JP2003067704A - Attachment method of non-contact type ic chip - Google Patents
Attachment method of non-contact type ic chipInfo
- Publication number
- JP2003067704A JP2003067704A JP2001254041A JP2001254041A JP2003067704A JP 2003067704 A JP2003067704 A JP 2003067704A JP 2001254041 A JP2001254041 A JP 2001254041A JP 2001254041 A JP2001254041 A JP 2001254041A JP 2003067704 A JP2003067704 A JP 2003067704A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- contact type
- attachment
- attached
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000005022 packaging material Substances 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、非接触方式でデー
タの読み出しあるいは読み出し及び書き込みが可能な非
接触方式ＩＣチップの取り付け方法と該取り付け方法を
用いて作製したＩＣチップを装着した包装材料に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching a non-contact type IC chip capable of reading or writing data in a non-contact type and a packaging material having the IC chip produced by the attaching method. .
【０００２】[0002]
【従来の技術】従来、包装体やラベルには、それらの包
装内容物の商品名、製造会社情報、製品情報、バーコー
ド等の商品情報が印刷され、店頭などに陳列されてい
る。これらの商品情報などの情報は、包装体やラベルの
大きさによって制約を受け、面積の小さな包装体やラベ
ルでは商品の情報量も少なくなり、また、情報量を多く
のせようと文字を小さくすると読みにくくなってしまう
という問題があった。2. Description of the Related Art Conventionally, a package and a label are printed with product information such as a product name of the package contents, manufacturer information, product information, and a bar code, and displayed at a store or the like. Information such as product information is limited by the size of the packaging or label, and the amount of information on the product is small for packaging and labels with a small area, and if the letters are made small to increase the amount of information, There was a problem that it became difficult to read.
【０００３】また、現在、商品の個別情報を管理するた
め、バーコードが広く利用されているが、バーコード
は、バーコード自体が表面に表示されていなければなら
ないこと、バーの明瞭性が必要であること、など包装体
又はラベルに印刷する上での制約事項があった。さら
に、埃や汚れなどによって読み取り不良が生じる点や、
バーコードは桁数の問題から情報量が少なく、また情報
の追加・変更ができない、セキュリティ性がないといっ
た課題があり、これらの改善が望まれていた。At present, bar codes are widely used to manage individual information of merchandise. However, the bar code itself must be displayed on the surface and the bar must be clear. That is, there are restrictions on printing on a package or a label. In addition, dust and dirt may cause reading failure,
The barcode has a small amount of information due to the problem of the number of digits, there is a problem that the information cannot be added or changed, and there is no security. Therefore, these improvements have been desired.
【０００４】これらの解決策として、最近では、物品に
関する様々な情報、例えば、物品の名称や重量、内容
量、製造・販売者名、製造場所、製造年月日、使用期限
等の情報を記録したＩＣを物品に取り付けることが行わ
れるようになってきている。As a solution to these problems, recently, various kinds of information about an article, such as the name and weight of the article, the content, the name of the manufacturer / seller, the place of manufacture, the date of manufacture, the expiration date, etc. are recorded. It has become common to attach such ICs to articles.
【０００５】このＩＣの物品への取り付けは、プラスチ
ックフィルムや金属箔、紙、これらの積層体などからな
る基材にＩＣを装着したＩＣタグと呼ばれるラベル状の
タグの裏面に粘着剤あるいは接着剤を施し、この粘着剤
または接着剤を利用してＩＣタグを物品に取り付けるこ
とが一般的であった。This IC is attached to an article by attaching a pressure-sensitive adhesive or an adhesive to the back surface of a label-like tag called an IC tag in which the IC is mounted on a substrate made of a plastic film, metal foil, paper, or a laminate of these. It was common to attach an IC tag to an article using this adhesive or adhesive.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うなＩＣの物品への取り付け方法では、物品への取り付
け位置、方向精度が悪くなることが考えられる。However, in such a method of attaching an IC to an article, it is conceivable that the attaching position to the article and the direction accuracy will be deteriorated.
【０００７】本発明は、ＩＣの物品への取り付け方法に
関する以上のような問題点を解決するためになされたも
ので、対象物へのＩＣの取り付け位置、取り付け精度を
向上させたＩＣチップの取り付け方法と該取り付け方法
を用いて作製したＩＣチップを取り付けた包装材料、包
装容器を提供することを課題とする。The present invention has been made in order to solve the above-mentioned problems relating to the method of attaching an IC to an article, and is to attach an IC chip to an object and an IC chip with improved attachment accuracy. It is an object to provide a packaging material and a packaging container to which an IC chip produced by using the method and the attachment method is attached.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１の発明
は、被装着体に凹部を形成し、その凹部に非接触方式で
データの読み出しあるいは読み出し及び書き込みが可能
である非接触方式ＩＣチップを取り付け、さらにその上
にフィルムを積層したことを特徴とする非接触方式ＩＣ
チップの取り付け方法である。According to a first aspect of the present invention, a concave portion is formed in a mounted body, and a non-contact type IC in which data can be read or read and written in the concave portion in a non-contact manner. A non-contact type IC characterized in that a chip is attached and a film is laminated on the chip.
