JP2021117791A - Contact/non-contact common use ic card and method for manufacturing contact/non-contact common use ic card - Google Patents

Abstract

To provide a contact/non-contact common use IC card with enhanced electrical connection reliability between an antenna and an IC module, and a method for manufacturing a contact/non-contact common use IC card.SOLUTION: A contact/non-contact common use IC card 1 includes: an IC module 7 having an IC chip 15 and a substrate 71 equipped with an external contact terminal 14 on one face thereof and a plurality of antenna connection terminals 71a, 71b on the other face; and a card substrate 2 incorporating an antenna 8 having two end parts 8a, 8b each of which electrically connected to a conductive block 11. The conductive block 11a (11b) is composed of a first portion 12a (12b) having a first thickness and a second portion 13a (13b) having a second thickness thicker than that, and the first and second portions are adjacent to each other. The first portion and the end part of the antenna are electrically connected, and the second portion and the antenna connection terminal are electrically connected via a conductive adhesion layer 10.SELECTED DRAWING: Figure 4

Description

The present invention relates to a contact and non-contact shared IC card including an external contact terminal and an antenna for non-contact communication.

Conventionally, as an IC card, a contact IC card that inputs and outputs an electric signal through an external contact terminal on the surface of the card, a non-contact IC card that inputs and outputs an electric signal by electromagnetic induction via an antenna, and a built-in card. A contact and non-contact shared IC card that can realize both the function of the contact IC card and the function of the non-contact IC card by a single IC chip is used. Among them, the contact and non-contact shared IC card can be used as a contact IC card that can suppress the external leakage of input / output data at the time of financial settlement by properly using one card, such as when entering / exiting a room or at a ticket gate at a station. It is highly convenient and is becoming more widespread, as it can be used as a non-contact IC card that can exchange data in close proximity to the card.

By the way, in general, in the manufacture of a contact and non-contact shared IC card, first, as described in Patent Document 1, an IC card substrate in which a core sheet or the like is laminated on both sides of an antenna sheet on which an antenna coil is formed is first manufactured. On the other hand, by cutting the end mill, a recess for mounting an IC module equipped with an external contact terminal and an IC chip is formed, and both ends of the antenna coil of the antenna sheet are exposed and used as a connection terminal.

Next, after applying a conductive adhesive so as to cover the upper part of the connection terminal, the IC module is attached via the adhesive, and the antenna connection terminal of the IC module and the connection terminals at both ends of the antenna coil are attached. The IC module is adhesively fixed to the IC card substrate so as to be electrically connected by the conductive adhesive. As a result, the IC chip built into the IC module is electrically connected to the external contact terminal, and is also electrically connected to the antenna via the antenna connection terminal, conductive adhesive, and connection terminal, so that the contact IC can be connected. It can be used as a contact and non-contact shared IC card that has the functions of both a card and a non-contact IC card.

Further, in Patent Document 2, a connection pad having a first portion and a second portion electrically connected to each other at each of two ends of an antenna arranged between two layers of plastic is flexible. The first part of the connection unit formed on the film is connected, the solder material is deposited on the second part, a cavity (recess) is formed in the plastic, and the chip card module is introduced into the cavity. Then, it is described that the chip card can be manufactured by bringing the conductive track of the chip card module into contact with the second part of the connection pad, melting the internal solder by heating, and soldering the conductive track to the connection pad. Has been done.

JP-A-2009-157666 Special Table 2019-511782

Generally, if the antenna formed on the antenna sheet is made by etching copper foil, the thickness of the antenna is, for example, about 15 μm or more and 75 μm or less, and if it is a wound antenna, the antenna diameter is For example, since it is about 50 μm or more and 150 μm or less, depending on the processing accuracy of end mill cutting, the antenna may be penetrated or cut, or the area of both ends of the antenna coil is small, so that the connection terminals may not be exposed due to misalignment. rice field. In addition, since the distance between the antenna connection terminal of the IC module and the antenna connection terminal in the card thickness direction is large, the conductive adhesive after coating and curing breaks when the card is bent, and is electrically charged. There was a risk of loss of connection.

Further, as in Patent Document 2, when the internal solder is melted by heating, the shape of the liquefied solder becomes uncertain, so that the solder is detached from the conductive track of the chip card module and the electrical connection is impaired. In addition, since the cross-sectional area of the solder in the thickness direction fluctuates, the bonding area between the solder portion exposed on the surface when the card is cut and the conductive track also fluctuates, which may reduce the bonding reliability. Further, since the distance between the conductive track of the chip card module and the second portion of the connection pad in the thickness direction of the chip card is large and solder is deposited so as to connect the two, the above-mentioned conductive adhesive and the conductive adhesive are used. Similarly, when the card is bent or the like, the solder having an uncertain shape after curing may break and the electrical connection may be lost.

The present disclosure has been made in view of such a situation, and is a method for manufacturing a contact and non-contact shared IC card and a contact and non-contact shared IC card with enhanced electrical connection reliability between the antenna and the IC module. The challenge is to provide.

The contact and non-contact shared IC card according to the present embodiment is mounted on a substrate having an external contact terminal on one surface and a plurality of antenna connection terminals on the other surface, and the other surface of the substrate. A card containing the external contact terminal, the antenna connection terminal, an IC module having an IC chip electrically connected to each other, and an antenna having a conductive block electrically connected to each of both ends. The conductive block comprises a substrate, and the conductive block is configured such that a first portion having a first thickness and a second portion having a second thickness thicker than the first thickness are adjacent to each other. The first portion and the end portion of the antenna are electrically connected, and the second portion and the antenna connection terminal are electrically connected via a conductive adhesive layer.

Further, in the contact and non-contact shared IC card according to another embodiment of the present embodiment, the melting point of the portion of the second portion that comes into contact with the conductive adhesive layer is such that the IC module is passed through the conductive adhesive layer to the second. It may be higher than the temperature required to adhere to the site.

Further, in the contact and non-contact shared IC card according to another embodiment of the present embodiment, the conductive adhesive layer may include an anisotropic conductive film.

Further, in the contact and non-contact shared IC card according to another embodiment of the present embodiment, the second portion of the conductive block is formed by partially bending a member having the same thickness as the first portion. A gap may be provided inside the second portion.

Further, in the contact and non-contact shared IC card according to another embodiment of the present embodiment, when the IC card is viewed through from the normal direction of the surface of the contact and non-contact shared IC card on the side on which the external contact terminal is arranged. The first portion may have a shape that tapers as the distance from the second portion increases.

Further, in the contact and non-contact shared IC card according to another embodiment of the present embodiment, a recess or a through hole along the thickness direction may be formed in the second portion.

The method for manufacturing a contact and non-contact shared IC card according to the present embodiment includes a substrate having an external contact terminal on one surface and a plurality of antenna connection terminals on the other surface, and the other surface of the substrate. A step of preparing an IC module having an external contact terminal, an antenna connection terminal, and an IC chip electrically connected to each other, a first portion having a first thickness, and the first portion. A card containing an antenna, in which a conductive block configured adjacent to a second portion having a second thickness thicker than the thickness is electrically connected to each of both ends by the first portion. It includes a step of manufacturing a substrate and a step of electrically connecting the second portion and the antenna connection terminal via a conductive adhesive layer.

According to the present embodiment, it is possible to provide a contact and non-contact shared IC card and a method for manufacturing a contact and non-contact shared IC card in which the reliability of electrical connection between the antenna and the IC module is improved.

