JP5496929B2 - 面型蒸着源及びその蒸着メッキ法とシステム - Google Patents
面型蒸着源及びその蒸着メッキ法とシステム Download PDFInfo
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- 230000008021 deposition Effects 0.000 title claims description 111
- 238000000034 method Methods 0.000 title claims description 34
- 238000007747 plating Methods 0.000 title description 13
- 238000007740 vapor deposition Methods 0.000 claims description 220
- 239000000463 material Substances 0.000 claims description 131
- 239000000758 substrate Substances 0.000 claims description 119
- 238000000151 deposition Methods 0.000 claims description 114
- 238000001704 evaporation Methods 0.000 claims description 25
- 230000008020 evaporation Effects 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000004804 winding Methods 0.000 claims description 10
- 238000009826 distribution Methods 0.000 claims description 9
- 238000009834 vaporization Methods 0.000 claims description 7
- 230000008016 vaporization Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000010899 nucleation Methods 0.000 claims description 4
- 230000006911 nucleation Effects 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 3
- 230000012010 growth Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000000576 coating method Methods 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 6
- 238000005401 electroluminescence Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000010924 continuous production Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000010549 co-Evaporation Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
Description
(1)薄膜品質を精確に制御可能。
(2)連続生産を行う技術手段の提供。
(3)蒸着の大面積化を実現可能。
(4)蒸着材料は、材質の劣化回避のために長期的に高温状態にする必要がない。
11、11A 蒸着源基板
12、12A 蒸着材料
20、20A 蒸着対象基材
30 面型蒸着源
31 蒸着源基板
32 蒸着材料
40 加熱装置
100 蒸着源システム
Claims (21)
- 面型蒸着源を用いて少なくとも一つの蒸着対象基材に対し、面型蒸着を行い、前記面型蒸着源は、一つの蒸着源基板を備え、前記蒸着源基板には少なくとも一つの表面を備え、 蒸着源基板の少なくとも一表面は粗表面として蒸着材料で被覆し、該蒸着材料の凸点或いは凹状は尖錐形とし、
前記面型蒸着源に対して加熱を行い、前記蒸着材料を蒸着対象基材表面に蒸着し、前記蒸着対象基材表面に蒸着膜を形成し、
前記蒸着源基板の蒸着材料で被覆されたエリアは気化後のエリアとなり、複数の蒸着対象基材を包含することを特徴とする面型蒸着法。 - 前記蒸着材料で被覆される蒸着源基板は、平面又は曲面の何れかとすることを特徴とする請求項1に記載の面型蒸着法。
- 前記蒸着源基板の蒸着材料で被覆されるエリアは、点、線、或いは面分布配列によって形成されることを特徴とする請求項1に記載の面型蒸着法。
- 前記蒸着源基板は、可撓性を備える材質とすることを特徴とする請求項1に記載の面型蒸着法。
- 前記蒸着材料で被覆される蒸着源基板は、巻き付けて面型蒸着源の巻付材を形成したもので、面型蒸着源の巻付材は駆動装置に配置し、前記駆動装置により面型蒸着源の巻付材を連続的に送り出すか断続的フィード式で送り出して、連続蒸着を行うことを特徴とする請求項4に記載の面型蒸着法。
- 前記蒸着材料は、少なくとも一種の蒸着物質により組成されることを特徴とする請求項1に記載の面型蒸着法。
- 面型蒸着源は、少なくとも一つの蒸着対象基材に対し蒸着を行うもので、前記面型蒸着源は、一つの蒸着源基板を備え、
前記蒸着源基板には少なくとも一つの粗表面を備え、少なくとも一つの蒸着材料が蒸着源基板の該粗表面を被覆し、該蒸着材料の凸点或いは凹状は尖錐形とされ、前記蒸着材料の分布エリアは、蒸着材料気化後に蒸着対象基材を包含するエリアとなることを特徴とする面型蒸着源。 - 前記蒸着源基板の蒸着材料で被覆されるエリアは気化後のエリアとなり複数の蒸着対象基材を包含することを特徴とする請求項7に記載の面型蒸着源。
- 前記蒸着材料で被覆される蒸着源基板は、平面又は曲面の何れかとすることを特徴とする請求項7に記載の面型蒸着源。
- 前記蒸着源基板の蒸着材料で被覆されるエリアは、点、線、或いは面分布配列によって形成されることを特徴とする請求項7に記載の面型蒸着源。
- 前記蒸着源基板は、可撓性を備える材質とすることを特徴とする請求項7に記載の面型蒸着源。
- 前記蒸着材料で被覆される蒸着源基板は、巻き付けて面型蒸着源の巻付材を形成することを特徴とする請求項11に記載の面型蒸着源。
- 前記面型蒸着源の巻付材は駆動装置に配置し、前記駆動装置によって面型蒸着源の巻付材を連続的に送り出すか断続的フィード式で送り出すことを特徴とする請求項12に記載の面型蒸着源。
- 前記蒸着材料は、少なくとも一種の蒸着物質により組成されることを特徴とする請求項7に記載の面型蒸着源。
- 面型蒸着源と加熱装置とを含む面型蒸着システムにおいて、
前記面型蒸着源は、一つの蒸着源基板と少なくとも一つの蒸着材料とによって構成され、
前記蒸着材料は、蒸着源基板の少なくとも一つの粗表面を被覆し、しかも蒸着材料の気化後に蒸着対象基材を包含するエリアとなり、蒸着材料の凸点或いは凹点は尖錐形とされ、
前記加熱装置は、面型蒸着源を加熱可能なエリアに配置し、加熱装置が面型蒸着源に対して加熱を行うことにより、面型蒸着源を固体から気体へと変換し、蒸着対象基材表面に拡散させ、表面において核生成、凝結、及び成長等のメカニズムを起こして膜を形成することを特徴とする面型蒸着システム。 - 前記蒸着源基板は曲面とされてその蒸着材料を配置したエリアは蒸着材料気化後に複数の蒸着対象基材を包含するエリアとなることを特徴とする請求項15に記載の面型蒸着システム。
