concave portion is formed on the card base in the first aspect, and is linked to the module code from the module thickness storage unit. The thickness information is read out, and a concave portion is formed in the card base at a depth corresponding to the thickness.

  Further, the fourth aspect is the first aspect, in which the thickness information of the IC module printed on the IC module is read at the stage where the recess is formed in the card base, and the card base corresponds to the thickness. A recess is formed at a depth.

  The IC card according to the fifth aspect is manufactured by the method for manufacturing an IC card according to any one of the first, second, third and fourth aspects.

1) As in the IC card manufacturing method of the present invention, by forming a recess that matches the thickness of the IC module to be mounted when forming the recess in the card base, there is no gap between the card base and the IC module. Since it does not occur, cracks due to stress are unlikely to occur in the card base, and there is no risk of the IC chip being destroyed due to excessive pressure applied to the IC module or the external terminal surface being damaged.
2) Further, like the IC card produced by the above-described IC card manufacturing method, when the concave portion is formed in the card base, the concave portion matching the thickness of the IC module is used, so that the card base and the IC module are Since there is no gap between them, the card base is unlikely to crack due to stress. In addition, there is no danger of the IC chip being destroyed or scratched on the external terminal surface due to excessive pressure applied to the IC module, and the durability of the IC card is improved.

It is a figure which shows one Embodiment of the IC card by the manufacturing method of the IC card of this invention. It is the sectional view on the AA line of FIG. It is a figure which shows an example of the cross section of the module part of the conventional IC card. It is a figure which shows another example of the cross section of the module part of the conventional IC card. It is a figure for demonstrating the recessed part formed in the card | curd base | substrate. It is a figure which shows an example of the cross section of IC module (COT) of this embodiment. It is a figure for demonstrating the thickness information or module code of the module printed on IC module (COT) of this embodiment. It is a figure for demonstrating 1st embodiment of the manufacturing method of the IC card of this invention. It is a figure for demonstrating 2nd embodiment of the manufacturing method of the IC card of this invention. It is a figure for demonstrating 3rd embodiment of the manufacturing method of the IC card of this invention.

Hereinafter, an embodiment of an IC card manufacturing method of the present invention and an embodiment of an IC card manufactured by this manufacturing method will be described with reference to the drawings.
FIG. 1 is an embodiment of an IC card 100 according to the present invention, which is an IC card with an external terminal (hereinafter also simply referred to as an IC card).
As an IC card with an external terminal, there is also a contact non-contact type IC card that has an antenna built in the card base and functions as a non-contact type IC card.
In the description of the IC card of the present embodiment, several methods for mounting the IC module 2 on the IC card base 1 without a gap and improving the strength around the IC module will be described.

The surface of the IC card 100 on which the IC module 2 is mounted is printed with a design or the like such as “IC card” which is the name of the card.
Although not shown, the magnetic stripe may be formed on the front or back of the IC card or on either side.
The IC module 2 is mounted at a position avoiding the center of the short side direction and the long side direction of the card base 1 so that it is difficult for stress to be applied to the IC module 2 when the card base 1 is bent in the short side direction and the long side direction. Is considered.

FIG. 2 shows a cross section taken along line AA of FIG.
The IC module 2 is formed on the IC card base 1 and is bonded and fixed to the first recess 11 serving as an adhesive portion by an adhesive sheet 3.
The card base 1 is mostly a laminate of non-conductive plastics. First, a first recess 11 serving as an adhesive portion is first formed by a cutting blade, and a second recess 12 is similarly cut inside the first recess 11. The IC module 2 is mounted by being formed by a blade.
The 2nd recessed part 12 is formed in the pot shape close | similar to the bowl shape shown in FIG. 2, and the shape of the sealing resin 23 of IC module.

Hereinafter, an IC module (hereinafter also referred to as COT) mounted on a card substrate will be described with reference to FIGS.
COT is an abbreviation of “Chip On Tape”. A through hole is not formed in the module substrate, a hole is formed in the IC module substrate, and the metal surface on the back of the external terminal exposed in the hole of the substrate and the pad electrode of the IC chip Is an IC module of a type in which these are connected with bonding wires. The adhesive sheet 3 placed in the first recess 11 serving as an adhesive portion is made of an adhesive material that is activated by heating and is bonded under pressure. As described above, the adhesive sheet 3 is formed on the surface of the first recess 11, and the card base 1 and the surface of the substrate 22 of the IC module (see FIG. 6) are joined via the adhesive sheet 3.

