JP5075493B2 - Light emitting element storage package, manufacturing method thereof, and light emitting device using the same - Google Patents

Description

  The present invention relates to a light emitting element storage package including a reflector having a highly reflective metal film on a reflection surface, and the surface of the highly reflective metal film undergoes a chemical reaction with sulfur (S) in the air and changes its color. The present invention relates to a light-emitting element storage package that can prevent light emission and can efficiently extract light from the light-emitting element, a manufacturing method thereof, and a light-emitting device using the same.

Conventionally, in a package, a light-emitting device, and a lighting device that house a light-emitting element such as a light-emitting diode (LED), for example, on a ceramic substrate on which the light-emitting element is mounted in order to increase the illuminance of light emitted from the light-emitting element, Light emitted from a light-emitting element by joining a metallic reflector with a mirror-polished reflective surface or a reflector with a highly reflective metal film formed by vapor deposition or plating on the reflective surface of a ring-shaped enclosure The attenuation of was prevented.
The reflectance of light when a film made of Ag (silver) is formed on the reflecting surface of the reflector as described above is defined as 100 in the visible light region of the metal sphere coated with BaSO ₄ . The Ag film has been frequently used as a highly reflective metal film material because it has a high reflectivity of 94% to 98%.

Usually, in a light-emitting device using a light-emitting element storage package, the light-emitting element is sealed with a sealing material, or a synthetic resin lens, for example, is covered on the upper surface side of the light-emitting element. When a metallic reflector whose surface is coated with an Ag film or a reflector made entirely of Ag is exposed to the air for a long period of time, Ag and hydrogen sulfide in the air come into contact with each other. There was a problem that a sulfurization reaction occurred and the surface of Ag was discolored. For this reason, the malfunction that the appearance of a product falls remarkably has arisen.
In order to cope with such a problem, several inventions are disclosed.

The “light emitting device” according to the prior art will be described below.
Patent Document 1 discloses an invention relating to a light emitting device in which a light emitting element such as an LED is mounted on a three-dimensional circuit molded body.
More specifically, the “light emitting device” according to Patent Document 1 is a light emitting device formed by mounting a light emitting element such as an LED on a three-dimensional circuit molded body, and includes a concave portion and an upper surface portion around the concave portion. A three-dimensional circuit molded body is formed by forming a metal layer on the surface of the insulating substrate, and the light-emitting element is mounted in the recess of the three-dimensional circuit molded body, and the light-emitting element is formed on the metal layer formed on the upper surface portion. In the light emitting device in which the upper surface including the inside of the recess is sealed with a transparent resin, a glossy metal layer constituting a reflective surface is formed in the recess as the metal layer, A metal layer having good bonding properties is formed on the portion.
According to the invention described in Patent Document 1 having the above configuration, the glossy metal layer constituting the reflective layer is formed in the concave portion of the three-dimensional circuit molded body, and the metal layer having a good bonding property is formed on the upper surface portion. Therefore, both reflection characteristics and bonding properties can be satisfied.
In addition, by forming a wall portion for preventing the transparent resin from flowing out on the outer peripheral portion of the upper surface portion, it is possible to provide a light emitting device that is easy to process and has reduced reduction in light emission efficiency due to leakage light. Has an effect.
In particular, when the glossy metal layer is an Ag film, discoloration of the Ag film due to hydrogen sulfide in the air can be prevented by covering the Ag thin film with a metal layer having good bonding properties.

Patent Document 2 discloses a “chip component type diode” relating to a so-called chip component type light emitting diode having no lead frame.
The invention according to Patent Document 2 is composed of a resin molded article, a base body having a recess on the front surface thereof, a silver plating layer provided from the front surface to the back surface of the base body, and a recess portion of the base body via the silver plating layer. A light-emitting diode chip mounted on the light-emitting diode chip, a light-transmitting sealing resin filled in the recess to seal the light-emitting diode chip, and a silver plating layer exposed from the sealing resin. And a protective plating layer made of tin or solder.
According to the invention described in Patent Document 2 having the above-described configuration, by forming the protective plating layer made of tin or solder on the plating layer other than the concave portion, it is possible to improve the mountability on the board. Have.
Moreover, since the plating layer in the concave portion on which the light emitting diode is mounted and filled with the sealing resin is only the silver plating layer, the reflection efficiency at the time of light emission of the light emitting diode can be increased.
Furthermore, the silver plating layer outside the recess exposed from the sealing resin is covered with a protective plating layer made of tin or solder, thereby preventing a sulfurization reaction caused by contact of hydrogen sulfide in the air with the surface. It is possible to prevent discoloration of the surface of the silver plating layer.

JP 2003-152226 A JP-A-5-102531

However, in the case of the invention disclosed in the above-mentioned Patent Document 1, the greatest purpose of forming the Au thin film on the Ag thin film is to use the Au thin film as a conductor. It was also necessary to form an Au layer on the side.
That is, when manufacturing the “light emitting device” according to Patent Document 1, it is necessary to individually perform Au plating on each insulating substrate to form Au layers on the side and bottom surfaces of the insulating substrate. The operation of performing the treatment for preventing the inflow of the Au plating solution into each of the recesses of the minute light emitting device is extremely complicated because it requires high accuracy, and the productivity of the “light emitting device” according to Patent Document 1 is high. There was a problem that it was difficult to improve.

In the case of the invention disclosed in Patent Document 2, it is necessary to form a protective plating layer made of tin or solder up to the side surface and the back surface side of the insulating substrate.
Therefore, for the same reason as in Patent Document 1, there is still a problem that it is difficult to improve the productivity of the “chip component type diode” according to Patent Document 2.

  The present invention has been made in view of such a conventional situation, and a highly reflective metal film formed on the surface excluding the bonding surface of a reflector bonded to the upper surface of the base of the light emitting element storage package is in the air. Prevents discoloration by contacting with the hydrogen sulfide content of the water to prevent discoloration, and at the same time, increase the productivity of such light emitting device storage package and improve the appearance of the light emitting device storage package It is an object of the present invention to provide a light emitting element storage package and a method for manufacturing the same.

