JP6249699B2 - LED light emitting device - Google Patents

Description

  The present invention relates to a structure of an LED light emitting device using a semiconductor light emitting element and a phosphor, and more particularly to an invention for improving heat dissipation characteristics from the phosphor.

2. Description of the Related Art In recent years, LED elements (hereinafter referred to as LEDs), which are semiconductor light-emitting elements, have a long life, are small in size, have high luminous efficiency, and have a bright emission color, so that they are widely used in backlights and illumination of color display devices. It has become. For LED elements, phosphors are used as wavelength conversion elements, but the wavelength conversion efficiency of the phosphors decreases due to heat from the semiconductor light emitting elements and the heat generation of the phosphors themselves, and the color rendering properties and light emission efficiency of the LED light emitting device. May decrease.
In particular, in recent years, as the brightness of LEDs has increased and the energy of light emitted from LEDs has increased, there has been a problem of a decrease in wavelength conversion efficiency due to an increase in the amount of heat generated by phosphors.

Next, the heat generation of the phosphor will be described in more detail with reference to FIG.
FIG. 13 shows the theoretical luminous efficiency of the phosphor at each temperature of two types of phosphors, phosphor A and phosphor B, whose emission axes (λp) are 518 nm and 527 nm, respectively, where the horizontal axis is the temperature of the phosphor. It is the graph which plotted a certain internal quantum yield on the vertical axis | shaft.
As shown in FIG. 13, when the temperature of the phosphor is increased by 150 ° C., the internal quantum yields of the phosphor A and the phosphor B are reduced to 50% to 60%.
For this reason, a technique for solving the heat radiation of the phosphor is disclosed. (For example, Patent Document 1)

Next, the technique disclosed in Patent Document 1 will be described with reference to FIG. FIG. 14 shows an example of the configuration of an LED light emitting device using a phosphor disclosed in Patent Document 1.
The LED light emitting device 1 shown in FIG. 14 is mounted on a substrate 5 with the light emitting surface of the LED element 2 facing upward, the periphery and upper part of the LED element 2 are surrounded by a support member 8, and an air layer 9 is formed on the upper end of the support member 8. A phosphor layer 3 is provided. This configuration is a remote phosphor (Remote).
The phosphor layer 3 is provided via the air layer 9 on the upper surface side of the LED element 2 using the support member 8, so that the emission heat of the LED element 2 is directly transmitted to the phosphor layer 3. To prevent that.

  Further, a heat dissipation layer 6 having a metal oxide deposited on the surface is provided on the upper surface side of the phosphor layer 3. The heat radiation layer 6 efficiently conducts heat 7h emitted from the phosphor quanta 7 in the phosphor layer 3 to the support member 8, and radiates heat from the surface of the heat radiation layer 6 to the upper air as heat 6h. Is intended to be. By doing so, it is possible to release heat generated when the phosphor receives light and emits excitation light. Thereby, it becomes possible to extract light from the phosphor layer 3 more efficiently without suppressing the temperature rise of the phosphor particles 7 and reducing the internal quantum efficiency.

Japanese Patent No. 5100744 (5th page, Fig. 5-7)

However, in the structure of the LED light emitting device disclosed in Patent Document 1, the amount of heat 6h radiated from the surface of the heat dissipation layer 6 to the upper air is very small and inefficient. Further, since the heat capacity of the heat dissipation layer 6 is small when the phosphor layer 6 generates heat, the heat dissipation layer 6 is immediately thermally saturated. As a result, the central portion of the phosphor layer 3 farthest from the support member 8 is obtained. Cannot be cooled effectively.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems, and to provide an LED light-emitting device with improved luminous efficiency by improving the heat dissipation property above a phosphor layer.

  In order to achieve the above object, the LED light-emitting device of the present invention has the following configuration.

An LED light emitting device according to the present invention includes an LED element mounted on a substrate, a support member formed on the substrate so as to surround the LED element, a wavelength conversion member disposed on the support member, a wavelength conversion member, and an LED. In the LED light emitting device having an air layer between the elements, the wavelength conversion member is fixed in a sealed container having a light-transmitting member on the top and bottom, and in the container at the top or bottom of the container. and a phosphor layer are, the solvent filled in the container together with contact with the phosphor layer, is constituted by the heat capacity of the solvent is much larger than the heat capacity of the phosphor layer, the solvent, the phosphor in which the phosphor layer has Phosphor particles different from the particles are contained, and the different phosphor particles are characterized in that the phosphor powder is encapsulated by a resin .

