JP5492808B2 - 電気検査用治具、及び配線基板の製造方法 - Google Patents

電気検査用治具、及び配線基板の製造方法 Download PDF

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Publication number
JP5492808B2
JP5492808B2 JP2011046319A JP2011046319A JP5492808B2 JP 5492808 B2 JP5492808 B2 JP 5492808B2 JP 2011046319 A JP2011046319 A JP 2011046319A JP 2011046319 A JP2011046319 A JP 2011046319A JP 5492808 B2 JP5492808 B2 JP 5492808B2
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Prior art keywords
inspection jig
electrical inspection
electrical
wirings
jig
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Expired - Fee Related
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JP2011046319A
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Japanese (ja)
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JP2011227059A (ja
Inventor
康晴 山田
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Priority to JP2011046319A priority Critical patent/JP5492808B2/ja
Priority to TW100110683A priority patent/TWI453424B/zh
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  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
JP2011046319A 2010-03-30 2011-03-03 電気検査用治具、及び配線基板の製造方法 Expired - Fee Related JP5492808B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011046319A JP5492808B2 (ja) 2010-03-30 2011-03-03 電気検査用治具、及び配線基板の製造方法
TW100110683A TWI453424B (zh) 2010-03-30 2011-03-29 電氣檢查用治具及配線基板之製造方法

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JP2010079020 2010-03-30
JP2010079020 2010-03-30
JP2011046319A JP5492808B2 (ja) 2010-03-30 2011-03-03 電気検査用治具、及び配線基板の製造方法

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JP2011227059A JP2011227059A (ja) 2011-11-10
JP5492808B2 true JP5492808B2 (ja) 2014-05-14

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JP2011046319A Expired - Fee Related JP5492808B2 (ja) 2010-03-30 2011-03-03 電気検査用治具、及び配線基板の製造方法

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JP (1) JP5492808B2 (zh)
TW (1) TWI453424B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5966688B2 (ja) * 2012-07-04 2016-08-10 日本電産リード株式会社 配線構造及び基板検査装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5376874U (zh) * 1976-11-29 1978-06-27
JPS6453429A (en) * 1987-08-24 1989-03-01 Mitsubishi Electric Corp Device for testing semiconductor chip
JP2000249738A (ja) * 1999-02-26 2000-09-14 Uht Corp テープ状物の導通検査装置
JP2005069954A (ja) * 2003-08-27 2005-03-17 Hioki Ee Corp 基板検査装置のための基板検査用治具および基板検査方法
TWI271529B (en) * 2005-10-21 2007-01-21 Advanced Semiconductor Eng Electrical testing device
TWI272887B (en) * 2005-12-09 2007-02-01 High Tech Comp Corp Printed circuit board and manufacturing method thereof
CN201035106Y (zh) * 2007-04-19 2008-03-12 纬创资通股份有限公司 测试模块
JP2008309587A (ja) * 2007-06-13 2008-12-25 Taiyo Kogyo Co Ltd プリント基板のユニバーサル機能を有する検査装置

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TW201142307A (en) 2011-12-01
TWI453424B (zh) 2014-09-21
JP2011227059A (ja) 2011-11-10

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