In order to achieve the above object, a light emitting element storage package according to claim 1 is bonded to an insulating base body including at least one mounting portion for mounting the light emitting element so as to surround the mounting portion. And an annular reflector, and a lens or a sealing material for sealing or sealing a cavity formed by the inner surface of the reflector and the upper surface of the substrate. And a highly reflective metal film on the outer surface and the upper surface, and at least a part of the outer surface and upper surface of the reflector has a coating for preventing this discoloration on the highly reflective metal film, and The upper surface of the reflector and the highly reflective metal film on the inner surface do not have a coating, and the outer edge of the lens or the sealing material overlaps the edge of the coating disposed on the cavity side, so that the reflection is high. JP that all denudation portion sexual metal film is hermetically or sealed It is an.
In the invention having the above-described structure, the insulating base has an effect of supporting the light emitting element and the reflector.
Further, the mounting portion formed on the upper surface side of the substrate has an effect of supporting the light emitting element so as to be conductive.
Further, the reflector has an effect of preventing light emitted from the light emitting element from diffusing in the plane direction of the substrate, and reflecting this light on the inner side surface to emit in the normal direction of the substrate. In addition, by forming the reflector itself with metal, it is possible to form a highly reflective metal film only on the surface other than the junction surface of the reflector while the reflector is bonded to the upper surface of the insulating base. It has the action.
And the highly reflective metal film formed on surfaces other than the joint surface of a reflector has the effect | action of raising the reflectance of the light on the inner surface of a reflector.
In particular, when the light-emitting element is sealed with a sealing material, the sealing material covers the surface of the highly reflective metal film formed on the inner surface of the reflector, and this portion contains hydrogen sulfide in the air. Has the effect of preventing the contact. On the other hand, particularly when the light-emitting element is sealed by covering a lens in the vicinity of the opening of the reflector, the lens includes a highly reflective metal film formed on the inner surface of the reflector and hydrogen sulfide in the air. It has the effect of preventing the contact of.
The coating covers the surface of the highly reflective metal film when the space formed by the inner surface of the reflector and the substrate is sealed or sealed with a lens or a sealing material, so that the hydrogen sulfide content in the air is reduced. And has a function of preventing the highly reflective metal film from contacting.

The light emitting element storage package according to claim 2 is the light emitting element storage package according to claim 1, wherein the inner surface of the reflector is formed in a step shape and is continuous with the upper surface of the reflector. At least a part of the step surface formed in this way is characterized by comprising a coating.
In addition to the same operation as that of the invention of the first aspect, the invention having the above-described structure is used for forming a coating for preventing the sulfidation reaction of the highly reflective metal film by forming the inner surface of the reflector in a step shape. The masking material is fitted into and closely adhered to the stepped portion formed on the inner surface side of the reflector.
As a result, the film is formed on at least a part of the step surface continuously formed on the upper surface of the reflector.

A light emitting device according to a third aspect of the present invention is the light emitting element storage package according to the first or second aspect, wherein the light emitting element is mounted on the mounting portion.
The light-emitting device having the above-described structure has an effect of irradiating light in the normal direction of the upper surface of the substrate in addition to the same effect as that of the invention described in claim 1 or claim 2.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a light emitting element storage package, comprising: an insulating base including at least one mounting portion for mounting a light emitting element; and a metal bonded so as to surround the mounting portion. The reflector has a ring-shaped reflector, and the reflector has a bottom surface of the substrate and a reflector in a method for manufacturing a light-emitting element storage package having a highly reflective metal film on the inner surface, the outer surface, and the upper surface. A masking step of covering the cavity formed by the inner surface of the body and the upper surface of the substrate with a masking material, and after the masking step, on the highly reflective metal film and on the outer surface of the reflector and at least a part of the upper surface And a film forming step of forming a film for preventing these discoloration.
In the manufacturing method of the light emitting element storage package having the above-described structure, the masking step covers the cavity and the back surface side of the substrate with a masking material, thereby preventing an unnecessary film from being formed on this portion. Have
Further, in the film forming process provided after the masking process, when the light emitting element storage package is completed and actually used as a product, it is selectively applied only to the surface of the highly reflective metal film exposed in the air. Has the effect of forming a film on the surface.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a light emitting element storage package, comprising: an insulating base provided with at least one mounting portion for mounting a light emitting element; and a metal member joined so as to surround the mounting portion. And the inner surface of the reflector is formed in a staircase shape, and the reflector has an outer surface, an upper surface, a step surface continuously formed on the upper surface, and a step surface. In a method for manufacturing a light emitting element storage package comprising a highly reflective metal film on each of a step surface continuously formed on the inner surface and an inner surface formed continuously on the step surface, the bottom surface of the substrate, and the reflector A masking step of covering the cavity formed by the inner surface of the substrate and the upper surface of the substrate with a masking material, and after the masking step, on the highly reflective metal film, the outer surface of the reflector, the upper surface, and the step surface And at least one of the staircases To, those characterized by having a film forming step of forming a coating to prevent these discoloration.
The manufacturing method of the light emitting element storage package having the above structure has the same operation as that of the fourth aspect of the invention.

The manufacturing method of the light emitting element storage package which is invention of Claim 6 is a manufacturing method of the light emitting element storage package of Claim 4 or Claim 5, Comprising: In a masking process, a masking material is plural. These masking materials are connected by a connecting material to form an integral block shape.
In the invention of the above configuration, in addition to the same operation as that of the invention described in claim 4 or 5, the connecting body connects a plurality of masking materials together while maintaining a predetermined interval to form a block shape. Has an effect.
The block-shaped masking material has an action of simultaneously covering a plurality of cavities formed on the substrate in one masking operation.

The manufacturing method of the light emitting element storage package which is invention of Claim 7 is a manufacturing method of the light emitting element storage package of any one of Claim 4 thru | or 6, Comprising: In a masking process, The masking material is an elastic body.
The manufacturing method of the light-emitting element storage package having the above-described configuration has the same effect as that of each of the inventions according to claims 4 to 6, and the masking material is formed of an elastic body, thereby opening a plurality of reflectors. The back surface side of the substrate and the substrate is covered with a masking material, and the masking material disposed on the opening side of the reflector is directed to the top surface side of the substrate, and the masking material disposed on the back surface side of the substrate is directed to the back surface side of the substrate. By pressing each, it has the effect | action that each masking material is elastically deformed and it closely_contact | adheres to the opening part of a reflector, and the back surface side of a base | substrate.

The manufacturing method of the light emitting element storage package which is invention of Claim 8 is a manufacturing method of the light emitting element storage package of any one of Claim 4 thru | or 7, Comprising: In a masking process, The masking material covering the opening of the reflector has a protrusion on the surface facing the mounting portion.
In the manufacturing method of the light emitting element storage package having the above-described configuration, in addition to the same operation as that of each of the inventions according to claims 4 to 7, the protrusion formed on the surface facing the mounting portion of the masking material includes: When the opening of the reflector is covered with the masking material, the contact area between the opening of the reflector and the masking material is increased.

