JP3982561B2 - LED lighting device - Google Patents

Description

  The present invention relates to an LED lighting device using an LED chip (light emitting diode chip).

  Conventionally, an LED chip, a circuit board on which the LED chip is mounted, a metal (for example, aluminum) frame that surrounds the LED chip on the LED chip mounting surface side of the circuit board, and an inner side of the frame There has been proposed a light-emitting device including a sealing portion made of a sealing resin (for example, a transparent resin such as an epoxy resin or a silicone resin) that is filled and sealed with a bonding wire connected to the LED chip. (For example, refer to Patent Documents 1 and 2). Here, the frames described in Patent Documents 1 and 2 are formed in a shape in which the opening area gradually increases as the distance from the circuit board increases, and the inner side surface is a mirror surface, which is emitted from the LED chip. It also serves as a reflector that reflects light.

As an application example of the above light emitting device, as shown in FIG. 4, an LED chip 10 that emits blue light, a mounting board 20 on which the LED chip 10 is mounted via a submount member 30, and the mounting board 20, a frame body 40 that also serves as a frame-shaped reflector surrounding the LED chip 10 on the mounting surface side of the LED chip 10, a LED wire 10 filled inside the frame body 40, and a bonding wire 14 connected to the LED chip 10, 14 includes a sealing portion 50 made of a sealing resin that seals 14, a convex lens 60 that is placed on top of the sealing portion 50, and a yellow phosphor that emits light when excited by light emitted from the LED chip 10. A dome-shaped color conversion member 70 ′ fixed to the frame 40 so as to cover the convex lens 60, and a light distribution lens for controlling the light distribution of the light emitted from the color conversion member 70 ′ An LED including a light distribution lens 90 which has a recess 91 for accommodating the color conversion member 70 ′ on the frame body 40 side and is arranged on the frame body 40 so as to coincide with the optical axis of the convex lens 60. An illuminating device has been proposed (not related to a known literature). Here, the light distribution lens 90 in FIG. 4 has a function of guiding the light incident from the inner side surface 91b of the recess 91 to the light emitting surface 90a of the light distribution lens 90 by totally reflecting the light incident on the outer side surface 90b. It is constituted by a hybrid lens having a function of directly guiding light incident from the inner bottom surface 91a to the light emitting surface 90a. In the configuration of FIG. 4, the color conversion member 70 ′ and the convex lens 60 are in close contact. In addition, the mounting substrate 20 has conductor patterns 23 and 23 which are paired via an insulating layer 22 on a heat transfer plate 21 made of a heat conductive material (for example, a metal material such as Cu).

  In the LED illumination device shown in FIG. 4, a part of the light incident from the inner surface 91b of the recess 91 of the light distribution lens 90 among the light emitted through the color conversion member 70 ′ is not totally reflected by the outer surface 90b. There is a problem that the light is not reflected to the light emitting surface 90a side.

  This invention is made | formed in view of the said reason, The objective is to provide the LED illuminating device which can improve the light extraction efficiency from the light-projection surface of a light distribution lens.

The invention of claim 1 includes an LED chip, a base member on which the LED chip is mounted, a frame body that surrounds the LED chip on the mounting surface side of the LED chip in the base member, and an LED chip that is filled inside the frame body and sealed. Fluorescence that emits light of a color different from the emission color of the LED chip by being excited by the light emitted from the LED chip, the sealing part made of the stopped sealing resin, the convex lens arranged on the sealing part, and the light emitted from the LED chip A dome-shaped color conversion member formed on the mounting surface side of the base member so as to cover the convex lens formed of a body and a transparent material, and a light distribution lens for controlling the light distribution of light emitted from the color conversion member A light distribution lens having a recess for accommodating the color conversion member on the base member side and disposed on the mounting surface side of the base member in a form in which the optical axis coincides with the convex lens, Inside the recess A function of totally reflecting the light incident from the outer surface and guiding it to the light exit surface of the light distribution lens and a function of directly guiding light incident from the inner bottom surface of the recess to the light exit surface of the light distribution lens A reflecting structure that surrounds the light distribution lens and reflects the light incident from the inner side surface of the recess to the light emitting surface side in a direction that does not satisfy the total reflection condition on the outer side surface is provided. Thus , the color conversion member is arranged in such a manner that the convex lens is covered on the mounting surface side of the base member, and an air layer is formed between the base lens and the exit surface of the convex lens .

