JP2003011945A - Container with non-contact type ic chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a container with a non-contact type IC chip for writing in necessary information for a packaging container such as a consumption date or a container material, and for easily managing the container itself and a product therein. SOLUTION: This container is molded from a laminate of a base material (11), a non-contact type IC chip (12) and a lamination film or sheet (13). In molding, a sheet molding method such as vacuum forming, pressure forming where a temperature rise is relartively small is desirable for decreasing influence on the chip.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact method for reading / writing data and / or I / O.
The present invention relates to a non-contact type IC chip-equipped container having a C chip.

[0002]

2. Description of the Related Art Conventionally, in addition to product information such as product name, manufacturer information, product information, bar code, etc. of packaging contents and labels, contact information, application ticket mark at the time of campaign, seal Information other than product information such as is printed and displayed in stores. Information such as product information is limited by the size of the packaging or label, and the amount of information on the product is small for packaging and labels with a small area, and if the letters are made small to increase the amount of information, There was a problem that it became difficult to read.

At present, bar codes are widely used to manage individual information of merchandise. However, the bar code itself must be displayed on the surface and the bar must be clear. That is, there are restrictions on printing on a package or a label. In addition, dust and dirt may cause reading failure,
The barcode has a small amount of information due to the problem of the number of digits, there is a problem that the information cannot be added or changed, and there is no security. Therefore, these improvements have been desired.

On the other hand, in order to give such product information to a package or a label, a great deal of labor and time are spent in the manufacturing process such as printing, shrinking, and secondary processing with other labels. Leads directly to cost and profit reduction.

[0005]

The problem to be solved by the present invention is that the required information such as the expiration date and the container material information can be written in the packaging container. Therefore, the management of the container itself or the product in the container can be performed. It is an object to provide a container with a non-contact type IC chip that can be easily performed.

[0006]

The invention according to claim 1 of the present invention is characterized in that a base material, a non-contact type IC chip, and a laminating sheet or film are laminated and molded. It is a container with a contact type IC chip.

As described above, since the base material, the non-contact type IC chip, and the laminating sheet or film are laminated and molded, the product name and the manufacturing company information conventionally used by printing or bar code. Product information such as production information can be read into the non-contact type IC chip.

A second aspect of the present invention is the non-contact type IC chip-equipped container according to the first aspect, wherein the base material is paperboard.

As described above, since the paperboard is used as the base material, the IC chip can be I
The C chip is not damaged.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The non-contact type IC chip-equipped container of the present invention will be described below in detail based on one embodiment.
The non-contact type IC chip-equipped container (10) of the present invention includes a base material (11) and a non-contact type IC as shown in FIG.
The chip (12) and the laminating sheet or film (13) are laminated and molded.

The base material (11) may be any material as long as it has a function of maintaining the shape-retaining property as a container and protects the contents contained in the container, especially from physical impact, such as paper or a relatively rigid plastic sheet. And the like, or a plastic-processed paper in which a plastic film is laminated on paper is preferably used. It may be in the form of a sheet, or may be preformed in a tray-like container.

The non-contact type IC chip (12) is capable of reading at least the data in the IC chip, and is preferably a readable and writable IC.
It's a chip. By being writable, it becomes possible to write new information, add additional information, or rewrite information before stacking as a container, in advance, or after molding as a container.

The non-contact type IC chip (12) is
Whether it is a literal IC chip or a coin-shaped one in which the IC chip is embedded in a resin, an IC tag made of a thermoplastic resin film, metal foil, paper, or a laminate of these, and having the IC mounted on a base material, It does not matter which is called the label-like tag.

Laminating sheet or film (1
In 3), the non-contact type IC chip mounted on the base material is fixed and, if necessary, the container is provided with resistance such as water resistance and gas barrier property.

Laminating sheet or film (1
As 3), a plastic sheet or film of polystyrene, amorphous polyethylene terephthalate (A-PET), polypropylene or the like can be preferably used.

The base material (11) and the non-contact type IC chip (1
The lamination and molding of 2) and the laminating sheet or film (13) are carried out by laminating three members and then molding, and IC of the molded base material to which the IC chip is attached.
Any method such as a method of laminating a laminating sheet or film by a method such as a sheet forming method on the surface on which the chips are attached may be used.

For example, as shown in FIG. 2, a molding die (2
0), a paper tray blank which is a base material (11) on which a non-contact type IC chip (12) is placed, and a polystyrene sheet which is a laminating sheet or a film (13) are placed thereon. By heating and pressurizing by a vacuum forming method, a tray-shaped container with an IC chip is formed. The IC chip may be placed at a predetermined position on the paper tray blank by transferring it from a magazine rack or a parts feeder. Since the non-contact type IC chip (12) is thin and small, the buffering action of the paper in the paper tray causes I
The C chip is in a state of being set in the paper tray, and it is not necessary to provide a recess for the IC chip in the mold, and the C chip may be flat.

[0018]

As described above, since the non-contact type IC chip-equipped container is manufactured by the film / sheet molding method, the temperature rising level is lower than that of the injection molding method and the like. Thermal influence is relatively small, and good products can be obtained by focusing on adhesion.

[Brief description of drawings]

FIG. 1 is an explanatory view in cross section showing an example of a container with a non-contact type IC chip of the present invention.

FIG. 2 is an explanatory view showing an example of a stacking order of constituent materials of a container with a non-contact type IC chip of the present invention.

[Explanation of symbols]

10 ... Non-contact type container with IC chip 11 ... Base material 12 ... Non-contact type IC chip 13 ... Sheet or film for laminating 20 Molding mold

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G06K 19/077 G06K 19/00 K

Claims (2)

[Claims] 1. A container with a non-contact type IC chip, comprising a base material, a non-contact type IC chip, and a laminating sheet or film laminated and molded. 2. The container with a non-contact type IC chip according to claim 1, wherein the base material is paperboard.