According to the first aspect of the present invention, the light emitting element is mounted on the mounting portion by covering the outer surface of the plurality of reflectors bonded to the upper surface of the substrate and at least a part of the upper surface with the coating. Then, when the lens is covered with the opening of the reflector or the cavity, which is the space formed by the inner surface of the reflector and the upper surface of the substrate, is sealed with a sealing material, air is applied to the highly reflective metal film. It has the effect that it can prevent contacting with the hydrogen sulfide content.
As a result, it is possible to prevent the highly reflective metal film from being discolored due to a sulfurization reaction, and when the light emitting element storage package is a light emitting device, the appearance of the product can be improved over a long period of time. It has the effect. For this reason, it has the effect that the commercial value of a product can be raised. Therefore, there is an effect that a high-quality light-emitting device can be provided.
Moreover, according to the package for light emitting element accommodation of Claim 1, it has the effect that a film can be simultaneously formed with respect to a several reflector by one plating process.
Further, at this time, there is an effect that the masking operation can be simultaneously performed on a plurality of reflectors.
Therefore, the production efficiency of the light emitting element storage package according to claim 1 can be increased, and the manufacturing cost can be reduced.
Therefore, according to the first aspect of the invention, there is an excellent effect that a high-quality light emitting element storage package can be provided at a low cost.

According to the second aspect of the present invention, in addition to the same effect as the first aspect of the invention, when forming a coating on the highly reflective metal film of the reflector, a masking material is applied to the opening of the reflector. By inserting and covering the cavity, which is a space formed by the inner surface of the reflector and the upper surface of the substrate, it is possible to prevent the plating solution for forming the coating from flowing into the cavity. Have
As a result, there is an effect that a film can be formed also on at least a part of the step surface formed continuously on the upper surface of the reflector.
That is, this is formed when the light emitting element is mounted on the light emitting element storage package according to claim 2 and the lens is covered with the opening of the reflector, or is formed by the inner surface of the reflector and the upper surface of the substrate. When sealing the cavity, which is a space, with the sealing material, even if there is some error in the lens covering position or the filling amount of the sealing material, the height formed on the reflector This has the effect of preventing the reflective metal film from being exposed in the air.
As a result, when the light emitting device is manufactured using the light emitting element storage package according to the second aspect, it is possible to prevent the occurrence of defective products.
Therefore, the yield of the product can be improved.

The invention according to claim 3 of the present invention uses the light emitting element storage package according to claim 1 or 2 as a light emitting device in addition to the same effects as the invention according to claim 1 or claim 2. In this case, there is an effect that the highly reflective metal film can be prevented from coming into contact with hydrogen sulfide in the air and causing a sulfurization reaction to cause discoloration.
As a result, even when the light emitting device according to claim 3 is used for a long time, it is possible to prevent the appearance of the product from being deteriorated due to the discoloration of the highly reflective metal film.
Therefore, there is an effect that a high-quality light-emitting device can be provided.

According to the method for manufacturing a light emitting element storage package according to claim 4 of the present invention, particularly when a plurality of reflectors having a highly reflective metal film are bonded to the upper surface of the substrate, the plurality of reflectors. On the other hand, it has the effect that the formation process of the film which prevents the sulfidation reaction of a highly reflective metal film can be performed simultaneously.
In particular, by providing a masking step, it is possible to prevent the plating solution for forming a coating from flowing into or coming into contact with the cavity formed by the inner surface of the reflector and the upper surface of the substrate and the back surface of the substrate. It has the effect.
As a result, when the manufactured light emitting element storage package is used, it is possible to prevent the highly reflective metal film from coming into contact with air and to prevent the highly reflective metal film from being discolored by a sulfurization reaction. Has an effect. Therefore, there is an effect that the appearance of the manufactured light emitting element storage package can be favorably maintained for a long time.
Further, it is possible to prevent unnecessary coating from being formed on the inner surface of the reflector, on the conductor disposed in the cavity, and on the conductor disposed on the back side of the substrate. Has an effect.
Therefore, the invention according to claim 4 has an effect that a high-quality light-emitting element storage package can be efficiently manufactured. Moreover, it has the effect that the yield of a product can be raised in that case.

The manufacturing method of the light emitting element storage package according to claim 5 of the present invention has the same effect as that of the invention according to claim 4, and the step of the reflector is formed by forming the inner surface of the reflector stepwise. The film can be formed on at least a part of the stepped surface continuously formed on the surface.
As a result, when the light emitting element is mounted on the light emitting element storage package manufactured by the method according to claim 5 and sealed or sealed with a resin or a lens, for example, the supply amount of the sealing resin is somewhat Even if this error occurs, or even if a slight error occurs in the lens covering position, it is possible to prevent the highly reflective metal film from being exposed to the outside air. Therefore, there is an effect that it is possible to prevent the highly reflective metal film from being sulfided and discolored by hydrogen sulfide in the air.
As a result, it is possible to prevent the light emitting element storage package manufactured by the method according to claim 5 from being discolored and becoming defective, thereby improving the yield of products.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a light-emitting element storage package, wherein, in addition to the same effects as the respective inventions according to the fourth to fifth aspects, a plurality of reflectors bonded to the upper surface of the substrate are provided. On the other hand, the masking operation can be performed simultaneously. As a result, the time required for the masking process can be shortened.
As a result, the production efficiency of the light emitting element storage package can be improved.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a light-emitting element storage package. In addition to the same effects as the respective inventions according to the fourth to sixth aspects, the masking material is made of an elastic material. By applying a pressing force to the masking material during the process, the masking material can be brought into close contact with each of the opening of the reflector and the back side of the substrate.
As a result, the effects of the respective inventions according to claims 4 to 6 are promoted.

According to an eighth aspect of the present invention, in addition to the same effects as those of the fourth to seventh aspects, the masking material covering the cavity faces the mounting portion. By forming the protrusion on the surface to be performed, the contact area between the opening of the reflector and the masking material can be increased.
As a result, the effects of the inventions according to claims 4 to 7 are promoted.

  A light emitting element storage package and a manufacturing method thereof according to the best embodiment of the present invention will be described in detail with reference to FIGS.

Hereinafter, a light emitting element storage package and a manufacturing method thereof according to Embodiment 1 of the present invention will be described in detail with reference to FIGS. (Especially corresponding to claims 1 and 3)
FIG. 1 is a conceptual diagram showing an overall image of a light emitting element storage package according to Embodiment 1 of the present invention.
As shown in FIG. 1, in the light emitting element storage package 18 according to the first embodiment, for example, the upper surface of the ceramic base 2 is partitioned by grids 19 and 19, and surrounds the mounting portion 3 provided in the partition. As described above, the annular and metallic reflector 4 is bonded onto the base 2.
The term “annular” as used in the present application does not necessarily mean only “circular”, but may have a corner such as a polygon. It is shown.
That is, the light-emitting element storage package 18 according to the first embodiment is obtained by integrally connecting a plurality of individual light-emitting element storage packages 1 a in the planar direction of the base 2.
In the light emitting element storage package 18 according to the first embodiment, the base 2 may be made of insulating synthetic resin or glass ceramics in addition to the ceramics.