It is a top view and the cross-sectional view explaining the structure of the card of embodiment of this disclosure. It is sectional drawing which shows the card substrate. It is a top view explaining the vicinity of the IC module in FIG. 1A. It is sectional drawing explaining the vicinity of IC module in FIG. 1B. It is a top view explaining the modification about the conductive block. It is a top view explaining the modification about the conductive block.

Hereinafter, an example of the contact and non-contact shared IC card of the present disclosure will be described with reference to the drawings and the like. However, the contact and non-contact shared IC card of the present disclosure is not limited to the embodiments and examples described below.

The figures shown below are schematically shown. Therefore, the size and shape of each part are exaggerated as appropriate to facilitate understanding. Further, in each drawing, hatching showing a cross section of the member is omitted as appropriate. Numerical values such as dimensions of each member and material names described in the present specification are examples of embodiments, and are not limited thereto, and can be appropriately selected and used. In the present specification, terms that specify a shape or a geometric condition, such as parallel, orthogonal, and vertical, are intended to include substantially the same state in addition to the exact meaning.

1. 1. Embodiments of the present disclosure An example of embodiments of the contact and non-contact shared IC card of the present disclosure will be described. Here, for convenience of explanation, the XYZ coordinate system is set for the contact and non-contact shared IC card 1. First, as shown in FIGS. 1A and 1B, the Z-axis is taken in the normal direction of the main surface of the contact and non-contact shared IC card 1, and the external contact terminal 14 of the IC module 7 is arranged. The direction from the main surface on the non-existing side toward the main surface on the side where the external contact terminal 14 is arranged is the upper side in the Z2 direction or the thickness direction, and the opposite direction is the lower side in the Z1 direction or the thickness direction. do.

Further, when the contact and non-contact shared IC card 1 is viewed from the Z2 direction, both short sides of the non-contact shared IC card 1 and a straight line perpendicular to the Z axis are defined as the X axis, and one of the sides closer to the external contact terminal 14. The direction from the short side to the other short side is the X2 direction or the right side, and the opposite direction is the X1 direction or the left side. Further, the straight line perpendicular to the X-axis and the Z-axis is the Y-axis, the direction from one long side far from the external contact terminal 14 to the other long side is the Y2 direction or the upper side, and the opposite direction is the Y1 direction or The lower side.

Here, FIG. 1 (a) is a plan view of the contact and non-contact shared IC card 1 as viewed from the Z2 direction, and FIG. 1 (b) is a contact and non-contact shared IC card 1 of FIG. 1 (a). Is a cross-sectional view taken along the line AA, which is a straight line parallel to the X-axis passing through the substantially center of the external contact terminal 14 in the vertical direction, and viewed from the Y1 direction. Further, FIG. 2 is a cross-sectional view of the card substrate 2 before the recess 9 for embedding the IC module 7 is formed by cutting, in the same cross-sectional view as in FIG. 1 (b).

An external contact terminal 14 for contact communication with the IC chip 15 built in the IC module 7 is arranged on the surface of the contact and non-contact shared IC card 1 on the Z2 direction side. Although the details will be described later, the card base 2 shown in FIG. 2 is a cut card base 2a in which the recess 9 is formed by cutting. The IC module 7 is embedded and fixed in the recess 9 of the cut card substrate 2a via the conductive adhesive layer 10, and is the contact and non-contact shared IC card 1 shown in FIG. 1 (b). Further, inside the card substrate 2 or the cut card substrate 2a, an antenna 8 formed of a coated conductor or the like and wound in a loop shape is arranged near the substantially center in the thickness direction thereof. A pair of conductive blocks 11 composed of a first conductive block 11a and a second conductive block 11b, which are conductive members, are provided on the Z2 direction side near the ends 8a and 8b of the antenna 8 from which the coating has been removed, respectively. It is electrically connected. The first conductive block 11a and the second conductive block 11b have a substantially L-shaped cross section or a symmetrical shape when viewed from the Y1 direction.

Further, on the Z2 direction side of each of the first conductive block 11a and the second conductive block 11b, a pair of conductive adhesive layers 10 composed of the first conductive adhesive layer 10a and the second conductive adhesive layer 10b are electrically formed. And mechanically connected, the pair of conductive adhesive layers 10 are also electrically and mechanically connected to the main surface of the IC module 7 on the Z2 direction side opposite to the external contact terminal 14 of the substrate 71 of the IC module 7. ing. The conductive adhesive layer 10 may be separately arranged as the first conductive adhesive layer 10a and the second conductive adhesive layer 10b, or both may be integrally connected to the external contact terminal 14 of the substrate 71 of the IC module 7. It may be a mode that covers a part or all of the main surface on the opposite side.

As a result, the IC module 7 is mechanically connected to the card substrate 2 via the conductive adhesive layer 10 to be integrated, and the IC chip 15 incorporated in the IC module 7 and the external contact terminal 14 are electrically connected to each other. Be connected. Further, both ends 8a and 8b of the IC chip 15 and the antenna 8 are also electrically connected. Therefore, the contact and non-contact shared IC card 1 is compliant with ISO / IEC7816 in addition to ISO / IEC14443 and NFC communication standards, and is based on the same IC chip 15 built in, and is used for contact communication and non-contact communication. Both (wireless communication) can be performed. Next, each part of the main component of the contact and non-contact shared IC card 1 will be described.

(A) Card base The card base 2 refers to a member in a card state before embedding the IC module 7, and typically, as shown in FIG. 2, the oversheet layer 6 and the core layer 5 are formed from the lower side in the thickness direction. , The core layer 4 and the oversheet layer 3 are laminated in this order. Further, an antenna 8 wound in a loop shape and formed of a covered conductor or the like is arranged between the core layer 5 and the core layer 4. Further, a pair of conductive blocks 11 composed of the first conductive block 11a and the second conductive block 11b, which are conductive members, are electrically connected to both ends of the antenna 8 in the vicinity of 8a and 8b, respectively. Has been done. However, the layer structure of the card substrate 2 is not limited to this, and is a three-layer structure of an oversheet layer, a core layer, and an oversheet layer, a two-layer structure of a core layer and a core layer, or an oversheet layer, a core layer, and an antenna. It may have a five-layer structure of a core layer, a core layer, and an oversheet layer on which the above is formed. Further, printing or magnetic stripes may be embedded on the surface of the card substrate 2 opposite to the core layer 4 or 5 of the oversheet layer 3 or 6, and the oversheet 3 or 6 of the core layer 4 or 5 may be embedded. It may be printed on the adjacent surface of.

(I) Core layer As the core layers 4 and 5, various white or colored plastic sheets can be widely used, and the following single films or composite films thereof can be used. For example, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose. Triacetate, polystyrene, ABS, polyacrylic acid ester, polypropylene, polyethylene, polyurethane, etc. The thickness of the core sheet can be appropriately selected in consideration of the total thickness of the card, and can be, for example, about 0.25 mm or more and 0.38 mm or less. As will be described later, it is necessary to arrange the antenna 8 on the surface of either the core layer 4 or 5 so as to be sandwiched between the two core layers.

