JP5225138B2 - IC tag container package manufacturing method and IC tag container package - Google Patents

Description

  The present invention relates to a method of manufacturing an IC tag container package in which a plurality of IC tag containers each having an IC tag label attached to a container are packaged.

  With recent remarkable progress in IT technology, IC tags equipped with ultra-small IC chips are being used for merchandise management instead of barcodes. As one form of usage, product information (product name, lot number, production date, quality retention time, etc.) and receipt / shipment information (shipping date, warehousing date, etc.) etc. are appropriately recorded on the IC tag, and distributed from the product manufacturer. Product management including distribution history up to the consumer through the dealer can be performed for each individual product.

An example of a product having such an IC tag is a medical container such as an ampoule.
By providing an IC tag in a medical container, desired information such as receipt / shipment information and inspection information can be added to or updated in each IC tag at each base from a pharmaceutical manufacturer through a distributor to a hospital. Thus, if an IC tag is used, a very accurate distribution history can be left. For this reason, there exists an advantage that tracking management of a pharmaceutical can be performed easily.

Conventionally, as a means for providing an IC tag in a container, an antenna pattern made of conductive ink is printed on the surface of a cylindrical label base material, and the IC tag is attached so as to be electrically connected to the antenna pattern. It is known that a bottle label with an IC tag is attached to a container body (Patent Document 1).
In addition to such a cylindrical label, means for attaching a tack label having an IC tag to the container body is also conceivable.

Japanese Patent Laid-Open No. 2004-20771

By the way, various commodities including medical containers are usually used for distribution such as storage and transportation in the form of a package that is packed in a packaging box such as a cardboard box or a cardboard box.
However, as in the conventional case, a package in which an IC tag container having an IC tag provided on the container body portion may not be able to accurately read the IC tag information provided in each container.

For example, a medical container (IC tag container) equipped with an IC tag is provided in each storage recess of a storage member (generally, a lotion is used as the storage member) in which a plurality of storage recesses are formed. Can be put.
However, since the storage recesses are formed side by side from one side of the storage member to the other side, the IC tags of adjacent medical containers placed in the storage recesses may face each other. . In this case, since the IC tags facing each other interfere with each other, it may not be possible to accurately read the IC tag information of each medical container by a wireless communication device such as a reader device, or to correctly write information to each IC tag. is there. In addition, when the filled medicine is a liquid, radio waves are easily absorbed by the liquid, so that the reading accuracy of the IC tag similarly decreases.

  In this regard, when manufacturing the package, if the medical container is inserted into each storage recess while adjusting the orientation of the medical container so that the IC tag does not face each other, interference between the IC tags can be prevented. However, putting the medical container into the storage recess while adjusting the direction of the individual medical containers leads to complication of the packaging operation. In addition, when the medical container is rotatable in the storage recess, even if the IC tags are aligned, the medical container rotates in the storage recess in the distribution process, and the orientation of the IC tag is changed. There is also a risk of change.

A first object of the present invention is to provide a method for manufacturing an IC tag container package that can easily align the orientation of each IC tag and accurately access each IC tag after the IC tag container is placed in the housing recess of the housing member. Is to provide.
A second object of the present invention is an IC that can accurately access an IC tag of each IC tag container in a packaging body in which the IC tag container provided in the container is placed in each storage recess of the storage member. It is to provide a tag container package.

  The method for producing an IC tag container package according to the present invention is an IC tag container in which a part of an IC tag label is affixed to a body part of the container, and one side part of the IC tag label is a body part at a position where the IC tag label is applied. The IC tag container is placed in each storage recess of a storage member in which a plurality of storage recesses are formed from one side to the other side. The IC tag label is placed in one direction so as to be in contact with the surface of the IC tag label so that one side of the IC tag label faces the one side of the storage member when rotated in the direction. And a step of relatively moving the rotating alignment tool from the other side portion of the storage member to the one side portion.

In the manufacturing method of the IC tag container package, first, the IC tag container from which one side portion of the IC tag label protrudes is placed in each storage recess of the storage member. At this time, each IC tag container is placed in each storage recess so that one side of the IC tag label faces one side of the storage member when the IC tag container is rotated in one direction. In this step, it is not necessary to arrange the IC tag labels on substantially the same plane, and it is only necessary to randomly place the IC tag containers in the storage recesses.
When each IC tag container is randomly placed in the storage recess with one side of the IC tag label facing one side of the storage member, the IC tag label enters the storage recess with one side protruding from the storage recess. Some IC tag containers are included in such a state that one side portion of the IC tag label is substantially parallel to the surface including the top surface portion of the storage recess.

Next, when an alignment tool that contacts the surface of the IC tag label and rotates the IC tag container in one direction is relatively moved from the other side of the storage member to the one side, the protruding IC tag label The alignment tool that hits the surface draws the IC tag label toward one side of the storage member. The IC tag container rotates in one direction within the storage recess as the aligner pulls the IC tag label. As a result, an IC tag container package in which the IC tag labels of the IC tag containers are arranged on substantially the same plane can be obtained.
In the obtained IC tag container package, since the IC tag labels of the IC tag containers are arranged on substantially the same plane, it is possible to prevent adjacent IC tags from interfering with each other. In addition, by making a wireless communication device act on the IC tag container / package, information on individual IC tags can be accessed accurately.

  The preferable manufacturing method of this invention is a cover material with which the said alignment tool covers the opening side of the storage recessed part of the said storage member.

  As in the preferred manufacturing method described above, by using a lid material as the aligning tool, the IC tag label can be aligned and the storage member can be closed simultaneously.

  In another preferred manufacturing method of the present invention, the other side portion of the IC tag label is bonded to the body portion, and the other side portion of the IC tag label is curved along the curved surface of the body portion.

  According to the other preferable manufacturing method, since the other side portion of the IC tag label is curved along the curved surface of the body portion, the alignment tool is relatively moved from the other side portion of the storage member to the one side portion side. Sometimes, the alignment tool can be prevented from hitting the edge of the other side of the IC tag label. For this reason, it is possible to prevent the IC tag label from being bent or peeled off from the container with the relative movement of the alignment tool.