Although not particularly illustrated, the base 2 of the light-emitting element storage package 18 according to the first embodiment may be a single layer or a stacked body in which a plurality of flat bases 2 are stacked. In particular, in the latter case, circuit wiring can be accommodated between the stacked bases 2, 2,..., 2 and the versatility of the light emitting element accommodation package 1a according to the first embodiment can be improved. Have
In addition to the form shown in FIG. 1, for example, the light-emitting element storage package 18 according to Example 1 is provided at a desired position on the upper surface of the base 2 without providing a grid 19 on the upper surface of the base 2. It may be a light emitting element storage package 18 having at least one mounting portion 3 and a reflector 4 joined so as to surround the outer edge of the mounting portion 3. In other words, the light emitting element storage package 18 may be, for example, one in which the plurality of mounting portions 3 and the reflectors 4 are arranged on the upper surface of the base 2 so as to draw a circle.
The light emitting element storage package 18 according to the modified example of the first embodiment can be manufactured through substantially the same manufacturing process as the light emitting element storage package 18 as shown in FIG. Using the production line for the light emitting element storage package 18, the light emitting element storage package 18 can be manufactured in various forms.
Further, the reflector 4 in the light emitting element storage package 18 according to the modification of the first embodiment includes the highly reflective metal film 5 and the coating 7 as described in detail below.

The light emitting element storage package according to the first embodiment will be described in detail with reference to FIG.
FIG. 2 is a partial cross-sectional view of the light emitting element storage package according to the first embodiment of the present invention. In addition, the same code | symbol is attached | subjected about the part same as what was described in FIG. 1, and the description about the structure is abbreviate | omitted.
2 will be described focusing on an arbitrary light emitting element storage package 1a after the light emitting element storage package 18 shown in FIG.
As shown in FIG. 2, the light emitting element storage package 1 a according to Example 1 has a mounting portion 3 provided on the upper surface of a base 2, and a metal reflector 4 is a bonding material so as to surround the mounting portion 3. 6 is joined.
And this reflector 4 equips each surface of the outer surface 4a and the upper surface 4b, and the inner surface 4c with Ag film | membrane which is the highly reflective metal film 5, Furthermore, on the upper surface of the highly reflective metal film 5, A coating 7 is provided on at least a part of the outer surface 4a and the upper surface 4b of the reflector 4.
As used herein, “having the coating 7 on at least a part of the upper surface 4b of the reflector 4” means that the coating 7 is provided over the entire upper surface of the reflector 4, and FIG. As shown in the figure, it means a concept that combines both of the cases where the upper surface of the reflector 4 is not provided with the coating 7 annularly along the opening 4d.

FIG. 3 is a partial cross-sectional view showing an example of a light emitting device using the light emitting element storage package according to the first embodiment of the present invention. In addition, the same code | symbol is attached | subjected about the same part as what was described in FIG. 1 or FIG. 2, and the description about the structure is abbreviate | omitted.
As shown in FIG. 3, the light emitting device 20 a is mounted on the mounting portion 3 of the light emitting element storage package 1 a according to the first embodiment, that is, in a cavity formed by the inner surface 4 c of the reflector 4 and the upper surface of the base 2. For example, the light emitting element 13 is mounted via the bonding material 11 and the bonding bump 12, and the light emitting element 13 is sealed by filling the cavity with the sealing material 14.
In this case, the end 7a of the coating 7 covering the highly reflective metal film 5 of the reflector 4 is accommodated in the sealing material 14, so that the highly reflective metal film 5 is in the air when the light emitting device 20a is used. It has the effect that it can prevent contacting with the hydrogen sulfide content.
As a result, there is an effect that the surface of the Ag film which is the highly reflective metal film 5 can be prevented from being discolored due to a chemical reaction with the hydrogen sulfide content in the air.
Therefore, even when the light emitting device 20a is used for a long time, the surface of the highly reflective metal film 5 is not likely to be discolored, and the appearance of the light emitting device 20a is maintained in a good state for a long time. Has the effect of being able to. Therefore, there is an effect that the quality of the light emitting device 20a can be improved.

In particular, in the light emitting element storage package 1a according to Example 1, a metal reflector 4 was used, an Ag film was formed as the highly reflective metal film 5, and an Au film was formed as the film 7, for example. In this case, there is an effect that the constituent material of the reflector 4 can be all metal.
The coating 7 of the highly reflective metal film 5 may be a plating film such as palladium (Pd), rhodium (Rh), or platinum (Pt) other than the Au film. This case also has the same effect.
Further, the film 7 may be a film made of a synthetic resin other than the above. In this case, similarly to the metal film 7, there is an effect that discoloration of the highly reflective metal film 5 can be prevented.
Therefore, when the film 7 is made of a synthetic resin in particular, it has an effect that the raw material cost for manufacturing the light emitting element storage package 1a according to the first embodiment can be reduced.
The same applies to the coating film 7 in the light emitting element storage package according to Example 2 described below.

  Further, in the light emitting device 20a shown in FIG. 3, the case where the light emitting element 13 is mounted on the mounting portion 3 of the light emitting element housing package 1a by the flip chip method is described as an example. The element 13 may be mounted on the mounting portion 3 by a wire bonding method. The same applies to the light-emitting device using the light-emitting element storage package according to Example 2 described below.

In FIG. 3, the case where the light emitting element 13 according to the light emitting device 20 a is sealed in the cavity with the sealing material 14 is described as an example. However, instead of using the sealing material 14, the reflector 4 is used. The light-emitting element 13 may be sealed in the cavity by covering a lens (not shown) in the opening 4d.
In this case, it is possible to prevent the highly reflective metal film 5 from coming into contact with hydrogen sulfide in the air when the light emitting device 20a is used by accommodating the end 7a of the coating 7 on the lower surface side of the lens (not shown). It has the effect of being able to.
As a result, it is possible to prevent the Ag film, which is the highly reflective metal film 5, from being discolored due to a sulfurization reaction, and it is possible to continue to maintain the appearance of the light emitting device 20a satisfactorily for a long time. It has the effect.
As described above, according to the light emitting element storage package 1a including the coating 7 on at least a part of the outer surface 4a and the upper surface of the reflector 4, it is possible to provide a high quality light emitting device 20a. Have.

  In the light-emitting element storage package 1a (light-emitting element storage package 18) according to Example 1, the case where the inner side surface 4c of the reflector 4 is flat is described as an example. The vertical cross-sectional shape of the inner surface 4c is not necessarily a straight shape as shown in FIGS. 2 and 3, and may be, for example, a curved surface or a shape having irregularities. Also in this case, the inner side surface 4 c of the reflector 4 acts as a reflecting surface, and has an effect of emitting light emitted from the light emitting element 13 in the normal direction of the base 2.

