JP5699376B2 - IC card manufacturing method - Google Patents

Description

  The present invention relates to an IC card manufacturing method for cutting a cutting portion of an IC card based on cutting information printed on a card substrate.

There are IC cards with external terminals (contact type IC cards) and IC cards without external terminals (non-contact type IC cards) defined by JIS.
For an IC card with external terminals, first, a card base (card before mounting external terminals) is formed, a recess for mounting the IC module is formed on the card base, and an IC card with external terminals is manufactured by mounting the IC module. To do. When manufacturing such an IC card with an external terminal, it is necessary to make a mistake in the combination of the IC module to be mounted and the card base. Even if the IC module has the same terminal surface design, the mounted IC chip may be different, and the IC module mounted may be different depending on the printed language even if the symbols printed on the card are the same. is there.

  Therefore, an IC card in which an IC module is embedded in a plastic card substrate, and the unique number and symbol correlated with the card-specific number and symbol written on the card substrate are designated as an IC module (module). An IC card in which a card base material and an IC module are associated with each other is introduced (see, for example, Patent Literature 1).

JP 7-314963 A

The invention of Patent Document 1 is intended for a card such as an IC telephone card in which a large amount of money is charged to an IC chip. For example, after purchasing a new telephone card, the IC card just purchased a used module. The purpose is to prevent fraud by re-mounting and forging the card substrate, scratching the card substrate, bending the card substrate, requesting replacement of the IC card, and obtaining an unused IC module. It is what.
However, it has not been checked whether a legitimate IC module is taken out from a plurality of types of IC modules and mounted in a correct combination on a plurality of types of card bases having different designs and materials.
Therefore, the present invention prints the cutting information of the IC module to be mounted on the surface of the card base by a method that can be optically read, and includes the cutting processing information for embedding the IC module as well as the type of the IC module. An object of the present invention is to provide an IC card manufacturing method in which a legitimate IC module is mounted on a card substrate by reading from information.

In order to achieve the object, the first aspect of the IC card manufacturing method of the present invention is at least a card base supply unit, a cutting information reading unit, a cutting unit, an IC module supply unit, and an IC module. An IC card manufacturing method for manufacturing an IC card with an external terminal using an IC card manufacturing apparatus having a mounting portion, wherein a card substrate on which cutting information is optically readable printed on either front or back surface of the card substrate A card base supply step supplied from the supply unit, a cutting information reading step in which the cutting information is read by the cutting information reading unit, and an IC on the card base surface based on the cutting information read by the cutting information reading unit by the cutting unit A cutting process in which a recess for module mounting is formed, and the IC module is supplied by the IC module supply unit, and the IC module is placed in the recess. An IC module supplying step, the IC module mounting step of bonding the IC module to the card base in IC module mounting portion, in a manufacturing method of an IC card having,
The cutting information includes shape information of the recess and depth information of the recess .

Further, the second aspect is that an IC card with an external terminal is provided by an IC card manufacturing apparatus having at least a card base supply unit, a cutting information reading unit, a cutting unit, an IC module supply unit, and an IC module mounting unit. An IC card manufacturing method to be manufactured,
A card base supply process for supplying a card base having a cutting information optically readable printed on either the front or back surface of the card base from a card base supply section, and a cutting information reading process for reading the cutting information by a cutting information reading section. A cutting step in which a recess for mounting the IC module is formed on the card base surface based on the cutting information read by the cutting information reading unit by the cutting unit, and the IC module is supplied by the IC module supply unit and the recess An IC module supplying step in which the IC module is mounted on the IC module, and an IC module mounting step in which the IC module is bonded to the card substrate at the IC module mounting portion.
When the card base is for a small IC card, in the IC card manufacturing method having a groove forming step of further forming a groove for removing the small IC card at the cutting portion,
The cutting information includes recess shape information, recess depth information, groove position information, and groove shape information .

