JP5480466B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

  Conventionally, as shown in FIG. 6, an LED chip 1 ′, a mounting substrate (package) 2 ′ on which the LED chip 1 ′ is mounted, and a translucent sealing material that seals the LED chip 1 ′. A translucent material (for example, a silicone resin) containing a phosphor that emits light of a color different from the emission color of the LED chip 1 ′ when excited by the light emitted from the sealing part 3 ′ and the LED chip 1 ′ And the color conversion member (wavelength conversion member) 4 ′ disposed on the light emitting surface side of the sealing portion 3 ′ and the LED chip 1 ′ and the color conversion member 4 ′ disposed so that the optical axis coincides with the optical axis. A bowl-shaped reflecting member 5 ′ for controlling the light distribution of the light emitted from the light emitting surface, a lens 16 held by the reflecting member 5 ′, and a wiring board 7 ′ on which the mounting board 2 ′ is mounted. A light emitting device provided is proposed (see, for example, Patent Document 1).

  Here, the mounting substrate 2 ′ is formed of a ceramic substrate in which a housing recess 2a ′ for housing the LED chip 1 ′ is provided on one surface side, and the color conversion member 4 ′ is formed in the housing recess 2a ′. The storage recess 2a ′ is arranged on the inside so as to close the storage recess 2a ′. In addition, the reflecting member 5 ′ is formed with a cylindrical portion 5a ′ into which the mounting substrate 2 ′ is inserted into the bottom, and the fixing piece 5b ′ is outward from the edge of the cylindrical portion 5a ′ on the wiring substrate 7 ′ side. The fixing piece 5b ′ is fixed to the wiring board 7 ′ with an adhesive.

In the above-described light emitting device, a blue LED chip that emits blue light is employed as the LED chip 1 ′, and a yellow phosphor is employed as the phosphor of the color conversion member 4 ′, whereby the blue color emitted from the LED chip 1 ′. The light and the yellow light emitted from the yellow phosphor are emitted from the light exit surface of the color conversion member 4 ′, and white light can be obtained. Further, in the above-described light emitting device, the light distribution of light emitted from the light emitting unit constituted by the LED chip 1 ′ and the color conversion member 4 ′ can be controlled by the reflecting member 5 ′ and the lens 16 ′.
JP-A-2005-158963 (paragraphs [0027]-[0032] and FIG. 2)

  Incidentally, in the light emitting device having the configuration shown in FIG. 6, when the input power to the LED chip 1 ′ is increased, the radiant energy of blue light or ultraviolet light emitted from the LED chip 1 ′ increases, and the color conversion member 4. The total amount of heat generated due to the energy loss due to the Stokes shift in the phosphor of 'increases, and the temperature of the color conversion member 4 ′ increases.

  However, in the light emitting device described above, the thermal conductivity of the sealing portion 3 ′ on the light incident surface side of the flat color conversion member 4 ′ is approximately the same as the thermal conductivity of the color conversion member 4 ′. The heat conductivity of the medium on the light exit surface side of 4 ′ (for example, a gas such as air) is lower than the heat conductivity of the color conversion member 4 ′, and the heat generated by the color conversion member 4 ′ is efficiently dissipated. There are problems that the temperature of the phosphor rises and the conversion efficiency of the phosphor decreases and the light output decreases, and that the life of the color conversion member 4 ′ is shortened.

  Further, in the above-described light emitting device, the color conversion member 4 ′ is disposed inside the storage recess 2 a ′ of the mounting substrate 2 so as to close the storage recess 2 a ′, and therefore the phosphor of the color conversion member 4 ′. Most of the light emitted from the sealing portion 3 ′ side and the light reflected by the color conversion member 4 ′ are absorbed by the mounting substrate 2 ′ and the LED chip 1 ′. There was a problem that the light extraction efficiency as a whole was lowered.

  In the above-described light emitting device, the light emitted from the light emitting surface of the color conversion member 4 ′ (that is, the light emitted from the light emitting unit constituted by the LED chip 1 ′ and the color conversion member 4 ′) is arranged. Since a part of the mounting substrate 2 is interposed between the reflecting member 5 ′ for controlling light and the color converting member 4 ′, the relative positional accuracy between the reflecting member 5 ′ and the color converting member 4 ′ is lowered. However, for example, there is a problem that high light distribution controllability such as narrow-angle light distribution cannot be obtained.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a light emitting device capable of suppressing an increase in temperature of a color conversion member and improving light output.