Next, a method for manufacturing the light emitting element storage package 1a according to the first embodiment will be described in detail with reference to FIG. (Particularly corresponding to claims 4 to 6)
4 (a) to 4 (e) are conceptual views showing manufacturing steps of the light emitting element storage package according to the first embodiment of the present invention. The same parts as those described in FIGS. 1 to 3 are denoted by the same reference numerals, and description of the configuration is omitted.
In order to manufacture the light emitting element storage package 1a (light emitting element storage package 18) according to the first embodiment, first, as shown in FIG. The metal reflector 4 is bonded, and the base 2 and the reflector 4 are integrally formed, for example, immersed in an Ag plating solution, and the outer surface 4a and the upper surface of the reflector 4 are immersed. An Ag film, which is a highly reflective metal film 5, is formed on the surface of 4b and the inner side surface 4c.
In this case, when the substrate 2 is made of insulating ceramics, synthetic resin, glass ceramics, or the like, and the reflector 4 is made of metal, in the step of forming the highly reflective metal film 5, the reflector 4 has an effect that an Ag thin film layer, which is a highly reflective metal film 5, can be formed only on the outer surface 4a, the upper surface 4b, and the inner surface 4c.
That is, there is an effect that the highly reflective metal film 5 can be formed on all surfaces other than the back surface of the reflector 4.

Instead of using the reflector 4 having the highly reflective metal film 5, the reflector 4 itself may be made of a highly reflective metal. For example, you may comprise all the reflectors 4 with Ag.
In this case, since the reflector 4 and the highly reflective metal film 5 are integrally formed in the light emitting element storage package 1a according to the first embodiment, the step of forming the highly reflective metal film 5 on the surface of the reflector 4 is performed. Has the effect that can be omitted.
The same applies to the reflector according to Example 2 described in the present specification.

In the masking process that follows the completion of the preparation process as described above, as shown in FIGS. 4B and 4C, in order to cover the opening 4d of the reflector 4 bonded to the upper surface of the substrate 2, A masking material 8 having protrusions 8a on the surface facing the mounting portion 3 and a flat masking material 9 for covering the back side of the base 2 are prepared. The opening 4d of the reflector 4 is brought into contact with the back surface of the base 2 to cover the opening 4d of the reflector 4 and the back surface of the base 2.
In this way, by covering the opening 4d of the reflector 4 and the back surface of the base body 2 with the masking materials 8 and 9, respectively, the upper surface of the base body 2 and the inner side surface 4c of the mounting portion 3 are formed in the next coating film 7 forming step. The plating solution for forming the coating 7 flows into the cavity constituted by the above, and the plating solution for forming the coating 7 can be prevented from coming into contact with the back surface side of the substrate 2. Have.
Therefore, in the subsequent process of forming the coating film 7, the reflector 4 according to the first embodiment is disposed on the inner surface 4 c that is a reflecting surface, on the conductor disposed in the cavity, or on the back surface side of the base 2. This has the effect that it is possible to prevent unnecessary coating 7 from being formed on the conductor.

At this time, a gently curved projection 8 a may be formed on the surface of the masking material 8 facing the mounting portion 3. In this case, when the masking material 8 is brought into contact with the opening 4d of the reflector 4, the contact area between the masking material 8 and the opening 4d can be increased.
As a result, it is possible to more effectively prevent the plating solution for forming the film 7 from flowing into the cavity in the subsequent process of forming the film 7.

Further, the above-described masking materials 8 and 9 may be formed of an elastic body having elastic deformability, that is, an insulating rubber or synthetic resin. In this case, in the masking step, as shown in FIG. 4C, the masking material 8 has a pressing force A directed toward the upper surface side of the substrate 2, and the masking material 9 has a pressing force A on the back surface side of the substrate 2. By applying a pressing force B that is directed to each other, the masking materials 8 and 9 can be elastically deformed to be brought into close contact with the opening 4d of the reflector 4 and the back surface of the base 2 respectively.
The same applies to the masking material used in the manufacturing process of the light emitting element storage package according to the second embodiment of the present specification.
As a result, the contact area between the opening 4d of the reflector 4 and the masking material 8 can be further increased, and the above effect can be promoted.

At this time, as shown in FIG. 4B, the angle θ formed by the straight line 21 forming the side surface of the protrusion 8a and the upper surface of the base 2 in the vertical cross section of the masking material 8 is the upper surface of the inner surface 4c of the reflector 4 and the upper surface. If the angle formed by 4b is α, it is desirable that 0 <θ <α.
When the vertical cross-sectional shape of the inner side surface 4c of the reflector 4 is other than a straight line, the “angle α between the inner side surface 4c of the reflector 4 and the upper surface of the base 2” is “in the vertical cross-sectional shape of the reflector 4 The angle α ”formed by the straight line connecting the point where the side surface 4c and the upper surface of the substrate 2 are in contact with the opening 4d and the upper surface of the substrate 2 is replaced.
This is because when the surface of the masking material 8 facing the mounting portion 3 is configured to be substantially parallel to the upper surface 4b of the reflector 4, the opening 4d of the reflector 4 can be reliably covered. All of the upper surface is covered with the masking material 8, and the coating 7 cannot be formed on at least a part of the upper surface 4 b of the reflector 4.
On the other hand, when the angle θ formed by the straight line 21 forming the side surface of the protrusion 8a and the upper surface 4b of the reflector 4 in the vertical cross section of the masking material 8 is θ ≧ α, the masking material 8 is provided to cover the opening 4d. In this case, a gap is generated between the reflector 4c of the reflector 4 and the protrusion 8a of the masking material 8, and there is a high possibility that a sufficient masking effect cannot be obtained.
Therefore, the angle θ formed by the straight line 21 forming the side surface of the protrusion 8a and the upper surface 4b of the reflector 4 in the vertical cross section of the masking material 8 is in the range of 0 <θ <α. This has the effect that the film 7 can be reliably formed on at least a part of 4b.

In addition, when the openings 4d of the respective reflectors 4 in the base body 2 to which the plurality of reflectors 4 are bonded are covered with the masking material 8, the plurality of masking materials 8 are maintained at specific intervals by a coupling body (not shown). By integrally connecting them in a block shape, the openings 4d of the plurality of reflectors 4 arranged on the substrate 2 can be efficiently and reliably covered with a single masking operation. Have.
The same applies to the method for manufacturing the light emitting element storage package according to the second embodiment.

  Then, after this masking step, as shown in FIG. 4 (d), a plating solution 10 for forming a film 7 is formed by covering the opening 4 d of the reflector 4 and the back surface of the substrate 2 with masking materials 8 and 9. The coating 7 is formed on the outer surface 4a of the reflector 4 and at least a part of the upper surface of the upper surface 4b, that is, on the highly reflective metal film 5 bare in the plating solution 10 You can do it. In the present embodiment, the case where the coating 7 is immersed in the plating solution 10 has been described. However, if the coating 7 can be formed on the highly reflective metal film 5, the plating 7 can be used. The film may be formed by physical vapor deposition such as chemical vapor deposition or sputtering, or plasma spraying, and the method for forming the film 7 is not limited. The same applies to the manufacturing method of the light emitting element storage package 1b according to Example 2 described later.