  In another preferred manufacturing method of the present invention, the container has a small body part that is continuously provided above the body part and has a circumference shorter than the circumference of the body part, and the upper part of the IC tag label is It is bonded to the front of the small body part.

  According to the preferable manufacturing method, since the upper part of the IC tag label is bonded to the small body part of the container, when the alignment tool is relatively moved from the other side of the storage member to the one side, the alignment tool is It is possible to prevent the IC tag label from hitting the upper part of the other side. For this reason, it is possible to prevent the IC tag label from being bent or peeled off from the container with the movement of the alignment tool.

According to another aspect of the present invention, an IC tag container package is provided.
The IC tag container package of the present invention is an IC tag container in which a part of the IC tag label is attached to the body of the container, and one side of the IC tag label is tangent to the body at the position where the IC tag label is attached. A plurality of IC tag containers protruding in one direction, and a storage member in which a plurality of storage recesses are formed from one side to the other side, and the IC tag container is It is put in each storage recess of the storage member, an IC tag is provided near one side of the IC tag label, and one side of the IC tag label of each IC tag container is on one side of the storage member Directed and arranged on substantially the same plane.

In the IC tag container package, since one side portion of the IC tag label of each IC tag container is directed to one side portion side of the storage member and is disposed on substantially the same plane, adjacent IC tags interfere with each other. Can be prevented. Therefore, the IC tag container / package can accurately access information of each IC tag using a wireless communication device.
Moreover, since one side part of the IC tag label of each IC tag container protrudes from the trunk part, the one side part of the IC tag label can be positioned on the top surface part of the storage member. It is. For this reason, the IC tag container package can prevent the IC tag container from rotating in the housing recess and changing the direction of the IC tag label during the distribution process.

  In a preferred IC tag container / packaging body of the present invention, the container has a small body part that is continuously provided above the body part and has a shorter circumference than the circumference of the body part. Further, the upper part of the IC tag label is located apart.

  In the preferable IC tag container package, since the upper part of the IC tag label is located in front of the container body, the radio wave is hardly absorbed by the liquid filled in the container. Therefore, the preferable IC tag container package can reliably access the information of the IC tag.

According to the manufacturing method of the IC tag container package of the present invention, the IC tag labels put in the storage recesses of the storage member can be easily aligned on substantially the same plane. Therefore, according to the manufacturing method of the present invention, it is possible to easily manufacture an IC tag container package that can accurately access information of each IC tag.
Moreover, according to the IC tag container package of the present invention, the IC tag of each IC tag container can be accurately accessed.

The front view of the IC tag container packaging body which concerns on one embodiment. II-II sectional view taken on the line of FIG. However, only the packaging box is shown cut. (A) is a front view of a storage member, (b) is the top view. The perspective view of the box concerning one embodiment. The front view of the container which concerns on one embodiment. The front view of the winding type IC tag label which concerns on one embodiment. VII-VII line sectional drawing of FIG. VIII-VIII sectional view taken on the line of FIG. The top view of the IC tag container concerning one embodiment. The front view of the IC tag container which concerns on one embodiment. The top view of the state which showed the process of one manufacturing method of an IC tag container package, and put the IC tag container in each storage recessed part of a storage member. The top view of the state which has shown the process of one manufacturing method of an IC tag container package, and is aligning the direction of an IC tag label while rotating an IC tag container by relatively moving an alignment tool. The top view of the IC tag container which concerns on other embodiment. The front view of the winding type IC tag label which concerns on other embodiment. FIG. 15 is a top view of an IC tag container to which the winding type IC tag label of FIG. 14 is attached. The front view of the IC tag container where the IC tag label which does not have a winding label was stuck. The upper side figure before showing the process of the other manufacturing method of an IC tag container packaging body, and affixing the IC tag label temporarily fixed to the supply tool on the container of a storage member. The top view of the state which showed the process of the other manufacturing method of an IC tag container packaging body, affixed the IC tag label to the container, and retracted the supply tool. The front view of the IC tag container which concerns on other embodiment.

<One Embodiment of IC Tag Container / Packaging Body>
1 and 2, reference numeral 1 denotes a packaging box having a storage member 3 and a box body 8 in which a plurality of storage recesses 2 are formed side by side, and is stored in each storage recess 2 of the storage member 3. The IC tag container package which has IC tag container 5 is shown. However, in FIG. 1, the box 8 is indicated by a two-dot chain line.
The IC tag container 5 includes a container 6 having a body portion 61 and an IC tag label 7 partially attached to the body portion 61.
The IC tag label 7 is affixed to the body part 61 of the container 6 so that one side part 7a protrudes in one direction of a tangent at the attachment position of the body part 61.
With the protruding one side portion 7a of the IC tag label 7 facing the one side portion 3a side of the storage member 3 and the one side portion 7a of the IC tag label 7 being arranged on substantially the same plane, the IC tag container 5 Is stored in each storage recess 2 of the storage member 3.
This will be specifically described below.

The packaging box includes the storage member 3 and a box body 8 that covers the storage member 3.
As shown in FIG. 3, the storage member 3 has a substantially rectangular shape when viewed from the front, and a plurality of storage recesses 2 are formed side by side from one side 3a to the other side 3b.
The storage recess 2 is a substantially U-shaped elongated recess, and the recess is formed from the upper end to the lower end of the storage member 3. The inner peripheral surface of the storage recess 2 is formed in an arc shape. An opening 21 (a slot for the IC tag container 5) of the storage recess 2 facing the inner peripheral surface is open toward the top side of the storage member 3.

A plurality of storage recesses 2 are continuously provided from one side 3a to the other side 3b of the storage member 3 so that the longitudinal direction thereof (the direction in which the elongated recess extends) is parallel. A top surface portion 22 is formed in a continuous portion of each storage recess 2. The top surface portion 22 is formed, for example, in the shape of a small circular arc. The top surface portion 22 is a portion connecting adjacent storage recesses 2 and constitutes the highest portion of the storage member 3. In addition, the height of each top surface part 22 is substantially the same. Therefore, when the storage member 3 is placed on a flat placement surface, the plane including each top surface portion 22 is parallel to the placement surface described above.
The number of the storage recesses 2 is not particularly limited as long as it is plural (two or more). In this embodiment, the storage member 3 in which five storage recesses 2 are formed is illustrated.

