JP2012059101A - Card embedded with base plate having electronic component mounted thereon and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a card embedded with a base plate having electronic components mounted thereon in which a position to embed the base plate having the electronic components mounted thereon is strictly specified, and to provide a manufacturing method of the card embedded with a base plate having electronic component mounted thereon.SOLUTION: In a card embedded with a base plate having electronic components mounted thereon, a card base of the card has a structure in which a front cover sheet, a first core sheet, a second core sheet and a back cover sheet are laminated in the order. Each of the first core sheet and the second core sheet is formed with an opening for embedding the base plate having the electronic components mounted thereon. The opening of the first core sheet is formed so that the periphery portion of the second core sheet is partially exposed from the opening of the first core sheet when the first core sheet and the second core sheet overlap.

Description

The present invention relates to an electronic component mounting board built-in card in which the mounting position of the electronic component mounting board is strictly set, and a method for producing the electronic component mounting board built-in card.

In recent years, cards equipped with electronic components have been used in many fields.
For example, it is used as a commuter pass or prepaid card in the transportation field such as railways and buses, and as an employee ID card equipped with an ID code.
There are few commuter passes and prepaid cards used in the transportation field mentioned above that have a display section that displays variable information, but in the financial field, electronic components are mounted on the card and the personal identification code is displayed. Cards with display units are starting to be used.
These display-equipped cards have a specification in which an electronic component is built in a card having a thickness of 0.8 mm, a display unit is provided on the card surface, and a personal identification code of the holder is displayed.
As a card having an electronic component and a display unit, a card having a fingerprint sensor and a display unit for displaying a fingerprint identification result is provided (for example, see Patent Document 1).

JP 2003-288573 A

The IC card disclosed in Patent Document 1 has a laminated structure of a plurality of substrates, so that the IC chip cannot be separated from the IC card, and a display unit is provided so that the person holding the card can be identified. The IC card includes a connection terminal called a plug for connecting to an external device.
The IC card disclosed in Patent Document 1 has a laminated structure of two to three substrates, and the alignment of each substrate is performed at the plug portion.
The electronic component mounting board built-in card of the present invention is not a structure in which an external terminal is provided as in the IC card of Patent Document 1, and is not a structure in which the boards are stacked, and the mounting position of the electronic component mounting board is set strictly. It is an object of the present invention to provide an electronic component mounting board built-in card and a method for producing the electronic component mounting board built-in card.

In order to achieve the above object, a first aspect of the present invention is a card incorporating an electronic component mounting board, wherein the card base of the card includes a front cover sheet, a first core sheet, and a second core sheet. The core sheet and the back cover sheet have a structure in which the core sheet and the back cover sheet are sequentially stacked, and the first core sheet and the second core sheet each have an opening for containing an electronic component mounting board. When the first core sheet and the second core sheet are overlapped, the first core is such that a part of the peripheral edge of the second core sheet is exposed at the opening of the first core sheet. A sheet opening is formed.

The second aspect is characterized in that, in the first aspect, the opening formed in the first core sheet or the second core sheet is formed in substantially the same shape as the electronic component mounting substrate. It is.

The third aspect is a method for producing an electronic component mounting board built-in card according to the first or second aspect, the step of forming characters and designs on the front and back cover sheets, the first core sheet and the second Forming the opening at a predetermined position of the core sheet, preparing the electronic component mounting substrate, and forming the opening at a predetermined position on the back cover sheet surface to which the adhesive is applied. A step of aligning and placing the second core sheet, and a step of applying the adhesive on the exposed surface of the second core sheet and positioning the first core sheet on which the opening has been formed in advance. Placing the electronic component mounting substrate on the peripheral edge of the second core sheet exposed to the opening of the first core sheet, and opening of the first core sheet. And the opening of the second core sheet A step of pouring and filling an adhesive, a step of placing the front cover sheet coated with an adhesive at a predetermined position, a front cover sheet, a first core sheet, a second core sheet, and a back cover sheet. It has the process of hardening an adhesive agent, pressing, and the process of cut | judging to card size.