Invention of Claim 1 was radiated | emitted from the LED chip, the mounting board | substrate with which the said LED chip was mounted, the sealing part which consists of a translucent sealing material which sealed the said LED chip, and the said LED chip A color conversion member formed of a translucent material containing a phosphor that emits light of a color different from the emission color of the LED chip when excited by light and disposed on the light exit surface side of the sealing portion; A reflective member that controls the light distribution of the light emitted from the light exit surface of the color conversion member formed in a bowl shape from a material having a higher thermal conductivity than the color conversion member, and the sealing portion and the reflecting member and is separated between, and are spaced apart between the front Symbol mounting substrate and the reflecting member, and which is separated between the mounting substrate and the color converting member, the color conversion The member is fixed to the reflecting member inside the reflecting member and is heated. The combined, characterized by comprising.

  According to this invention, since the color conversion member is fixed and thermally coupled to the reflection member inside the reflection member formed of a material having higher thermal conductivity than the color conversion member, the color conversion member is generated in the color conversion member. Heat can be efficiently dissipated from the reflecting member, the temperature rise of the color conversion member can be suppressed, the luminous efficiency of the phosphor can be improved, and the light output can be improved by increasing the input power to the LED chip. Reliability is improved by suppressing the temperature rise of the conversion member. Further, since the color conversion member is directly fixed to the reflection member, there is an advantage that the relative positional accuracy between the color conversion member and the reflection member is improved, and the light distribution controllability is improved.

According to a second aspect of the present invention, in the first aspect of the present invention, the reflecting member is formed with a window hole into which the mounting board is inserted at a central portion of a flat bottom wall, and the color conversion member is the window hole. is formed in a dome shape that is disposed inside of the reflecting member so as to cover the, and the bottom wall odor Te characterized by being fixed to a site remote from the window opening of the reflecting member.

  According to this invention, the color conversion member is disposed inside the reflection member so as to cover a window hole into which the mounting board is inserted in the bottom wall of the reflection member, and from the window hole in the bottom wall of the reflection member. Since the light is emitted from the phosphor of the color conversion member, a part of the light emitted toward the sealing portion or the light reflected by the color conversion member is reflected. Since light can be reflected toward the color conversion member in a region between the window hole and the fixing portion of the color conversion member on the bottom wall of the member, light extraction efficiency can be increased, and light output can be improved.

According to a third aspect of the present invention, in the first aspect of the invention, the color conversion member is formed in a flat plate shape, and the reflection member is located farther from the mounting substrate than the light emitting surface of the sealing portion. supporting portion is provided for supporting the peripheral portion of the color converting member, the peripheral portion of the color conversion member to said supporting lifting unit is characterized by comprising fixed.

  According to this invention, a part of the light emitted from the phosphor of the color conversion member to the sealing portion side or the light reflected by the color conversion member is supported in the reflection member. In addition, since the light can be reflected toward the color conversion member in a region closer to the mounting substrate, the light extraction efficiency can be increased, and the light output can be improved.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the mounting substrate is formed of a metal base substrate on which a projecting portion for mounting the LED chip is formed, and the reflecting member is a center of a flat bottom wall parts said window opening collision table portion is inserted is formed on the color converting member, the formed in a dome shape that is disposed inside of the reflecting member so as to cover the window opening, the said reflective member It is fixed to the periphery of the window opening that put on the bottom wall, characterized by comprising.

  According to the present invention, the color conversion is performed by causing the light emitted from the LED chip to the rear of the plane including the mounting surface of the LED chip in the projecting portion to be incident directly on the color conversion member or reflected by the reflection member. Since it can re-enter the member, the light extraction efficiency can be increased, and the light output can be improved. In addition, since the mounting board is provided with a projecting portion, it is easy to dispose the bottom wall of the reflecting member behind the mounting surface of the LED chip. The manufacturing cost can be reduced.

  In the invention of claim 1, there is an effect that the temperature increase of the color conversion member can be suppressed and the light output can be improved.