  According to the IC card manufacturing method of the present invention, a card base on which cutting information is optically readable printed on either the front or back side of the card base is prepared, supplied from the card base supply section, and the cutting information reading section The cutting information is read, the cutting unit forms a recess or a groove for removing a small IC card on the card base surface based on the cutting information, the IC module is supplied from the IC module supply unit, and the card base is installed at the IC module mounting unit. By adhering the IC module to the IC card, at least a recess of the IC module to be mounted is formed according to the cutting information printed on the surface of the card base. Further, if the SIM card is a SIM card, a groove is further formed. Mounted on a card substrate.

It is a figure for demonstrating an example of an IC card production apparatus. It is a figure for demonstrating one Embodiment of the IC card production method of this invention. It is a figure which shows one Embodiment of the IC card by the manufacturing method of the IC card of this invention. FIG. 4 is a sectional view taken along line AA in FIG. 3. It is a figure which shows an example of the cross section only of the recessed part of FIG. It is a figure which shows an example of the cutting information printed on the surface of a card | curd base | substrate. It is a figure which shows another example of the cutting information printed on the surface of the card | curd base | substrate.

Hereinafter, a method for manufacturing an IC card according to the present embodiment will be described with reference to the drawings.
An example of an IC card manufacturing apparatus will be described with reference to FIG.
The IC card manufacturing apparatus 5 is provided with a card base supply unit 51, a cutting information reading unit 52, a cutting unit 53, an IC module supply unit 54, and an IC module mounting unit 55 on the same line. When the external terminal is bonded to the card substrate in the IC module mounting portion 55, the card is handled as an IC card and moves to the next process. The next process may be performed on the same line as the IC card manufacturing apparatus or on a separate line. “Cutting” of the cutting part is also called “spotting” or “milling”, but in the description of the present embodiment, it is called “cutting”.

With reference to FIG. 1 and FIG. 2, the manufacturing method of the IC card of this embodiment is demonstrated.
The card substrate 1 is manufactured by an apparatus different from the IC card manufacturing apparatus.
In order to produce the card substrate 1, first, printing is performed on the core of the card (base material placed at the center of the card in a state before being stacked) (“step” is denoted by “S”, and step) 1 is labeled S1). The printing surface of the core is covered and protected by a cover sheet (a transparent material for protecting the printing ink). The cover sheet may be replaced with a protective coat or the like.
The contents of printing are the card name, wording, design, etc., but cutting information described later can also be printed together.

The cutting information may be printed by means such as inkjet in a state where the card substrate is printed, laminated, die-cut and completed as a card substrate (S2).
Since the cutting information is optically read by the cutting information reading unit 52 of the IC card manufacturing apparatus 5 described above, it is printed with optically readable characters, numbers, symbols, bar codes, two-dimensional codes, and the like.

In the case of a normal IC card with an external terminal, the cutting information is the shape information of the concave portion and the depth information of the concave portion.
In the case of a small IC card, the cutting information includes groove position information and groove shape information in addition to recess shape information and depth information.
The cutting information is simple and clear in order to make the printing space as small as possible and improve the reading accuracy. For example, instead of recording the shape of the recess and the depth of the recess in actual size, it is replaced with a 2-digit or 3-digit calling code, and the cutting portion 53 converts the information into the shape of the recess or the depth information of the recess. And cut.

For example, when the cutting information printed on the card substrate 1 is the numeral “1”, the cutting unit 53 converts the cutting information into the shape information of the concave portion, and is positioned 17 mm from the upper side of the card substrate and 8 mm from the left side of the card substrate. First recesses are formed with round corners having a width of 14 mm, a length of 13 mm, and four corners of about R2 (radius 2 mm).
In the case of the number “2”, the shape information of the concave portion is 16 mm from the upper side of the card base, 7 mm from the left side of the card base, 16 mm wide, 15 mm long, four corners at round corners of about R2 (radius 2 mm). A recess is formed.
The details of the cutting information will be described in detail with reference to FIG.