This is the method of attaching the chip.
【０００９】このように、被装着体に凹部を形成し、そ
の凹部に非接触方式ＩＣチップを取り付け、さらにその
上にフィルムを積層したので、例えば、アイマーク等を
利用して被装着体の特定位置に凹部を形成することが可
能で、その形成した凹部に非接触方式ＩＣチップを取り
付け、最終製品中のＩＣの位置を特定の位置とすること
ができる。As described above, since the concave portion is formed in the mounted body, the non-contact type IC chip is mounted in the concave portion, and the film is further laminated thereon, for example, an eye mark or the like is used to attach the mounted body to the mounted body. A recess can be formed at a specific position, and a non-contact IC chip can be attached to the formed recess to set the position of the IC in the final product to the specific position.
【００１０】また、請求項２の発明は、請求項１記載の
非接触方式ＩＣチップの取り付け方法を用いて、非接触
方式ＩＣチップを装着した包装材料である。A second aspect of the present invention is a packaging material in which a non-contact type IC chip is mounted by using the non-contact type IC chip mounting method according to the first aspect.
【００１１】また、請求項３の発明は、請求項１記載の
非接触方式ＩＣチップの取り付け方法を用いて、非接触
方式ＩＣチップを装着した包装容器である。A third aspect of the present invention is a packaging container in which a non-contact type IC chip is mounted by using the non-contact type IC chip mounting method according to the first aspect.
【００１２】[0012]
【発明の実施の形態】本発明の非接触方式ＩＣチップの
取り付け方法を一実施形態に基づいて以下に詳細に説明
する。本発明の非接触方式ＩＣチップの取り付け方法
は、例えば、図１に示すように、被装着体（１１）に凹
部（１２）を形成し、その凹部に非接触方式ＩＣチップ
（１３）を取り付け、さらにその上にフィルム（１４）
を積層した非接触方式ＩＣチップの取り付け方法であ
る。BEST MODE FOR CARRYING OUT THE INVENTION A method for mounting a non-contact type IC chip of the present invention will be described below in detail based on one embodiment. The non-contact type IC chip mounting method of the present invention, for example, as shown in FIG. 1, forms a recessed part (12) in a mounted body (11) and mounts the non-contact type IC chip (13) in the recessed part. , And films on it (14)
It is a method of attaching a non-contact type IC chip in which the above are laminated.
【００１３】被装着体（１１）としては、凹部（１２）
を形成させる必要があるため、可撓性、柔軟性を有する
ものが好ましく、紙、プラスチックフィルム、プラスチ
ックシート等あるいはこれらの積層体からなる基材シー
ト等が使用できる。As the mounted body (11), the recess (12)
Since it is necessary to form a sheet, it is preferable that the sheet has flexibility and flexibility, and paper, a plastic film, a plastic sheet or the like, or a base sheet made of a laminated body thereof or the like can be used.
【００１４】凹部（１２）を形成させる手段は、特に限
定されず、被装着体が平面的である基材シートなどの場
合は、例えば、基材シートにエンボス加工などを施す方
法が好ましい。あらかじめ、凹部の形成予定個所にアイ
マーク等を印刷しておくことにより、所望に位置に凹部
を形成することができる。The means for forming the concave portion (12) is not particularly limited, and when the mounted body is a flat base sheet or the like, for example, a method of embossing the base sheet is preferable. By previously printing an eye mark or the like at the place where the recess is to be formed, the recess can be formed at a desired position.
【００１５】非接触方式ＩＣチップ（１３）は、ＩＣチ
ップ内のデータを少なくとも読み出すことができるもの
であり、好ましくは、読み出し及び書き込みが可能なＩ
Ｃチップである。書き込みができることにより、包装材
料等の被装着体に取り付ける前にあらかじめ、あるいは
包装材料等の被装着体に取り付けた後などに、新たに情
報を書き込んだり、付加情報を書き換えたりすることが
できる。The non-contact type IC chip (13) is capable of reading at least the data in the IC chip, and is preferably a readable and writable I chip.
It is a C chip. By being able to write, new information can be written or additional information can be rewritten before being attached to a mounted object such as packaging material, or after being attached to a mounted object such as packaging material.
【００１６】また、ＩＣチップ（１３）は、文字通りＩ
Ｃチップの状態でも、ＩＣチップを樹脂中に埋め込んだ
コイン状の状態にしても、熱可塑性樹脂フィルムや金属
箔、紙、これらの積層体からなる基材にＩＣを取り付け
たＩＣタグと呼ばれるラベル状のタグの状態にしてもい
ずれでも構わない。The IC chip (13) is literally I
A label called an IC tag in which an IC is attached to a base material made of a thermoplastic resin film, a metal foil, paper, or a laminated body of the C chip or a coin-like state in which the IC chip is embedded in a resin. It does not matter whether the tag is in the shape of a circle.