(Embodiment 1)
As shown in FIG. 1, the light emitting device according to the present embodiment includes an LED chip 1, a mounting substrate 2 on which the LED chip 1 is mounted, and a light-transmitting sealing material that seals the LED chip 1. The light emission of the sealing portion 3 formed of a translucent material containing a phosphor that emits light of a color different from the emission color of the LED chip 1 when excited by the light emitted from the LED chip 1 The color conversion member 4 disposed on the surface side and a material having higher thermal conductivity than the color conversion member 4 are formed in a bowl shape to control the light distribution of light emitted from the light exit surface of the color conversion member 4. A reflection member 5 and a wiring board 7 on which the mounting board 2 is mounted are provided.

In addition, the light emitting device of the present embodiment is a disc-shaped translucent cover 8 that is formed of a translucent material (for example, acrylic resin, glass, etc.) and is disposed so as to close the opening surface of the reflecting member 5. A bottomed cylindrical outer shell 9 that is formed of a metal material (for example, aluminum) and accommodates the wiring board 7, the reflecting member 5, the translucent cover 8, etc. And an annular holding frame 10 for holding a peripheral portion of the translucent cover 8 and an outer flange portion 53 extending outward from the opening edge of the reflecting member 5 in an overlapped manner. ing. Here, the holding frame 10 is fixed to the outer shell 9 by a fixing screw (not shown).

  The wiring board 7 is a metal base board (metal base printed wiring board). On the insulating layer on the metal plate made of an Al plate, each of the external connection electrodes of the mounting board 2 has bonding portions 31 and 31 made of solder. A conductor pattern (a current-carrying pattern) to be joined via the contact hole is formed. Note that the metal plate is not limited to an Al plate, and may be a Cu plate, for example. Further, a white resist layer having a high reflectance with respect to visible light is appropriately formed on the exposed portion of the wiring board 7 on the mounting surface side of the mounting board 2.

  Further, the wiring board 7 uses a resin sheet containing a filler made of a filler such as silica or alumina and having a low viscosity when heated (for example, an organic green sheet such as an epoxy resin sheet highly filled with fused silica). The wiring board 7 and the bottom wall of the outer shell 9 are joined by the resin sheet. Since the resin sheet has electrical insulation and high thermal conductivity, and has high fluidity during heating and high adhesion to the uneven surface, the resin sheet and the wiring board 7 and the bottom wall of the outer shell 9 It is possible to prevent the generation of gaps between them, and it is possible to prevent an increase in thermal resistance due to insufficient adhesion and the occurrence of variations, and from the LED chip 1 as compared with the case where a rubber sheet-like heat dissipation sheet is used. The thermal resistance up to the outer shell 9 can be reduced, heat dissipation is improved, variation in thermal resistance is reduced, and the temperature rise of the junction temperature of the LED chip 1 can be suppressed, so that the input power can be increased and the light output can be increased. High output can be achieved.

  In the light emitting device of the present embodiment, a GaN blue LED chip that emits blue light is used as the LED chip 1, and the phosphor of the color conversion member 4 is excited by the blue light emitted from the LED chip 1. Blue light that is emitted from the LED chip 1 and transmitted through the sealing portion 3 and the color conversion member 4 and the yellow phosphor of the color conversion member 4 that uses a particulate yellow phosphor that emits broad yellow light. The yellow light emitted from the color conversion member 4 is emitted from the light emission surface of the color conversion member 4, and white light can be obtained.

  The mounting substrate 2 described above is formed of a ceramic substrate in which a housing recess 2a for housing the LED chip 1 is provided at the center of one surface and a wiring pattern (not shown) for supplying power to the LED chip 1 is provided. The LED chip 1 is mounted on the central portion of the inner bottom surface of the housing recess 2a, and the housing recess 2a is filled with the above-described translucent sealing material (for example, silicone resin, epoxy resin, etc.). It is sealed by the sealing part 3 formed in this way. In addition, the outer peripheral shape of the mounting substrate 2 is a rectangular shape, and the storage recess 2a in the mounting substrate 2 is opened in a circular shape and the opening area gradually increases as the distance from the inner bottom surface increases. On the inner surface, a reflective film made of a metal film that reflects light emitted from the LED chip 1 or the phosphor is appropriately formed at a site.