(Ii) Oversheet layer As the oversheet layers 3 and 6, a material of the same quality as the core layer is usually used, but a transparent material having a thickness of 0.05 mm or more and 0.10 mm or less may be used. many. From the viewpoint of preventing the occurrence of curl when the laminated body of the core layer and the oversheet layer is integrated by a hot press or the like, it is preferable that the thicknesses of the oversheet layers 3 and 6 are the same, but they are not necessarily the same. It does not have to be. The material of the oversheet layer may be one having adhesiveness due to heat, but even if the oversheet layer itself does not have adhesiveness due to heat, a layer of a known adhesive that generates adhesive force by heat or the like can be used. Both can be integrated by additionally forming between the core layer and the oversheet layer. When the contact and non-contact shared IC card 1 is used as a magnetic card, the magnetic tape is thermally transferred to the main surface side opposite to the core layers 4 and 5 for either or both of the oversheet layers 3 and 6. It may be embedded in advance by such means.

(Iii) Antenna The cut card base 2a in FIGS. 1 (a) and 1 (b) and the antenna 8 built in the card base 2 in FIG. 2 use, for example, an HF frequency band of 13.56 MHz. Proximity communication may be performed, or other communication may be performed using the UHF frequency band of, for example, 920 MHz. However, when performing non-contact communication, the IC chip 15 is an external reader / writer (information reading / writing device). Arranged to communicate with. When the antenna 8 holds the contact and non-contact shared IC card 1 over the reader / writer, a current is generated by a magnetic field or the like formed by the reader / writer to supply electric power to the IC chip 15. As a result, the IC chip 15 can be driven, and when performing non-contact communication, information is transmitted / received to / from the reader / writer, information is rewritten, and the like.

The antenna 8 is typically formed of a coated conductor in which the circumference of the copper wire is coated with an insulator member. In addition to this, select copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires such as iron, stainless steel, and aluminum, and metal alloy wires. You can also do it. The contact and non-contact shared IC card 1 can be made cheaper than, for example, a copper foil etching method or the like by using a coated conductor. However, the antenna 8 may be formed by etching from copper foil, aluminum foil, or the like. Next, FIG. 3A is an enlarged view of the vicinity of the IC module 7 of FIG. 1A. Further, FIG. 3 (b) is a diagram showing a state in which the IC module 7 is removed in FIG. 3 (a), and FIG. 3 (c) further removes the oversheet layer 3 and the core layer 4 from this. It is a figure which shows the state which exposed the pair of conductive blocks 11. FIG. 4 (a) is an enlarged view of the vicinity of the IC module 7 of FIG. 1 (b), and FIG. 4 (b) shows the card substrate 2 before forming the recess 9 for embedding the IC module 7. FIG. 4 (c), which shows the state, is an enlarged view of the vicinity of the first conductive block 11a.

As shown in FIG. 3A, both end portions 8a and 8b of the antenna 8 are arranged on the left and right outside of the external contact terminal 14 of the IC module 7 so that the conducting wires are substantially parallel to the Y axis. For convenience, the end on the X1 direction side is 8a, and the end on the X2 direction side is 8b. Further, the portions of the antenna 8 in the vicinity of both ends 8a and 8b that come into contact with the first conductive block 11a and the second conductive block 11b are exposed in advance with their coatings stripped off for electrical connection with them. It is a copper wire.

(Iv) Conductive Block As shown in FIGS. 2 and 4B, the first conductive member having a conductive member is provided on the Z2 direction side near the end 8a and the vicinity of 8b of the antenna 8 from which the coating has been removed, respectively. A pair of conductive blocks 11 composed of the block 11a and the second conductive block 11b are electrically connected. Further, as shown in FIG. 3A, when the vicinity of the IC module 7 of the contact and non-contact shared IC card 1 is viewed from the Z2 direction, the first conductive block 11a is the left end of the external contact terminal 14 of the IC module 7. Is arranged so as to overlap both the region of the antenna 8 and the vicinity of the end portion 8a of the antenna 8.

Similarly, the second conductive block 11b is also arranged so as to overlap both the right end region of the external contact terminal 14 of the IC module 7 and the vicinity of the end portion 8b of the antenna 8. It should be noted that the back surface side of the substrate 71 (opposite to the external contact terminal 14 of the substrate 71) corresponding to the left end and right side regions of the external contact terminal 14 of the IC module 7 on which the first conductive block 11a and the second conductive block 11b overlap. On the main surface side), as shown in FIG. 4A, a first antenna connection terminal 71a and a second antenna connection terminal 71b that are electrically connected to the IC chip 15 are arranged respectively.

As shown in FIG. 4A, the first conductive block 11a and the second conductive block 11b, which are a pair of conductive blocks 11, have a substantially L-shaped cross section or a symmetrical shape thereof when viewed from the Y1 direction. There is. As illustrated in FIG. 4C, the first conductive block 11a has a thin thickness of h11 along the Z axis, and has a plate-shaped portion 12a protruding in the X1 direction by the length of d11. , H1 having a thickness along the Z axis by h12 thicker than h11, and a second portion 13a of a plate-shaped portion having a length along the X axis of d12. Both the first conductive block 11a and the second conductive block 11b are arranged above the antenna 8, that is, on the Z2 direction side. A method of joining both conductive blocks so as to be in contact with the lower end of the antenna 8 can be adopted, but the former can reduce the thickness h1 along the Z axis of the second portion 13a and reduce the size of the conductive block 11. In that respect, it is advantageous from the viewpoint of reducing the heat capacity and the like.

Here, the thickness h1 of the second portion 13a of the first conductive block 11a is the distance from the upper end of the antenna end portion 8a along the Z axis to the lower end of the conductive adhesive layer 10 as shown in FIG. 4C. From the viewpoint of preventing the card substrate 2 from warping, it is preferable that the antenna 8 is arranged near the center of the card substrate 2 having a thickness of about 0.8 mm in the thickness direction. In consideration of the above, it is preferably 0.1 mm or more and 0.3 mm or less. The length of the second portion 13a along the Y-axis may be generally 2.0 mm or more and 10.0 mm or less, although it depends on the cross-sectional shape of the first conductive block 11a along the XZ plane. preferable.

On the other hand, in the dimensions of the first conductive block 11a, the ratio of the thickness h1 of the second portion 13a to the thickness h11 of the first portion 12a is set to 1.3 or more and 20.0 or less. It is preferable from the viewpoint of reducing the heat capacity of the block 11a and ensuring the physical strength of the first portion 12a. Further, in order to stably secure these characteristics at the time of mass production, it is more preferable that the ratio is 2.0 or more and 10.0 or less.

Further, for the same reason as described above, it is preferable that the ratio of the length d1 along the X axis to the thickness h1 of the second portion 13a of the first conductive block 11a is 20.0 or more and 60.0 or less. It is more preferably 3,0.0 or more and 50.0 or less. On the other hand, the ratio of the total length d1 to the length d12 of the second portion 13a of the first conductive block 11a along the X axis is preferably 1.5 or more and 7.0 or less.

On the other hand, the surface of the first conductive block 11a on the Z1 side of the first portion 12a and the surface of the second portion 13a on the Z2 side are preferably substantially parallel to the XY plane and flat. In particular, for the second portion 13a, which is difficult to weld, the maximum value of the angle formed by the surface of the second portion 13a on the Z2 side with respect to the surface of the first recess 9a of the cut card substrate 2a may be 5 ° or less. preferable. As a result, the surface of the second portion 13a on the Z2 side is cut when the first recess 9a is formed, and when the conductive adhesive layer 10 is attached, an appropriate contact area is secured and the bonding with the conductive adhesive layer 10 is performed. This is to do well. However, from the viewpoint of adhesion to the conductive adhesive layer 10, minute irregularities having an arithmetic surface roughness Ra of 0.5 μm or more and 50.0 μm or less are formed on the surface of the second portion 13a on the Z2 side. You may. From the viewpoint of ensuring the appropriate contact area, the cross-sectional area of the second portion 13a on the surface of the first recess 9a of the cut card substrate 2a is directed toward the Z1 direction from the surface of the first recess 9a. The ratio of the cross-sectional areas of the second portion 13a cut in the XY plane at an arbitrary depth up to 1 mm is preferably 0.8 or more and 1.2 or less.