If the masking materials 8 and 9 are separated from the opening 4d of the reflector 4 and the back surface of the substrate 2 after the coating film 7 forming step, the coating film 7 is applied to at least a part of the outer surface 4a and the upper surface 4b of the reflector 4. The light emitting element storage package 1a, that is, the light emitting element storage package 18 is provided.
Thus, according to the method for manufacturing the light emitting element storage package 1a according to Example 1, the Ag film as the highly reflective metal film 5 is bare on the inner side surface 4c of the reflector 4, and the reflector 4 The effect that it is possible to provide the light emitting element storage package 1a (the light emitting element storage package 18) in which the highly reflective metal film 5 is coated with the coating 7 on at least a part of the outer side surface 4a and the upper surface 4b. Have
Moreover, even if the plurality of reflectors 4 are joined to the upper surface of the base 2 of the light emitting element storage package 18 by connecting the upper end portions of the masking material 8 with a connecting portion (not shown), all the reflectors 4 openings 4d can be covered simultaneously.
Further, when the light emitting device storage package 1a manufactured by the method for manufacturing the light emitting device storage package 1a according to the first embodiment is used, for example, when the light emitting device 20a as shown in FIG. Even when used for a long period of time, at least a part of the outer surface 4a and the upper surface 4b of the reflector 4 is not discolored, so that the appearance of the light emitting device 20a can be favorably maintained over a long period of time. Has an effect.
As a result, it is possible to provide a high-quality light emitting element storage package 1a.

As described above, the light emitting element storage package 1a according to the first embodiment includes the light emitting element storage package 18 in which a plurality of light emitting element storage packages 1a are integrally connected in the plane direction of the base 2. Is formed along the grids 19 and 19.
Therefore, as shown in FIG. 4, when attention is paid only to the light emitting element storage package 1a according to the first embodiment, the individual light emitting element storage package 1a in the manufacturing process includes the “side surface” of the substrate 2, that is, There is no “divided surface” of the substrate 2.
For this reason, in the manufacturing process of the film 7 in the manufacturing process of the light emitting element storage package 1a according to the first embodiment, for example, an Au film, which is the film 7, is formed on the side surface of the base 2 of the light emitting element storage package 1a. There is absolutely nothing.
Therefore, according to the method for manufacturing the light emitting element storage package 1a according to Example 1, when the light emitting device 20a is configured using the light emitting element storage package 1a, the high reflectivity formed on the surface of the reflector 4 is formed. This has the effect that the film 7 can be formed only on the bare portion of the metal film 5.
As a result, it is possible to provide a high-quality light emitting element storage package 1a. The same applies to the light emitting element storage package according to Example 2 of the present specification.

  In the method of manufacturing the light emitting element storage package 1a (light emitting element storage package 18) according to Example 1, the masking step and the film forming step are performed without mounting the light emitting element 13 on the mounting portion 3. The masking process and the film forming process may be performed after mounting the light emitting element 13 on the mounting part 3. The same applies to the method for manufacturing the light emitting element storage package according to Example 2 described below.

Hereinafter, a light emitting element storage package and a manufacturing method thereof according to Embodiment 2 of the present invention will be described in detail with reference to FIGS. (Especially corresponding to claims 2 and 3)
The light emitting element storage package according to the second embodiment of the present invention has the same configuration as the light emitting element storage packages 18 and 1a according to the first embodiment, but the light emitting element storage package 18 according to the first embodiment. , 1a is different in the structure of the reflector 4.
Therefore, here, the description will be given with an emphasis on the difference between the light emitting element storage package according to the second embodiment and the light emitting element storage packages 18 and 1a according to the first embodiment.
FIG. 5A is a partial cross-sectional view of the light-emitting element storage package according to the second embodiment of the present invention, and FIG. 5B is a cross-sectional view of the reflector of the light-emitting element storage package according to the second embodiment. The same parts as those described in FIGS. 1 to 4 are denoted by the same reference numerals, and description of the configuration is omitted.
As shown in FIGS. 5A and 5B, the light emitting element storage package 1b according to the second embodiment has the same configuration as the light emitting element storage package 1a according to the first embodiment. Instead of the body 4, the inner surface 4 c of the reflector 4 has a reflector 15 formed in a step shape.
More specifically, the reflector 15 has a step surface 15e formed continuously on the upper surface 15b of the reflector 15 and a step surface 15f formed continuously on the step surface 15e. A coating 7 covering the upper surface of the Ag film, which is the reflective metal film 5, is provided on at least a part of the outer surface 15a, the upper surface 15b, the step surface 15e, and the step surface 15f of the reflector 15.

Note that “at least a part of the step surface 15 e” described in the specification of the present application refers to a case where the coating 7 is provided over the entire step surface 15 e of the reflector 4 and a step surface in the step surface 15 e of the reflector 4. This means a concept that combines both of the cases where the coating film 7 is not provided in an annular shape along the connecting portion between the step 15e and the stepped surface 15f.
In the light emitting element storage package 1b according to the second embodiment, the case where the inner side surface 15c of the reflector 15 is flat is described as an example. However, the vertical sectional shape of the inner side surface 15c of the reflector 15 is described. Is not necessarily a straight line as shown in FIG. 5, and may be, for example, a curved surface or a shape having irregularities.
In FIG. 5, the case where the angle β between the step surface 15e and the step surface 15f in the reflector 15 is, for example, 90 ° is described as an example, but the angle formed between the step surface 15e and the step surface 15f is described. β may be 90 ° or less or 90 ° or more.
That is, in the light emitting element storage package 1b according to Example 2, if the inner side surface 15c side of the reflector 15 is formed in a stepped shape, the contact angle between the upper surface 15b of the reflector 15 and the step surface 15e, The contact angle between the surface 15e and the step surface 15f is not particularly problematic.

FIG. 6 is a partial cross-sectional view showing an example of a light emitting device using the light emitting element storage package according to the second embodiment of the present invention. The same parts as those described in FIGS. 1 to 5 are denoted by the same reference numerals, and description of the configuration is omitted.
As shown in FIG. 6, the light emitting device 20 b is mounted on the mounting portion 3 of the light emitting element storage package 1 b according to the second embodiment, that is, in a cavity formed by the inner side surface 15 c of the reflector 15 and the upper surface of the base 2. For example, the light emitting element 13 is mounted via the bonding material 11 and the bonding bump 12, and the light emitting element 13 is sealed by filling the sealing material 14 in the cavity to the vicinity of the opening 15 d of the reflector 15. It is.
At this time, filling the sealing material 14 to the vicinity of the opening 15d of the reflector 15 has an effect that the end portion 7a of the coating 7 can be reliably accommodated in the sealing material 14.
That is, there is an effect that the highly reflective metal film 5 can be reliably prevented from coming into contact with hydrogen sulfide in the air in the light emitting device 20b.
As a result, the light emitting element housing package 1a according to the first embodiment has the same effect.