  In the mounting substrate 2, the part formed across the side surface and the other surface of each wiring pattern constitutes an external connection electrode, and the heat generated in the LED chip 1 is generated at the center of the other surface. Since a heat radiating conductor (not shown) for radiating heat is formed, when mounting on the wiring board 7, each external connection electrode is connected to the wiring board 7 via the joints 31 and 31 made of solder. By joining to a circuit pattern (not shown) and joining the heat-dissipating conductor part to the conductor pattern (not shown) of the wiring board 7 via the joining part 32 made of solder and thermally bonding to the wiring board 7 The temperature rise of the LED chip 1 can be suppressed.

  The shape of the inner surface of the reflecting member 5 is designed so that the light incident from the light emitting surface of the color conversion member 4 is reflected toward the translucent cover 8 and a narrow-angle light distribution is obtained. The inner surface is formed in a parabolic shape with the vertex of the dome-shaped color conversion member 4 as a focal point. The shape of the inner peripheral surface of the reflecting member 5 is not particularly limited, and the opening area of the reflecting member 5 increases as the distance from the LED chip 1 increases in the optical axis direction of the LED chip 1 according to desired light distribution characteristics. What is necessary is just to be formed in the bowl-shaped shape which becomes large gradually.

  As a material of the reflecting member 5, for example, a metal (for example, aluminum, iron, copper) having a high reflectance of light emitted from the LED chip 1 or the phosphor and having a higher thermal conductivity than the color conversion member 4 is used. In this embodiment, aluminum is used. Moreover, the inner surface of the reflecting member 5 is a mirror surface by evaporating aluminum or silver or applying silver plating. Note that the material of the reflecting member 5 is not limited to metal, and a resin or ceramic having a higher thermal conductivity than the color conversion member 4 may be employed.

In the reflecting member 5 according to this embodiment, the outer flange portion 53 is held between the outer shell 9 and the holding frame 10 via the peripheral portion of the translucent cover 8 and is directly fixed to the mounting substrate 2 and the wiring substrate 7. Therefore, as compared with the case where the reflecting member 5 is directly fixed to the mounting substrate 2 or the wiring substrate 7, the mechanical strength of the reflecting member 5 is less restricted and the joint portion between the mounting substrate 2 and the wiring substrate 7 is used. It is possible to prevent mechanical stress from being applied to 31, 31, 32.

  By the way, the reflection member 5 is formed with a window hole 52 into which the mounting substrate 2 is inserted at the center of the flat bottom wall 51, and the color conversion member 4 covers the window hole 52 in a form of the reflection member 5. It is disposed on the inner side, and is fixed and thermally coupled to the reflecting member 5 inside the reflecting member 5.

  The color conversion member 4 is formed in a dome shape using a mixed material in which a particulate yellow phosphor that is excited by blue light emitted from the LED chip 1 and emits yellow light is dispersed in a translucent material made of silicone resin. Is formed. The translucent material used as the material of the color conversion member 4 is not limited to a silicone resin. For example, an organic / inorganic hybrid in which an acrylic resin, glass, an organic component and an inorganic component are mixed and combined at the nm level or the molecular level. Materials etc. may be adopted. Further, the phosphor to be contained in the translucent material used as the material of the color conversion member 4 is not limited to the yellow phosphor, and a plurality of types of phosphors may be used for the purpose of improving color adjustment and color rendering. White light with high color rendering properties can be obtained by using a red phosphor and a green phosphor. Here, when a plurality of types of phosphors are used, the phosphor is not necessarily a combination of phosphors having different emission colors, and for example, a plurality of types of phosphors having an emission color of yellow and different emission spectra may be combined.

  The above-described color conversion member 4 is formed in a dome shape in which the LED chip 1 side is opened and the light incident surface and the light emission surface are each composed of a part of a spherical surface, and a flange portion 4b is extended outward from the periphery of the opening. The flange portion 4b is fixed to the bottom wall 51 of the reflecting member 5 using, for example, an adhesive (for example, silicone resin, epoxy resin). In short, the color conversion member 4 is fixed to the reflecting member 5 so that the flat ring-shaped flange portion 4b and the bottom wall 51 of the reflecting member 5 overlap each other. Here, in the color conversion member 4, the flange portion 4 b is fixed to a portion of the bottom wall 51 of the reflection member 5 that is separated from the window hole 52.