The first portion 12a and the second portion 13a are adjacent to each other, and both may be integrally formed of the same member, or different members may be joined to each other. Further, the second conductive block 11b is also symmetrical with the first conductive block 11a, and similarly, the first portion 12b of the plate-like portion having a thin thickness and protruding in the X2 direction and the thickness along the Z axis. It is composed of a second portion 13b of a plate-shaped portion having a thickness thicker than this.

As described above, the first conductive block 11a has the first portion 12a and the second portion 13a having different thicknesses with the antenna end portion 8a having different arrangement positions in the thickness direction of the contact and non-contact shared IC card 1. The first conductive block 11a is electrically connected to the first antenna connection terminal 71a of the IC module 7 and has the minimum cross-sectional area and volume when cut in a plane parallel to the XZ plane. This is to reduce the heat capacity of the antenna as much as possible. Further, a flat surface is formed on both the surface of the first portion 12a on the side of the first conductive block 11a to be joined to the antenna terminal 8a and the surface of the second portion 13a on the side to be joined to the conductive adhesive layer 10. As a result, a sufficient contact area with the antenna 8 and the conductive adhesive layer 10 can be secured, and highly reliable electrical connection can be achieved. In addition, all the above-mentioned explanations about the first conductive block 11a also apply to the second conductive block 11b.

The material used for the conductive block 11 has conductivity for contributing to the electrical connection between the IC chip 15 and the antenna 8, and as will be described later, the embedded recess 9 of the IC module 7 is cut. There is no particular limitation as long as it has machinability and hardness and strength that do not break due to external force such as bending of the card. However, when the connection with the antenna 8 is performed by welding, it is preferable to have weldability with an antenna member such as a copper wire and adhesiveness with a conductive adhesive layer 10 described later.

Further, the melting point of the portion of the conductive block 11 that abuts at least the second portions 13a and 13b with the conductive adhesive layer 10 causes the IC module 7 to adhere to the second portions 13a and 13b via the conductive adhesive layer 10. It is preferably higher than the temperature required for. The temperature required to bond the IC module 7 to the second portions 13a and 13b via the conductive adhesive layer 10 is, for example, if the conductive adhesive layer 10 is a thermoplastic resin or the like, it is softened. Or, it may be a heating temperature for melting, and if the conductive adhesive layer 10 is a thermosetting resin or the like, it may be at a heating temperature for softening, causing a cross-linking reaction or the like, or activating the adhesive force. There may be.

When the conductive adhesive layer 10 contains solder, if the solder is Sn-Pb type (including Sn-Pb-Bi type and Sn-Pb-Ag type), the melting point is 180 ° C. or higher and 300 ° C. or lower. Lead-free solder has a melting point of 120 ° C. or higher and 250 ° C. or lower, but a member having a melting point higher than the melting point of the solder actually used should be a member of the conductive block 11.

When the conductive adhesive layer 10 is composed of a hot melt adhesive, it is defined by, for example, the softening point test method of the ring-and-ball method defined in JIS K6863-1994 (softening point test method of hot melt adhesive). A member higher than the softening point can be used as a member of the conductive block 11. On the other hand, when the conductive adhesive layer 10 is composed of an epoxy resin adhesive, it is defined by, for example, the softening point test method of the ring ball method or the mercury substitution method defined in JIS K7234-1986 (softening point test method of epoxy resin). A member having a softening point higher than the softening point can be used as a member of the conductive block 11. For the conductive adhesive layer 10 other than the above, the temperature that is substantially recognized as the melting point, softening point, etc. is measured according to the above method or if it is difficult to carry out the above method. You can convert it.

The material of the conductive block 11 having the above requirements may vary depending on how many temperatures are required to bond the conductive adhesive layer 10 to the second portions 13a and 13b, such as copper, aluminum, iron, and the like. Metals such as stainless steel, brass, brass, bronze, gold, silver, titanium, and lead, having an overall volume resistivity of 80 × 10 ^-8 Ωm or less at 0 ° C. and a melting point of 300 ° C. or higher. Things can be mentioned. In particular, from the viewpoint that the conductive adhesive layer 10 needs to be melted at a high temperature and good non-contact communication is performed, the volume resistivity is 20 × 10 ^-8 Ωm or less and the melting point is 500 ° C. or more. Aluminum, gold, silver, copper, brass, brass and bronze are more preferred.

Further, the conductive block 11 may be made of the same metal, and for example, the first parts 12a and 12b and the second parts 13a and 13b may be made of different metals, respectively. For example, in the conductive block 11, for the first portions 12a and 12b which are arranged relatively apart from the conductive adhesive layer 10, members having a melting point equal to or lower than the softening point temperature of the conductive adhesive layer 10 are used for conductive adhesion. For the second portions 13a and 13b that come into contact with the layer 10, members having a melting point higher than the softening point temperature of the conductive adhesive layer 10 may be used. By doing so, it is possible to expand the selection range of the members of the conductive block 11 as a whole while suppressing the decrease in the connection reliability with the conductive adhesive layer 10 due to the thermal deformation of the conductive block 11.

Further, in the members used for the second portions 13a and 13b that come into contact with the conductive adhesive layer 10, the heat applied for adhesion to the conductive adhesive layer 10 is conducted to the first portions 12a and 12b, and the surrounding cutting is performed. In order to prevent the finished card substrate 2a from being thermally deformed, it is preferable to use one that does not conduct heat as much as possible. For example, bronze, platinum iridium, platinum rhodium, lead, titanium, iron, stainless steel, tin, etc. having a thermal conductivity of 70 W / m · K or less are suitable on the premise that the melting point is higher than the softening point of the conductive adhesive layer 10. Can be selected. Among them, platinum iridium, platinum rhodium, lead, titanium, iron, stainless steel and the like having a thermal conductivity of 40 W / m · K or less are effective in further suppressing thermal deformation of the cut card substrate 2a.

Further, the main body of the conductive block 11 may be formed of the same metal, and the outer surface thereof may be plated with another metal. As an example, it is conceivable that the inside of the conductive block 11 is formed of copper, brass or bronze, and silver plating or gold plating is applied only to the entire outer surface thereof or the contact portion between the antenna 8 and the conductive adhesive layer 10. .. As a result, the antenna 8 can be satisfactorily welded to the conductive block 11, or the IC module 7 and the conductive block 11 can be satisfactorily connected electrically and mechanically via the conductive adhesive layer 10. Can be done.

In particular, the pair of conductive blocks 11 as described above can be formed so that the thickness of the second portions 13a and 13b is slightly thicker than that of h1 in FIG. 4C. In this case, as shown in FIG. 4B, the upper ends of the second portions 13a and 13b slightly protrude into the planned area of the first recess 9a, which is a wide portion of the recess 9 for embedding the IC module 7. Become. In other words, as shown in FIG. 4B, the first conductive block 11a and the second conductive block along the thickness direction from the main surface of the card substrate 2 on the side where the first recess 9a of the recess 9 is formed. The shortest distance e2 to the second portions 13a and 13b of 11b is along the thickness direction from the main surface of the non-cutting region of the card substrate 2a cut by the end mill on the side where the first recess 9a of the recess 9 is formed. It can be shorter than the shortest distance e1 to the lower end of the first recess 9a.

