JP5508516B2 - 低発熱性エポキシ樹脂系コア充填剤 - Google Patents
低発熱性エポキシ樹脂系コア充填剤 Download PDFInfo
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- JP5508516B2 JP5508516B2 JP2012503527A JP2012503527A JP5508516B2 JP 5508516 B2 JP5508516 B2 JP 5508516B2 JP 2012503527 A JP2012503527 A JP 2012503527A JP 2012503527 A JP2012503527 A JP 2012503527A JP 5508516 B2 JP5508516 B2 JP 5508516B2
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- epoxy resin
- epoxy
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- amine
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- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1535—Five-membered rings
- C08K5/1539—Cyclic anhydrides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0905362.0A GB0905362D0 (en) | 2009-03-30 | 2009-03-30 | Fire resistant epoxy resin based core filler material developing low exothermic heat |
| GB0905362.0 | 2009-03-30 | ||
| PCT/US2010/028778 WO2010117669A1 (en) | 2009-03-30 | 2010-03-26 | Epoxy resin based core filler material developing low exothermic heat |
Publications (3)
| Publication Number | Publication Date |
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| JP2012522113A JP2012522113A (ja) | 2012-09-20 |
| JP2012522113A5 JP2012522113A5 (enExample) | 2014-03-06 |
| JP5508516B2 true JP5508516B2 (ja) | 2014-06-04 |
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| JP2012503527A Expired - Fee Related JP5508516B2 (ja) | 2009-03-30 | 2010-03-26 | 低発熱性エポキシ樹脂系コア充填剤 |
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| EP (1) | EP2414425B1 (enExample) |
| JP (1) | JP5508516B2 (enExample) |
| KR (1) | KR101709360B1 (enExample) |
| CN (1) | CN102378772B (enExample) |
| BR (1) | BRPI1014695A2 (enExample) |
| CA (1) | CA2756886C (enExample) |
| ES (1) | ES2473968T3 (enExample) |
| GB (1) | GB0905362D0 (enExample) |
| PL (1) | PL2414425T3 (enExample) |
| PT (1) | PT2414425E (enExample) |
| WO (1) | WO2010117669A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0905362D0 (en) | 2009-03-30 | 2009-05-13 | 3M Innovative Properties Co | Fire resistant epoxy resin based core filler material developing low exothermic heat |
| WO2011023227A1 (en) * | 2009-08-27 | 2011-03-03 | Abb Research Ltd | Curable epoxy resin composition |
| CN103687889A (zh) * | 2011-07-15 | 2014-03-26 | 巴斯夫欧洲公司 | 在环氧体系中用作促进剂的聚醚胺 |
| EP2653486B1 (en) * | 2012-04-20 | 2014-12-03 | 3M Innovative Properties Company | Low density epoxy composition with low water uptake |
| EP2818490B1 (en) | 2013-06-28 | 2019-04-10 | 3M Innovative Properties Company | Use of an epoxy resin-based composition as a filler honeycomb cells |
| JP6200715B2 (ja) * | 2013-07-24 | 2017-09-20 | ナミックス株式会社 | エポキシ樹脂組成物、アンダーフィル剤、接着剤、および半導体装置 |
| PL2957584T3 (pl) | 2014-06-17 | 2017-08-31 | 3M Innovative Properties Company | Szybko utwardzane epoksydowe kompozycje klejące |
| WO2016025597A1 (en) | 2014-08-12 | 2016-02-18 | 3M Innovative Properties Company | Film adhesive |
| US10662302B2 (en) * | 2014-09-23 | 2020-05-26 | The Boeing Company | Polymer nanoparticles for improved distortion capability in composites |
| CN105000129B (zh) * | 2015-04-08 | 2017-04-05 | 江苏宏强船舶重工有限公司 | 一种小型船滑油循环舱保护结构的施工工艺 |
| EP3162829B1 (en) * | 2015-10-29 | 2018-08-15 | 3M Innovative Properties Company | Rapid curing and high thixotropy epoxy adhesive compositions |
| EP3239207B1 (en) | 2016-04-27 | 2021-07-28 | 3M Innovative Properties Company | Curable epoxy compositions |
| EP3333211B1 (en) | 2016-12-09 | 2020-10-14 | 3M Innovative Properties Company | Composite article comprising a honeycomb structure comprising hot/wet resistant low density epoxy compositions |
| EP3589694A4 (en) * | 2017-03-01 | 2020-11-18 | Purdue Research Foundation | COMPOSITIONS OF PRODUCT RESULTING FROM THE EPOXY-TANNIN REACTION |