  In the light emitting device of the present embodiment described above, the color conversion member 4 is fixed and thermally coupled to the reflection member 5 inside the reflection member 5 formed of a material having a higher thermal conductivity than the color conversion member 4. Therefore, the color conversion member 4 is thermally conducted from the outer flange portion 4b of the color conversion member 4 to the reflection member 5 having a high thermal conductivity, thermally diffuses in the reflection member 5, and is dissipated to the surrounding air and the outer shell 9. The heat generated in 4 can be efficiently radiated from the reflecting member 5, the temperature rise of the color conversion member 4 can be suppressed, the light emission efficiency of the phosphor is improved, and the light output due to the increase in input power to the LED chip 1 is achieved. The improvement can be achieved and the temperature increase of the color conversion member 4 is suppressed, so that the reliability is improved. Further, in the light emitting device of the present embodiment, the color conversion member 4 is directly fixed to the reflection member 5 by the adhesive without using another member such as the mounting substrate 2. There is also an advantage that relative positional accuracy is improved and light distribution controllability is improved.

  In the light emitting device of the present embodiment, the color conversion member 4 is disposed inside the reflection member 5 so as to cover the window hole 52 into which the mounting substrate 2 is inserted in the bottom wall 51 of the reflection member 5. 5 is fixed to a portion of the bottom wall 51 spaced from the window hole 52, so that the light emitted from the phosphor of the color conversion member 4 and the color conversion member 4 are emitted to the sealing portion 3 side. A part of the reflected light can be reflected to the color conversion member 4 side in the region between the window hole 52 and the fixing portion of the color conversion member 4 in the bottom wall 51 of the reflection member 5. The light output can be improved.

(Embodiment 2)
The basic configuration of the light emitting device of the present embodiment is substantially the same as that of the first embodiment. As shown in FIG. 2, the mounting substrate 2 is formed in a flat plate shape, and the LED chip 1 is surrounded between the mounting substrate 2. The dome-shaped optical member 6 is fixed to the mounting substrate 2, the sealing portion 3 is enriched in a space surrounded by the optical member 6 and the mounting substrate 2, and the color conversion member 4 is connected to the light emitting surface of the optical member 6. The point which is adhering to the reflection member 5 in the form in which the air layer 11 is formed in between is different. Further, in this embodiment, the outer flange portion 53 of the reflecting member 5 is fixed to the groove portion 9b of the outer shell 9 with an adhesive, and the translucent cover 8 (see FIG. 1) described in the first embodiment is provided. Although not provided, a translucent cover 8 similar to that of the first embodiment may be provided. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  The above-described optical member 6 is formed of a translucent material (for example, a silicone resin). Here, in this embodiment, since the optical member 6 is formed of a silicone resin, the refractive index difference and the linear expansion coefficient difference between the optical member 6 and the sealing portion 3 can be reduced.

  By the way, the optical member 6 has a light exit surface formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface at the boundary between the light exit surface and the air layer 11 described above. Here, the optical member 6 has a light emission surface formed by a part of a spherical surface, and is arranged so that the center of the spherical surface is located on the optical axis of the LED chip 1. Therefore, the light emitted from the LED chip 1 and incident on the light incident surface of the optical member 6 can easily reach the color conversion member 4 without being totally reflected at the boundary between the light emitting surface and the air layer 11, and the total luminous flux. Can be increased. The light emitted from the side surface of the LED chip 1 propagates through the sealing portion 3, the optical member 6, and the air layer 11 to reach the color conversion member 4 to excite the phosphor of the color conversion member 4 or to the phosphor. Passes through the color conversion member 4 without colliding. Moreover, the optical member 6 is formed so that the thickness along the normal line direction becomes uniform regardless of the position, and the above-described sealing portion 3 is formed in a hemispherical shape.

  In the light emitting device of the present embodiment described above, the color conversion member 4 is fixed and thermally coupled to the reflection member 5 inside the reflection member 5 as in the first embodiment. The heat is transmitted to the reflective member 5 having a high temperature, diffuses in the reflective member 5 and is dissipated to the surrounding air and the outer shell 9, so that the heat generated in the color conversion member 4 can be efficiently dissipated from the reflective member 5. Thus, the temperature increase of the color conversion member 4 can be suppressed, the luminous efficiency of the phosphor can be improved, the light output can be improved by increasing the input power to the LED chip 1, and the temperature increase of the color conversion member 4 can be suppressed. This improves the reliability. The color conversion member 4 may be provided with a flange portion 4b similar to that of the first embodiment.