According to the present invention, light having a direction that does not satisfy the total reflection condition on the outer surface among the light incident from the inner surface of the recess disposed around the light distribution lens and housing the color conversion member in the light distribution lens is distributed. Since the reflecting structure that reflects on the light exit surface side of the optical lens is provided, the light emitted from the color conversion member to the side and incident from the inner surface of the recess of the light distribution lens is distributed by the reflecting structure. Since the light is reflected toward the light exit surface of the optical lens, the light extraction efficiency from the light exit surface of the light distribution lens can be increased . Further, according to the present invention, since the air layer is formed between the color conversion member and the convex lens, the fluorescence emitted from the LED chip and incident on the color conversion member through the sealing portion and the convex lens is emitted from the color conversion member. Of the light scattered by the body, the amount of light scattered to the convex lens side and transmitted through the convex lens can be reduced, and the light extraction efficiency to the outside as the entire apparatus can be improved.

  A second aspect of the present invention is the reflector according to the first aspect of the invention, wherein the frame body reflects light emitted from an LED chip formed in a shape in which an opening area gradually increases as the distance from the mounting surface increases. The light distribution lens is disposed so as to overlap with a reflector, and the reflecting structure includes a frame-like reflecting portion that extends continuously and integrally from the reflector in the optical axis direction of the reflector.

  According to this invention, since the reflecting structure is continuously formed integrally with the reflector as the frame body, the number of parts can be reduced and the assembly can be reduced as compared with the case where another member is used as the reflecting structure. Improves.

  According to the first aspect of the invention, there is an effect that the light extraction efficiency from the light exit surface of the light distribution lens can be increased.

(Embodiment 1)
As shown in FIG. 1, the LED lighting device of the present embodiment includes an LED chip 10, a mounting substrate 20 that is a base member on which the LED chip 10 is mounted, and an LED chip on the mounting surface side of the LED chip 10 in the mounting substrate 20. A frame-shaped frame 40 surrounding the frame 10, a sealing portion 50 made of a transparent sealing resin (for example, a transparent resin such as silicone resin) filled inside the frame 40 and sealing the LED chip 10, A convex lens 60 disposed so as to overlap the stopper 50 and a phosphor that emits light of a color different from the emission color of the LED chip 10 when excited by light emitted from the LED chip 10 is made of a transparent material (for example, silicone resin). And the like, and the mounting substrate 20 is formed in such a manner that the convex lens 60 is covered on the exit surface 60b side of the convex lens 60 and an air layer 80 is formed between the convex surface 60b and the exit surface 60b. A dome-shaped color conversion member 70 disposed on the mounting surface side and a light distribution lens for controlling the light distribution of light emitted from the color conversion member 70, and the color conversion member 70 is accommodated on the mounting substrate 20 side. And a light distribution lens 90 disposed on the frame body 40 so as to coincide with the optical axis of the convex lens 60. In the present embodiment, the frame body 40 constitutes a reflector that reflects the light emitted from the LED chip 10.