- 前記蒸着源基板の蒸着材料で被覆されるエリアは、点、線、或いは面の分布配列によって形成されることを特徴とする請求項15に記載の面型蒸着システム。
- 前記蒸着源基板は、可撓性材質とすることを特徴とする請求項15に記載の面型蒸着システム。
- 前記蒸着材料を配置した蒸着源基板は、巻き付けて面型蒸着源の巻付材を形成することを特徴とする請求項15に記載の面型蒸着システム。
- 前記面型蒸着源の巻付材は駆動装置に配置し、前記駆動装置によって面型蒸着源の巻付材を連続的に或いは断続的にフィードして送り出すことを特徴とする請求項19に記載の面型蒸着システム。
- 前記蒸着材料は、少なくとも一種の蒸着物質により組成されることを特徴とする請求項15に記載の面型蒸着システム。
Applications Claiming Priority (4)
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TW99103892 | 2010-02-09 | ||
TW099103892 | 2010-02-09 | ||
TW099141055A TWI452157B (zh) | 2010-02-09 | 2010-11-26 | 一種面型蒸鍍源及其蒸鍍方法與系統 |
TW099141055 | 2010-11-26 |
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JP2011162881A JP2011162881A (ja) | 2011-08-25 |
JP5496929B2 true JP5496929B2 (ja) | 2014-05-21 |
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US (1) | US20110195186A1 (ja) |
JP (1) | JP5496929B2 (ja) |
TW (1) | TWI452157B (ja) |
Families Citing this family (5)
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WO2012121238A1 (ja) * | 2011-03-09 | 2012-09-13 | コニカミノルタホールディングス株式会社 | 蒸着用シート、蒸着装置、及び蒸着用シートの製造方法 |
TWI582251B (zh) | 2014-10-31 | 2017-05-11 | 財團法人工業技術研究院 | 蒸鍍系統以及蒸鍍方法 |
CN104694882A (zh) * | 2015-03-19 | 2015-06-10 | 中国建材国际工程集团有限公司 | 用于基板镀膜的工艺方法 |
EP3704285A4 (en) * | 2017-11-01 | 2021-06-30 | BOE Technology Group Co., Ltd. | EVAPORATION PLATE FOR DEPOSITING A DEPOSIT MATERIAL ON A SUBSTRATE, EVAPORATION APPARATUS AND PROCESS FOR DEPOSITING A DEPOSIT MATERIAL ON A SUBSTRATE |
CN109457218A (zh) * | 2018-12-10 | 2019-03-12 | 上海大学 | 面蒸发源蒸镀装置 |
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US5904961A (en) * | 1997-01-24 | 1999-05-18 | Eastman Kodak Company | Method of depositing organic layers in organic light emitting devices |
US6202591B1 (en) * | 1998-11-12 | 2001-03-20 | Flex Products, Inc. | Linear aperture deposition apparatus and coating process |
JP2000195665A (ja) * | 1998-12-25 | 2000-07-14 | Toyota Motor Corp | 有機膜の形成方法 |
US6767807B2 (en) * | 2001-03-02 | 2004-07-27 | Fuji Photo Film Co., Ltd. | Method for producing organic thin film device and transfer material used therein |
TWI264473B (en) * | 2001-10-26 | 2006-10-21 | Matsushita Electric Works Ltd | Vacuum deposition device and vacuum deposition method |
US6555284B1 (en) * | 2001-12-27 | 2003-04-29 | Eastman Kodak Company | In situ vacuum method for making OLED devices |
JP4053302B2 (ja) * | 2002-02-01 | 2008-02-27 | パイオニア株式会社 | 有機エレクトロルミネッセンス表示パネルの製造装置及び製造方法 |
US6566032B1 (en) * | 2002-05-08 | 2003-05-20 | Eastman Kodak Company | In-situ method for making OLED devices that are moisture or oxygen-sensitive |
US20040135160A1 (en) * | 2003-01-10 | 2004-07-15 | Eastman Kodak Company | OLED device |
EP2369035B9 (en) * | 2003-08-04 | 2014-05-21 | LG Display Co., Ltd. | Evaporation source |
US20050244580A1 (en) * | 2004-04-30 | 2005-11-03 | Eastman Kodak Company | Deposition apparatus for temperature sensitive materials |
US7410542B2 (en) * | 2006-10-10 | 2008-08-12 | Paul Terrance Nolan | Variable environment, scale-able, roll to roll system and method for manufacturing thin film electronics on flexible substrates |
US8486736B2 (en) * | 2008-10-20 | 2013-07-16 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting device |
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US20110195186A1 (en) | 2011-08-11 |
TWI452157B (zh) | 2014-09-11 |
TW201127974A (en) | 2011-08-16 |
JP2011162881A (ja) | 2011-08-25 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |