JP2016162860A - Led light-emitting device - Google Patents

Led light-emitting device Download PDF

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JP2016162860A
JP2016162860A JP2015039359A JP2015039359A JP2016162860A JP 2016162860 A JP2016162860 A JP 2016162860A JP 2015039359 A JP2015039359 A JP 2015039359A JP 2015039359 A JP2015039359 A JP 2015039359A JP 2016162860 A JP2016162860 A JP 2016162860A
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emitting device
led light
led
led element
lid member
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今井 貞人
Sadato Imai
貞人 今井
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PROBLEM TO BE SOLVED: To provide an LED light-emitting device with improved heat dissipation.SOLUTION: An LED light-emitting device 1 comprises: a metallic mounting substrate 110; a metallic frame body 140; an adiathermic circuit board 120 including an opening 121 and arranged between the mounting substrate 110 and the frame body 140; an LED element 130 mounted on the mounting substrate 110 in the opening 121; a thermally conductive translucent lid member 150 fixed onto the frame body 140; and a phosphor layer 160 fixed onto the thermally conductive translucent lid member 150 at intervals between itself and the LED element 130 for wavelength conversion of at least a part of the light emitted from the LED element 130.SELECTED DRAWING: Figure 1

Description

本発明は、LED発光装置に関し、特に、蛍光体層を有するLED発光装置に関する。   The present invention relates to an LED light emitting device, and more particularly to an LED light emitting device having a phosphor layer.

近年、半導体素子であるLED素子は、長寿命で優れた駆動特性を有し、さらに小型で発光効率が良く鮮やかな発光色を有することから、照明等に広く利用されるようになってきた。   In recent years, LED elements, which are semiconductor elements, have long life and excellent driving characteristics, and are widely used for illumination and the like because they are small in size, have high luminous efficiency, and have bright emission colors.

ベースに結合されたLED素子と、LED素子が発する光を波長変換する蛍光体と、蛍光体及びベースを熱的に接続する熱伝導体を有する発光装置が知られている(例えば、特許文献1参照)。   A light emitting device having an LED element coupled to a base, a phosphor that converts the wavelength of light emitted from the LED element, and a thermal conductor that thermally connects the phosphor and the base is known (for example, Patent Document 1). reference).

特表2014−517527号公報Special table 2014-517527 gazette

上記発光装置では、LED素子が発する熱は、ベースへと伝わり、ベースから周囲へ放熱される。上記発光装置では、更に、蛍光体が発する熱は、熱伝導体を経由してベースへと伝わり、ベースから周囲へ放熱される。このように、LED素子及び蛍光体が熱的に接続された発光装置においては、両者が発する熱が混合してしまい、発光装置全体として効率良く放熱することが容易ではなかった。   In the light emitting device, the heat generated by the LED element is transmitted to the base and radiated from the base to the surroundings. In the light emitting device, the heat generated by the phosphor is further transmitted to the base via the heat conductor, and is radiated from the base to the surroundings. As described above, in the light emitting device in which the LED element and the phosphor are thermally connected, the heat generated by the both is mixed, and it is not easy to efficiently dissipate heat as the entire light emitting device.

そこで、本発明は、上述した問題点を解消することを可能としたLED発光装置を提供することを目的とする。   Then, an object of this invention is to provide the LED light-emitting device which made it possible to eliminate the trouble mentioned above.

また、本発明は、放熱性が向上したLED発光装置を提供することを目的とする。   Another object of the present invention is to provide an LED light emitting device with improved heat dissipation.

本発明に係るLED発光装置は、金属製の実装基板と、金属製の枠体と、開口部を有し、実装基板と枠体との間に配置された断熱性の回路基板と、開口部内で実装基板上に実装されたLED素子と、枠体上に固定された熱伝導性の透光性蓋部材と、LED素子から出射された光の少なくとも一部を波長変換するために、LED素子との間に間隔を空けて透光性蓋部材上に固定された蛍光体層と、を有することを特徴とする。   An LED light emitting device according to the present invention includes a metal mounting board, a metal frame, an opening, a heat insulating circuit board disposed between the mounting board and the frame, and an opening In order to convert the wavelength of at least a part of the light emitted from the LED element, the LED element mounted on the mounting board, the thermally conductive translucent lid member fixed on the frame, and the LED element, And a phosphor layer fixed on the light-transmitting lid member with a space therebetween.