Here, when the recess 9 is cut by the end mill, the upper ends of the slightly protruding first portions 12a and 12b are cut together, and the lower surface portion of the first recess 9a of the card substrate 2 and the surface portion of the conductive block 11 are formed. Form the same surface. Therefore, the electrical and mechanical connection between the IC module 7 and the antenna 8 via the conductive adhesive layer 10 can be satisfactorily performed.

Further, even if the arrangement of the conductive block 11 with respect to the card substrate 2 in the thickness direction is slightly shifted to the lower side from the original position, the displacement amount does not exceed the above-mentioned difference between e1 and e2. As long as e2 is always shorter than e1, when the recess 9 is cut by the end mill, the upper ends of the first portions 12a and 12b are not exposed to the lower surface portion of the first recess 9a of the cut card substrate 2a. It can be suppressed. Furthermore, since a flat surface is formed on the surface of the second portion 13a on the side to be joined to the conductive adhesive layer 10, even if the cutting depth by the end mill fluctuates, the conductive adhesion of the cutting surface of the second portion 13a The area of the surface facing the layer 10 is always constant, a stable contact area with the conductive adhesive layer 10 can be secured, and a highly reliable electrical connection can be achieved.

(B) IC module Next, a recess 9 is formed in the card base 2 by cutting to form a cut card base 2a, and then the concave portion 9 is embedded in the cut card base 2a via a conductive adhesive layer 10. The IC module 7 will be described. As shown in FIGS. 3A and 4A, the IC module 7 has an external contact terminal 14 on one surface of a substantially rectangular flat plate-shaped substrate 71 having rounded corners and an external contact terminal 14 on the other surface. It includes a first antenna connection terminal 71a and a second antenna connection terminal 71b, which are antenna connection terminals, and a mold portion 72, which is a protruding portion containing an IC chip 15. Each part of the main component of the IC module 7 will be described below.

(I) Substrate In the substrate 71, copper foil is attached to the front and back of a flexible resin film such as glass epoxy resin or polyimide resin via an adhesive, and the copper foil is attached to the front and back surfaces of the resin film. Is left so as to form a predetermined pattern. Specifically, a photosensitive material is applied so as to form an external contact terminal 14 on one copper foil surface of the resin film and a first antenna connection terminal 71a and a second antenna connection terminal 71b on the other copper foil surface. By sequentially placing the film plate on which the predetermined pattern is formed, exposing it, and removing the etching of the non-photosensitive portion, the substrate 71 in which the copper foil of the predetermined pattern partially remains on the front and back surfaces of the resin film can be obtained. It is formed. Further, the substrate 71 is provided with a plurality of through holes (not shown) for wire bonding to the external contact terminal 14 in advance.

(Ii) The IC chip 15 is adhered and fixed to the surface of the IC chip substrate 71 opposite to the surface on which the external contact terminal 14 is formed via an adhesive. The IC chip 15 performs input signal decoding and output signal generation of contact communication and non-contact communication with a CPU for controlling both contact communication and non-contact communication operations, storage devices such as RAM, EEPROM, and flash memory. It is equipped with various circuits such as an interface circuit and a power generation circuit to perform. The various circuits may be provided as elements separate from the IC chip. The IC chip 15 is adhesively fixed to the central portion of the forming surface of the first antenna connection terminal 71a and the second antenna connection terminal 71b of the substrate 71 via an adhesive, and is attached to a pad on the circuit surface of the IC chip 15. Each terminal section of the external contact terminal 14 is connected by a wire 16 such as a gold wire that passes through a through hole of the substrate 71. Further, the pad of the IC chip 15 and the first antenna connection terminal 71a and the second antenna connection terminal 71b of the substrate 71 are similarly connected by a wire 16.

(Iii) Molded portion In order to protect the IC chip 15 and the wire 16 from an external force load and an environmental load on the mounting surface of the IC chip 15 of the substrate 71 on which the above-mentioned IC chip 15 is mounted and the wire 16 is connected, A mold portion 72, which is a protruding portion that covers these, is formed. An ultraviolet curable resin, a thermosetting resin, or the like is used as the mold portion 72.

(C) Conductive Adhesive Layer After forming a recess 9 for embedding the IC module 7 in the card substrate 2 by cutting with an end mill, the above-mentioned IC module 7 is embedded and fixed in the cut card substrate 2a. Then, the conductive adhesive layer 10 that is electrically and mechanically connected will be described. As shown in FIG. 4C, the conductive adhesive layer 10 is a liquid or tape-like member to be applied or attached to the upper side of the first conductive block 11a in the thickness direction of the second portion 13a. The same applies to the second conductive block 11b. However, the conductive adhesive layer 10 does not necessarily have to be first coated and attached to the first conductive block 11a and the second conductive block 11b, and the first antenna connection terminal is attached to the back surface side of the substrate 71 of the IC module 7. It may be coated and affixed so as to cover the 71a and the second antenna connection terminal 71b.

Further, since the conductive adhesive layer 10 also serves as a mechanical connection between the IC module 7 and the cut card substrate 2a, the conductive adhesive layer 10 may be coated or affixed to the entire back surface of the substrate 71. However, the conductive adhesive layer 10 is coated and affixed so as to cover only the regions of the first antenna connection terminal 71a and the second antenna connection terminal 71b on the back surface of the substrate 71, and on the back surface of the other substrate 71. Another non-conductive adhesive may be applied and affixed. This is because it is possible to easily select an adhesive that is more advantageous for mechanical connection by not considering the conductivity as the other adhesive.

Such a conductive adhesive layer 10 includes ACF (Anisotropic Conductive Film), that is, an anisotropic conductive film, ACP (anisotropic conductive paste), or other, so-called, in which silver particles are dispersed as a filler in an epoxy resin. A conductive paste or the like can be used. Above all, if ACF is used, ACF is heat-laminated on the entire back surface of the substrate 71 of the IC module 7, the IC module 7 is embedded in the recess 9 of the cut card substrate 2a, and then the IC module 7 is placed at a predetermined temperature and load. By heat pressing, the IC chip 15 and the antenna 8 can be electrically connected. Further, since the IC module 7 can be mechanically connected to the cut card base 2a at the same time, the mounting process of the IC module 7 on the cut card base 2a can be simplified.

(D) Method for manufacturing a contact and non-contact shared IC card Next, an example of a method for manufacturing a contact and non-contact shared IC card 1 using the card substrate 2, the IC module 7, and the conductive adhesive layer 10 described above will be described. ..

(I) Formation of an antenna on the core layer First, a coated conductor coated with an insulator member is attached to the surface of either the core layer 5 or 4 on the side not adjacent to the oversheet layer 6 or 3, and the antenna end. It is embedded by a winding machine with either part 8a or 8b as a starting point. Specifically, for example, the antenna supply head is drawn in a loop shape as shown in FIG. 1A while applying a predetermined heat pressure to the core layer 5, and the antenna 8 supplied from the antenna supply head is drawn. Are sequentially embedded in the core layer 5. Here, the antenna 8 is arranged so that the vicinity of the antenna ends 8a and the vicinity of 8b are lined up in the vertical direction on the left and right outside of the planned mounting position of the IC module 7, and the antenna 8 is cut off at the end point. Further, it is preferable that the coatings around the antenna ends 8a and 8b are removed in advance for electrical connection with the conductive block 11 in a later process. Although FIG. 1A shows the card-shaped cut card substrate 2a, the actual antenna formation is often performed in units of large-sized sheets in which the cards are arranged vertically and horizontally in multiple impositions.