【００１７】ＩＣチップ（１３）を被装着体である基材
シートなどの凹部（１２）に取り付けた後、凹部を覆う
ように基材シート（１１）にプラスチックフィルム（１
４）をラミネートして積層する。After the IC chip (13) is mounted in the recess (12) such as the base sheet which is the mounted object, the plastic film (1) is attached to the base sheet (11) so as to cover the recess.
4) is laminated and laminated.
【００１８】プラスチックフィルム（１４）としては、
ポリエチレン、ポリプロピレン、ポリスチレン等の一般
的に公知の熱可塑性フィルムが使用できる。As the plastic film (14),
Generally known thermoplastic films such as polyethylene, polypropylene and polystyrene can be used.
【００１９】被装着体（１１）である基材シートとプラ
スチックフィルム（１４）との積層方法は、ドライラミ
ネート法、溶融押し出しラミネート法等の公知の積層方
法を用いればよい。As a method for laminating the base material sheet which is the article to be mounted (11) and the plastic film (14), known laminating methods such as a dry laminating method and a melt extrusion laminating method may be used.
【００２０】[0020]
【発明の効果】上記のように、本発明の非接触方式ＩＣ
チップの取り付け方法によれば、基材シート等の被装着
体の所望の位置に非接触方式ＩＣチップを取り付けるこ
とができる。また、この取り付け方法を採用することに
より、所望の位置に非接触方式ＩＣチップを取り付けた
包装材料や包装容器を作製することができる。As described above, the non-contact type IC of the present invention
According to the chip mounting method, the non-contact type IC chip can be mounted at a desired position on the mounted body such as the base material sheet. Further, by adopting this attachment method, it is possible to manufacture a packaging material or a packaging container in which a non-contact type IC chip is attached at a desired position.
【図１】本発明の非接触方式ＩＣチップの取り付け方法
の一実施形態を示す、模式説明図である。FIG. 1 is a schematic explanatory view showing an embodiment of a method for attaching a non-contact type IC chip of the present invention.
１１‥‥被装着体 １２‥‥凹部 １３‥‥非接触方式ＩＣチップ １４‥‥フィルム 11 ... Attached body 12 ... Recess 13 ... Non-contact type IC chip 14 film
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｌ 23/28 Ｇ０６Ｋ 19/00 Ｈ Ｆターム(参考） 2C005 MA33 NA06 NB01 QC01 SA05 TA22 3E067 AA11 AB47 AC01 BA31A BA33A BB14A BB15A BB16A EA04 FA01 FB05 FC01 4M109 AA01 BA05 CA22 DB16 GA03 5B035 BA03 BA05 BB09 CA01 CA23 5F061 AA01 BA05 CA22 FA03 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01L 23/28 G06K 19/00 HF term (reference) 2C005 MA33 NA06 NB01 QC01 SA05 TA22 3E067 AA11 AB47 AC01 BA31A BA33A BB14A BB15A BB16A EA04 FA01 FB05 FC01 4M109 AA01 BA05 CA22 DB16 GA03 5B035 BA03 BA05 BB09 CA01 CA23 5F061 AA01 BA05 CA22 FA03
Claims (3)
触方式でデータの読み出しあるいは読み出し及び書き込
みが可能である非接触方式ＩＣチップを取り付け、さら
にその上にフィルムを積層したことを特徴とする非接触
方式ＩＣチップの取り付け方法。1. A non-contact type IC chip capable of reading data or reading and writing data in a non-contact system is attached to the recess, and a film is laminated on the recess. A characteristic non-contact type IC chip mounting method.
り付け方法を用いて、非接触方式ＩＣチップを装着した
包装材料。2. A packaging material on which a non-contact type IC chip is mounted by using the non-contact type IC chip mounting method according to claim 1.
り付け方法を用いて、非接触方式ＩＣチップを装着した
包装容器。3. A packaging container in which a non-contact type IC chip is mounted by using the method for mounting a non-contact type IC chip according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001254041A JP2003067704A (en) | 2001-08-24 | 2001-08-24 | Attachment method of non-contact type ic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001254041A JP2003067704A (en) | 2001-08-24 | 2001-08-24 | Attachment method of non-contact type ic chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003067704A true JP2003067704A (en) | 2003-03-07 |
Family
ID=19082257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001254041A Pending JP2003067704A (en) | 2001-08-24 | 2001-08-24 | Attachment method of non-contact type ic chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003067704A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007286213A (en) * | 2006-04-14 | 2007-11-01 | Hitachi Ltd | Wearing band and method for manufacturing the same |
| US7669387B2 (en) | 2001-09-14 | 2010-03-02 | Focke & Co. (Gmbh & Co. Kg) | Package particularly a cigarette package, and method and device for the production thereof |
-
2001
- 2001-08-24 JP JP2001254041A patent/JP2003067704A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7669387B2 (en) | 2001-09-14 | 2010-03-02 | Focke & Co. (Gmbh & Co. Kg) | Package particularly a cigarette package, and method and device for the production thereof |
| JP2007286213A (en) * | 2006-04-14 | 2007-11-01 | Hitachi Ltd | Wearing band and method for manufacturing the same |
| JP4755524B2 (en) * | 2006-04-14 | 2011-08-24 | 株式会社日立製作所 | Wristband |
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