Further, a leg portion 31 extending outward is provided at a portion constituting the one side portion 3 a of the storage member 3. The leg portion 31 can be formed, for example, by bending the lower end of the portion constituting the one side portion 3a of the storage member 3 at a substantially right angle. But the leg part 31 may be formed in the approximate center of the part which comprises the one side part 3a of the storage member 3, and may be formed in the upper end of the part which comprises the one side part 3a. Moreover, the leg part 31 may be formed also in the part which comprises the other side part 3b of the storage member 3 (not shown).
By providing the leg portion 31, as shown in FIG. 2, a space X is generated between the one side portion 3 a of the storage member 3 and the side surface 81 a of the case 81 of the box 8. The space X is securely held by the end of the leg portion 31 hitting the side surface 81a. Due to the presence of the space X, it is possible to prevent the end portion of the one side portion 7a of the IC tag label 7 protruding outward from the one side portion 3a of the storage member 3 from hitting the side surface. It can prevent being crushed.

The storage member 3 can be formed of cardboard, a synthetic resin sheet, or the like. The storage member 3 formed of a sheet such as a cardboard or a synthetic resin sheet is generally called a rondolation (corrugated buffer sheet).
Moreover, the said storage member 3 is not restricted to what was formed with the sheet | seat, For example, a synthetic resin molded product etc. may be sufficient.

The box body 8 is not particularly limited as long as the storage member 3 can be put inside and covered.
For example, the box 8 includes a case 81 that surrounds the bottom, top, and bottom of the storage member 3 and a lid 82 that covers the opening 21 of the storage recess 2 of the storage member 3.
In the present embodiment, the box 8 is formed of a rectangular cylindrical body in which the case 81 and the lid member 82 are integrally formed as shown in FIG. The rectangular cylindrical body can surround four sides of the bottom, top, top, and bottom of the storage member 3, and openings 84 (inlet / outlets for the storage member 3) are formed on both sides thereof. The rectangular cylindrical body may have a side surface 81 a for closing both the openings 84. The box body 8 provided with the side surface 81a can prevent the storage member 3 placed inside the box body 8 from inadvertently coming out of the opening 84. Even in the case of the box body 8 provided with the side surface 81a, the side portion 7a of the IC tag label 7 can be prevented from being crushed if the storage member 3 is provided with the leg portion 31 as described above.
The side surface 81a can be formed, for example, by providing flap pieces 83 that close the opening 84 on both sides of the rectangular cylindrical body. By fitting the flap piece 83 into the opening 84, the side surface 81a can be formed. In FIG. 4, the flap piece 83 is indicated by a two-dot chain line.

The IC tag container package 1 can be configured by slidingly inserting the storage member 3 containing the IC tag container 5 into the box 8 from the opening 84 of the box 8.
The bottom of the storage member 3 stored in the box 8 is in contact with or close to the bottom surface of the box 8. Further, in the storage member 3 stored in the box 8, a part of the IC tag container 5 protruding from the opening 21 of the storage recess 2 is in contact with or close to the top surface (lid member 82) of the box 8. .
The box 8 can be formed by assembling relatively hard sheets such as cardboard, cardboard, and synthetic resin sheets. The box 8 may be either non-transparent or transparent.

As shown in FIG. 5, the container 6 provided with the IC tag label 7 is, for example, a body 61 and a small body that is connected to the top of the body 61 and has a shorter circumference than the circumference of the body 61. Part 62.
Specifically, the body 61 of the container 6 is formed in a shape that can rotate within the housing recess 2 (for example, a cylindrical shape as illustrated). The small body 62 connected to the body 61 is formed in a circular shape having a smaller diameter than the diameter of the cylindrical body 61. The diameter difference between the body 61 and the small body 62 is not particularly limited, but preferably, the diameter of the small body 62 is 3/4 to 1/4 times the diameter of the body 61.

An example of such a container 6 is an ampoule (one type of medical container) as illustrated. Further, although not particularly illustrated, the container 6 is not limited to an ampule, and may be a medical container such as a vial or a prefilled syringe. The container 6 is not limited to a medical container, and may be a bottle-type container (for example, a bottle-type container filled with a beverage) in which a spout with a diameter smaller than that of the trunk portion is formed.
When the container 6 is a medical container, the container 6 is filled with a medicine. In the case where the container 6 is a bottle-type container or the like, it is filled with arbitrary things such as beverages and seasonings.
The material of the container 6 is not particularly limited, and examples thereof include synthetic resin such as polyethylene terephthalate, metal, earthenware, and glass. However, when a metal container is used, there is a risk that abnormal reflection of magnetic flux or the like will occur, affecting electromagnetic induction and reducing the reading sensitivity of the IC tag.

As shown in FIGS. 6 to 8, the IC tag label 7 includes an IC tag 71, and a part thereof (for example, the lower end of the other side of the IC tag label 7) can be adhered to the container 6.
The IC tag label 7 is formed in a predetermined shape when viewed from the front (for example, a rectangular shape when viewed from the front), and a tongue-shaped sticking portion 72 is extended to a part thereof. The IC tag label 7 can be adhered to the container 6 on the back surface of the sticking portion 72, but the other part of the IC tag label 7 is not substantially sticky and cannot be adhered to the container 6.

The IC tag 71 is affixed to the surface of the IC tag label 7 via an adhesive layer 715 provided on the back surface thereof. Specifically, the IC tag 71 is affixed near the one side portion 7 a of the IC tag label 7 through the adhesive layer 715. As will be described later, the IC tag 71 includes an IC chip 711 and an antenna unit 712, and the antenna unit 712 occupies a certain large area. In the present embodiment, as shown in FIG. 6, the IC tag 71 is provided close to the one side portion 7 a with respect to the center of the IC tag label 7 in plan view. Further, the IC tag 71 is preferably provided near the upper end of one side of the IC tag label 7 as shown in FIG. In particular, in the IC tag 71, the IC chip 711 is more preferably provided near the one side portion 7 a of the IC tag label 7, and is further provided near the upper end of the one side portion of the IC tag label 7. Particularly preferred.
The IC tag 71 attached via the adhesive layer 715 can be peeled off from the IC tag label 7. However, the IC tag 71 may be provided integrally with the IC tag label 7 without being detachably attached to the IC tag label 7.