本発明に係るLED発光装置では、回路基板は樹脂製の基板であることが好ましい。   In the LED light emitting device according to the present invention, the circuit board is preferably a resin substrate.

本発明に係るLED発光装置では、LED素子と蛍光体層とは、空気層により隔てられていることが好ましい。   In the LED light-emitting device according to the present invention, the LED element and the phosphor layer are preferably separated by an air layer.

本発明に係るLED発光装置では、LED素子と蛍光体層とは、樹脂層により隔てられていることが好ましい。   In the LED light emitting device according to the present invention, the LED element and the phosphor layer are preferably separated by a resin layer.

本発明に係るLED発光装置では、透光性蓋部材は単結晶サファイアから構成されることが好ましい。   In the LED light emitting device according to the present invention, it is preferable that the translucent lid member is made of single crystal sapphire.

本発明に係るLED発光装置では、回路基板上に固定された放熱フィルムを更に有し、枠体は、放熱フィルムの少なくとも一部の上に固定されることが好ましい。   In the LED light emitting device according to the present invention, it is preferable that the LED light emitting device further includes a heat dissipation film fixed on the circuit board, and the frame is fixed on at least a part of the heat dissipation film.

本発明に係るLED発光装置では、枠体は放熱フィンを有することが好ましい。   In the LED light emitting device according to the present invention, it is preferable that the frame body has a heat radiation fin.

本発明によれば、LED素子が発する熱が放熱する経路と蛍光体層が発する熱を放熱する経路を熱的に遮断する様にしたので、放熱性が向上したLED発光装置を提供することが可能となる。   According to the present invention, the path for radiating the heat generated by the LED element and the path for radiating the heat generated by the phosphor layer are thermally blocked, so that an LED light emitting device with improved heat dissipation can be provided. It becomes possible.

(a)は本発明に係るLED発光装置1の斜視図であり、(b)は(a)に示すAA’線に沿った断面図である。(A) is a perspective view of the LED light-emitting device 1 which concerns on this invention, (b) is sectional drawing along the AA 'line shown to (a). LED発光装置1の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the LED light-emitting device. LED発光装置1の放熱の様子を説明するための図である。It is a figure for demonstrating the mode of heat dissipation of LED light-emitting device. (a)は本発明に係る他のLED発光装置2の斜視図であり、(b)は(a)に示すBB’線に沿った断面図である。(A) is a perspective view of the other LED light-emitting device 2 which concerns on this invention, (b) is sectional drawing along the BB 'line | wire shown to (a). (a)は本発明に係る更に他のLED発光装置3の斜視図であり、(b)は(a)に示すCC’線に沿った断面図である。(A) is a perspective view of still another LED light emitting device 3 according to the present invention, and (b) is a cross-sectional view taken along line CC ′ shown in (a).

以下、添付図面を参照して、本発明に係るLED発光装置について詳細に説明する。ただし、本発明の技術的範囲はそれらの実施の形態に限定されず、特許請求の範囲に記載された発明とその均等物に及ぶ点に留意されたい。   Hereinafter, an LED light emitting device according to the present invention will be described in detail with reference to the accompanying drawings. However, it should be noted that the technical scope of the present invention is not limited to these embodiments, but extends to the invention described in the claims and equivalents thereof.

図1(a)は本発明に係るLED発光装置1の斜視図であり、図1(b)は図1(a)に示すAA’線に沿った断面図である。   FIG. 1A is a perspective view of an LED light-emitting device 1 according to the present invention, and FIG. 1B is a cross-sectional view taken along line AA ′ shown in FIG.