(Ii) Connection of the Conductive Block to the End of the Antenna Next, as shown in FIG. 3A, near the ends 8a and 8b of the antenna 8 formed on the core layer 5 when viewed from the Z2 direction. The first conductive block 11a and the second conductive block 11b, which are a pair of conductive blocks 11, are electrically and mechanically joined to each other at a position where they overlap with each other and also overlap with the IC module 7 to be mounted later. For example, the first conductive block 11a is silver-plated on the outer peripheral portion of phosphor bronze, which is excellent in corrosion resistance, fatigue resistance, wear resistance, etc., in order to improve weldability.

As shown in FIGS. 2 and 3 (c), the first conductive block 11a has a substantially inverted L-shaped cross section when viewed from the Y1 direction, which is the side surface of the card, and a planar shape when viewed from the Z2 direction. Is a rectangular shape. Further, the second conductive block 11b is also symmetrical with the first conductive block 11a. Here, the first portions 12a and 12b, each of which has a thin thickness, are joined to the vicinity of the ends 8a and 8b of the antenna 8 by welding.

(Iii) Manufacture of a card substrate Using the core layer 5 on which the antenna 8 and the pair of conductive blocks 11 are formed, the oversheet layer 6, the core layer 5, and the core layer are used from the lower side in the thickness direction as shown in FIG. 4 and the oversheet layer 3 are stacked in this order. After that, the cards are sandwiched between stainless steel plates from above and below in the thickness direction in units of a laminated body of large-sized sheets in which cards are arranged vertically and horizontally in a multi-imposed manner, and heat pressure is applied to the laminated body through the stainless steel plates. By going through such a heat pressing step, it is possible to obtain a card substrate in units of large-sized sheets in which each layer of the laminated body is integrated. If either the oversheet layer or the core layer has heat resistance that does not heat-fuse at a predetermined temperature, an adhesive sheet that heat-fuse at a predetermined temperature is sandwiched between the layers, or an adhesive is applied. Then, these are subjected to a heat pressing process to obtain an integrated large-format sheet-based card substrate.

Depending on the size of the first conductive block 11a in FIG. 4C, that is, the length d11 and thickness h11 of the first portion 12a and the length d12 and thickness h1 of the second portion 13a, the core layer 5 A through hole or a recess corresponding to the contact region of the core layer 4 overlapping with the first conductive block 11a, particularly the contact region with the thick second portion 13a, is formed in advance. Is preferable. The same applies to the second conductive block 11b. By doing so, when heat pressure is applied from above and below in the thickness direction, the risk of appearance defects due to thermal deformation on the front and back surfaces of the card substrate due to the influence of the locally thick conductive block 11 is reduced. Can be made to.

(Iv) Punching the card base to the card size and forming recesses The ISO / IEC7816 card obtained by punching the card base of a large-format sheet unit in which the cards are arranged vertically and horizontally in multiple faces is punched. It is punched out as the card base 2 which is the size. Further, the cut card base 2a can be obtained by forming the recess 9 for embedding the IC module 7 in the card base 2 by cutting with an end mill. The recess 9 is composed of two stages, a first recess 9a for accommodating the flat plate-shaped substrate 71 and a second recess 9b for accommodating the mold portion 72 which is a convex portion.

At this time, as shown in FIG. 4B, the first conductive block 11a and the second conductive block 11b are arranged so that the upper end portions thereof slightly protrude into the region to be formed of the recess 9. Therefore, when the first concave portion 9a of the concave portion 9 is cut on the card substrate 2, the upper ends of the first conductive block 11a and the second conductive block 11b are cut together. Therefore, as described above, the subsequent electrical and mechanical connection between the IC module 7 and the antenna 8 via the conductive adhesive layer 10 is satisfactorily performed, and the conductive block 11 is arranged in the thickness direction with respect to the cut card substrate 2a. It is possible to expand the permissible range of.

(V) Attachment of Conductive Adhesive Layer to IC Module On the other hand, apart from manufacturing the card substrate 2 and processing the cut card substrate 2a, the conductive adhesive layer 10 is attached to the IC module 7. As the IC module 7, a module tape in which the IC module 7 is formed on a long tape continuously in one row or two rows is usually used. A tape-shaped ACF is attached to the surface of the module tape opposite to the forming surface of the external contact terminal 14 while applying a constant heat pressure. Then, the module tape to which the ACF is attached is punched out as an IC module 7 having a substantially rectangular shape with rounded corners by a punching machine to obtain an IC module 7 to which the conductive adhesive layer 10 is attached.

(Vi) Implantation and electrical connection of the IC module in the card substrate Then, as shown in FIG. 3A, the conductive adhesive layer 10 was attached to the cut card substrate 2a in which the recess 9 was formed. The IC module 7 is embedded, and a heat block (not shown) is pressed against the external contact terminal 14 to apply a predetermined heat pressure for a predetermined time. As a result, the conductive adhesive layer 10 composed of ACF is melted to cause a thermal curing reaction, so that the upper ends of the first conductive block 11a and the second conductive block 11b are formed as shown in FIG. 4A. , The conductive adhesive layer 10 arranged above the conductive adhesive layer 10 can be electrically and mechanically bonded at the interfaces 91a and 91b. Further, the first recess 9a of the cut card substrate 2a in which the conductive block 11 does not exist and the conductive adhesive layer 10 arranged above the first recess 9a are mechanically bonded only mechanically. The time and heat pressure conditions of ACF differ depending on the type and composition, but as an example, the time is 0.5 seconds or more and 10.0 seconds or less, the temperature is 150 ° C or more, 250 ° C or less, and the pressure. Can be 20 MPa or more and 100 MPa or less.

On the other hand, in the case of the conductive block 11 made of phosphor bronze, its solid phase melting point is considered to be between 880 ° C. and 975 ° C., so that the heating temperature for promoting the softening and heat curing reaction of ACF is, for example, 250 ° C. Even if there is, the conductive block 11 is not softened by the heating. Therefore, since the shape of the conductive block 11 is uncertain, the electrical connection with the IC module 7 is impaired, or the conductive block 11 is deformed in the left-right direction, so that the amount of heat transfer to the core layer and the oversheet layer increases. However, it is possible to prevent the card substrate 2 from having a poor appearance. Furthermore, it is possible to prevent the conductive block 11 from becoming fragile due to thermal deformation, breaking the conductive block 11 when the card is bent, and losing the electrical connection.

Here, the electrical connection between the vicinity of the antenna end 8a and the first portion 12a of the first conductive block 11a, the second portion 13a of the first conductive block 11a, and the first antenna connection terminal 71a of the IC module 7 The difference between the electrical connection and the electrical connection will be explained. In the former, as described above, for example, the first portion 12a of the first conductive block 11a made of metal is brought close to the vicinity of the end portion 8a of the antenna 8 embedded and formed on the core layer 5 by a winding machine or the like. , It can be easily electrically connected by welding using electric discharge. A working space for sufficient welding can be secured around the antenna end 8a and the first conductive block 11a, and even if the core layer 5 is thermally deformed by a certain degree of high temperature welding, the final contact and non-contact are immediately obtained. This is because there is little possibility that the appearance of the shared IC card 1 will be poor.