  The mounting substrate 20 is formed by forming a pair of conductor patterns 23 and 23 on a rectangular heat transfer plate 21 made of a heat conductive material (for example, Cu) via an insulating layer 22 (for example, metal A rectangular window hole 24 that exposes the mounting surface of the LED chip 10 on the heat transfer plate 21 is formed at the center of the insulating layer 22, and the LED chip 10 is disposed inside the window hole 24. It is mounted on the heat transfer plate 21 via a submount member 30 described later. Therefore, the heat generated in the LED chip 10 is transferred to the submant member 30 and the heat transfer plate 21 without passing through the insulating layer 22. In addition, although Cu is employ | adopted as a heat conductive material of the heat exchanger plate 21, not only Cu but Al etc. may be employ | adopted, for example.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light, and is a conductive substrate composed of an n-type SiC substrate having a lattice constant and a crystal structure close to GaN as a crystal growth substrate and having conductivity compared to a sapphire substrate. The light-emitting portion 12 is formed of a GaN-based compound semiconductor material on the main surface side of the conductive substrate 11 and formed of a laminated structure portion having a double hetero structure, for example, by an epitaxial growth method (for example, MOVPE method or the like). ), A cathode electrode (n electrode) which is a cathode side electrode (not shown) is formed on the back surface of the conductive substrate 11, and is shown on the surface of the light emitting unit 12 (the outermost surface on the main surface side of the conductive substrate 11). An anode electrode (p electrode) which is an electrode on the anode side that is not to be formed is formed. In short, the LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side. The cathode electrode and the anode electrode are composed of a laminated film of a Ni film and an Au film, but the material of the cathode electrode and the anode electrode is not particularly limited, and a material capable of obtaining good ohmic characteristics For example, Al or the like may be employed. In the present embodiment, the light emitting unit 12 of the LED chip 10 is mounted on the metal plate 21 so as to be on the side farther from the metal plate 21 than the conductive substrate 11. The conductive plate 11 may be mounted on the metal plate 21 so as to be closer to the metal plate 21 than the conductive substrate 11. In consideration of the light extraction efficiency, it is desirable to arrange the light emitting unit 12 on the side away from the metal plate 21, but in this embodiment, the conductive substrate 11 and the light emitting unit 12 have the same refractive index. Therefore, even if the light emitting unit 12 is disposed on the side close to the metal plate 21, the light extraction loss does not become too large.

  The LED chip 10 is formed on the above-described heat transfer plate 21 in a rectangular plate shape larger than the chip size of the LED chip 10, and is caused by a difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21. It is mounted via a submount member 30 that relieves stress acting on the LED chip 10. The submount member 30 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the heat transfer plate 21. Yes. In the present embodiment, AlN having a relatively high thermal conductivity and insulation is employed as the material of the submount member 30, and the LED chip 10 has the cathode electrode on the LED chip 10 side of the submount member 30. It is electrically connected to one conductor pattern 23 via a bonding wire 14 provided on the surface and connected to the cathode electrode (not shown) and a metal fine wire (for example, a gold fine wire, an aluminum fine wire, etc.). The anode electrode is electrically connected to the other conductor pattern 23 via the bonding wire 14. The LED chip 10 and the submount member 30 are bonded using lead-free solder such as AuSn or SnAgCu.

  The material of the submount member 30 is not limited to AlN, and any material may be used as long as the linear expansion coefficient is relatively close to 6H—SiC that is the material of the conductive substrate 11 and the heat conductivity is relatively high. Si or the like may be employed.

  Further, in the present embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is farther from the heat transfer plate 21 than the surface of the mounting substrate 20. Can be prevented from being absorbed by the insulating layer 22 through the inner peripheral surface of the window hole 24 of the insulating layer 22. In addition, if a reflective film that reflects the light emitted from the LED chip 10 is formed around the electrode pattern on the surface of the submount member 30 on the side to which the LED chip 10 is bonded, the radiation is emitted from the side surface of the LED chip 10. The absorbed light can be prevented from being absorbed by the submount member 30, and the light extraction efficiency to the outside can be further increased. Here, the reflective film may be formed of, for example, a laminated film of a Ni film and an Ag film.