As shown in FIG. 5, the depth d1 of the first recess 11 and the depth d2 of the second recess 12 are the thickness h1 of the module substrate of the IC module 2 shown in FIG. 6 and the IC on which the sealing resin is formed. It is formed so as to correspond to the module total thickness h2.
h1 and h2 are measured by a cylinder-type contact-type displacement sensor or a laser displacement sensor, and the values of h1 and h2 are stored in a storage device electrically connected with a COT code, as will be described later. It is printed directly on the sealing resin surface of the COT with a machine reading code.
As a result of forming the first recess 11 and the second recess 12 based on h1 and h2, the IC module has an external terminal surface that is flush with the card substrate, and the bottom of the sealing resin 23 is the second surface. It is mounted on the card base so as to be in contact with the bottom surface of the recess 12.

Hereinafter, an embodiment of the IC card manufacturing method of the present invention will be described with reference to FIGS.
The adhesion of the IC module described in FIGS. 8, 9, and 10 to the card base (also simply referred to as “card” in the figure) will be described using an example in which an adhesive sheet that is activated by heat is used. Alternatively, an adhesive may be directly applied to the adhesive surface for adhesion.
The COT will be described on the assumption that the finished product is prepared in a reel form, and that the card substrate is prepared after the printing and laminating steps.

With reference to FIG. 8, a first embodiment of the IC card manufacturing method of the present invention will be described.
In order to manufacture an IC card, an IC card manufacturing apparatus including at least an IC module (COT) supply unit, a card base supply unit, a recess cutting unit, and an IC module mounting unit is used.

First, in step 1 (hereinafter referred to as S1), a card is punched out from a multi-faceted state. The card base punched out in S1 is temporarily stored (S2).
An adhesive sheet (which may be die-cut in the shape of the exposed surface of the first recess) die-cut to the size of the IC module on a COT (multi-sided strip-like IC module) wound up in a reel shape. Temporarily bonded to each IC module (S3).
The IC module is die-cut into a COT having a card mounting size (S4).
The COT that has been punched in S4 is stored (S5).

The card base 1 supplied (fed) from the card base supply unit of the IC card manufacturing apparatus waits for thickness information from the IC module thickness measurement unit in the cutting unit of the IC card manufacturing apparatus.
COT2 is supplied from the COT supply unit, and the thickness for forming the first recess (h1 = total thickness of the external terminal 21, the module substrate 22, and the adhesive sheet 3 shown in FIG. 6) is measured. Next, the thickness for forming the second recess (h2 shown in FIG. 6 = total thickness of the external terminal 21, the module substrate 22, and the sealing resin 23) is measured. (S11).
The measured COT thickness information is temporarily stored in the thickness information storage unit 5 of the IC card manufacturing apparatus.

The thickness information of the COT to be mounted is sent from the thickness information storage unit 5 to the above-described cutting unit, and a recess is formed in the card base 1 that has been on standby.
First, the first recess is cut with the aforementioned thickness h1, and then the second recess is cut with the aforementioned thickness h2 (S12).
The first concave portion and the second concave portion cut card base set in the same line merge with the IC module to be mounted, and the IC module is mounted on the card base (S13).
In the IC card manufacturing method according to the first embodiment, COT thickness measurement, recess formation on the card base, and COT mounting on the card base are performed in the same line.

A second embodiment of the IC card manufacturing method of the present invention will be described with reference to FIG.
In this embodiment, a module code (hereinafter referred to as COT code) 4 is printed on the exposed surface of the sealing resin 23 of the IC module (COT) 2 as shown in FIG.
Since the COT code 4 is read by a machine, it is printed by an optical reading character or an optical reading symbol. Although FIG. 7 shows an example of a QR code, it may be a bar code or a two-dimensional code other than the QR code. When the color of the surface of the sealing resin is dark, the back may be formed with a white pigment in advance.
The COT code 4 is printed by an inkjet printer or the like.

The card is punched into one card from the multi-faceted state (S21).
The card punched in S1 is temporarily stored (S22).
The COT wound in a reel shape is temporarily bonded to each COT with an adhesive sheet die-cut to the COT bonding size (S23).
The COT code is printed on the sealing resin exposed surface of the COT (S24).
Next, h1 and h2 described in the first embodiment are measured, the above-described COT code is linked, and thickness information for each COT code is stored in the thickness information storage unit 5 (S25).
The COT connected in a reel shape is punched into a COT having a card mounting size (S26).
The COT die-cut in S26 is stored (S27).
S26 and S27 are not provided, and the COT may be stored in a reel shape. In this case, S26 is incorporated before the next step (S31).