  According to the above configuration, since the solvent has fluidity, convection is generated due to a temperature difference, and the convection of the solvent quickly removes heat from the light emitting surface or light incident surface having a large area of the phosphor layer. Since it is transported to the member, it is possible to efficiently dissipate heat. In addition, since a large amount of heat can be stored in the solvent due to the large heat capacity of the solvent, thermal saturation is difficult. Further, since the solvent itself having heat moves by the convection of the solvent, the central portion of the phosphor layer 3 can be effectively cooled. As a result, the temperature rise of the phosphor is suppressed and the luminous efficiency of the LED light emitting device is improved.

Further, it is desirable that the solvent is methyl silicone oil, and the phosphor layer contains a phosphor in a silicone resin .

  According to the above structure, phosphor particles having characteristics different from those of the phosphor layer can be mixed in the solvent, so that different color rendering properties can be obtained.

As described above, according to the present invention, the heat of the phosphor layer is quickly dissipated to the outside from the entire surface where the phosphor layer and the solvent are in contact, and the wavelength conversion efficiency of the phosphor does not decrease. The luminous efficiency can be increased.
Furthermore, the color rendering property as an LED light-emitting device can be improved by the phosphor particles in the solvent.

It is sectional drawing which shows the structure of the LED light-emitting device in 1st Embodiment of this invention. It is sectional drawing which shows the structure of the container of the LED light-emitting device shown in FIG. It is sectional drawing which shows the effect | action of the LED light-emitting device shown in FIG. It is sectional drawing and a perspective view explaining the manufacturing process of the LED light-emitting device shown in FIG. It is sectional drawing and a perspective view explaining the manufacturing process of the LED light-emitting device shown in FIG. It is sectional drawing which shows the structure and effect | action of the LED light-emitting device in 2nd Embodiment of this invention. It is sectional drawing explaining the manufacturing process of the LED light-emitting device shown in FIG. It is sectional drawing which shows the structure and effect | action of the LED light-emitting device in 3rd Embodiment of this invention. It is sectional drawing explaining the manufacturing process of the LED light-emitting device shown in FIG. It is sectional drawing which shows the structure of the LED light-emitting device in 4th Embodiment of this invention. It is sectional drawing which shows the effect | action of the LED light-emitting device shown in FIG. It is sectional drawing which shows the structure and effect | action of the LED light-emitting device in 5th Embodiment of this invention. It is a graph showing the temperature characteristic of fluorescent substance. It is sectional drawing of the conventional LED light-emitting device.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings.
1 to 5 show the LED light-emitting device according to the first embodiment of the present invention, and FIGS. 1 to 3 are cross-sectional views showing the structure of the LED light-emitting device according to the first embodiment. (D) and FIG.5 (e)-(i) are sectional drawings explaining a manufacturing process.

(Description of structure of the first embodiment)
The structure of the LED light emitting device 100 will be described with reference to FIGS. 1 and 2.
FIG. 1 is a cross-sectional view showing the structure of the LED light emitting device 100, and FIG. 2 is a cross-sectional view showing the structure of the container 18.

  In FIG. 1, an LED light emitting device 100 includes an LED element 60 that emits blue light using gallium nitride (GaN) as a material and mounted on a substrate 50 using a ceramic material such as alumina or aluminum nitride with a light emitting surface facing upward. Then, the periphery and the upper part of the LED element 60 are surrounded by a support member 40 using a metal material having high reflectivity and high thermal conductivity such as aluminum, and the wavelength conversion member 10 is placed on the upper end of the support member 40 via the air layer 90. Provided and configured.

  The wavelength conversion member 10 includes a container 18, a solvent 20 held in the container 18, and a phosphor layer 30, and the phosphor layer 30 is on the bottom of the container 18, that is, on the light incident surface side from the LED element 60. It arranges in.

  The container 18 is provided with a cylindrical storage portion for holding the injected solvent 20 made of a light-transmitting ceramic such as light-transmitting alumina. As shown in FIG. The light incident surface 16 on which the emitted light enters, the light emitting surface 14 that emits light emitted from the LED element 60 and excitation light from the phosphor layer 30 described later.