  The frame body 40 constituting the reflector has a circular frame shape, and the shape of the inner side surface 40a is designed so that the light emitted from the side surface of the LED chip 10 is reflected toward the convex lens 60 side. Has been. In other words, the frame body 40 is formed in a shape in which the opening area increases as the distance from the LED chip 10 increases in the thickness direction of the LED chip 10 (that is, a shape in which the opening area gradually increases as the distance from the mounting surface increases). Here, as the material of the frame body 40, a material (for example, Al) having a relatively high reflectance with respect to the light emitted from the LED chip 10 (here, blue light) is adopted, and the inner surface of the frame body 40 is used. What is necessary is just to make 40a into a mirror surface, and the frame 40 should just be formed, for example by drawing an aluminum base material. In this embodiment, after the frame body 40 is fixed to the mounting substrate 20, the above-described sealing resin for sealing the LED chip 10 is potted inside the frame body 40.

  As the sealing resin that is a material of the sealing portion 50, a silicone resin is used, but is not limited to a silicone resin, and for example, an acrylic resin, an epoxy resin, or the like may be used.

  In the convex lens 60, the incident surface 60a on the sealing portion 50 side is formed in a flat shape, and the output surface 60b is formed in a convex curved surface shape. Here, the convex lens 60 is made of silicone and has the same refractive index as that of the sealing resin. The convex lens 60 is a transparent material having a refractive index equal to or higher than the refractive index of the sealing resin. If present, a material other than silicone (for example, acrylic resin, glass, etc.) may be used. In addition, when the material of the sealing part 50 is an acrylic resin, it is preferable to form the convex lens 60 also with an acrylic resin.

  By the way, the convex lens 60 and the frame body 40 constituting the reflector are arranged so that their optical axes coincide with each other and each optical axis passes through the LED chip 10, and the convex lens 60 has an exit surface 60b and an incident surface. It is formed in a convex curved surface shape that does not totally reflect the light incident from 60a at the boundary between the light emitting surface 60b and the air layer 80 described above. Here, the convex lens 60 is formed such that the emission surface 60 b is formed by a part of a spherical surface, and the center of the spherical surface is located on the center line of the light emitting unit 12 along the thickness direction of the LED chip 10. . Therefore, the light emitted from the LED chip 10 (the light emitted from the LED chip 10 and incident on the incident surface 60a of the convex lens 60 without being reflected by the frame 40 and the inner surface of the frame 40 emitted from the LED chip 10) The light reflected by 40a and incident on the entrance surface 60a of the convex lens 60) can easily reach the color conversion member 70 without being totally reflected at the boundary between the exit surface 60b and the air layer 80, thereby increasing the total luminous flux. it can.

  The color conversion member 70 is a molded article made of a mixture of a transparent material such as silicone and a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10. (In short, the color conversion member 70 is formed of a phosphor and a transparent material). Therefore, in the LED lighting device of the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface 70b of the color conversion member 70 to obtain white light. Can do. The transparent material used as the material of the color conversion member 70 is not limited to silicone, and for example, acrylic resin, epoxy resin, glass, or the like may be employed. Further, the phosphor mixed with the transparent material used as the material of the color conversion member 70 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Here, in the color conversion member 70, the inner surface 70 a has a shape along the emission surface 60 b of the convex lens 60 (that is, a shape made of a part of a spherical surface having a diameter larger than the spherical surface corresponding to the emission surface 60 b of the convex lens 60). Is formed. Therefore, the distance between the exit surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the exit surface 60b of the convex lens 60. In addition, the color conversion member 70 is shape | molded so that the thickness along a normal line direction may become uniform irrespective of a position. The color conversion member 70 may be bonded to the frame body 40 using, for example, an adhesive (for example, a silicone resin, an epoxy resin, or the like).

  Further, the light distribution lens 90 has a function of totally reflecting light incident from the inner side surface 91b of the recess 91 by the outer side surface 90b and guiding it to the light emitting surface 90a of the light distribution lens 90, and from the inner bottom surface 91a of the recess 91. It is constituted by a hybrid lens having a function of directly guiding incident light to the light exit surface 90a. Here, the inner bottom surface 91a of the recess 91 in the light distribution lens 90 is formed in a convex curved surface that is convex toward the color conversion member 70 side. Further, the outer diameter of the light distribution lens 90 gradually increases as the distance from the frame body 40 increases.