実装基板110は、その上面にLED素子130が実装される平面領域を有する基板であり、放熱性を高めるためにアルミニウムで構成される。実装基板110は、アルミニウムに限られるものではなく、耐熱性および放熱性に優れた他の素材で構成される金属基板であっても良い。実装基板110は略正方形の形状を有しているが、同様に、この形状に限られるものではない。   The mounting substrate 110 is a substrate having a planar area on which the LED element 130 is mounted on its upper surface, and is made of aluminum in order to enhance heat dissipation. The mounting substrate 110 is not limited to aluminum, and may be a metal substrate made of another material excellent in heat resistance and heat dissipation. The mounting substrate 110 has a substantially square shape, but is not limited to this shape.

回路基板120は、実装基板110と同じ大きさの略正方形の形状を有し、その中心部には円形の開口部121が形成されている。回路基板120の下面は、接着シートにより実装基板110上に貼り付けられて固定される。回路基板120は、断熱性のガラスエポキシ(ガラス繊維にエポキシ樹脂を染みこませ熱硬化処理を施したもの)により形成される。ガラスエポキシの熱伝導率は概ね1W/(m・K)以下である。しかしながら、回路基板120は、ガラスエポキシ以外の熱伝導率の低い素材から形成されてもよい。言い換えると、回路基板120は後述する様にLED素子130が発する熱を放熱する経路と、蛍光体層160が発する熱を放熱する経路とを、熱的に十分に遮断できる程度の断熱性を有することが必要である。   The circuit board 120 has a substantially square shape having the same size as the mounting board 110, and a circular opening 121 is formed at the center thereof. The lower surface of the circuit board 120 is affixed and fixed on the mounting board 110 with an adhesive sheet. The circuit board 120 is formed of a heat insulating glass epoxy (a glass fiber impregnated with an epoxy resin and subjected to a thermosetting process). The thermal conductivity of glass epoxy is approximately 1 W / (m · K) or less. However, the circuit board 120 may be formed of a material having low thermal conductivity other than glass epoxy. In other words, as will be described later, the circuit board 120 has a heat insulating property that can sufficiently sufficiently block a path for radiating heat generated by the LED element 130 and a path for radiating heat generated by the phosphor layer 160. It is necessary.

回路基板120の上面には、接続電極123A及び接続電極123Bが、それぞれ形成されている。接続電極123A、123Bは一方がアノード電極で他方がカソード電極である。また、回路基板120の上面には、金属製の放熱端子125A及び放熱端子125Bが、それぞれ形成されている。   A connection electrode 123A and a connection electrode 123B are formed on the upper surface of the circuit board 120, respectively. One of the connection electrodes 123A and 123B is an anode electrode and the other is a cathode electrode. Further, on the upper surface of the circuit board 120, a metal heat dissipation terminal 125A and a heat dissipation terminal 125B are respectively formed.

LED素子130は、青色光を発するLED素子であり、回路基板120の開口部21から露出している実装基板110上に実装される。LED素子130として、青色光以外の光を発するLED素子を用いても良い。開口部121から露出している実装基板110上には、LED素子130又は蛍光体層160が発する光を反射する効果を高めるための増反射膜を形成してもよい。増反射膜としては、例えば、二酸化ケイ素(SiO2)及び二酸化チタン(TiO2)のように、屈折率の差が大きい誘電体の薄膜対から成る多層膜(当該薄膜対を複数積層してもよい)を用いることができる。 The LED element 130 is an LED element that emits blue light, and is mounted on the mounting substrate 110 exposed from the opening 21 of the circuit board 120. An LED element that emits light other than blue light may be used as the LED element 130. On the mounting substrate 110 exposed from the opening 121, a reflection enhancing film for enhancing the effect of reflecting the light emitted from the LED element 130 or the phosphor layer 160 may be formed. As the reflective reflection film, for example, a multilayer film composed of a pair of dielectric thin films having a large difference in refractive index, such as silicon dioxide (SiO 2 ) and titanium dioxide (TiO 2 ) (even if a plurality of such thin film pairs are laminated). Good) can be used.