  Further, in the light emitting device of this embodiment, the mounting substrate 2 is formed in a flat plate shape, and light emitted from the LED chip 1 is less likely to enter the mounting substrate 2 than in the first embodiment. Reflection loss and absorption loss can be reduced, and the amount of light emitted from the LED chip 1 and incident on the color conversion member 4 can be increased. Therefore, the light extraction efficiency to the outside as the entire apparatus can be increased.

(Embodiment 3)
The basic configuration of the light emitting device of the present embodiment is substantially the same as that of the second embodiment, and is different in that the color conversion member 4 is formed in a box-shaped dome shape as shown in FIG. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted suitably.

  The color conversion member 4 in the present embodiment is a mixed material in which a particulate yellow phosphor that emits yellow light when excited by blue light emitted from the LED chip 1 is dispersed in a translucent material made of silicone resin. The color conversion part 41 formed into a cylindrical shape using the liquid crystal polymer resin or ceramic is disposed so as to close the opening surface on one end side of the color conversion member 41, and the light from the LED chip 1 is used. It is formed by joining a disk-like diffuse reflection part 42 that diffuses and reflects. Therefore, the light emitted from the LED chip 1 and propagating through the sealing unit 3, the optical member 6, and the air layer 11 is directly incident on the color conversion unit 41 or is reflected by the diffuse reflection unit 42 and incident on the color conversion unit 41. To do.

  Thus, in the light emitting device of this embodiment, the color conversion member 4 is fixed and thermally coupled to the reflection member 5 inside the reflection member 5 as in the second embodiment. Can be efficiently dissipated from the reflecting member 5, the temperature rise of the color conversion member 4 can be suppressed, the luminous efficiency of the phosphor can be improved, and the light output can be improved by increasing the input power to the LED chip 1. By suppressing the temperature rise of the color conversion member 4, the reliability is improved.

(Embodiment 4)
The basic configuration of the light emitting device of this embodiment is substantially the same as that of the second embodiment. As shown in FIG. 4, the color conversion member 4 is formed in a flat plate shape, and the light emitting surface of the sealing portion 3 in the reflecting member 5. A support portion 54 including a stepped portion that supports the peripheral portion of the color conversion member 4 at a position farther from the mounting substrate 2, and the peripheral portion of the color conversion member 4 is fixed to the support portion 54. The outer shell 9 is formed in a cylindrical shape, and the wiring board 7 is fixed to the outer shell 9 so as to close the opening surface on one end side of the outer shell 9. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Thus, in the light emitting device of this embodiment, the color conversion member 4 is fixed and thermally coupled to the reflection member 5 inside the reflection member 5 as in the second embodiment. Can be efficiently dissipated from the reflecting member 5, the temperature rise of the color conversion member 4 can be suppressed, the luminous efficiency of the phosphor can be improved, and the light output can be improved by increasing the input power to the LED chip 1. By suppressing the temperature rise of the color conversion member 4, the reliability is improved.

  Further, in the light emitting device of the present embodiment, a part of the light emitted from the phosphor of the color conversion member 4 and the light emitted to the sealing portion 3 side or the light reflected by the color conversion member 4 is reflected on the reflection member. 5 can be reflected toward the color conversion member 4 in a region closer to the mounting substrate 2 than the support portion 54, so that the light extraction efficiency can be increased and the light output can be improved.

  Further, in the light emitting device of the present embodiment, compared with the case where the color conversion member 4 is formed in a dome shape as in the second embodiment, the reflection member 5 in the color conversion member 4 and the color conversion member 4 from the center. The distance to the fixing part becomes shorter (that is, the size of the color conversion member 4 becomes compact), and the heat dissipation is improved.

(Embodiment 5)
The basic configuration of the light emitting device of this embodiment is substantially the same as that of the second embodiment, and as shown in FIG. The LED chip 1 is mounted on the mounting board 2 in that it is constituted by a metal base board (metal base printed wiring board) on which conductor patterns 23 and 23 electrically connected to the respective electrodes of the chip 1 are formed. The difference is that the protrusion 2a is formed and the mounting substrate 2 also serves as the wiring substrate 7 in the light emitting device of the second embodiment. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted. In FIG. 5, the outline 9 (see FIG. 2) described in the second embodiment is not shown.