The IC tag 71 has at least a module part including an IC chip 711 and an antenna part 712. The IC tag 71 uses a wireless communication device (which may be any of a read type, a write type, and a read / write type as will be described later) to read electrical information of the IC chip 711 in a non-contact manner and / or an IC It is written to the chip 711.
Specific examples of the configuration of the IC tag 71 include a configuration in which a module portion including an IC chip 711 and an antenna portion 712 is formed on a base material 713, and a protective layer 714 is stacked on the module portion.
The IC tag 71 includes those generally expressed as an RFID tag, an RFID inlet, a wireless IC tag, a non-contact IC, a non-contact data carrier, and the like.

The layer structure of the IC tag label 7 is the same as that of the pressure-sensitive adhesive layer 732 except for the base film 731 provided with the IC tag 71, the pressure-sensitive adhesive layer 732 provided on the back surface of the base film 731 and the portion corresponding to the pasting portion 72. And a concealing layer 733 provided to overlap. The concealing layer 733 is a layer that suppresses the adhesive force of the pressure-sensitive adhesive layer 732. Therefore, the pressure-sensitive adhesive layer 732 is exposed only on the back surface of the pasting portion 72 of the IC tag label 7, and the IC tag label 7 can be adhered to the container 6 at the pasting portion 72.
Note that the IC tag label 7 is not limited to the above layer configuration, and may be a layer configuration in which the adhesive layer 732 is provided only on the back surface of the base film 731 corresponding to the pasting portion 72, for example.

The adhesive layer 715 of the IC tag 71 and the adhesive layer 732 of the IC tag label 7 are formed by applying a conventionally known adhesive to the base film 731 or the like.
The pressure-sensitive adhesive means that two members can be bonded with an adhesive force that can be easily peeled off manually at room temperature, and can be reapplied after peeling. Examples of the pressure-sensitive adhesive include acrylic and rubber pressure-sensitive pressure-sensitive adhesives.
The concealing layer 733 can be formed by applying a masking agent having a property of concealing the adhesive force of the pressure-sensitive adhesive. Examples of the masking agent include ultraviolet curable ink.

  The base material 713 and the base film 731 are not particularly limited, and for example, a synthetic resin film such as a polyester film, a film such as paper or synthetic paper, a laminated film in which two or more films are laminated, and the like are used. it can. It is preferable that the IC tag label 7 is not easily deformed when hit by the alignment tool. For this reason, as the base film 731, it is preferable to use a highly rigid film, for example, a polyester film such as polyethylene terephthalate or a laminated film in which a polyester film is laminated.

The thickness of the base film 731 is preferably 50 μm or more, and more preferably 80 μm or more because it is easily deformed if it is too thin. In addition, when the thickness of the base film 731 is too thick, the handleability is poor, and from the viewpoint of cost effectiveness, it is preferably 200 μm or less.
The IC tag 71 and / or the IC tag label 7 may be printed with product information (product name, lot number, date of manufacture, quality retention time, etc.) or other designs as required. It may be displayed.

Furthermore, the IC tag label 7 of the present embodiment is a wound IC tag label 9 in which a wound label 75 that can be wound around and pasted on the body 61 of the container 6 is integrally provided. By using the wound IC tag label 9 as the IC tag label 7, the wound label 75 mainly stuck for advertising purposes can be stuck to the body portion 61 and at the same time, the IC tag label 7 can be provided in the container 6.
The winding label 75 and the IC tag label 7 are partially connected. For example, both labels 7 and 75 are connected in series at the pasting portion 72 (lower end of the other side portion) of the IC tag label 7 and the upper end of the other side portion of the wound label 75. In order to partially connect in this way, a cut 79 is formed from the lower end of one side of the IC tag label 7 toward the other side. At the cut 79, the IC tag label 7 and the winding label 75 are separated. Therefore, when the winding label 75 is wound around the body 61 of the container 6, it is possible to prevent the entire IC tag label 7 from being curved in an arc shape following the winding label 75.

The winding label 75 is formed in a predetermined shape when viewed from the front (for example, a rectangular shape when viewed from the front), and the back surface thereof can be bonded to the body 61 of the container 6. In addition, since the winding label 75 is wound around the trunk | drum 61, it is normally formed in a larger area than the IC tag label 7. Product information and design may be printed and displayed on the winding label 75 as necessary.
The layer structure of the winding label 75 includes a base film 731 and an adhesive layer 732 provided on substantially the entire back surface of the base film 731. Therefore, the wound label 75 can be bonded to the body 61 of the container 6 through the adhesive layer 732.
As the base film and the pressure-sensitive adhesive layer constituting the winding label 75, those exemplified for the IC tag label 7 can be used.

  A cut break line 76 for separating both labels is formed at the boundary between the winding label 75 and the IC tag label 7 provided continuously (in each figure (excluding FIG. 8), the cut break line is provided). Line 76 is indicated by a dashed line). One end of the breaking line 76 for cutting is connected to the other end of the cut 79. Examples of the breaking line 76 for cutting include a perforation line and a half-cut line.

The winding label 75 and the IC tag label 7 may be formed separately, and then a part of both labels 7 and 75 may be integrally connected. Usually, the winding label 75 and the IC tag label 7 (winding) The type IC tag label 9) is composed of a single base film 731.
For example, the wound IC tag label 9 is provided with an adhesive layer 732 on the entire back surface of one base film 731, and is concealed on the adhesive layer 732 corresponding to the IC tag label 7 (excluding the pasting portion 72). After the layers 733 are provided in an overlapping manner, the base film 731 can be obtained by cutting into a predetermined shape (at the same time, forming the breaking lines 76 and the cut lines 79).