On the other hand, in the latter, the recess 9 of the cut card substrate 2a is covered with the IC module 7, and then the second portion 13a of the internal first conductive block 11a and the first antenna connection terminal 71a of the IC module 7 are connected to each other. It is necessary to make an electrical connection. In this case, heat adhesion or the like is imparted to the second portion 13a of the first conductive block 11a itself, or between the second portion 13a of the first conductive block 11a and the first antenna connection terminal 71a of the IC module 7. Separately, it is necessary to sandwich the conductive adhesive layer 10 and heat-melt it to bond it. However, as long as the connecting portion is hidden, means such as welding cannot be taken.

Further, as described above, when the second portion 13a of the first conductive block 11a is made of solder to impart adhesiveness to the second portion 13a itself by heating, the shape of the first conductive block 11a changes due to melting. The connection reliability between the first conductive block 11a and the first antenna connection terminal 71a is lowered, and the appearance of the cut card substrate 2a itself may be deteriorated due to a change in heat conduction. Therefore, under the temperature condition that the second portion 13a of the first conductive block 11a does not melt, only the conductive adhesive layer 10 sandwiched between them is thermally melted, and the first conductive block 11a and the first antenna connection terminal 71a are electrically connected. It is necessary to ensure the reliability of the connection. That is, it is essential that the melting point of the portion of the second portion 13a that comes into contact with the conductive adhesive layer 10 is higher than the temperature required for adhering the IC module 7 to the second portion 13a via the conductive adhesive layer 10. It becomes. Of course, these also have the same relationship with the second conductive block 11b.

As described above, at least the melting point of the portion of the second portion 13a and 13b where the conductive block 11 is thick in contact with the conductive adhesive layer 10 is necessary for adhering the conductive adhesive layer 10 to the second portions 13a and 13b. The temperature of the conductive adhesive layer 10 is higher than the heating temperature for promoting the softening and thermal curing reaction of the ACF constituting the conductive adhesive layer 10, so that the conductive adhesive layer 10 is firmly electrically and mechanically and electrically connected to the conductive block 11. It will be connected.

Taking the first conductive block 11a as an example, the pair of conductive blocks 11 includes an antenna end portion 8a on the side of the cut card substrate 2a and a first antenna connection terminal 71a arranged on the back surface of the substrate 71 of the IC module 7. The thin first portion 12a having a function as a connection bridge in the left-right direction, and the antenna end portion 8a and the first antenna connection terminal 71a having a thick thickness having a function as a connection bridge in the thickness direction. It is a conductive member having a substantially L-shaped or substantially inverted L-shaped cross section composed of a second portion 13a.

By forming the pair of conductive blocks 11 in such a shape, the heat capacity of the conductive blocks 11 can be reduced as compared with the case where the entire conductive block 11 is a flat plate having the thickness of the second portion 13a. .. Therefore, when the external contact terminal 14 of the IC module 7 is heated by the heat block, the heat accumulated in the conductive block 11 is dissipated to the surroundings, and the core layers 4, 5 and the oversheet layers 3, 6 of the card substrate 2 are dissipated. Can be prevented from being thermally deformed and causing poor appearance. Further, by reducing the volume of foreign matter other than the core layer and the oversheet layer sandwiched inside the card substrate 2 as much as possible, the card substrate 2 is thermally deformed in the heat pressing process in which heat pressure is applied from above and below in the thickness direction. It is possible to suppress poor appearance due to.

2. Deformation Example In the contact and non-contact shared IC card of the present disclosure, a modification of the conductive block will be described.

(A) Modification 1
FIG. 5A shows a plan view of the conductive block 21 according to the first modification according to FIG. 3C in the contact and non-contact shared IC card of the present disclosure. The first conductive block 21a and the second conductive block 21b constituting the conductive block 21 have a symmetrical shape like the conductive block 11 of the embodiment, and are not shown, but correspond to FIG. 4 (b). The cross section seen from the Y1 direction is substantially L-shaped or substantially inverted L-shaped. However, as shown in FIG. 5A, the first portion 22a or 22b, which is thinner than the second portion 23a or 23b, which is thicker, is located along the X-axis from the second portion 23a or 23b. It differs from the conductive block 11 of the embodiment in that the width of the first portion along the Y axis becomes smaller and the shape tapers as the distance increases.

As described above, the width of the thin first portions 22a and 22b along the Y-axis is gradually tapered as the distance from the second portions 23a and 23b is along the X-axis. The volume and heat capacity of the conductive block 21a and the second conductive block 21b can be further reduced. Therefore, without reducing the contact area between the conductive adhesive layer 10 and the conductive block 21, the heat is accumulated in the conductive block 21 when the conductive adhesive layer 10 is heated, and the surrounding card substrate 2 is thermally deformed due to heat dissipation. It can be further suppressed.

(B) Modification example 2
Next, FIG. 5B shows a plan view of the conductive block 31 according to the modified example 2, which is similar to the modified example 1 described above. In the first conductive block 31a and the second conductive block 31b constituting the conductive block 31, recesses or through holes 34 along the thickness direction are formed in the regions of the thick second portions 33a and 33b. Except for the above, the conductive block 31 according to the modified example 2 has the same shape as the conductive block 21 according to the modified example 1. By forming recesses or through holes 34 in the regions of the second portions 33a and 33b where the thickness of the conductive block 31 is thick, the upper surfaces of the second portions 33a and 33b and the conductive adhesive layer 10 arranged on the upper surfaces thereof. The mechanical adhesive force can be strengthened by the wedge effect. Further, the surface area of the conductive block 31 is increased by the amount of the recess or the through hole, so that the heat dissipation effect is enhanced. The thermal deformation of the above can be further suppressed.

(C) Modification 3
Next, FIG. 5C shows a plan view of the conductive block 41 according to the third modification. In this modification, unlike the above-described embodiment and modification, the first conductive block 41a and the third conductive block 41c are arranged so that the conductive block 41 is divided into two as a portion connecting to the vicinity of the antenna end 8a. A second conductive block 41b and a fourth conductive block 41d divided into two are arranged as portions connecting to the vicinity of the antenna end 8b. That is, the conductive block 41 is divided into four parts. Further, although not shown, each of the four conductive blocks has a substantially L-shaped cross section or a substantially inverted L-shaped cross section as seen from the Y1 direction corresponding to FIG. 4 (b).

As described above, since the conductive block 41 is divided into four parts, the surface area of the conductive block 41 as a whole is increased to enhance the heat dissipation effect, and the heat to the conductive block 41 when the conductive adhesive layer 10 is heated is increased. Thermal deformation of the surrounding card substrate 2 due to accumulation and heat dissipation can be effectively suppressed. Further, the conductive block connected to the vicinity of the antenna end 8a and the conductive block connected to the vicinity of the antenna end 8b are each divided into two, so that, for example, two conductive blocks connected to the vicinity of the antenna end 8a Even if an electrical connection failure occurs in one of them, a good electrical connection can be ensured as a whole by electrically connecting the other conductive block. As a result, the reliability of the electrical connection between the conductive block and the antenna 8 can be improved. Further, even when the card is bent or the like, the internal stress applied to the conductive block 41 is dispersed in each of the four divided conductive blocks, so that the breakage of the conductive block 41 is suppressed.

(D) Modification example 4
Subsequently, FIG. 5D shows a plan view of the conductive block 51 according to the modified example 4. In this modification, the conductive block 51 is composed of a first conductive block 51a and a second conductive block 51b, the first conductive block 51a is located near the antenna end 8a, and the second conductive block 51b is located near the antenna end 8b. It is connected. Here, in the first conductive block 51a, the thin first portion 52a has a single plate-like structure, but the thick portion is parallel to the second portion 53a along the Y axis. It is different from the above-described embodiment and modification in that it is divided and arranged in the third portion 53c.