1) As described above, according to the present invention, the mounting position accuracy of the electronic component mounting substrate with respect to the card base can be remarkably improved.
2) Further, the work of fixing the electronic component mounting board can be simplified, and the manufacturing efficiency can be improved while ensuring high mounting position accuracy.

It is a figure for demonstrating an example of the electronic component mounting substrate built-in card of this embodiment. It is a figure which shows an example of the state which removed the front cover sheet | seat of the electronic component mounting substrate built-in card of this embodiment. It is a figure for demonstrating an example of the state with which the 1st core sheet and the 2nd core sheet were piled up. It is a figure for demonstrating the AA line cross section of FIG. It is sectional drawing for demonstrating another example by which the electronic component mounting board | substrate was fixed to the 2nd core sheet | seat of FIG.

Hereinafter, an electronic component mounting board built-in card in which the mounting position of the electronic component mounting board is set strictly and a method for manufacturing the electronic component mounting board built-in card will be described with reference to the drawings.
In the description of the present embodiment, an electronic component mounting substrate will be described as an example of a display device mounting substrate.

With reference to FIG. 1, an example of the electronic component mounting board built-in card of the present embodiment will be described.
In the electronic component mounting board built-in card 1, display information 3 on the display unit of the display device mounted on the board is provided in a window 31 provided on a transparent front cover sheet (not shown) of the electronic component mounting board built-in card 1. It is displayed from.
Portions other than the window portion of the front cover sheet are shielded by the shielding ink, and printing information 4 such as “credit card” is printed on the exposed surface.

Bank cards and credit cards used in financial institutions and the distribution industry are standardized by ISO (International Organization for Standardization) and JIS (Japanese Industrial Standards).
The dimensions and formation positions of the magnetic stripe card are defined in ISO 7811/2, 7811/4, 7811/5, and JIS X6301 and JIS X6302. Further, the shape and position of the external terminal of the IC card are defined in ISO7816 / 2. The card reader is also made in accordance with the above-mentioned standard.

The example of the electronic component mounting substrate built-in card 1 shown in FIG. 1 is an example of a magnetic card in which a magnetic stripe is formed. The magnetic stripe 2 is hidden by the shielding layer made of the aforementioned shielding ink.
From the window 31, it mounts so that the display part of the display apparatus incorporated in the card base of the lower part of a window may be visually recognized.
The display unit is provided at a position avoiding the position where the conveyance roller of the magnetic recording apparatus is provided so as not to be damaged by the conveyance roller of the magnetic recording apparatus. Therefore, the position from the edge of the card to the display unit is strictly limited.

With reference to FIG. 2, an example of the state which removed the front cover sheet | seat of the electronic component mounting board built-in card | curd of this embodiment is demonstrated.
The first core sheet 103 of the electronic component mounting board built-in card 1 has an electronic component mounting board 302 having substantially the same size as that of the first core sheet 103 along with the second core on the back side of the first core sheet 103. It is fixed to the core sheet. Before the electronic component mounting substrate 302 is fixed to a second core sheet (not shown), the first core sheet 103 is overlaid on the second core sheet 104 as shown in FIG.
The first core sheet and the second core sheet are superposed and placed on the first core sheet opening 1030 so that the peripheral edge of the second core sheet opening 1040 is partially exposed. .

The substrate 302 on which the electronic component is mounted is fixed to the peripheral portion of the opening portion 1040 of the second core sheet exposed to the opening portion 1030 of the first core sheet shown in FIG.
The example shown in FIG. 2 is an example in which the size of the opening portion 1030 of the first core sheet and the size of the substrate 302 on which the electronic component is mounted are substantially equal to each other. The substrate 302 on which the electronic component is mounted can be fixed to the opening without fine alignment by simply applying the agent and fitting the substrate 302 on which the electronic component is mounted in the opening 1030 of the first core sheet.