  In the light emitting device of the present embodiment, the projecting portion 2 a of the mounting substrate 2 is inserted through a window hole 52 formed in the central portion of the flat bottom wall 51 of the reflecting member 5. Further, the color conversion member 4 of the present embodiment is provided with a flange portion 4b as in the color conversion member 4 of the first embodiment. Moreover, in this embodiment, the above-mentioned protrusion part 2a is inserted in the color conversion member 4, The mounting surface of the LED chip 1 in the protrusion part 2a above the plane including the opening edge of the color conversion member 4 Is located.

  Therefore, in the light emitting device of the present embodiment, light emitted backward from the plane including the mounting surface of the LED chip 1 in the protruding portion 2a from the LED chip 1 can be directly incident on the color conversion member 4. The light emitted from the LED chip 1 can be efficiently incident on the color conversion member 4, and the light incident on the color conversion member 4 is also arranged so as to cover the rear side from the side of the color conversion member 4. Since the light is reflected by the reflecting member 5 and emitted from the opening surface of the reflecting member 5, the light extraction efficiency of the entire light emitting device can be increased. In addition, since the mounting substrate 2 is provided with the projecting portion 2a, the bottom wall 51 of the reflecting member 5 can be easily arranged behind the mounting surface of the LED chip 1, and thus the forming accuracy of the reflecting member 5 and The placement accuracy can be relaxed, and the manufacturing cost can be reduced.

  By the way, in each above-mentioned embodiment, although the blue LED chip which radiates | emits blue light is employ | adopted as LED chip 1, LED chip 1 is not restricted to what radiates | emits blue light, For example, radiates | emits ultraviolet light. The light emission color of the phosphor in the color conversion member 4 is not particularly limited.

1 is a schematic cross-sectional view showing a first embodiment. FIG. 6 is a schematic cross-sectional view showing a second embodiment. FIG. 6 is a schematic cross-sectional view showing a third embodiment. FIG. 6 is a schematic cross-sectional view showing a fourth embodiment. FIG. 6 is a schematic cross-sectional view showing a fifth embodiment. It is a schematic sectional drawing which shows a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED chip 2 Mounting board 2a Protrusion part 3 Sealing part 4 Color conversion member 4b Flange part 5 Reflective member 8 Translucent cover 9 Outer part 10 Holding frame 51 Bottom wall 52 Window hole 53 Outer part 54 Support part

Claims (4)

An LED chip, a mounting substrate on which the LED chip is mounted, a sealing portion made of a light-transmitting sealing material that seals the LED chip, and the LED excited by light emitted from the LED chip A color conversion member formed of a translucent material containing a phosphor that emits light of a color different from the emission color of the chip and disposed on the light exit surface side of the sealing portion; and more than the color conversion member A reflective member that controls the light distribution of the light emitted from the light emitting surface of the color conversion member, and that is spaced apart from the sealing portion. and have, and are spaced apart is between the reflective member and before Symbol mounting board, and are spaced apart between the color conversion member and the mounting substrate, the color conversion member, the reflecting member It is fixed to the reflective member on the inside and thermally bonded. Emitting device comprising.   The reflective member is formed with a window hole into which the mounting board is inserted at a central portion of a flat bottom wall, and the color conversion member is disposed inside the reflective member so as to cover the window hole. The light-emitting device according to claim 1, wherein the light-emitting device is formed in a dome shape and is fixed to a portion of the bottom wall of the reflecting member that is separated from the window hole.   The color conversion member is formed in a flat plate shape, and the reflection member is provided with a support portion that supports a peripheral portion of the color conversion member at a position farther from the mounting substrate than the light emitting surface of the sealing portion. The light emitting device according to claim 1, wherein a peripheral portion of the color conversion member is fixed to the support portion.   The mounting substrate is made of a metal base substrate on which a projecting portion for mounting the LED chip is formed, and the reflecting member is formed with a window hole through which the projecting portion is inserted in a central portion of a flat bottom wall. The color converting member is formed in a dome shape disposed inside the reflecting member so as to cover the window hole, and is fixed to a peripheral portion of the window hole in the bottom wall of the reflecting member. The light-emitting device according to claim 1.

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