  By the way, in the LED illuminating device of this embodiment, the light of the direction which does not satisfy | fill the total reflection conditions in the outer surface 90b among the light which was arrange | positioned surrounding the light distribution lens 90 and entered from the inner surface 91b of the recess 91 (in short, A reflecting structure 100 that reflects light that is about to leak from the outer surface 90 b of the light distribution lens 90 to the light emitting surface 90 a side is provided on the mounting surface side of the mounting substrate 20. Here, the reflecting structure 100 is constituted by a frame-like reflecting portion that is continuously and integrally extended in the optical axis direction of the frame 40 from the frame 40 constituting the reflector. The reflective structure 100 is a frame-like shape that is opened in a circular shape, and the shape in which the opening area increases as the distance from the LED chip 10 increases in the thickness direction of the LED chip 10 (that is, as the distance from the mounting surface increases). The opening area is gradually increased). Note that the reflective structure 100 has an extension length in the optical axis direction so that the height position from the mounting substrate 20 is aligned with the height position of the apex of the color conversion member 70.

  In the LED illumination device according to the present embodiment described above, the outer surface 90b out of the light incident from the inner surface 91b of the recess 91 that is disposed around the light distribution lens 90 and houses the color conversion member 70 in the light distribution lens 90. Since the reflecting structure 100 that reflects the light in the direction not satisfying the total reflection condition to the light emitting surface 90a side of the light distribution lens 90 is provided, the light distribution lens 90 is emitted from the color conversion member 70 to the side. Since the light incident from the inner side surface 91b of the recess 91 is reflected by the reflecting structure 100 toward the light exit surface 90a of the light distribution lens 90, the light extraction efficiency from the light exit surface 90a of the light distribution lens 90 is increased. Can be increased. Further, in this embodiment, since the reflecting structure 100 is continuously formed integrally with the frame 40 constituting the reflector, the number of parts can be reduced as compared with the case where another member is used as the reflecting structure 100. As a result, assemblability is improved.

  Further, in the LED lighting device of the present embodiment, the air layer 80 is formed between the color conversion member 70 and the convex lens 60, so that the color conversion is performed from the LED chip 10 through the sealing portion 50 and the convex lens 60. Of the light incident on the member 70 and scattered by the yellow phosphor particles in the color conversion member 70, the amount of light scattered to the convex lens 60 side and transmitted through the convex lens 60 can be reduced, so that the entire apparatus is exposed to the outside. There is an advantage that the light extraction efficiency can be improved.

(Embodiment 2)
The basic configuration of the LED lighting device of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIG. 2, the frame body 40 has a cylindrical shape and is formed of a light-transmitting material. On the other hand, the color conversion member 70 covers the convex lens 60 and the frame body 40 on the mounting surface side of the mounting substrate 20 as a base member, and an air layer 80 is formed between the emission surface 60 b of the convex lens 60 and the frame body 40. The reflecting structure 100 is different from the above in that the reflecting structure 100 is constituted by a frame-like reflecting member surrounding the light distribution lens 90. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  In the present embodiment, a transparent material such as silicone is used as the translucent material of the frame body 40. In short, in the present embodiment, the frame body 40 is formed of a translucent material having a linear expansion coefficient equivalent to the linear expansion coefficient of the sealing resin of the sealing portion 50 (the frame body 40 has the above-described translucency. It is composed of molded parts of material). Here, in the present embodiment, after the frame body 40 is fixed to the mounting substrate 20, the sealing portion 50 is formed by filling (potting) a sealing resin inside the frame body 40 and thermosetting it. The surface of the sealing part 50 is formed in a planar shape. In addition, when using an acrylic resin as sealing resin of the sealing part 50, it is desirable to form the frame 40 with an acrylic resin.

  As can be seen from the above description, in the LED lighting device of the present embodiment, the light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50, the frame body 40, and the air layer 80 to reach the color conversion member 70. The yellow phosphor of the color conversion member 70 is excited or transmitted through the color conversion member 70 without colliding with the yellow phosphor.