  Although the process of front and back pattern printing (S1) and cutting information printing (S2) is displayed separately, S2 may be performed simultaneously in S1.

  The core sheet on which the front and back symbols and cutting information are printed so as to be exposed on the surface of the card substrate 1 is laminated by heat and pressure, die-cut to the size of the card, inspected, and sent to the next process ( S3).

On the other hand, as described above, the cutting information and the cutting content printed so as to be displayed on the card base surface are created in advance as a program for driving the cutting device of the cutting unit 53 (S4).
Although not shown in FIG. 1, the central controller of the IC card manufacturing apparatus is at least a card base supply unit 51, a cutting information reading unit 52, a recess, a groove cutting unit 53, and an IC module supply unit 54 connected on the same line. The IC module mounting unit 55 is controlled.
The program created in advance is written in a predetermined external memory, and when it is attached to the external memory connection terminal of the central controller, it is written in a predetermined storage unit of the central controller.

An example of the cutting information will be described.
The cutting information includes, for example, an IC card manufacturing device code, a cutting information reading unit 52, a recess, a groove cutting unit 53, a unit code such as an IC module supply unit 54, a card base code (card type code), an IC module code, and cutting data. (First and second recess shape data, first and second recess depth data, groove shape data) are recorded, and the IC module code and cutting data are stored in a memory linked to the card base code. ing.
Therefore, when the cutting information reading unit 52 reads, for example, a three-digit number (up to 999 types of card substrate codes) printed on the card substrate surface, the cutting data associated with the code is formed into a recess, a groove, and a groove. Transmitted to the cutting unit 53, the recess and groove are cut by the recess and groove cutting unit 53, and an IC module code (for confirmation) is transmitted to the IC module supply unit 54 for confirmation, thereby completing a series of cutting steps. The IC module supply unit 54 inputs an IC module code every time a set number of IC modules are set in the IC module supply unit. When the IC module code is received, the IC module supply unit 54 inputs and stores the IC module code. The IC module code is collated, and the apparatus is stopped only when it does not match.

In the IC card manufacturing apparatus 5, the card base 1 is first supplied (S11).
The card base 1 is set so as to face the side where the printed cutting information is read by the reading device of the cutting information reading unit 52 (the side where the external terminal is mounted, the side where the recess is formed).
The card base 1 is supplied and transported by the card base supply unit 15 and reaches the cutting information reading unit 52. The cutting information reading unit 52 reads cutting information printed on the surface of the card base 1.
Normally, the card base 1 that is conveyed is supplied in the same number of card bases (same type of card base) on which the same type of printing has been performed, so the cutting information marked on the card base 1 is the same. It is. For this reason, when a card base 1 having different cutting information is read suddenly, the card base 1 is once flipped to the eject box.
The read cutting information is transmitted to the cutting unit 53 (S12).

In the case of a normal IC card with an external terminal, the cutting unit 53 cuts only the recess for mounting the IC module (S13). In the case of a small IC card, a recess cutting part and a groove for removing the small IC card from the card base are also cut (S14).
A small IC card is also called a SIM card or the like, and is used for a part of a memory such as a mobile phone. When a device for writing information to an IC chip of a small IC card (SIM card) is installed, information is written in the state of the small IC card from the beginning.
In the cutting part 53, a recessed part cutting part and a groove cutting part may be cut with a separate cutting device. Depending on the amount of work, it is determined whether to perform recess cutting and groove cutting with a single machine or to perform recess cutting and groove cutting with separate devices in order to improve efficiency.

  In the cutting process, cutting dust (referred to as fine powder generated during cutting) is generated, and due to the influence of static electricity, the plastic fine powder adheres to the card base 1, but adheres to the external terminal surface. Since it becomes an obstacle when information is written to the IC chip, the cutting waste is completely removed.