With reference to FIG. 1 and FIG. 4, the AA line cross section of FIG. 1 is demonstrated.
The card base of the electronic component mounting board built-in card 1 is formed by stacking a front cover sheet 102, a first core sheet 103, a second core sheet 104, and a back cover sheet 105 in order, and an adhesive 106 that solidifies at room temperature. In this embodiment, which is structured as described above, a transparent film is used for the front cover sheet 102, and the mounted electronic components are not directly visible from the surface of the card on the exposed surface of the front cover sheet 102. A shielding layer 101 is formed.
A transparent film is also used for the back cover sheet, and a shielding layer (not shown) is formed on the exposed surface like the front cover sheet 102 so that the mounted electronic components cannot be directly seen from the surface of the card. In the case of this embodiment, a transparent film does not necessarily need to be used for the back cover sheet.
Openings are provided in the first core sheet 103 and the second core sheet 104, and a substrate 302 on which electronic components such as a power source 304, a control component 303, and a display unit (not shown) are mounted in the openings. Built-in.

When the first core sheet 103 and the second core sheet 104 are overlapped, a part of the peripheral edge (fixed portion 5) of the second core sheet 104 is exposed at the opening of the first core sheet 103. Yes.
The substrate 302 is fixed to the fixing portion 5 of the second core sheet 104 exposed in the opening of the first core sheet 103 with an adhesive sheet, a double-sided adhesive tape, or the like.
In the example shown in FIG. 4, an opening (not shown) formed in the substrate 302 and the first core sheet is formed in substantially the same shape, and the opening formed in the first core sheet. It is in a state of being fitted.

In the example shown in FIG. 4, nothing is mounted on the back side (back cover sheet 105 side) of the substrate 302, but protrusions bonded to the circuit formed on the substrate with solder or the like are actually formed. It is not necessarily a plane.
Therefore, the thickness of the second core sheet 104 is determined according to the protruding state on the back side of the substrate 302. Although not shown, a material that has the same thickness as the thickness of the second core sheet 104 and the fixing material is attached to the non-fixed side of the back side (back cover sheet side) of the substrate 302. It may be stabilized.

In addition, the adhesive 106 filled in the opening for bonding passes through the gaps between the electronic components mounted on the substrate 302 and holes formed in the substrate, and turns to the front and back of the substrate.
The front cover sheet 102 and the first core sheet 103 are applied by an adhesive (not shown) applied to the front cover sheet 102, and the back cover sheet 105 and the second core sheet 104 are applied to the back cover sheet 105. It is adhered by an adhesive (not shown).
Further, the first core sheet 103 and the second core sheet 104 are bonded by an adhesive formed at each boundary.

With reference to FIG. 5, another example in which the electronic component mounting substrate is fixed to the second core sheet of FIG. 3 will be described.
In the example described with reference to FIG. 4, the openings (not shown) formed in the substrate 302 and the first core sheet are substantially the same shape. However, the example illustrated in FIG. This is an example in which openings (not shown) formed in the core sheet are formed substantially the same.
As the fixing material used for the fixing portion 5, an adhesive tape using a thick base film is preferably used. Although not shown, a material that has the same thickness as the second core sheet 104 may be attached to the back side (back cover sheet side) of the substrate 302 that is not fixed to be stabilized. This simplifies the work of fixing the electronic component mounting board, and can increase the manufacturing efficiency while ensuring high mounting position accuracy.

In the example shown in FIG. 5, this configuration is effective when the substrate 302 is thick and the power supply 304 and the control component 303 mounted on the substrate 302 are thick.

As in the example described with reference to FIG. 4, the adhesive 106 filled in the opening for bonding passes through the gaps between the electronic components mounted on the substrate 302 and holes formed in the substrate, and turns to the front and back of the substrate. .
The front cover sheet 102 and the first core sheet 103 are applied by an adhesive (not shown) applied to the front cover sheet 102, and the back cover sheet 105 and the second core sheet 104 are applied to the back cover sheet 105. It is adhered by an adhesive (not shown).
Further, the first core sheet 103 and the second core sheet 104 are bonded by an adhesive formed at each boundary.