  The phosphor layer 30 is made of translucent silicone or epoxy resin as a base material, and contains phosphor particles (not shown) that emit light emitted from the LED element 60 and emit wavelength-converted excitation light. Has been. In this embodiment, a YAG (Yttrium Aluminum Garnet) phosphor, which is a phosphor particle that receives blue light emitted from the LED element 60 and emits yellow excitation light, is used as the phosphor particle.

  As the solvent 20, methyl silicon oil is used in this embodiment. However, the solvent 20 has translucency, nonflammability, inertness, and insulation, and has a boiling point lower than the temperature at which the LED element used emits light. Any liquid can be used.

  Next, the structure of the container 18 will be described in detail with reference to FIG. As shown in FIG. 2, the container 18 includes a container bottom 181, a container top 182, and a container side 180, and the container bottom 181 and the container top 182 are bonded to the container side 180 to form the container 18. . The inner surface of the container upper portion 182 is the light emitting surface 14, and the outer surface of the container bottom 181 is the light incident surface 16.

  The container bottom part 181, the container upper part 182 and the container side part 180 are made of translucent alumina and processed by a pressure molding method or an extrusion molding method, and the container 18 is formed by adhesion using a hot press method or the like. The container side portion 180 may not have translucency, and aluminum having high reflectivity and good thermal conductivity may be used. Details of the manufacturing method will be described later.

(Description of operational effects of the first embodiment)
Next, the operation and effect of the LED light emitting device 100 of the present invention will be described with reference to FIG.
FIG. 3 is a cross-sectional view illustrating the operation of the LED light emitting device 100 of the present invention, where the solid line is blue light Pb emitted from the LED element 60 and the dotted line is yellow excitation wavelength-converted by the phosphor layer 30. The light Py is shown, and the rotation arrow shows the convection F generated in the solvent 20.

  As shown in FIG. 3, the blue light Pb emitted from the LED element 60 passes through the air layer 90, enters from the light incident surface 16 of the container 18, and is converted into yellow excitation light Py by the phosphor layer 30. The light exits from the light exit surface 14 to the outside of the container 18.

  Further, a part of the blue light Pb emitted from the LED element 60 is incident from the light incident surface 16 of the container 18, and is not excited by the phosphor layer 30 and is directly converted into the blue light Pb from the light emitting surface 14. 18 is emitted to the outside.

  As a result, white light Pw generated by the combination of the blue light Pb and the yellow excitation light Py is emitted from the LED light emitting device 100 to the outside. In the above-described process, the phosphor layer 30 generates heat due to excitation heat generated when the wavelength of the blue light Pb is converted into the yellow excitation light Py.

  In FIG. 3, the solvent 20 h in the vicinity of the phosphor layer 30 absorbs heat generated in the phosphor layer 30, but the temperature rises slowly because of its large heat capacity. The solvent 20h whose temperature has risen is convected due to the flow of the solvent generated in the direction against gravity from the heat source due to the temperature difference with the solvent 20f in the vicinity of the upper part (region close to the light emitting surface 14) of the container 18 having a low temperature. F is generated.

  In this way, the heat generated in the phosphor layer 30 is moved by the convection F without rapidly increasing the temperature of the solvent 20 in the container 18, and is transferred from the peripheral portion of the container 18 to the support member 40 through the heat dissipation path indicated by the arrow Th. And dissipate heat. Thus, the solvent 20h in the vicinity of the phosphor layer 30 moves directly by the convection F and transfers heat to the support member, unlike heat conduction, and the heat is continuously transferred to the phosphor without the heat capacity of the solvent 20 being saturated. It can continue to absorb from the layer 30. Therefore, it becomes possible to keep taking heat from the entire surface of the phosphor layer 30 in contact with the solvent 20 efficiently. Thereby, when heat dissipation in the phosphor layer 30 is promoted, the temperature rise of the phosphor layer 30 is reduced, and the wavelength conversion efficiency of the phosphor layer 30 is increased, so that the light emission efficiency of the LED light emitting device 100 is improved.

(Manufacturing method of the first embodiment)
Next, the manufacturing method of the LED light-emitting device 100 is demonstrated using FIG.
4 and 5 are cross-sectional views illustrating a manufacturing process for manufacturing a plurality of LED light emitting devices 100 using an aggregate material, and FIGS. 4A to 4D are pre-processes, and FIG. -(G) is a post-process.