  The cutting information printed on the surface of the card substrate 1 and the cutting information printed on the recess formation scheduled portion is scraped off in S13 and disappears from the surface of the card substrate 1. Therefore, the cutting information may be printed on a portion other than the recess formation scheduled portion.

The card base 1 on which the recess, the recess, and the groove for removing the small IC card are formed is supplied to the IC module supply unit 54. In the IC module supply unit 54, the matching between the mounted IC module and the card base 1 has already been completed when the cutting information is read by the cutting information reading unit, so that the IC module is formed on the card base 1. The recessed portion is attached with an adhesive (S15). As the adhesive, a sheet type melted by heat or a liquid adhesive applied by an applicator is used.
The IC module supply unit 54 checks the number of IC modules loaded while confirming the number read by the cutting information reading unit 52, and transmits the check result to the central control unit (not shown).

  In the IC module mounting section 55, the IC module supply section 54 pressurizes the external terminal surface of the IC module mounted on the card base 1 and, if necessary, heats and pressurizes it, thereby firmly bonding the IC module and the card base 1 (S16). ).

  The card base (IC card base) on which the IC module is mounted is sent to the next process as an IC card.

With reference to FIG. 3, an embodiment of an IC card according to the IC card manufacturing method of the present invention will be described. The IC card 10 shown in FIG. 3 is an IC card for producing the small IC card 100 formed inside the groove 13 formed in the card base 1, but usually in a state where the groove 13 is not formed. IC card of standard size of card.
On the inner side of the IC module 2, recesses (first recess 11 and second recess 12) for mounting the IC module are formed. Although not shown, the small IC card 100 is supported on the card base 1 by a bridge (a portion that passes through the groove 13 and connects the small IC card and the card base).

Characters such as “IC card” which is the name of the card are printed on the IC card 10 with an external terminal according to the IC card manufacturing method of the present embodiment together with a design or the like.
Although not shown, the magnetic stripe may be formed on the front or back of the IC card or on either side.
The IC module 2 is mounted at a position avoiding the center of the short side direction and the long side direction of the card base 1 in accordance with ISO (International Standardization for Organization), and the card base 1 is bent in the short side direction and the long side direction. It is considered that stress is not easily applied to the IC module 2 when it is applied.

FIG. 4 is a diagram illustrating an example of a cross section taken along line AA in FIG. 3.
The IC module 2 is formed on the card base 1 and is bonded and fixed to the first recess 11 serving as an adhesive portion by an adhesive sheet 3.
The card base 1 is mostly a laminate of non-conductive plastics. First, a first recess 11 serving as an adhesive portion is first formed by a cutting blade, and a second recess 12 is similarly cut inside the first recess 11. The IC module 2 is mounted by being formed by a blade.
The 2nd recessed part 12 is formed in the pot shape close | similar to the bowl shape shown in FIG. 3, and the shape of the sealing resin of IC module.
Since the IC card 10 is a card for a small IC card, a groove 13 for removing the small IC card 100 from the card base 1 is formed.

The IC module 2 (hereinafter also referred to as COT) mounted on the card base 1 will be described with reference to FIGS.
COT is an abbreviation of “Chip On Tape”. A through hole is not formed in the module substrate, a hole is formed in the IC module substrate, and the metal surface on the back of the external terminal exposed in the hole of the substrate and the pad electrode of the IC chip Is an IC module of a type in which these are connected with bonding wires.
For the adhesive sheet 3 placed in the first concave portion 11 serving as an adhesive portion, an adhesive that is activated by heating and is bonded under pressure is used.

As shown in FIG. 5, the depth d1 of the first recess 11 corresponds to the thickness of the module substrate of the IC module 2 (including the thickness of the adhesive), and the depth d2 of the second recess 12 is It is formed so as to correspond to the entire thickness of the IC module on which the stop resin is formed.
As a result of forming the first concave portion 11 and the second concave portion 12 based on the thickness of the above-mentioned portion of the IC module, the IC module 2 has a sealing resin so that the external terminal surface is flush with the card substrate. Is mounted on the card base 1 so that the bottom of the card contacts the bottom of the second recess 12.