Furthermore, according to the light emitting element storage package 1b according to the second embodiment, the filling amount of the sealing material 14 is adjusted as compared with the case where the light emitting device is manufactured using the light emitting element storage package 1a according to the first embodiment. It is possible to facilitate the process.
More specifically, when the light emitting device 20a is manufactured using the light emitting element storage package 1a according to Example 1, the contact between the Ag film, which is the highly reflective metal film 5, and the hydrogen sulfide in the air is ensured. In order to prevent this, as shown in FIG. 3, it is necessary to fill the sealing material 14 so as to rise beyond the upper surface 4b of the reflector 4, and the end 7a of the coating 7 is sealed. Care must be taken to ensure that the material 14 is housed in the material 14.
On the other hand, when the light emitting device 20b is manufactured using the light emitting element storage package 1b according to the second embodiment, the coating 7 is formed on the step surface 15e formed continuously from the upper surface 15b of the reflector 15. Therefore, the end portion 7a of the coating 7 can be reliably accommodated in the sealing material 14 only by filling the sealing material 14 in the vicinity of the opening 15d of the reflector 15.

Further, in FIG. 6, the case where the light emitting element 13 according to the light emitting device 20 b is sealed with the sealing material 14 is described as an example, but the opening 14 d of the reflector 15 is used instead of the sealing material 14. May be covered with a lens (not shown) to seal the light emitting element 13 in the cavity.
Also in this case, the light emitting element storage package 1b according to Example 2 includes the coating 7 on at least a part of the step surface 15e in addition to the entire upper surface 15b of the reflector 15, and thus the opening 15d of the reflector 15 is provided. There is an effect that the end 7a of the film 7 can be reliably accommodated on the lower surface side of the lens only by mounting the lens in the vicinity.
Therefore, according to the light-emitting element storage package 1b according to the second embodiment, even when the light-emitting element 13 is sealed with the sealing material 14 or when the light-emitting element 13 is sealed with a lens, the light-emitting element storage package 1b is related to the first embodiment. Compared to the light emitting element storage package 1a, the light emitting device 20b having the same or higher quality can be easily manufactured, and at the same time, the production efficiency of the light emitting device 20b can be increased.

Next, a method for manufacturing the light emitting element storage package 1b according to the second embodiment will be described in detail with reference to FIG. (Particularly corresponding to claims 4 to 6)
FIGS. 7A to 7E are conceptual views showing manufacturing steps of the light emitting element storage package according to the second embodiment of the present invention. The same parts as those described in FIGS. 1 to 6 are denoted by the same reference numerals, and description of the configuration is omitted.
The manufacturing method of the light emitting element storage package 1b according to the second embodiment has substantially the same steps as the manufacturing method of the light emitting element storage package 1a (the light emitting element storage package 18) according to the first embodiment. Instead of 8, a masking material 16 having a protrusion 16 a and a flat portion 16 b formed around the protrusion 16 a on the surface facing the mounting portion 3 is different.
Here, a description will be given with emphasis on differences from the method for manufacturing the light emitting element storage package 1a according to the first embodiment.

In order to manufacture the light emitting element storage package 1b according to the first embodiment, as shown in FIG. 7A, first, for example, a metal reflector 15 is formed on the upper surface of the base 2 via the bonding material 6. The substrate 2 and the reflector 4 integrally formed are immersed in an Ag plating solution, and the reflector 15 has an outer surface 15a, an upper surface 15b, an inner surface 15c, a step surface 15e, An Ag film, which is a highly reflective metal film 5, is formed on the surface of the step surface 15f.
In this case, when the substrate 2 is made of insulating ceramics, synthetic resin, glass ceramics, or the like, and the reflector 15 is made of metal, in the step of forming the highly reflective metal film 5, the reflector The Ag thin film layer, which is the highly reflective metal film 5, can be formed only on the surfaces of the outer surface 15a, the upper surface 15b, the step surface 15e, the step surface 15f, and the inner surface 4c.
That is, there is an effect that the highly reflective metal film 5 can be formed on all surfaces other than the back surface of the reflector 15.

In the masking process that follows the completion of the preparation process as described above, as shown in FIGS. 7B and 7C, the mounting portion is disposed on the opening 15 d side of the reflector 15 bonded to the upper surface of the base 2. 3 is prepared with a masking material 16 having a protrusion 16a and a flat portion 16b on the surface facing the substrate 3, and a flat masking material 9 is prepared on the back surface side of the substrate 2, and then the masking material 16 is applied to the reflector. The flat portion 16b of the masking material 16 is brought into contact with the stepped surface 15f of the reflector 15 and the side surface of the projection 16a of the masking material 16 is brought into contact with the inner side surface 15c. . Further, the upper surface of the masking material 9 is brought into contact with the back surface of the substrate 2 to cover the mounting portion 3 of the reflector 15 and the back surface of the substrate 2.
At this time, as shown in FIG. 7C, the width of the masking material 16 is made smaller than the width of the opening 15d of the reflector 15, and the side surface of the masking material 16 and the step surface 15e of the reflector 15 are formed. A gap 17 is formed between them.
In this way, by covering the mounting portion 3 and the back surface of the substrate 2 with the masking materials 16 and 9, respectively, the upper surface of the substrate 2 and the inner surface 15c of the reflector 15 are formed in the next coating film 7 forming step. This is a plating solution for preventing the plating solution for forming the coating 7 from flowing into the cavity, and for forming the coating 7 on the terminal (not shown) disposed on the back side of the substrate 2. For example, it has the effect that it can prevent that Au plating solution contacts.
In particular, when the upper end portion of the masking material 16 is connected by a connecting portion (not shown), all the reflectors bonded to the upper surface of the base 2 of the light emitting element storage package to which the plurality of light emitting element storage packages 1b are connected. There is also an effect that the 15 mounting portions 3 can be covered simultaneously.

Then, after this masking step, as shown in FIG. 7 (d), the plating solution 10 for forming the coating 7 is formed by covering the mounting portion 3 of the reflector 15 and the back surface of the base 2 with masking materials 16 and 9. By immersing in, the coating is formed on at least a part of the outer surface 15a, the upper surface 15b, and the step surface 15e of the reflector 15, that is, on the highly reflective metal film 5 in contact with the plating solution 10. For example, an Au film can be formed.
That is, since a gap 17 is formed between the side surface of the masking material 16 and the step surface 15e of the reflector 15, the Au plating solution is intruded into the gap 17 on the step surface 15e of the reflector 15. Has the effect that the film 7 can be formed.
At this time, as shown in FIG. 7C, the shape of the side surface of the protrusion 16 a in the masking material 16 and the shape of the inner surface 15 c of the reflector 15 are made to substantially coincide with each other. This has the effect of reliably preventing the plating solution 10 from flowing into the space formed by the side surface 15 c and the upper surface of the base 2.
Further, since the masking material 16 has the protrusions 16a, when the mounting portion 3 of the light emitting element storage package 1b is covered with the masking material 16, the center of the mounting portion 3 and the central axis of the masking material 16 are substantially aligned. Thus, the masking material 16 can be guided.
As a result, the gap 17 can be surely formed between the side surface of the masking material 16 and the step surface 15e of the reflector 15.