By winding the winding label 75 around the body 61 of the container 6 in a state where the IC tag label 7 of the winding type IC tag label 9 is positioned in front of the small body 62 of the container 6, the IC tag container 5 is It is configured.
In the IC tag container 5, the winding label 75 and the attaching part 72 of the IC tag label 7 are attached to the body part 6 through the adhesive layer 732, but the IC tag label 7 does not adhere to the container 6, and the IC tag label 7 protrudes and is located in front of the small body 62 of the container 6. Therefore, the upper part of the IC tag label 7 is separated from the small body part 62 of the container 6 with a gap. Since most of the IC tag 71 (antenna portion 712) is included in the upper part of the IC tag label 7, there is a gap between the IC tag 71 and the container 6.
The attached winding label 75 is curved in an arc along the curved surface of the body portion 61. Since the affixing portion 72 (lower end of the other side portion) of the IC tag label 7 is continuously provided at the upper end of the other side portion of the winding label 75, the other side portion 7b of the IC tag label is curved along the curved surface of the body portion 61. ing.

Further, the IC tag label 7 attached at the attaching portion 72 is substantially flat except for the other side portion 7 b of the IC tag label 7. Since the IC tag 71 is provided near the one side portion 7a of the IC tag label 7, the IC tag 71 is also substantially flat.
As shown in FIG. 9, one side portion 7a of the substantially flat IC tag label 7 protrudes in one direction of the tangent L of the body portion 61 at the outer edge 72a of the attaching portion 72 (the outer edge of the attaching position of the IC tag label 7). Yes.
One side portion 7a of the substantially flat IC tag label 7 is more than the tangential surface M of the body portion 61 at a position 61a that is shifted by about ¼ circumference in the circumferential direction of the body portion 61 with respect to the pasting position. Projects outward.
Therefore, as shown in FIG. 10, when the IC tag container 5 is viewed from the front, one side portion 7 a of the IC tag label 7 protrudes outward from the outer surface of the body portion 61.

As shown in FIGS. 1 and 2, the IC tag container 5 is placed in each storage recess 2 of the storage member 3.
In the inserted IC tag container 5, one side portion 7 a of the IC tag label 7 is directed to the one side portion 3 a side of the storage member 3. Since at least one side portion 7a of the IC tag label 7 of the IC tag container 5 is substantially flat and the one side portion 7a projects outward from the outer surface of the body portion 61, one side portion of each IC tag label 7 is provided. 7 a is located on the top surface portion 22 of the storage member 3, and at least one side portion 7 a of the IC tag label 7 is substantially parallel to the surface including each top surface portion 22 of the storage member 3. However, “substantially parallel” refers not only to the case where the one side portion 7a of the IC tag label 7 and the surface including each top surface portion 22 are completely parallel, but also to a case where both surfaces have an angle within 20 degrees, preferably within 10 degrees. including. This is because, in this type of product, the precision that the two surfaces are completely parallel is not required, and such a product cannot actually be mass-produced industrially.

  Each IC tag container 5 placed in the housing recess 2 preferably has one side 7a of the IC tag label 7 not overlapping the IC tag label 7 of the adjacent IC tag container 5. By placing the adjacent IC tag labels 7 in the storage recess 2 so as not to partially overlap in this way, it is possible to access the information of the individual IC tags more accurately. In order to prevent the adjacent IC tag labels 7 from partially overlapping in this way, for example, the width of the IC tag label 7 may be set as appropriate. However, when the IC tag container 5 is placed in the storage recess 3, a part of the IC tag label 7 may partially overlap the adjacent IC tag label 7.

In the IC tag container package 1, the one side portion 7 a of the IC tag label 7 of each IC tag container 5 is directed to the one side portion 3 a side of the storage member 3, and the one side portion 7 a of each IC tag label 7 is substantially flush. Since they are arranged on the top, it is possible to prevent adjacent IC tags 71 from interfering with each other. Therefore, the IC tag container package 1 can accurately access the individual IC tags 71 using the wireless communication device.
Further, the IC tag container package 1 has an upper portion of the IC tag label 7 protruding forward of the small body part 62 of the container 6 and is not adhered to the small body part 62. Radio waves are less likely to be absorbed by the filled liquid. Further, the IC tag container package 1 can reliably access the information of the IC tag 71 using a wireless communication device.
In the IC tag container package 1, one side portion 7 a of each IC tag label 7 is located on the top surface portion 22 of the storage member 3. For this reason, even if vibration is applied in the distribution process, one side portion 7a of the IC tag label 7 is locked to the top surface portion 22, and the IC tag container 5 is difficult to rotate in the housing recess 2, and the orientation of the IC tag label 7 changes. Can be prevented.

<One Embodiment of Manufacturing Method of IC Tag Container / Packaging Body>
Next, the manufacturing method of the said IC tag container packaging body 1 and the communication method of the IC tag container packaging body 1 are demonstrated.
In the following description, a medical container filled with a medicine is taken as an example of the container, but the present invention is not limited to the medical container.

  The manufacturing method of the IC tag container package of the present invention is, for example, the IC tag container 5 in which a part of the IC tag label 7 is affixed to the body 61 of the container 6, and the one side portion 7a of the IC tag label 7 is the above-mentioned A storage member in which a plurality of storage recesses 2 are formed side by side from one side to the other side of an IC tag container 5 that protrudes in one direction on the tangent line of the body 61 at the attachment position of the IC tag label 7 3, the step of inserting the one side portion 7 a of the IC tag label 7 toward the one side portion 3 a side of the storage member 3, and the surface of the IC tag label 7 protruding from the storage recess 2. Thus, there is a step of relatively moving the alignment tool 10 from the other side 3b of the storage member 3 toward the one side 4a.

(IC tag container manufacturing process)
In the first step, product information relating to a medicine (desired information such as a product name, an individual identification number of the medicine, a manufacturing date, a manufacturing place, a quality retention period) is recorded on the IC tag 71 of the IC tag label 7. This recording can be performed using a write-type or read-write type wireless communication device capable of writing information to the IC tag 71.
An IC tag container 5 as shown in FIG. 9 and FIG. 10 is produced by sticking the wound label 75 connected to the IC tag label 7 around the body 61 of the container 6 filled with a medicine while being wound. . The configuration and manufacturing method of the IC tag container 5 are as described above.
Note that the product information can be recorded on the IC tag 71 before being attached to the container 6 and after being attached to the container 6.