  The aforementioned cutting information is information for calling up the shape data of the first recess 11 and the second recess 12 shown in FIG. 4, the shape data of the groove 13 for removing the small IC card, and the like. Further, this is information for calling the depth data d1 and d2 of the first recess 11 and the second recess 12 shown in FIG.

An example of cutting information printed on the surface of the card base will be described with reference to FIGS.
The example shown in FIG. 6 is an example in which cutting information 41 with a three-digit number is printed on the inside of the above-described recessed portion formation planned portion (first recessed portion 11) and on the exposed surface of the card base 1. In this case, the IC module is mounted after the recess is formed, and the cutting information 41 disappears from the card surface.
On the other hand, since the cutting information 42 is printed at the lower right corner of the card substrate 1 as in the example shown in FIG. 7, it may be left on the card display surface even after the IC module is mounted.
In FIGS. 6 and 7, the cutting information has been described using the example of a three-digit optically read character. However, as described above, the cutting information may be printed using any of characters, numbers, symbols, barcodes, and two-dimensional codes.
When there is a large amount of information such as a two-dimensional code, the shape and depth data to be cut may be directly used as cutting information.
As described above, at least the recesses of the IC module to be mounted are properly formed based on the registered data based on the cutting information printed on the surface of the card base, and further grooves are formed if the SIM card is mounted. The IC module to be mounted is correctly mounted on the card substrate to be mounted.

  It can be used as a method for producing an IC card with external terminals.

DESCRIPTION OF SYMBOLS 1 Card base | substrate 2 IC module 3 Adhesive sheet 5 IC card production apparatus 10 IC card 11 1st recessed part 12 2nd recessed part 13 Groove 41, 42 Cutting information 51 IC card supply part 52 Cutting information reading part 53 Recessed part, groove cutting part 54 IC Module supply section 55 IC module mounting section 100 Small IC card

Claims (2)

An IC card manufacturing method for manufacturing an IC card with an external terminal using an IC card manufacturing apparatus having at least a card base supply unit, a cutting information reading unit, a cutting unit, an IC module supply unit, and an IC module mounting unit. And
A card base supply process for supplying a card base having a cutting information optically readable printed on either the front or back surface of the card base from a card base supply section, and a cutting information reading process for reading the cutting information by a cutting information reading section. A cutting step in which a recess for mounting the IC module is formed on the card base surface based on the cutting information read by the cutting information reading unit by the cutting unit, and the IC module is supplied by the IC module supply unit and the recess In an IC card manufacturing method, comprising: an IC module supply step in which the IC module is mounted; and an IC module mounting step in which the IC module is bonded to the card substrate at the IC module mounting portion .
The method for producing an IC card, wherein the cutting information includes shape information of a recess and depth information of the recess . An IC card manufacturing method for manufacturing an IC card with an external terminal using an IC card manufacturing apparatus having at least a card base supply unit, a cutting information reading unit, a cutting unit, an IC module supply unit, and an IC module mounting unit. And
A card base supply process for supplying a card base having a cutting information optically readable printed on either the front or back surface of the card base from a card base supply section, and a cutting information reading process for reading the cutting information by a cutting information reading section. A cutting step in which a recess for mounting the IC module is formed on the card base surface based on the cutting information read by the cutting information reading unit by the cutting unit, and the IC module is supplied by the IC module supply unit and the recess an IC module supply step of the IC module is mounted, and the IC module mounting step of bonding the IC module to the card base in IC module mounting portion, were closed to,
When the card base is for a small IC card, in the IC card manufacturing method having a groove forming step of further forming a groove for removing the small IC card at the cutting portion,
The IC card manufacturing method, wherein the cutting information includes shape information of the recess, depth information of the recess, position information of the groove, and shape information of the groove .
It is.

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