JP5500046B2 - リアクトル、昇圧回路、及び軟磁性複合材料 - Google Patents
リアクトル、昇圧回路、及び軟磁性複合材料 Download PDFInfo
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- JP5500046B2 JP5500046B2 JP2010244733A JP2010244733A JP5500046B2 JP 5500046 B2 JP5500046 B2 JP 5500046B2 JP 2010244733 A JP2010244733 A JP 2010244733A JP 2010244733 A JP2010244733 A JP 2010244733A JP 5500046 B2 JP5500046 B2 JP 5500046B2
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- soft magnetic
- composite material
- powder
- resin
- reactor
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- 229920005989 resin Polymers 0.000 claims description 98
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
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- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
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- 239000006087 Silane Coupling Agent Substances 0.000 description 2
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
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- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
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- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
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- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
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- 229910017061 Fe Co Inorganic materials 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017112 Fe—C Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
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- 229910010413 TiO 2 Inorganic materials 0.000 description 1
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- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
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- 238000002347 injection Methods 0.000 description 1
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- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000012762 magnetic filler Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- 229910001463 metal phosphate Inorganic materials 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
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- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
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- 239000004417 polycarbonate Substances 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
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- 229920006295 polythiol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
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- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
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- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- Soft Magnetic Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010244733A JP5500046B2 (ja) | 2010-10-29 | 2010-10-29 | リアクトル、昇圧回路、及び軟磁性複合材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010244733A JP5500046B2 (ja) | 2010-10-29 | 2010-10-29 | リアクトル、昇圧回路、及び軟磁性複合材料 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010184203A Division JP4692859B2 (ja) | 2010-08-19 | 2010-08-19 | リアクトル |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011214559A Division JP5700298B2 (ja) | 2011-09-29 | 2011-09-29 | リアクトル、軟磁性複合材料、及び昇圧回路 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011049586A JP2011049586A (ja) | 2011-03-10 |
| JP2011049586A5 JP2011049586A5 (enrdf_load_stackoverflow) | 2011-11-17 |
| JP5500046B2 true JP5500046B2 (ja) | 2014-05-21 |
Family
ID=43835544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010244733A Active JP5500046B2 (ja) | 2010-10-29 | 2010-10-29 | リアクトル、昇圧回路、及び軟磁性複合材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5500046B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6127365B2 (ja) * | 2011-04-28 | 2017-05-17 | 住友電気工業株式会社 | リアクトル、複合材料、リアクトル用コア、コンバータ、及び電力変換装置 |
| JP2012199580A (ja) * | 2012-06-06 | 2012-10-18 | Sumitomo Electric Ind Ltd | 軟磁性複合材料の製造方法 |
| JP5660164B2 (ja) * | 2013-06-28 | 2015-01-28 | 住友電気工業株式会社 | 軟磁性複合材料の製造方法 |
| CN108962557B (zh) * | 2018-06-04 | 2021-04-06 | 国网浙江省电力有限公司绍兴供电公司 | 一种基于等效磁密法的高压铁心滤波电抗器的设计方法 |
| CN112958779A (zh) * | 2021-02-01 | 2021-06-15 | 浙江工业大学 | 一种FeBP非晶软磁粉体及其磁粉芯的制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4684461B2 (ja) * | 2000-04-28 | 2011-05-18 | パナソニック株式会社 | 磁性素子の製造方法 |
| JP4336810B2 (ja) * | 2001-08-15 | 2009-09-30 | 大同特殊鋼株式会社 | 圧粉磁心 |
| JP2003109812A (ja) * | 2001-09-28 | 2003-04-11 | Daido Steel Co Ltd | 圧粉磁心とその製造方法 |
| JP2005116820A (ja) * | 2003-10-08 | 2005-04-28 | Daido Steel Co Ltd | 圧粉磁心 |
| JP2006261331A (ja) * | 2005-03-16 | 2006-09-28 | Nec Tokin Corp | インダクタンス部品およびその製造方法 |
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- 2010-10-29 JP JP2010244733A patent/JP5500046B2/ja active Active
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| Publication number | Publication date |
|---|---|
| JP2011049586A (ja) | 2011-03-10 |
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