(IC tag container storage process)
In the next step, the IC tag container 5 is put into the storage recess 2 of the storage member 3.
When the IC tag container 5 is inserted into the storage recess 2, the IC tag label 5 is oriented so that the one side 7 a of the IC tag label 7 faces the one side 3 a of the storage member 3 when the IC tag container 5 is rotated in one direction. The container 5 is put into the storage recess 2.
Preferably, the IC tag container 5 is put into the storage recess 2 while the one side portion 7 a of the IC tag label 7 is directed to the one side portion 3 a of the storage member 3. There is no restriction | limiting in particular except the above, What is necessary is just to put each IC tag container 5 in the accommodation recessed part 2 at random.
For example, one side part 7a of the IC tag label 7 is picked and the other side part 7b of the IC tag label 7 is directed toward the other side part 3b of the storage member 3 (in other words, the one side part 7a of the IC tag label 7 is stored in the storage member 3). The IC tag containers 5 are sequentially placed in the storage recesses 2 toward the one side 3a. In addition, you may put each IC tag container 5 in each accommodation recessed part 2 at once.
Alternatively, each IC tag container 5 may be placed in each storage recess 2 with the body 61 of the container 6 gripped, with the other side 7 b of the IC tag label 7 facing the other side 3 b of the storage member 3.

  When the IC tag container 5 is randomly inserted into the storage recess 2 in this manner, as shown in FIG. 11, there is an IC tag container 5 that has entered the storage recess 2 with the IC tag label 7 protruding from the storage recess 2. There is also an IC tag container 5 ′ in which the IC tag label 7 is placed in a state substantially parallel to the surface including the top surface portion 22 of the storage member 3.

(IC tag container alignment process)
In the next step, the alignment tool 10 is relatively moved from the other side 3b of the storage member 3 to the one side 3a so that the alignment tool 10 contacts the surface of the IC tag label 7 protruding from the storage recess 2.
The alignment tool 10 is not particularly limited as long as it has at least a portion that comes into contact with the IC tag label 7 projecting from the opening 21 of the storage recess 2 toward the top.
As the aligning tool 10, for example, a simple member such as a flat plate or a rod can be used. Further, the lid member 82 of the box 8 may be used as the alignment tool 10. When the lid member 82 is used as the aligner 10, it is preferable because the storage member 3 can be closed simultaneously with the completion of the alignment work of the IC tag containers 5.

The alignment tool 10 is relatively moved so as to substantially contact the body 61 of each IC tag container 5 protruding from the opening 21 of the storage recess 2. In other words, the alignment tool 10 is relatively moved along the tangential surface (surface including the tangent) of the body 61 of each IC tag container 5 protruding from the opening 21 of the storage recess 2.
Here, the relative movement means (1) fixing the storage member 3 and sliding the alignment tool 10 relative to the storage member 3, (2) fixing the alignment tool 10 and moving the storage member 3 to the alignment tool 10. (3) sliding both the storage member 3 and the alignment tool 10 are included. In the present invention, the relative movement of the alignment tool 10 may be any of the above (1) to (3), but the method (2) is usually adopted.

  When the alignment tool 10 is relatively moved (when the storage member 3 is moved in the direction of arrow A in FIG. 12), the leading edge 10a of the alignment tool 10 comes into contact with the surface of the IC tag label 7 protruding from the opening 21 of the storage recess 2. The alignment tool 10 draws the IC tag label 7 in the direction of the one side 3a of the storage member 3. Since the body 61 of the IC tag container 5 is rotatable in the storage recess 2, the IC tag container 5 rotates in one direction in the storage recess 2 as the alignment tool 10 pulls the IC tag label 7. (The direction of rotation is indicated by arrow B in FIG. 12). As a result, the one side portion 7a of the IC tag label 7 of each IC tag container 5 is positioned on the top surface portion 22 of the storage member 3, and the one side portion 7a of the IC tag label 7 of each IC tag container 5 is substantially on the same plane ( And substantially parallel to the lid member 82. However, “substantially parallel” means not only when one side portion 7a of the IC tag label 7 and the surface including each top surface portion 22 are completely parallel, but also both surfaces are within 20 degrees, preferably within 10 degrees. Including the angle of When the alignment tool 10 is relatively moved, the IC tag container 5 rotates in one direction and the IC tag label 7 is aligned, but the one side portion 7a is not completely parallel to the lid member 82.

As described above, when the IC tag container 5 is randomly inserted into the storage recess 2, the IC tag container 5 can be inserted in a state where the IC tag label 7 is substantially parallel to the surface including the top surface portion 22 of the storage member 3. (See the IC tag container indicated by reference numeral 5 'in FIG. 12). In this case, there is a possibility that the leading edge 10 a of the aligning tool 10 that has been relatively moved is caught on the edge of the other side portion 7 b of the substantially parallel IC tag label 7. In this respect, since the other side portion 7b of the IC tag label 7 of the IC tag container 5 is curved along the curved surface of the body portion 61, the leading edge 10a of the aligner 10 is the edge of the other side portion 7b of the IC tag label 7. Can be prevented. For this reason, it is possible to prevent the IC tag label 7 from being bent or peeled off from the container 6 with the relative movement of the alignment tool 10.
Furthermore, when the lid member 82 is used as the aligner 10, the IC tag container package 1 in which the storage member 3 is covered with the lid member 82 can be obtained simultaneously with the alignment of the IC tag labels 7.

The obtained IC tag container / packaging body 1 is transported by a transport line or the like, stored in a warehouse, or shipped from a manufacturer and distributed. And communication with each IC tag 71 is performed in the state of the package 1 using a radio | wireless communication apparatus in predetermined places, such as a conveyance line.
For example, a wireless communication device is arranged in the middle of a conveyor used for conveyance, and the wireless communication is performed while the bottom surface side of the IC tag container package 1 conveyed by the conveyor is passed over the wireless communication device. A radio wave is sent from the apparatus, and communication is performed with the IC tag 71 provided in each IC tag container 5. Information recorded in the IC tag 71 can be read and / or written in the IC tag 71 by communication.
In addition, the wireless communication device is not limited to the mode in which the wireless communication device is arranged in the middle of transporting the packaging body 1 and communicates with the IC tag 71, and the IC can be obtained by placing or passing the packaging body 1 on the wireless communication device at a desired place. It is also possible to communicate with the tag 71.