LED発光装置1には、21個のLED素子130が実装される。LED素子130の下面は、実装基板110と熱的に接続されるように、透明な絶縁性の接着剤により、実装基板110の上面に固定される。また、LED素子130は上面に一対の素子電極を有し、隣接するLED素子130の素子電極は、ボンディングワイヤ131により相互に接続される。開口部121の外周側に位置するLED素子130から出たボンディングワイヤ131は、接続電極123Aと導通されている配線パターン122A及び接続電極123Bと導通されている配線パターン122Bに接続される。接続電極123A、123Bに電圧が印加されることにより、LED素子130が発光する。なお、LED素子130の個数は21個に限定されるものではない。   In the LED light emitting device 1, 21 LED elements 130 are mounted. The lower surface of the LED element 130 is fixed to the upper surface of the mounting substrate 110 with a transparent insulating adhesive so as to be thermally connected to the mounting substrate 110. The LED element 130 has a pair of element electrodes on the upper surface, and the element electrodes of the adjacent LED elements 130 are connected to each other by bonding wires 131. The bonding wire 131 that comes out of the LED element 130 located on the outer peripheral side of the opening 121 is connected to the wiring pattern 122A that is electrically connected to the connection electrode 123A and the wiring pattern 122B that is electrically connected to the connection electrode 123B. When a voltage is applied to the connection electrodes 123A and 123B, the LED element 130 emits light. The number of LED elements 130 is not limited to 21.

枠体140は、開口部121の大きさに合わせて構成された円形の枠体であり、回路基板120の上面で放熱フィルム124A、124Bの一部と重なる位置に固定される。枠体140は、アルミニウムから成るが、他の熱伝導率の高い素材から構成されてもよい。また、枠体140は、LED素子130から側方に出射された光を反射する機能を有していてもよい。   The frame 140 is a circular frame configured in accordance with the size of the opening 121, and is fixed at a position overlapping the heat radiation films 124 </ b> A and 124 </ b> B on the upper surface of the circuit board 120. The frame 140 is made of aluminum, but may be made of another material having high thermal conductivity. Further, the frame body 140 may have a function of reflecting light emitted from the LED element 130 to the side.

透光性蓋部材150は、単結晶サファイアから成り、枠体140の大きさに合わせて構成された円板状をしている。透光性蓋部材150は、枠体140と熱的に接続するように、且つ、LED素子130を覆う様に枠体140の上部に固定されている。単結晶サファイアの熱伝導率は、20℃においておよそ40W/(m・K)である。しかしながら、透光性蓋部材150の素材はこれに限るものではなく、透光性及び熱伝導性を有する限り他の素材から形成されてもよく、熱伝導率が高いものが好ましい。   The translucent lid member 150 is made of single crystal sapphire and has a disk shape configured in accordance with the size of the frame body 140. The translucent lid member 150 is fixed to the upper part of the frame body 140 so as to be thermally connected to the frame body 140 and to cover the LED element 130. The thermal conductivity of single crystal sapphire is approximately 40 W / (m · K) at 20 ° C. However, the material of the translucent lid member 150 is not limited to this, and may be formed from other materials as long as it has translucency and thermal conductivity, and preferably has a high thermal conductivity.