  Here, the color conversion member 70 has an inner surface 70 a formed along the exit surface 60 b of the convex lens 60 and the outer surface of the frame body 40. Therefore, the distance between the exit surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the exit surface 60b of the convex lens 60. In addition, the color conversion member 70 is shape | molded so that the thickness along a normal line direction may become uniform irrespective of a position. The color conversion member 70 may be bonded to the mounting substrate 20 using, for example, an adhesive (for example, a silicone resin, an epoxy resin, or the like) on the periphery of the opening.

  The reflective structure 100 is a frame-like shape that is opened in a circular shape, and the shape in which the opening area increases as the distance from the LED chip 10 increases in the thickness direction of the LED chip 10 (that is, as the distance from the mounting surface increases). The opening area is gradually increased). The reflective structure 100 has a thickness in the thickness direction of the mounting substrate 20 set so that the height position from the mounting substrate 20 is aligned with the height position of the vertex of the color conversion member 70.

  Therefore, in the LED lighting device of the present embodiment, the outer surface 90a out of the light incident from the inner surface 91b of the recess 91 disposed around the light distribution lens 90 and housing the color conversion member 70 in the light distribution lens 90. Since the reflecting structure 100 that reflects the light in the direction not satisfying the total reflection condition to the light emitting surface 90a side of the light distribution lens 90 is provided, the light distribution lens 90 is emitted from the color conversion member 70 to the side. Since the light incident from the inner side surface 91b of the recess 91 is reflected by the reflecting structure 100 toward the light exit surface 90a of the light distribution lens 90, the light extraction efficiency from the light exit surface 90a of the light distribution lens 90 is increased. Can be increased.

  Further, in the LED lighting device of the present embodiment, since the frame body 40 is formed of a translucent material, it is possible to suppress the occurrence of light reflection loss in the frame body 40 and to improve the light output. .

  Further, in the LED lighting device of the present embodiment, the color conversion member 70 may be disposed in a form in which an air layer 80 is formed between the emission surface 60b of the convex lens 60 and the frame body 40. Since it is not necessary to make it contact | adhere to the convex lens 60 and the frame 40, the fall of the yield resulting from the dimensional accuracy and positioning accuracy of the color conversion member 70 can be suppressed.

(Embodiment 3)
The basic configuration of the LED lighting device of the present embodiment is substantially the same as that of the second embodiment. As shown in FIG. 3, a gap 110 is formed between the reflecting structure 100 and the outer surface 90 b of the light distribution lens 90. The difference is that they are arranged in a formed form. Here, the inner peripheral surface of the reflecting structure 100 is formed in a shape along the outer surface 90 b of the light distribution lens 90, and the reflecting structure 100 within the surface orthogonal to the optical axis of the light distribution lens 90 is formed. The inner peripheral shape is larger than the outer peripheral shape of the light distribution lens 90. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted.

  In the LED lighting device of the present embodiment, light leaking from the outer surface 90b of the light distribution lens 90 propagates through the gap 110 between the outer surface 90b of the light distribution lens 90 and the inner peripheral surface of the reflecting structure 100. Thus, the light is reflected from the inner peripheral surface of the reflecting structure 100 toward the light distribution lens 90, enters the light distribution lens 90, and is emitted from the light output surface 90a of the light distribution lens 90. Here, when the reflecting structure 100 is in contact with and closely contacts the outer surface 90b of the light distribution lens 90 as in the second embodiment, the omnidirectional reflection is determined by the reflectance of the reflecting structure 100. On the other hand, in the present embodiment, since the gap 110 is formed, the light incident on the outer surface 90b of the light distribution lens 90 is totally reflected up to the total reflection angle and leaks from the outer surface 90b. The reflection of light is determined by the reflectance of the reflecting structure 100. Therefore, in the LED illumination device according to the present embodiment, it is possible to increase the light extraction efficiency from the light emitting surface 90a of the light distribution lens 90 as compared with the second embodiment.