If the masking materials 16 and 9 are separated from the step surface 15f of the reflector 15 and the back surface of the substrate 2 after the coating film 7 forming step, at least a part of the outer surface 15a, the upper surface 15b, and the step surface 15e of the reflector 15 is formed. Thus, the light-emitting element storage package 1b having the coating 7 is completed.
Thus, according to the method for manufacturing the light emitting element storage package 1b according to Example 2, the Ag film that is the highly reflective metal film 5 is formed on the inner surface 15c of the reflector 15, and the reflector 15 There is an effect that the light emitting element storage package 1b having the coating 7 that covers the highly reflective metal film 5 on at least a part of the outer side surface 15a, the upper surface 15b, and the step surface 15e can be manufactured.
As a result, in addition to the same effects as the light emitting element housing package 1a according to the first embodiment, the yield of the light emitting element housing package 1b can be improved, and at the same time, the light emitting element housing package 1b according to the second embodiment can be produced. The efficiency can be increased as compared with the light emitting element storage package 1a according to the first embodiment.

  As described above, according to the present invention, the highly reflective metal film formed on the surface of the reflector bonded to the upper surface of the substrate of the light emitting element storage package undergoes a chemical reaction with hydrogen sulfide in the air and changes its color. Can be prevented, and at the same time, the productivity of the light-emitting element storage package can be improved, and the appearance can be kept good for a long period of time, which can be used in the field of lighting devices.

It is a conceptual diagram which shows the whole image of the light emitting element storage package which concerns on Example 1 of this invention. It is a fragmentary sectional view of the light emitting element accommodation package which concerns on Example 1 of this invention. It is a fragmentary sectional view which shows an example of the light-emitting device using the package for light emitting element accommodation which concerns on Example 1 of this invention. (A)-(e) is a conceptual diagram which shows the manufacturing process of the light emitting element storage package which concerns on Example 1 of this invention. (A) is a fragmentary sectional view of the light emitting element accommodation package concerning Example 2 of the present invention, and (b) is a sectional view of the reflector of the light emitting element accommodation package concerning Example 2. It is a fragmentary sectional view which shows an example of the light-emitting device using the package for light emitting element accommodation which concerns on Example 2 of this invention. (A)-(e) is a conceptual diagram which shows the manufacturing process of the package for light emitting element accommodation which concerns on Example 2 of this invention.

DESCRIPTION OF SYMBOLS 1a, 1b ... Light emitting element storage package 2 ... Base | substrate 3 ... Mounting part 4 ... Reflector 4a ... Outer side surface 4b ... Upper surface 4c ... Inner side surface 4d ... Opening 5 ... Highly reflective metal film 6 ... Bonding material 7 ... Film 8 ... Masking material 8a ... Projection 9 ... Masking material 10 ... Plating solution 11 ... Bonding material 12 ... Bonding bump 13 ... Light emitting element 14 ... Sealing material 15 ... Reflector 15a ... Outer surface 15b ... Upper surface 15c ... Inner surface 15d ... Opening 15e ... Stepped surface 15f ... Staircase 16 ... Masking material 16a ... Projection 16b ... Flat part 17 ... Gap 18 ... Light emitting element storage package 19 ... Cross section 20a, 20b ... Light emitting device 21 ... Straight line

Claims (8)

An insulating base provided with at least one mounting portion for mounting the light emitting element; a metal and annular reflector joined so as to surround the mounting portion; an inner surface of the reflector; and the base A lens or a sealing material for sealing or sealing the cavity formed by the upper surface of
The reflector includes a highly reflective metal film on its inner side surface, outer side surface, and upper surface,
Said outer surface of said reflector, and at least a portion of said upper surface, provided with a coating to prevent this discoloration to the high reflective metal film, and the remainder and the said top surface of said reflector Without the coating on the highly reflective metal film on the inner surface,
An outer edge of the lens or the sealing material overlaps with an end portion of the coating disposed on the cavity side, and all the bare portions of the highly reflective metal film are sealed or sealed. The light emitting element storage package. The inner surface of the reflector is formed in a step shape,
The light emitting element storage package according to claim 1, wherein at least a part of a stepped surface continuously formed on the upper surface of the reflector includes the coating. In the light emitting element storage package according to claim 1 or 2,
A light emitting device having a light emitting element mounted on the mounting portion. An insulating base provided with at least one mounting portion for mounting a light emitting element, and a metal and annular reflector joined so as to surround the mounting portion;
In the method of manufacturing a light emitting element storage package, the reflector includes a highly reflective metal film on the inner side surface, the outer side surface, and the upper surface.
A masking step of covering a cavity formed by the bottom surface of the substrate and the inner surface of the reflector and the upper surface of the substrate with a masking material;
A film forming step of forming a film for preventing discoloration on the highly reflective metal film and on the outer surface of the reflector and at least a part of the upper surface after the masking step; A manufacturing method of a package for housing a light emitting element, comprising: An insulating base provided with at least one mounting portion for mounting a light emitting element, and a metal and annular reflector joined so as to surround the mounting portion;
The inner surface of the reflector is formed in a step shape,
The reflector is continuously formed on the outer surface, the upper surface, a step surface formed continuously on the upper surface, a step surface formed continuously on the step surface, and the step surface. In the method for manufacturing a light emitting element storage package comprising a highly reflective metal film on each of the inner surfaces,
A masking step of covering a cavity formed by the bottom surface of the substrate and the inner surface of the reflector and the upper surface of the substrate with a masking material;
After the masking step, these discoloration is prevented on the highly reflective metal film and on the outer surface of the reflector, the upper surface, the step surface, and at least part of the step surface. And a film forming process for forming a film for the purpose of manufacturing a light emitting element storage package.   6. The light emitting device storage package according to claim 4, wherein, in the masking step, the masking material forms an integral block shape by connecting a plurality of the masking materials by a connecting material. 7. Method.   The method for manufacturing a light emitting element storage package according to any one of claims 4 to 6, wherein, in the masking step, the masking material is an elastic body.   8. The light emitting device according to claim 4, wherein, in the masking step, the masking material covering the opening of the reflector has a protrusion on a surface facing the mounting portion. 9. A method for manufacturing an element storage package.