蛍光体層160は、シリコン樹脂によるバインダ樹脂に、蛍光体粒子が分散混入されて構成された層である。なお、バインダ樹脂としてはエポキシ樹脂等を利用することができる。蛍光体層160は、LED素子130との間に間隔を設けて透光性蓋部材150の裏面上に固定される。蛍光体層160に含まれる蛍光体粒子は、LED素子130の青色光の少なくとも一部を波長変換して黄色光を発する。すなわち、LED素子130の青色光の少なくとも一部によって励起され、黄色光を発する。LED素子130の青色光と蛍光体粒子が発する黄色光とが混合し、透光性蓋部材150の上面からは白色光が発せられる。なお、蛍光体層160は、バインダ樹脂を有さず、焼結等の方法によって透光性蓋部材150の裏面に固定された蛍光体粒子からなる層であってもよい。この場合にも、蛍光体層160は透光性蓋部材150と熱的に接続される。   The phosphor layer 160 is a layer formed by dispersing phosphor particles in a binder resin made of silicon resin. An epoxy resin or the like can be used as the binder resin. The phosphor layer 160 is fixed on the back surface of the translucent lid member 150 with a space between the LED layer 130. The phosphor particles contained in the phosphor layer 160 emit yellow light by converting the wavelength of at least part of the blue light of the LED element 130. That is, it is excited by at least a part of the blue light of the LED element 130 and emits yellow light. The blue light of the LED element 130 and the yellow light emitted from the phosphor particles are mixed, and white light is emitted from the upper surface of the translucent lid member 150. The phosphor layer 160 may be a layer made of phosphor particles that does not have a binder resin and is fixed to the back surface of the translucent lid member 150 by a method such as sintering. Also in this case, the phosphor layer 160 is thermally connected to the translucent lid member 150.

充填材170は、実装基板110、回路基板120、LED素子130、枠体140、透光性蓋部材150、及び蛍光体層160によって囲まれた空間に充填されたシリコン系の紫外線硬化樹脂であり、LED素子130と蛍光体層160とを隔てている。充填材170は、例えばエポキシ樹脂を利用することができる。充填材170は、実装基板110、枠体140、透光性蓋部材150、及び蛍光体層160のいずれの熱伝導率よりも極めて低い熱伝導率(例えば、約1W/(m・K)以下)を有する。   The filler 170 is a silicon-based ultraviolet curable resin filled in a space surrounded by the mounting substrate 110, the circuit substrate 120, the LED element 130, the frame body 140, the translucent lid member 150, and the phosphor layer 160. The LED element 130 and the phosphor layer 160 are separated from each other. As the filler 170, for example, an epoxy resin can be used. The filler 170 has a thermal conductivity (for example, about 1 W / (m · K) or less) that is extremely lower than the thermal conductivity of any of the mounting substrate 110, the frame body 140, the translucent lid member 150, and the phosphor layer 160. ).

図2は、LED発光装置1の製造方法を説明するための図である。   FIG. 2 is a diagram for explaining a method of manufacturing the LED light emitting device 1.

図2(a)に示す様に、まず、上面に配線パターン122A、122B及び放熱フィルム123A、123Bが設けられた回路基板121を、実装基板110の上面に接着シートにより接着する。   As shown in FIG. 2A, first, the circuit board 121 provided with the wiring patterns 122A and 122B and the heat dissipation films 123A and 123B on the upper surface is bonded to the upper surface of the mounting substrate 110 with an adhesive sheet.

次に、図2(b)に示す様に、21個のLED素子130を開口部121から露出した実装基板110上に、高熱伝導性のダイボンド材により接着する。   Next, as shown in FIG. 2B, 21 LED elements 130 are bonded to the mounting substrate 110 exposed from the opening 121 with a high thermal conductivity die bond material.

次に、図2(c)に示す様に、ボンディングワイヤ231によって、配線パターン122Aと122Bとの間に、7個のLED素子130が直列に接続されたグループ3つを互いに並列に接続する。   Next, as shown in FIG. 2C, three groups in which seven LED elements 130 are connected in series are connected in parallel between the wiring patterns 122 </ b> A and 122 </ b> B by bonding wires 231.

次に、図2(d)に示す様に、枠体140を、放熱フィルム123A、123Bを覆う様に、回路基板120の上に高熱伝導性のダイボンド材により接着する。   Next, as shown in FIG. 2D, the frame 140 is bonded to the circuit board 120 with a high thermal conductivity die bonding material so as to cover the heat dissipation films 123A and 123B.