First, the previous process will be described.
As shown in FIG. 4A, the plurality of LED elements 60 are mounted on the collective substrate 50s on the wiring on the collective substrate (not shown) using flip chip bonding, and are electrically connected.

  Next, as shown in FIGS. 4B and 4C, the collective support member 40s having the support member openings 41 is bonded to the collective substrate 50s. As shown in FIG. 4 (b-1), the collective support member 40s includes a cylindrical support member opening 41, but may have a prismatic shape.

  Subsequently, as shown in FIG. 4D, the collecting container bottom portion 181s is bonded to the collecting support member 40s, and the collecting container side portion 180s is bonded to the collecting container bottom portion 181s. Here, the collecting container side portion 180s includes a cylindrical container opening 183, but may be a prismatic shape.

Next, a post process is demonstrated.
First, as shown in FIG. 5E, the phosphor layers 30 are dropped from the container opening 183 of the collecting container side portion 180s to the bottom of the collecting container side portion 180s and bonded to each other.

  Next, as shown in FIG. 5 (f), the solvent 20 is injected into each container opening 183 by the dispenser D.

  Subsequently, as shown in FIG. 5G, the collecting container upper part 182s is bonded to the collecting container side part 180s. Thereafter, separation is performed along the cutting line c. As shown in the cross-sectional view of FIG. 5H and the perspective view of FIG. 5I, the LED light emitting device 100 is completed by the separation step of FIG.

  For the adhesion in each of the above steps, an inorganic adhesive or a hot press method can be appropriately used depending on the material.

(Second Embodiment)
Next, the structure of the LED light-emitting device 200 of 2nd Embodiment is demonstrated using FIG.
FIG. 6 is a cross-sectional view showing the structure of the LED light emitting device 200 of the second embodiment. The same elements as those of the LED light emitting device 100 of the first embodiment shown in FIGS. A duplicate description is omitted.

(Description of configuration of second embodiment)
As shown in FIG. 6, the LED light emitting device 200 according to the second embodiment has a phosphor layer 30 disposed on the bottom of the container 18 of the wavelength conversion member 11, and the container bottom 181 used in the first embodiment is used. What is not used is different from the first embodiment.
With this structure, as shown in FIG. 6, the blue light Pb emitted from the LED element 60 is directly incident on the phosphor layer 30.

(Description of operational effects of the second embodiment)
Unlike the LED light emitting device 100 of the first embodiment, the LED light emitting device 200 of the second embodiment configured as described above is such that the blue light Pb emitted from the LED element 60 is directly incident on the phosphor layer 30. Light propagation loss is reduced, and the light emission efficiency of the LED light emitting device 200 is improved. Further, since the container bottom 181 is not used at the bottom of the container 18, the thickness of the wavelength conversion member 11 is reduced, the LED light emitting device 200 is reduced in thickness, and the number of members is reduced, leading to cost reduction.

  Further, similarly to the first embodiment, the heat dissipation of the phosphor layer 30 is promoted by the convection F of the solvent 20, so that the wavelength conversion efficiency of the phosphor layer 30 does not decrease, and the light emission efficiency of the LED light emitting device 200 Will improve.

(Manufacturing method of the second embodiment)
Next, a method for manufacturing the LED light emitting device 200 will be described with reference to FIG.
FIG. 7 is a cross-sectional view illustrating a manufacturing process for manufacturing a plurality of LED light emitting devices 200 using an aggregate material.

  As shown in FIG. 7, the phosphor layers 30 are bonded to the upper portions of the support member openings 41 in the collective support member 40s. Further, the collecting container side portion 180s having the container opening 183 is bonded to the upper portion of the collecting support member 40s. The collective container side portion 180s includes a container side convex portion 180sb, and bonds and fixes the container side convex portion 180sb and the collective support member 40s.

  Other steps are the same as those of the LED light emitting device 100 of the first embodiment shown in FIGS.

(Third embodiment)
Next, the LED light-emitting device 300 in 3rd Embodiment is demonstrated using FIG.
FIG. 8 is a cross-sectional view showing the structure of the LED light emitting device 300 according to the third embodiment of the present invention. The same elements as those of the LED light emitting device 200 of the second embodiment shown in FIG. The description to be omitted is omitted.