With reference to FIG. 4, the manufacturing method of the electronic component mounting substrate built-in card will be described.
First, the shielding layer 101 is formed on the transparent front cover sheet 102 by means such as printing or transfer. Next, letters and designs are formed on the shielding layer.
Further, similarly to the front cover sheet 102, the shielding layer 101 is formed on the transparent back cover sheet 105 by means such as printing or transfer. Furthermore, letters and designs are formed on the shielding layer.
In some cases, the front and back cover sheets need not be transparent, but in that case, the shielding layer 101 may not be formed. Further, openings are formed at predetermined positions of the first core sheet 103 and the second core sheet 104. Furthermore, an electronic component mounting board is prepared.
The above is the preparation process.

The second core sheet 104 having an opening formed in advance is positioned and placed at a predetermined position on the surface of the back cover sheet 105 to which the room temperature curable adhesive is applied.
Next, a room temperature curable adhesive is applied to the exposed surface of the second core sheet 104, and the first core sheet 103 is placed while positioning.
Next, the board | substrate 302 which mounted the electronic component to the peripheral part (fixing part 5) exposed to the opening part of the 1st core sheet 103 with an adhesive material is fixed.

Next, a normal temperature curable adhesive 106 is poured into the opening of the first core sheet 103 and the opening of the second core sheet 104 and filled. At this time, make sure that no air remains.
Next, the front cover sheet 102 coated with a room temperature curable adhesive is placed at a predetermined position.
The front cover sheet 102, the first core sheet 103, the second core sheet 104, and the back cover sheet 105 are pressurized, and the adhesive is cured while releasing air.
After confirming that the adhesive has hardened, cut into card size.
The above operations may be performed in multiple ways or one by one.

(material)
A part of the material used for the electronic component mounting board built-in card will be described.
The resin film used for the laminated card is selected from plastic films such as transparent polyester having a thickness of 0.05 mm to 0.7 mm, transparent polycarbonate, transparent polylactic acid, transparent acrylic, and transparent polyvinyl chloride.
As the printing ink, a commercially available ultraviolet curable offset ink or screen ink is used.
Moreover, a commercially available room temperature curing adhesive is used as the filling adhesive.
The material used is not limited to the above.

  The electronic component mounting board built-in card of the present invention is used as a card for displaying transaction information and the like.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting board built-in card 2 Magnetic stripe, magnetic stripe part 3 Display information 4 Print information 5 Peripheral part of fixed part, opening part 11 Insertion direction display 31 Window, window part 101 Shielding layer 102 Front cover sheet 103 First core Sheet 104 Second core sheet 105 Back cover sheet 106 Adhesive 301 Display unit 302 Substrate 303 Control component 304 Power source 1030 First opening 1040 Second opening

Claims (3)

A card with a built-in electronic component mounting board,
The card base of the card has a structure in which a front cover sheet, a first core sheet, a second core sheet, and a back cover sheet are sequentially stacked and laminated,
Each of the first core sheet and the second core sheet is formed with an opening for containing an electronic component mounting board.
When the first core sheet and the second core sheet are overlapped, the first core sheet is exposed so that a part of the peripheral edge of the second core sheet is exposed at the opening of the first core sheet. An electronic component mounting board built-in card, wherein an opening of a core sheet is formed. In the electronic component mounting board built-in card according to claim 1,
An electronic component mounting board built-in card, wherein an opening formed in the first core sheet or the second core sheet is formed in substantially the same shape as the electronic component mounting board. A method for producing an electronic component mounting board built-in card according to claim 1 or 2,
A step of forming letters and designs on the front and back cover sheets, a step of forming openings at predetermined positions of the first core sheet and the second core sheet, a step of preparing an electronic component mounting substrate,
A step of aligning and placing the second core sheet in which the opening is formed in advance at a predetermined position of the back cover sheet surface to which the adhesive is applied;
Placing the first core sheet in which the opening is formed in advance while applying and positioning an adhesive on the exposed surface of the second core sheet; and
Fixing the electronic component mounting substrate to the peripheral edge of the second core sheet exposed to the opening of the first core sheet with an adhesive material;
Pouring and filling an adhesive into the opening of the first core sheet and the opening of the second core sheet; and
Placing the front cover sheet coated with adhesive at a predetermined position;
Curing the adhesive while pressing the front cover sheet, the first core sheet, the second core sheet, and the back cover sheet;
Cutting to card size;
A method for producing an electronic component mounting board built-in card, comprising:

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