次に、充填材170を枠体140の内部に充填し、蛍光体層160が固定された円形の透光性蓋部材150を、蛍光体層160が実装基板110側になるように、枠体140の上部に高熱伝導性のダイボンド材により接着する。更に、透光性蓋部材150の上部から紫外線を照射して、充填材170を硬化させ、LED発光装置1を得る(図1参照)。   Next, the frame material 140 is filled with the filler 170 and the circular translucent lid member 150 to which the phosphor layer 160 is fixed is placed on the frame body so that the phosphor layer 160 is on the mounting substrate 110 side. Adhering to the upper part of 140 with a high thermal conductivity die bond material. Furthermore, the ultraviolet light is irradiated from the upper part of the translucent cover member 150, the filler 170 is hardened, and the LED light-emitting device 1 is obtained (refer FIG. 1).

図3は、LED発光装置1の放熱の様子を説明するための図である。   FIG. 3 is a diagram for explaining the heat dissipation of the LED light emitting device 1.

LED素子130は、発光する際に熱を発する。上述の通り実装基板110の熱伝導率は充填材170の熱伝導率に比して極めて高いので、矢印T1に示す様に、LED素子130が発した熱の大部分は実装基板110内へ移動する。実装基板110に移動した熱は、実装基板110内を拡散しながら、矢印T2に示す様に、対流や熱伝導等によって実装基板110の外部へ放熱される。回路基板120は熱伝導率が低いため、実装基板110に移動した熱のほとんどは回路基板120内へは移動しない。以上の様にして、LED素子130が発する熱がLED発光装置1の外部へ放熱される。   The LED element 130 generates heat when emitting light. As described above, the thermal conductivity of the mounting substrate 110 is extremely higher than the thermal conductivity of the filler 170, so that most of the heat generated by the LED element 130 moves into the mounting substrate 110 as indicated by an arrow T1. To do. The heat transferred to the mounting substrate 110 is dissipated to the outside of the mounting substrate 110 by convection, heat conduction, or the like as indicated by an arrow T2 while diffusing in the mounting substrate 110. Since the circuit board 120 has low thermal conductivity, most of the heat transferred to the mounting board 110 does not move into the circuit board 120. As described above, the heat generated by the LED element 130 is radiated to the outside of the LED light emitting device 1.

一方、蛍光体粒子を含有する蛍光体層160は、LED素子130の光により蛍光体粒子が励起されて黄色光を発する際に熱を発する。上述の通り透光性蓋部材150の熱伝導率は充填材170の熱伝導率に比して極めて高いので、矢印T3に示す様に、蛍光体層160が発した熱の大部分は充填材170ではなく透光性蓋部材150内へと移動する。蛍光体層160から透光性蓋部材150内に移動した熱の大部分は、矢印T4に示す様に透光性蓋部材150内を拡散し、透光性蓋部材150内に移動した熱の一部分は矢印T7に示す様に外部へ放熱される。透光性蓋部材150内を拡散した熱の大部分は、矢印T5に示す様に、枠体140内へ移動する。   On the other hand, the phosphor layer 160 containing phosphor particles emits heat when the phosphor particles are excited by the light of the LED element 130 to emit yellow light. As described above, the heat conductivity of the translucent lid member 150 is extremely higher than the heat conductivity of the filler 170. Therefore, as shown by the arrow T3, most of the heat generated by the phosphor layer 160 is the filler. It moves into the translucent lid member 150 instead of 170. Most of the heat transferred from the phosphor layer 160 into the translucent lid member 150 diffuses in the translucent lid member 150 as indicated by an arrow T4, and the heat that has moved into the translucent lid member 150. A part of the heat is radiated to the outside as indicated by an arrow T7. Most of the heat diffused in the translucent lid member 150 moves into the frame 140 as indicated by an arrow T5.