| US20210221971A1 (en) * | 2018-08-21 | 2021-07-22 | Evonik Operations Gmbh | Fast curing epoxy system for producing rigid foam and use of the foam in composites or as insulation material |
| EP3666812B1 (en) * | 2018-12-13 | 2021-10-13 | 3M Innovative Properties Company | Room temperature stable one-part void filler |
| WO2020131946A1 (en) * | 2018-12-18 | 2020-06-25 | Cytec Industries Inc. | Flame-retardant epoxy composition and method of using the same |
| RU2747941C1 (ru) * | 2020-03-03 | 2021-05-17 | Общество с ограниченной ответственностью "Архитектурно-конструкторское бюро Монолит" (ООО "АКБ Монолит") | Ячеистая негорючая эпоксидная композиция |
| CN112646521B (zh) * | 2020-12-18 | 2022-02-11 | 深圳市彩田化工有限公司 | 一种低放热环氧树脂胶的制备工艺 |
| CN113789034B (zh) * | 2021-10-13 | 2023-07-14 | 航天特种材料及工艺技术研究所 | 一种低放热量环氧树脂组合物及其制备方法 |
| EP4310127B1 (en) | 2022-07-19 | 2025-05-14 | 3M Innovative Properties Company | Low density potting adhesive |
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| JP3205914B2 (ja) | 1991-09-13 | 2001-09-04 | 大倉工業株式会社 | エポキシ樹脂組成物 |
| US5679719A (en) * | 1993-03-24 | 1997-10-21 | Loctite Corporation | Method of preparing fiber/resin composites |
| JPH07216057A (ja) | 1994-01-27 | 1995-08-15 | Bridgestone Corp | エポキシ樹脂組成物 |
| US5597886A (en) * | 1994-03-10 | 1997-01-28 | Ciba-Geigy Corporation | Heat-curable epoxy resin systems having a good reactivity/stability ratio |
| EP0671427B1 (de) | 1994-03-10 | 1998-05-27 | Ciba SC Holding AG | Thermisch härtbare Epoxidharzsysteme mit gutem Reaktivitäts-/Stabilitätsverhalten |
| JP3881381B2 (ja) * | 1995-11-18 | 2007-02-14 | ヴァンティコ アーゲー | 粉末化可能な反応性樹脂組成物 |
| EP1123184B1 (en) | 1998-10-23 | 2002-12-18 | Vantico AG | Method for filling and reinforcing honeycomb sandwich panels |
| US6534181B2 (en) * | 2000-03-27 | 2003-03-18 | Neltec, Inc. | Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds |
| EP1674518A1 (en) * | 2004-12-23 | 2006-06-28 | 3M Innovative Properties Company | Fire-retardant low-density epoxy composition |
| US8475694B2 (en) * | 2005-10-25 | 2013-07-02 | Zephyros, Inc. | Shaped expandable material |
| GB0905362D0 (en) | 2009-03-30 | 2009-05-13 | 3M Innovative Properties Co | Fire resistant epoxy resin based core filler material developing low exothermic heat |
-
2009
- 2009-03-30 GB GBGB0905362.0A patent/GB0905362D0/en not_active Ceased
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2010
- 2010-03-26 JP JP2012503527A patent/JP5508516B2/ja not_active Expired - Fee Related
- 2010-03-26 ES ES10723411.4T patent/ES2473968T3/es active Active
- 2010-03-26 BR BRPI1014695A patent/BRPI1014695A2/pt not_active Application Discontinuation
- 2010-03-26 PT PT107234114T patent/PT2414425E/pt unknown
- 2010-03-26 PL PL10723411T patent/PL2414425T3/pl unknown
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- 2010-03-26 US US13/258,665 patent/US8779032B2/en active Active
- 2010-03-26 WO PCT/US2010/028778 patent/WO2010117669A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP2414425A1 (en) | 2012-02-08 |
| CA2756886C (en) | 2017-06-13 |
| CN102378772B (zh) | 2014-07-09 |
| KR101709360B1 (ko) | 2017-02-22 |
| JP2012522113A (ja) | 2012-09-20 |
| KR20120013349A (ko) | 2012-02-14 |
| BRPI1014695A2 (pt) | 2016-04-12 |
| US20120022185A1 (en) | 2012-01-26 |
| PL2414425T3 (pl) | 2014-09-30 |
| CN102378772A (zh) | 2012-03-14 |
| PT2414425E (pt) | 2014-06-25 |
| CA2756886A1 (en) | 2010-10-14 |
| GB0905362D0 (en) | 2009-05-13 |
| ES2473968T3 (es) | 2014-07-08 |
| EP2414425B1 (en) | 2014-04-23 |
| US8779032B2 (en) | 2014-07-15 |
| WO2010117669A1 (en) | 2010-10-14 |
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