(Description of configuration of the third embodiment)
The difference between the structure of the LED light emitting device 300 in the third embodiment and the structure of the LED light emitting device 200 in the second embodiment is that in the LED light emitting device 200, the support member 40 is the phosphor layer 30 of the wavelength conversion member 11 and the container. In the LED light emitting device 300, the support member 40 is in contact with the phosphor layer 30 of the wavelength conversion member 12, the container side portion 180, and the solvent 20.

Hereinafter, the structure of the LED light emitting device 300 will be described with reference to FIG.
As shown in FIG. 8, the support member convex part 40b is formed in the upper part of the support member 40, and the support member 40 and the solvent 20 are contacting in the position of this support member convex part 40b. A support member side 40u is provided on the inner side of the support member convex portion 40b so as to indent the outer peripheral portion of the phosphor layer 30, and the support member convex portion 40b and the phosphor layer 30 are bonded at the position of the support member side 40u. It is fixed with.

  Further, a support member side 40g that indents the container side portion 180 is provided outside the support member convex portion 40b, and the container side portion 180 and the support member convex portion 40b are bonded to each other at the position of the support member side 40g. Fixed.

(Description of operational effects of the third embodiment)
In FIG. 8, the heat generation of the phosphor layer 30 and the convection F of the solvent 20 are the same as those of the LED light emitting device 100 of the first embodiment, and thus redundant description is omitted. Since the phosphor layer 30 is bonded to the support member convex portion 40b, a part of the heat of the phosphor layer 30 is transferred from the end of the phosphor layer 30 to the support member convex portion 40b by a heat conduction path indicated by an arrow T1. The heat is dissipated.
Further, the heat radiation accompanying the convection F of the solvent 20 is directly radiated to the support member 40 through the new heat radiation path indicated by the arrow T2 because the support member convex portion 40b of the support member 40 is in contact with the solvent 20. In this way, the LED light emitting device 300 in the third embodiment has two heat dissipation paths including the direct heat dissipation path T2 due to the convection F of the solvent 20 and the heat conduction path T1, and strong heat dissipation is achieved. It becomes possible.

As described above, in the LED light emitting device 300 according to the third embodiment, in addition to the heat dissipation path described in the first and second embodiments, heat is directly transferred from the convection F to the support member because the solvent 20 and the support member 40 are in direct contact. Since the heat radiation path is transmitted, the heat radiation of the phosphor layer 30 is further promoted, the wavelength conversion efficiency of the wavelength conversion member 12 is improved, and the light emission efficiency of the LED light emitting device 300 is further improved.

(Manufacturing method of 3rd Embodiment)
Next, a method for manufacturing the LED light emitting device 300 will be described with reference to FIG.
FIGS. 9A to 9B are cross-sectional views illustrating a manufacturing process for manufacturing a plurality of LED light emitting devices 300 using a collective material.

  As shown in FIG. 9A, the collective support member 40ss having the support member openings 41 is bonded to the collective substrate 50s on which the LED elements 60 are mounted. At this time, as shown in FIG. 9 (a-1), the collective support member 40 ss is composed of a plurality of support members 40 that form a plurality of support member openings 41. Has a protruding support member convex portion 40b. The convex part of the support member convex part 40b is provided in order to adhere and fix to the phosphor layer 30 and the collecting container side part (not shown).

  The other steps are the same as those of the LED light emitting device 100 of the first embodiment shown in FIGS. 4 and 5 or the LED light emitting device 200 of the second embodiment shown in FIG.

(Fourth embodiment)
Next, the LED light-emitting device 400 in 4th Embodiment is demonstrated using FIG. 10, FIG.
FIG. 10 is a cross-sectional view showing the structure of the LED light emitting device 400 of the present invention. The same elements as those of the LED light emitting device 100 of the first embodiment shown in FIGS. Description is omitted.

(Description of configuration of the fourth embodiment)
The LED light emitting device 400 is different from the LED light emitting device 100 in that the phosphor layer 30 of the wavelength conversion member 10 is fixed to the light incident surface 16 side of the container 18, that is, the container bottom 181. On the other hand, in the LED light emitting device 400, the wavelength conversion member 13 phosphor layer 30 is fixed to the light emitting surface 14 side of the container 18, that is, the container upper part 182.