  By the way, in each said embodiment, although one LED chip 10 was mounted in the mounting board | substrate 20, the number of the LED chips 10 mounted in the mounting board | substrate 20 is not restricted to one, A plurality may be sufficient. The frame body 40, the sealing portion 50, the convex lens 60, the color conversion member 70, and the light distribution lens 90 may be provided. In each of the above embodiments, the mounting board 20 constitutes a base member. However, the base member is not limited to the mounting board 20, for example, a package in which the package body is formed of a material having a relatively high thermal conductivity. Alternatively, it may be an instrument body made of metal (for example, a metal having high thermal conductivity such as Al or Cu). When mounted on a metal instrument body, for example, the submount member 30 and the instrument body In the meantime, for example, as a sheet-like joining member, a resin sheet containing a filler made of a filler such as silica or alumina and having a low viscosity when heated (for example, an epoxy resin sheet highly filled with fused silica, etc. The organic green sheet) may be mounted.

  In each of the above-described embodiments, a blue LED chip whose emission color is blue is used as the LED chip 10, and a SiC substrate is used as the conductive substrate 11, but a GaN substrate is used instead of the SiC substrate. When a SiC substrate or a GaN substrate is used, as compared with the case where a sapphire substrate, which is an insulator, is used as the crystal growth substrate as described in Patent Document 1, the thermal conductivity of the crystal growth substrate is used. The thermal resistance of the substrate for crystal growth can be reduced with a high rate. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light-emitting portion 12 of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and a GaAs-based compound semiconductor material, a GaP-based compound semiconductor material, or the like may be employed according to the emission color of the LED chip 10. Further, the conductive substrate 11 is not limited to the SiC substrate, and may be appropriately selected from, for example, a GaAs substrate and a GsP substrate according to the material of the light emitting unit 12.

1 is a schematic cross-sectional view showing a first embodiment. FIG. 6 is a schematic cross-sectional view showing a second embodiment. FIG. 6 is a schematic cross-sectional view showing a third embodiment. It is a schematic sectional drawing which shows a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 LED chip 14 Bonding wire 20 Mounting board 30 Submount member 40 Frame 50 Sealing part 60 Convex lens 60a Incidence surface 60b Output surface 70 Color conversion member 80 Air layer 90 Light distribution lens 90a Light output surface 90b Outer surface 91 Recess 91a Inner bottom face 91b Inner side face 100 Reflective structure 110 Air gap

Claims (2)

The LED chip, a base member on which the LED chip is mounted, a frame body that surrounds the LED chip on the LED chip mounting surface side of the base member, and a sealing resin that is filled inside the frame body and seals the LED chip It is formed by a sealing part, a convex lens arranged over the sealing part, a phosphor that emits light of a color different from the emission color of the LED chip when excited by light emitted from the LED chip, and a transparent material. A dome-shaped color conversion member disposed on the mounting surface side of the base member so as to cover the convex lens, and a light distribution lens for controlling the light distribution of light emitted from the color conversion member. A light distribution lens disposed on the mounting surface side of the base member so that the optical axis coincides with the convex lens, the light distribution lens from the inner surface of the recess The incident light Surrounds the light distribution lens by having a function of totally reflecting on the side surface to guide the light distribution surface of the light distribution lens and a light incident from the inner bottom surface of the recess to the light output surface of the light distribution lens. A reflecting structure that reflects the light incident on the outer surface among the light incident from the inner surface of the recess and that does not satisfy the condition of total reflection on the outer surface to the light emitting surface side is provided, and is a color conversion member Is an LED lighting device characterized in that a convex lens is covered on the mounting surface side of the base member and an air layer is formed between the convex surface and the exit surface of the convex lens . The frame body is a reflector that reflects light emitted from an LED chip formed in a shape in which an opening area gradually increases as the distance from the mounting surface increases, and the light distribution lens is arranged to overlap the reflector, 2. The LED lighting device according to claim 1, wherein the reflecting structure includes a frame-like reflecting portion continuously and integrally extended from the reflector in the optical axis direction of the reflector .

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