枠体140内に移動した熱の一部は、矢印T6に示す様に対流や熱伝導等によって枠体140の側面から外部へ放熱される。また、枠体140内に移動した熱の他の一部は、金属製の放熱フィルム124A、124Bへ移動し、放熱端子125A、125Bを経て外部の放熱部(例えば、放熱端子125A、125Bに熱的に接続されたLED発光装置1をパッケージングする装置の金属部材等)へ放熱される。回路基板120は熱伝導率が低いため、枠体140内に移動した熱のほとんどは回路基板120内へは移動しない。以上の様にして、蛍光体層160が発する熱がLED発光装置1の外部へ放熱される。   Part of the heat that has moved into the frame 140 is radiated from the side surface of the frame 140 to the outside by convection, heat conduction, or the like as indicated by an arrow T6. In addition, the other part of the heat moved into the frame 140 moves to the metal heat radiating films 124A and 124B, passes through the heat radiating terminals 125A and 125B, and heats to the external heat radiating part (for example, the heat radiating terminals 125A and 125B). The heat is dissipated to the metal member or the like of the device for packaging the LED light emitting device 1 connected in general. Since the circuit board 120 has low thermal conductivity, most of the heat transferred into the frame 140 does not move into the circuit board 120. As described above, the heat generated by the phosphor layer 160 is radiated to the outside of the LED light emitting device 1.

上述の通り、LED発光装置1において、LED素子130が発する熱と蛍光体層160が発する熱とは異なる経路を移動し、互いに混合されることなく外部へと放熱される。したがって、LED発光装置1では、LED素子130が発する熱を放熱する経路と、蛍光体層160が発する熱を放熱する経路とを熱的に遮断する様にしたので、放熱性が向上する。   As described above, in the LED light emitting device 1, the heat generated by the LED element 130 and the heat generated by the phosphor layer 160 move along different paths and are radiated to the outside without being mixed with each other. Therefore, in the LED light-emitting device 1, since the path for radiating the heat generated by the LED element 130 and the path for radiating the heat generated by the phosphor layer 160 are thermally blocked, heat dissipation is improved.

図4(a)は本発明に係る他のLED発光装置2の斜視図であり、図4(b)は図4(a)に示すBB’線に沿った断面図である。   FIG. 4A is a perspective view of another LED light emitting device 2 according to the present invention, and FIG. 4B is a cross-sectional view taken along the line BB ′ shown in FIG.

LED発光装置2では、LED発光装置1における充填材170の代わりに空気層270が設けられており、LED素子130と蛍光体層160は空気層270により隔てられている。LED発光装置2のその他の点は、LED発光装置1と同様である。   In the LED light emitting device 2, an air layer 270 is provided instead of the filler 170 in the LED light emitting device 1, and the LED element 130 and the phosphor layer 160 are separated by the air layer 270. Other points of the LED light emitting device 2 are the same as those of the LED light emitting device 1.

一般に、空気は樹脂よりも熱伝導率が低い。そのため、両者が充填材によって隔てられたLED発光装置1よりも、両者が空気層によって隔てられたLED発光装置2の方が、LED素子と蛍光体層との間の熱の移動を妨げる効果が高い。したがって、LED発光装置2では、更に放熱性が向上する。   In general, air has lower thermal conductivity than resin. Therefore, the LED light-emitting device 2 in which both are separated by the air layer is more effective in preventing the heat transfer between the LED element and the phosphor layer than the LED light-emitting device 1 in which both are separated by the filler. high. Therefore, in the LED light-emitting device 2, heat dissipation is further improved.

図5(a)は本発明に係る更に他のLED発光装置3の斜視図であり、図5(b)は図5(a)に示すCC’線に沿った断面図である。   FIG. 5A is a perspective view of still another LED light emitting device 3 according to the present invention, and FIG. 5B is a cross-sectional view taken along line CC ′ shown in FIG.

LED発光装置3では、LED発光装置1における枠体140の代わりに他の枠体340が設けられている。LED発光装置3のその他の点は、LED発光装置1と同様である。   In the LED light emitting device 3, another frame 340 is provided instead of the frame 140 in the LED light emitting device 1. Other points of the LED light emitting device 3 are the same as those of the LED light emitting device 1.