(Description of operational effects of the fourth embodiment)
Next, the operation of the LED light emitting device 400 of the present invention will be described with reference to FIG.
FIG. 11 is a cross-sectional view for explaining the operation of the LED light emitting device 400 of the present invention, where the solid line is blue light Pb emitted from the LED element 60 and the dotted line is yellow excitation light Py wavelength-converted by the phosphor layer 30. The rotation arrows indicate the convection F generated in the solvent 20.

  As shown in FIG. 11, the blue light Pb emitted from the LED element 60 passes through the air layer 90, enters from the light incident surface 16 of the container 18, passes through the solvent 20, and then becomes yellow by the phosphor layer 30. It is converted into excitation light Py and emitted from the light exit surface 14 to the outside of the container 18.

  Further, a part of the blue light Pb emitted from the LED element 60 is incident on the light incident surface 16 of the container 18 and passes through the solvent 20, and then is not emitted by the phosphor layer 30 and is emitted as it is. The blue light Pb is emitted from the surface 14 to the outside of the container 18.

  As a result, white light Pw generated by the synthesis of the blue light Pb and the yellow excitation light Py is emitted from the LED light emitting device 400 to the outside. In the above-described process, the phosphor layer 30 generates heat due to excitation heat generated when the wavelength of the blue light Pb is converted into the yellow excitation light Py.

  In FIG. 11, when the LED light emitting device 400 is used with the light emitting surface side down, that is, when the LED light emitting device 400 is disposed so as to have the solvent 20 on the phosphor layer 30, the solvent 20 in the vicinity of the phosphor layer 30 is The heat generated in the phosphor layer 30 is absorbed, and the temperature of the solvent 20h in the vicinity of the upper portion of the container 18 (region close to the light emitting surface 14) is increased. Therefore, the solvent 20h having the increased temperature and the lower portion of the container 18 having the lower temperature. Due to the temperature difference with the solvent 20f (region close to the light incident surface 14), convection F is generated due to the flow of the solvent generated in the direction against gravity from the heat source.

  In this manner, the heat generated in the phosphor layer 30 is moved by the convection F of the solvent 20 in the container 18 and is radiated from the peripheral portion of the container 18 to the support member 40 through the heat radiation path indicated by the arrow Th.

(Fifth embodiment)
Next, the LED light-emitting device 500 in 5th Embodiment is demonstrated using FIG.
12 is a cross-sectional view showing the structure of the LED light emitting device 500 of the present invention. The LED light emitting device 100 of the first embodiment shown in FIGS. 1 to 5 and the LED light emitting device 200 of the second embodiment shown in FIG. The same elements as those of the LED light emitting device 300 of the third embodiment shown in FIG.

(Description of configuration of fifth embodiment)
The configuration of the LED light emitting device 500 in the fifth embodiment is basically the same as the configuration of the LED light emitting device 100 in the first embodiment, but the difference is the wavelength conversion member of the LED light emitting device 100 in the first embodiment. Although the solvent 20 of 10 does not contain a phosphor, the solvent 20 of the wavelength conversion member 15 of the LED light emitting device 500 in the fifth embodiment contains phosphor particles 80 as shown in FIG. It is.

  This phosphor particle 80 includes a phosphor powder of several tens of microns in a capsule shape with an epoxy resin or an acrylic resin to improve durability and fluidity. Only powder may be sufficient. Other configurations are the same as those of the LED light emitting device 100 according to the first embodiment, and thus redundant description is omitted.

(Explanation of effects of the fifth embodiment)
As shown in FIG. 12, in the LED light emitting device 500 according to the fifth embodiment, in addition to the yellow excitation light Py and part of the unexcited blue light Pb generated by the blue light Pb emitted from the LED element 60, further blue light is emitted. The phosphor particles 80 in the solvent 20 are excited by Pb, and another excitation light Px is newly emitted. This excitation light Px is synthesized with the blue light Pb and the yellow excitation light Py, and has a different color rendering characteristic. It becomes light Pwr. That is, by using red phosphor particles as the phosphor particles 80, the white light Pwr becomes white light having a warm color rendering property.

  In the LED light emitting device 500, the new excitation light Px (indicated by a one-dot chain line) emitted by the phosphor particles 80 in the solvent 20 is a new color rendering effect together with the blue light Pb and the yellow excitation light Py. Therefore, if the phosphor particles 80 are appropriately selected, a desired color rendering effect can be generated, and the application range of the LED light emitting device 500 as an illumination device is expanded.