  The IC tag container package 1 can prevent the IC tags 71 of adjacent IC tag containers 5 from interfering with each other because the one side portion 7a of each IC tag label 7 is arranged on substantially the same plane. Therefore, the information of the IC tag 71 of each IC tag container 5 can be read accurately or recorded on each IC tag 71 using the wireless communication device. Therefore, even if the individual IC tag containers 5 are not taken out from the IC tag container package 1, the product management can be performed in the packaged state.

Here, the wireless communication device is a device that can be accessed wirelessly (contactlessly) with the IC tag 71, and is a read type that reads information from the IC tag 71, a write type that records information on the IC tag wirelessly, or a read type. Any one of a reading and writing type capable of both writing can be used.
The read-type wireless communication device has a function of reading the recorded information for the IC tag 71. When such a read-type wireless communication device is used, for example, a system is constructed in which each identification number (ID number) is recorded on the IC tag 71 for each container and product information corresponding to the identification number is made into a separate database. (For example, a database in which product information is recorded and updated on a separately installed host computer and can be accessed through a communication network such as the Internet), based on information (such as an identification number) read by a read type wireless communication device. It is possible to check individual product information by collating with the lever database and manage products.

The write-type wireless communication device has a function of writing predetermined information to the IC tag 71. When such a write-type wireless communication apparatus is used, product information can be accumulated on each IC tag 71 in a superimposed manner by additionally updating predetermined product information at each site in the distribution process.
These read type, write type, and read / write type wireless communication devices can be appropriately selected and used at each distribution base. For example, the same type of wireless communication device (for example, read type or read / write type) is used from the manufacturer to the distributor or the consumer, or the manufacturer is a write-type wireless communication device, distributor such as a wholesaler. Then, different types of wireless communication devices can be used at distribution bases, such as a read / write type and a read type for a distributor or a consumer.

  Further, the wireless communication device may be a method of accessing each IC tag 71 individually, or a method of accessing a plurality of IC tags 71 at once.

For example, at each distribution base from a manufacturer through a distributor to a consumer, a wireless communication device is allowed to act on the package 1, and receipt / shipment information (shipping date, receipt) is stored in the IC tag 71 of each IC tag container 5. By adding or updating and recording desired information such as date and inspection information, an IC tag 71 on which a very accurate distribution history is recorded can be obtained for each IC tag container 5.
According to the record information of the IC tag 71, merchandise can be easily tracked and managed, so that it can be used particularly suitably as a distribution management system for medical containers.

Further, since the IC tag 71 is attached to the IC tag label 7 via the adhesive layer 715, after using the medical container, the IC tag 71 is peeled off and attached to a syringe, an infusion bag, a medical record, or the like. Can also be stored.
In addition, when the IC tag 71 is provided integrally with the IC tag label 7 (when it cannot be separated by separation), the IC tag label 7 is separated from the winding label 75 along the breaking line 76 for cutting, The IC tag label 7 can be stored by removing the IC tag label 7 from the container 6 and attaching the attaching portion 72 of the IC tag label 7 to a syringe or the like.

<Other embodiments>
Next, another embodiment of the present invention will be described. However, in the following description of other embodiments, portions different from those of the above-described embodiments will be mainly described, and descriptions of similar configurations may be omitted, and terms and figure numbers may be used.

In the above embodiment, the upper part of the IC tag label 7 is not adhered to the container 6 and protrudes away from the front of the small body part 62 of the container 6, but as shown in FIG. Alternatively, it may be partially bonded in front of the small torso 62. Preferably, the other side portion 7 b of the upper portion of the IC tag label 7 is bonded to the front side of the small body portion 62. In addition, by partially exposing the adhesive layer on the back surface of the upper part of the IC tag label 7 (for example, by exposing the adhesive layer on the other side part 7 b), the upper part of the IC tag label 7 is connected to the small body part 62. Can be glued.
In the IC tag container 5 in which the IC tag label 7 is bonded to the small body part 62 in this way, the edge of the other side part 7 b of the IC tag label 7 protruding forward of the small body part 62 is more than the outer surface of the body part 61. Inside. Therefore, when the alignment tool 10 is relatively moved after the IC tag container 5 is placed in the storage recess 2 of the storage member 3, the leading edge 10a of the alignment tool 10 becomes the edge of the other side portion 7b of the IC tag label 7. Can be surely prevented.

Furthermore, in the said embodiment, although the other side part 7b of the IC tag label 7 is adhere | attached on the trunk | drum 61 of the container 6, the other side part 7b of the IC tag label 7 does not need to be adhere | attached on the container 6. FIG. The IC tag label 7 only needs to be bonded to the body 61 at a part thereof, and is not limited to the configuration in which the other side 7 b is bonded to the body 61.
Examples of the IC tag label 7 include a wound IC tag label 9 as shown in FIG. In the wound IC tag label 9 shown in FIG. 14, both labels 7 and 75 are connected at the lower end near the other side of the IC tag label 7 and the upper end near the other side of the wound label 75. A pasting portion 72 extends from the lower end near the other side. Other configurations are the same as those of the wound IC tag label shown in FIGS. As shown in FIG. 15, the IC tag container 5 to which the wound IC tag label 9 shown in FIG. 14 is attached has the IC tag label 7 adhered to the body 61 at the attaching portion 72, and one side portion 7a of the IC tag label 7 is attached. Protrudes in one direction of the tangent line of the body portion, and the other side portion 7b of the IC tag label 7 protrudes in the other direction of the tangent line.