Further, the second conductive block 51b is also formed symmetrically with the first conductive block 51a described above, and the thin first portion 52b has a single plate-like structure, whereas the thick portion has a thick portion. , The second part 53b and the third part 53d parallel to the second part 53b along the Y axis are divided and arranged.

As described above, the conductive block 51 is composed of one piece in the first portions 52a and 52b having a thin thickness, whereas the portion formed on the upper side thereof is the second portion in addition to the second portions 53a and 53b. It has three sites 53c and 53d. Therefore, the heat dissipation effect is enhanced by increasing the surface area of the conductive block 51 as a whole, particularly by increasing the surface area of the second and third portions where the temperature can be the highest, and when the conductive adhesive layer 10 is heated, the conductive block 51 is heated. Thermal deformation of the surrounding card substrate 2 due to heat accumulation and heat dissipation can be effectively suppressed. Further, even when the card is bent or the like, the internal stress applied to the conductive block 51 is dispersed in each of the second portion and the third portion, so that the entire conductive block 51 is suppressed from being broken.

(E) Modification 5
Next, FIG. 6A shows a cross-sectional view of the conductive block 61 according to the modified example 5 in the vicinity of the first conductive block 61a corresponding to FIG. 4C. In this modification, the first conductive block 61a forms a thin first portion 62a and a thick second portion 63a by bending a plate-shaped member having the same thickness. .. Therefore, a void 64 is formed inside the second portion 63a.

Specifically, first, a plate-shaped member having the same thickness h21 is bent at a point having a length d2 from the X1 direction to the X2 direction at a substantially right angle in the Z2 direction. Then, at a point having a total length of h2 with the height h22 added, bending is further performed at a substantially right angle in the X1 direction. Then, at the point of length d22, the first conductive block 61a is obtained by further bending at a substantially right angle in the Z1 direction. It is preferable that the end of the plate-shaped member is not brought into contact with the plate-shaped member by the final bending process, and at least a part of the plate-shaped member is provided with a gap to enhance the heat dissipation effect. Although not shown, the second conductive block is similar to the above-described embodiment in that it has a symmetrical shape with the first conductive block 61a.

In this way, the conductive block 61 has a structure in which a plate-shaped member having the same thickness is bent to form a first portion having a thin thickness and a second portion having a large thickness. The surface area of the conductive block 61 can be increased as compared with the conductive block 11 according to the above, and the heat dissipation effect can be further improved. Further, since plate-shaped members having the same thickness can be used, materials can be easily obtained and processed. Further, by imparting spring suitability by bending the plate-shaped member, even when the card is bent, it can be appropriately deformed with respect to the internal stress applied to the conductive block 61, so that the entire conductive block 61 is suppressed from being broken. NS.

(F) Modification example 6
Further, FIG. 6B shows a cross-sectional view of the conductive block 81 according to the modified example 6 similar to the modified example 5 in the vicinity of the first conductive block 81a corresponding to FIG. 6 (a). In this modification, the first conductive block 81a has a thin first portion 82a and a thick second portion by bending a plate-shaped member having the same thickness as in the fifth modification. It forms with 83a. Inside the second portion 83a, a gap 84 having a large open portion is formed. Specifically, first, a plate-shaped member having the same thickness h31 is bent at a point having a length d31 from the X1 direction to the X2 direction at a substantially right angle in the Z2 direction. Then, at a point having a total length of h3 with the height h32 added, bending is performed at a substantially right angle in the X2 direction. Then, at the point of length d32, the first conductive block 81a is obtained by further bending at a substantially right angle in the Z1 direction. The length of the section after the final bending process is set to h3.

By bending the conductive block 81 into a plate-shaped member having the same thickness in this way, the same heat dissipation effect as in the modified example 5 and the effect of suppressing breakage due to spring suitability can be obtained. In this modified example, by changing the bending direction of the plate-shaped member with respect to the modified example 5, the amount of the plate-shaped member used can be further reduced and the cost can be reduced, so that the material can be obtained and processed more easily.

1 Contact and non-contact shared IC card 2 Card base 2a Cut card base 3, 6 Oversheet layer 4, 5 Core layer 7 IC module 8 Antenna 8a, 8b Antenna end 9 Recess 9a 1st recess 9b 2nd recess 10 Conductive Adhesive layer 10a First conductive adhesive layer 10b Second conductive adhesive layer 11, 21, 31, 41, 51, 61, 81 Conductive blocks 11a, 21a, 31a, 41a, 51a, 61a, 81a First conductive blocks 11b, 21b, 31b, 41b, 51b Second conductive blocks 12a, 12b, 22a, 22b, 32a, 32b, 42a, 42b, 42c, 42d, 52a, 52b, 62a, 82a First part 13a, 13b, 23a, 23b, 33a, 33b , 43a, 43b, 43c, 43d, 53a, 53b, 63a, 83a Second part 53c, 53d Third part 14 External contact terminal 15 IC chip 16 Wire 34 Recessed or through hole 64, 84 Void 71 Board 72 Molded part 71a 1 Antenna connection terminal 71b Second antenna connection terminals 91a, 91b Interface 92a First antenna contact 92b Second antenna contact

Claims (7)

A board having an external contact terminal on one surface and a plurality of antenna connection terminals on the other surface, and
An IC module mounted on the other surface of the substrate and having an external contact terminal, an antenna connection terminal, and an IC chip electrically connected to each other.
Each of both ends is equipped with an antenna, with a conductive block electrically connected, with a built-in card substrate, and
The conductive block is configured such that a first portion having a first thickness and a second portion having a second thickness thicker than the first thickness are adjacent to each other.
The first portion and the end portion of the antenna are electrically connected to each other.
A contact and non-contact shared IC card in which the second portion and the antenna connection terminal are electrically connected via a conductive adhesive layer. The first aspect of the present invention, wherein the melting point of the portion of the second portion that comes into contact with the conductive adhesive layer is higher than the temperature required for adhering the IC module to the second portion via the conductive adhesive layer. Contact and non-contact shared IC card. The contact and non-contact shared IC card according to claim 1 or 2, wherein the conductive adhesive layer includes an anisotropic conductive film. The second portion of the conductive block is formed by partially bending a member having the same thickness as the first portion, and has a gap inside the second portion, according to claims 1 to 3. The contact and non-contact shared IC card according to any one of the above. When the IC card is viewed through from the normal direction of the surface of the contact and non-contact shared IC card on the side on which the external contact terminal is arranged, the first portion has a shape that tapers as the distance from the second portion increases. The contact and non-contact shared IC card according to any one of claims 1 to 4, which is possessed. The contact and non-contact shared IC card according to any one of claims 1 to 4, wherein a recess or a through hole is formed in the second portion along the thickness direction. A board having an external contact terminal on one surface and a plurality of antenna connection terminals on the other surface, and
A step of preparing an IC module having an IC chip mounted on the other surface of the substrate and having the external contact terminal, the antenna connection terminal, and an IC chip electrically connected to each other.
A conductive block formed by adjoining a first portion having a first thickness and a second portion having a second thickness thicker than the first thickness is formed at both ends by the first portion. The process of manufacturing a card substrate that incorporates an antenna, which is electrically connected to each of the
A method for manufacturing a contact and non-contact shared IC card, comprising a step of electrically connecting the second portion and the antenna connection terminal via a conductive adhesive layer.

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