The card base 1 and the COT 2 that have been die-cut to the card size are sequentially fed out from the respective feed sections of the IC card manufacturing apparatus, and the card base waits for COT thickness information in the cutting unit.
The COT is fed out, the COT code printed on the COT is read (S31), the COT code is transmitted to the thickness information storage unit 5, and the thickness information of the COT associated with the COT code is read (S32). .
In the above-described cutting unit, based on the thickness information in S32, the first recess is cut in the card base, and then the second recess is cut (S33), as described in the first embodiment.
The COT is fitted into the recess of the card base 1 and mounted (S34).
A feature of the second embodiment is that the COT thickness measurement and the recess formation on the card substrate do not have to be performed on the same line. Further, since the amount of information printed on the sealing resin exposed surface is a COT code, a relatively small amount of information is required.

A third embodiment of the IC card manufacturing method of the present invention will be described with reference to FIG.
In this embodiment, as shown in FIG. 7, COT thickness information (hereinafter simply referred to as thickness information) is printed on the exposed surface of the sealing resin 23 of COT2.
Since the thickness information is read by a machine, it is printed with an optical reading character or an optical reading symbol, for example, a QR code or a two-dimensional code other than the QR code. When the color of the surface of the sealing resin is dark, the back may be formed with a white pigment in advance.
First, the card is punched out from a multi-faceted state onto a single card substrate (S21).
The card base punched out in S1 is temporarily stored (S22).
A COT wound in a reel shape is temporarily bonded to each COT with an adhesive sheet that has been die-cut to the size of the bonded portion of the COT (S23).
The thickness information h1 and h2 described in the first embodiment is measured (S40).
The thickness information measured in S40 is printed on the sealing resin exposed surface of the COT (S41).
The die is cut into a COT having a card mounting size (S42).
The COT that has been punched in S42 is temporarily stored (S43).

The card base 1 and the COT 2 that have been die-cut to the card size are sequentially fed out from the respective feed sections of the IC card manufacturing apparatus, and the card base waits for COT thickness information in the cutting unit.
COT is fed out from the above-mentioned feed unit, and COT thickness information printed on the COT is read (S51).
In the cutting unit described above, first, the first recess is cut in the card base as described in the first embodiment, and then the second recess is cut (S52).
A COT is mounted in the concave portion of the card substrate 1 (S53).
The feature of the third embodiment is that, as in the second embodiment, the COT thickness measurement and the recess formation on the card base do not have to be performed on the same line. Further, as in the second embodiment, an IC is used. There is no need to provide a storage unit for reading thickness information in the line of the card manufacturing apparatus.

It can be used as a method for manufacturing an IC card with external terminals.
Moreover, it can utilize for the IC card produced by this method.

1 Card base (card)
2 IC module (COT)
DESCRIPTION OF SYMBOLS 3 Adhesive sheet 4 COT code, thickness information 5 Thickness information storage part 11 1st recessed part 12 2nd recessed part 21 External terminal 22 Module board 23 Sealing resin 100 IC card

Claims (5)

An IC card manufacturing method for mounting an IC module on a card base for an IC card in which a recess is formed,
A stage where the card base is punched to a finished size;
An external terminal is formed on one surface of the substrate of the IC module, an IC chip is mounted on the other surface, and a resin sealing portion that covers at least the IC chip is formed on the side on which the IC chip is mounted;
A step of forming an adhesive portion on the substrate surface exposed on the side where the resin sealing portion of the IC module substrate is formed;
A step in which the thickness of the adhesive portion is measured and stored as a thickness including the substrate; a step in which the thickness of the resin sealing portion of the IC module is measured and stored as a thickness including the substrate;
A first recess is formed in the card base on which the IC module is mounted with the thickness of the adhesive portion of the IC module, and a second recess is formed with the thickness of the resin sealing portion inside the first recess. Stages,
A step in which the IC module is fitted and bonded to the bottom surface of the first recess so that the bonding portion of the IC module faces;
A method for producing an IC card, comprising: In the manufacturing method of the IC card according to claim 1,
At the stage where the concave portion is formed on the card base and the IC module is mounted, the thickness of the IC module is measured, the thickness information is stored in the storage unit, and the thickness information of the IC module from the storage unit on a parallel line. Is read out, a recess is formed in the card base at a depth corresponding to the thickness, and the IC module is mounted on the card base in the next unit. In the manufacturing method of the IC card according to claim 1,
At the stage where the concave portion is formed on the card base, the module code printed on the IC module is read, and the thickness information linked to the module code is read from the module thickness storage unit, and the thickness is read on the card base. A method of manufacturing an IC card, wherein a recess is formed at a depth corresponding to the thickness. In the manufacturing method of the IC card according to claim 1,
In the stage where the concave portion is formed in the card base, the thickness information of the IC module printed on the IC module is read, and the concave portion is formed in the card base at a depth corresponding to the thickness. Card manufacturing method. An IC card produced by the method for producing an IC card according to claim 1.

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