LED発光装置3の枠体340の側面には、多数の溝から成る放熱フィン341が設けられている。放熱フィン341の溝の深さ、幅、数、及び形状等は特に限定されない。また、放熱フィン341は、枠体340の全周に渡って設けられている必要はなく、枠体340の一部にのみ設けられていてもよい。   On the side surface of the frame body 340 of the LED light emitting device 3, heat radiating fins 341 made up of a number of grooves are provided. The depth, width, number, shape, and the like of the grooves of the radiation fins 341 are not particularly limited. Moreover, the radiation fin 341 does not need to be provided over the entire circumference of the frame body 340, and may be provided only in a part of the frame body 340.

LED発光装置3では、放熱フィン341によって、枠体340が外部に接触する面積が増加する。よって、蛍光体層160に含有される蛍光体粒子から発せられ、透光性蓋部材150を通り枠体340に到達した熱が枠体340から外部へと放熱される効果が、更に高まる。したがって、LED発光装置3では、更に放熱性が向上する。なお、LED発光装置3では、LED発光装置2のように、充填材170を空気層に代えても良い。   In the LED light emitting device 3, the area where the frame body 340 comes into contact with the outside is increased by the radiation fins 341. Therefore, the effect that heat emitted from the phosphor particles contained in the phosphor layer 160 and reaches the frame body 340 through the translucent lid member 150 is dissipated from the frame body 340 to the outside is further enhanced. Therefore, in the LED light-emitting device 3, heat dissipation is further improved. In the LED light emitting device 3, the filler 170 may be replaced with an air layer as in the LED light emitting device 2.

1、2、3 LED発光装置
110 実装基板
120 回路基板
130 LED素子
140、340 枠体
150 透光性蓋部材
160 蛍光体層
170 充填材
270 空気層
341 放熱フィン
1, 2, 3 LED light emitting device 110 Mounting board 120 Circuit board 130 LED element 140, 340 Frame 150 Translucent lid member 160 Phosphor layer 170 Filler 270 Air layer 341 Radiation fin

Claims (7)

金属製の実装基板と、
金属製の枠体と、
開口部を有し、前記実装基板と前記枠体との間に配置された断熱性の回路基板と、
前記開口部内で前記実装基板上に実装されたLED素子と、
前記枠体上に固定された熱伝導性の透光性蓋部材と、
前記LED素子から出射された光の少なくとも一部を波長変換するために、前記LED素子との間に間隔を設けて前記透光性蓋部材上に固定された蛍光体層と、
を有することを特徴とするLED発光装置。
A metal mounting board;
A metal frame,
An insulating circuit board having an opening and disposed between the mounting board and the frame;
An LED element mounted on the mounting substrate in the opening;
A thermally conductive translucent lid member fixed on the frame;
In order to wavelength-convert at least a part of the light emitted from the LED element, a phosphor layer fixed on the translucent lid member with a space between the LED element,
The LED light-emitting device characterized by having.
前記回路基板は樹脂製の基板である、請求項1に記載のLED発光装置。   The LED light-emitting device according to claim 1, wherein the circuit board is a resin substrate. 前記LED素子と前記蛍光体層とは、空気層により隔てられている、請求項1又は2に記載のLED発光装置。   The LED light-emitting device according to claim 1, wherein the LED element and the phosphor layer are separated by an air layer. 前記LED素子と前記蛍光体層とは、樹脂層により隔てられている、請求項1又は2に記載のLED発光装置。   The LED light-emitting device according to claim 1, wherein the LED element and the phosphor layer are separated by a resin layer. 前記透光性蓋部材は単結晶サファイアから構成される、請求項1〜4の何れか一項に記載のLED発光装置。   The LED light-emitting device according to claim 1, wherein the translucent lid member is made of single crystal sapphire. 前記回路基板上に固定された放熱フィルムを更に有し、
前記枠体は、前記放熱フィルムの少なくとも一部の上に固定される、請求項1〜5の何れか一項に記載のLED発光装置。
Further comprising a heat dissipation film fixed on the circuit board,
The LED light-emitting device according to claim 1, wherein the frame is fixed on at least a part of the heat dissipation film.
前記枠体は放熱フィンを有する、請求項1〜6の何れか一項に記載のLED発光装置。   The LED light-emitting device according to claim 1, wherein the frame body has heat radiation fins.
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