(Manufacturing method of 5th Embodiment)
The manufacturing method of the LED light emitting device 500 in the fifth embodiment is substantially the same as that of the LED light emitting device 100 in the first embodiment, and only the mixing of the phosphor particles 80 is added in the sealing step of sealing the solvent 20 only. Therefore, illustration and overlapping explanation are omitted.

(Description of modification)
Each embodiment has been described above. The LED light emitting device 100 in the first embodiment shown in FIG. 1 and the LED light emitting device 400 in the fourth embodiment shown in FIG. This embodiment is different only in that the arrangement is set upside down. However, the configuration in which the heat generated by the phosphor layer 30 is dissipated by the fluid F of the solvent 20 is not changed, and is regarded as the same effect. be able to. Further, the arrangement of the phosphor layer 30 is not limited to the vertical position of the container 18, and the same effect can be obtained by providing the phosphor layer 30 at an intermediate position of the container 18. Further, in each embodiment, the phosphor layer 30 is disposed so as to cover all the optical paths of light emitted from the LED element 60 and passing through the container 18, but the container bottom 181 or the container upper part having translucency. As long as the solvent 20 is sandwiched between 182 and the phosphor layer 30, the phosphor 30 may be disposed so as to cover a part of the light path of the light passing through the container 18 instead of the whole.

  Moreover, the structure which arrange | positions the fluorescent substance layer 30 in each part of the container 18 is a figure except the case where arrangement | positioning of the fluorescent substance layer 30 has a restriction | limiting like the LED light-emitting device 300 of 3rd Embodiment shown in FIG. The LED light-emitting device 200 in the second embodiment shown in FIG. 6 and the LED light-emitting device 500 in the fifth embodiment shown in FIG.

  In the above description, the combination of the blue light emitting element and the YAG phosphor has been mainly described. However, the scope of the present invention is not limited to this, and for example, a nitride semiconductor light emitting element that emits near ultraviolet light is used as the light emitting element. It is also possible to use CaAlSiN3: Eu to which Eu is added as a red phosphor, (BaSr) 2SiO4: Eu as a green phosphor, Sr10 (PO4) 6Cl2: Eu as a blue phosphor, and the like.

  As is apparent from the above description, according to the LED light-emitting device of the present invention, the heat generation of the phosphor layer in the LED light-emitting device is quickly dissipated to the outside, and the wavelength conversion efficiency of the phosphor layer does not decrease. An LED light-emitting device that is excellent in light-emitting efficiency as a light-emitting device and has a wide application range as a lighting device can be realized.

1, 100, 200, 300, 400 LED light emitting device 2, 60 LED element 3, 30 Phosphor layer 5, 50 Substrate 6 Heat radiation layer 7, 70, 80 Phosphor particle 8 Support member 9, 90 Air layer 10, 11, 12, 13, 15 Wavelength conversion member 14 Light exit surface 16 Light entrance surface 18 Container
20, 20h, 20f Solvent 40 Support member 40b Support member convex part 40u, 40g Support member side 40s, 40ss Collective support member 41 Support member opening 50s Collective substrate 180 Container side part 180s Collecting container side part 180sb Container side convex part 181 Container bottom 181s Collecting container bottom 182 Container upper part 182s Collecting container upper part 183 Container opening

Claims (2)

An LED element mounted on a substrate, a support member formed on the substrate so as to surround the LED element, a wavelength conversion member disposed on the support member, and the wavelength conversion member and the LED element In an LED light emitting device having an air layer between,
The wavelength conversion member includes: a sealed container having a translucent member at the top and bottom; a phosphor layer in the container and fixed to the top of the container or the bottom of the container; and the phosphor layer; A solvent that is in contact with and filled in the container,
Heat capacity of the solvent is much larger than the thermal capacity of the phosphor layer,
The solvent contains phosphor particles different from the phosphor particles included in the phosphor layer,
The different phosphor particles are phosphor powders that are encapsulated by a resin ,
LED light emitting device characterized by the above. The solvent is a methyl silicone oil,
The phosphor layer is a mixture of a phosphor in a silicone resin;
The LED light-emitting device according to claim 1.

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