Moreover, in the said embodiment, although the winding type IC tag label 9 in which the winding label 75 was integrally provided was illustrated as the IC tag label 7, the winding label 75 was integrally provided in the IC tag label 7. It does not have to be. In the IC tag container 5 of the present invention, the IC tag label 7 and the winding label 75 may be attached to the container 6 separately, or only the IC tag label 7 may be attached to the container 6.
As shown in FIG. 16, the IC tag label 7 that does not have a winding label is affixed to the body portion of the container 6 at an affixing portion 72. 16A shows an IC tag container in which the affixing portion 72 is extended to the lower end of the other side portion of the IC tag label 7 and the other side portion 7b of the IC tag label 7 is curved along the curved surface of the body portion 61. 5 is shown. FIG. 16B shows the IC tag container 5 in which the pasting portion 72 is extended to the lower end near the other side portion of the IC tag label 7 and the other side portion 7 b of the IC tag label 7 is not bonded to the body portion 61.

  Furthermore, in the said embodiment, although the rectangular cylinder body in which the case 81 and the lid | cover material 82 were integrally formed was illustrated as the box 8, the case 8 and the lid | cover material were formed separately, and case 8 A lid material may be fitted on the lid.

  Moreover, in the said embodiment, although the container 6 which has the cylindrical trunk | drum 61 was illustrated, as for the IC tag container packaging body 1 of this invention, the trunk | drum 61 is not restricted to the cylindrical container 6, A barrel | drum is polygonal. A columnar container or a container having a bowl-shaped body may be used. The container 6 having the body portion 61 having such a shape can also be rotated in the housing recess 2.

Furthermore, in the manufacturing method of the IC tag container package of the above embodiment, the orientation of each IC tag label is aligned on substantially the same plane using an alignment tool. It can manufacture also by such a method.
First, as shown in FIG. 17, the containers 6 are put into the storage recesses 2 of the storage member 3.
On the other hand, the same number of IC tag labels 7 as the containers 6 are temporarily fixed to the flat surface 4a of the supply tool 4 having the flat surface 4a at a predetermined interval. For temporary fixing, a method of sucking the label toward the flat surface 4a or bonding it to the flat surface 4a very weakly can be adopted. The interval between the IC tag labels 7 is set to be substantially the same as the interval between the storage recesses. As the IC tag label 7, an IC tag label 7 having no winding label as shown in FIG. 16 is used.
When the supply tool 4 to which the IC tag label 7 is temporarily fixed is advanced to the storage member 3 side (direction indicated by a thick arrow), each IC tag label is placed on the body 61 of each container 6 protruding from the opening 21 of the storage recess 2. 7 pasting portions 72 are pasted at a time.
Next, as shown in FIG. 18, the IC tag label 7 moves away from the flat surface 4a to the container 6 side by retracting the supply tool 4 in a direction away from the storage member 3 (direction indicated by a thick arrow).
This manufacturing method can also easily manufacture the IC tag container package 1 in which the IC tag labels 7 are arranged on substantially the same plane.

  Furthermore, in the above embodiment, the upper part of the IC tag label 7 is located in front of the small torso part 62 of the container 6, but the IC tag label 7 has a body part in which one side part 7 a is attached to the IC tag label 7. What is necessary is just to affix on the container 6 so that it may protrude to the one direction side of the tangent of 61. FIG. For example, as shown in FIG. 19, the IC tag container 5 may be attached so that one side portion 7 a of the IC tag label 7 protrudes to the side of the body portion 61 of the container 6. In this case, the other side of the IC tag label 7 is attached to the body 61 of the container 6. Even when such an IC tag container 5 is used in the above-described method of manufacturing an IC tag container package, the one side portion 7a of each IC tag label 7 placed in the storage recess 2 can be easily aligned on substantially the same plane.

  DESCRIPTION OF SYMBOLS 1 ... IC tag container packaging body, 2 ... Storage recessed part, 21 ... Opening of storage recessed part, 22 ... Top surface part of storage member, 3 ... Storage member, 3a ... One side part of storage member, 3b ... Other side part of storage member 5 ... IC tag container, 6 ... container, 61 ... trunk, 62 ... small torso, 7 ... IC tag label, 7a ... one side of IC tag label, 7b ... other side of IC tag label, 71 ... IC tag, 72 ... IC tag label affixing part, 75 ... winding label, 76 ... tear line for cutting, 8 ... box, 82 ... cover material, 9 ... winding type IC tag label, 10 ... alignment tool

Claims (6)

An IC tag container in which a part of the IC tag label is affixed to the body part of the container, and one side part of the IC tag label is projected to one side of the tangent to the body part at the attachment position of the IC tag label One side of the IC tag label when the IC tag container is rotated in one direction in each storage recess of a storage member in which a plurality of storage recesses are formed from one side to the other side. A step of placing each so that the portion faces one side of the storage member;
And a step of relatively moving an aligner that contacts the surface of the IC tag label and rotates the IC tag container in one direction from the other side of the storage member toward the one side. A manufacturing method of an IC tag container package.   The manufacturing method of the IC tag container package according to claim 1, wherein the alignment tool is a lid member that covers the opening side of the storage recess of the storage member.   The manufacturing method of the IC tag container package according to claim 1 or 2, wherein the other side portion of the IC tag label is bonded to the body portion, and the other side portion of the IC tag label is curved. The container has a small body portion that is continuously provided above the body portion and has a circumferential length shorter than the circumferential length of the body portion,
The manufacturing method of the IC tag container packaging body according to any one of claims 1 to 3, wherein an upper part of the IC tag label is bonded to the front of the small body part. An IC tag container in which a part of the IC tag label is affixed to a body part of the container, and one side part of the IC tag label protrudes in one direction tangent to the body part at the application position of the IC tag label An IC tag container;
A plurality of storage recesses, the storage member formed side by side from one side to the other side,
The IC tag container is put in each storage recess of the storage member,
An IC tag is provided near one side of the IC tag label,
An IC tag container package, wherein one side portion of the IC tag label is directed to one side portion side of the storage member and is disposed on substantially the same plane. The container has a small body part continuously provided above the body part and having a shorter circumference than the circumference of the body part;
The IC tag container package according to claim 5, wherein an upper part of the IC tag label is located in front of the small body part.

Images