JP5478498B2 - シリコン/金属複合体マイクロメカニカル構成要素およびこれを製造する方法 - Google Patents
シリコン/金属複合体マイクロメカニカル構成要素およびこれを製造する方法 Download PDFInfo
- Publication number
- JP5478498B2 JP5478498B2 JP2010533559A JP2010533559A JP5478498B2 JP 5478498 B2 JP5478498 B2 JP 5478498B2 JP 2010533559 A JP2010533559 A JP 2010533559A JP 2010533559 A JP2010533559 A JP 2010533559A JP 5478498 B2 JP5478498 B2 JP 5478498B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- layer
- metal
- micromechanical component
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 79
- 239000010703 silicon Substances 0.000 title claims abstract description 79
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000002905 metal composite material Substances 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 127
- 239000002184 metal Substances 0.000 claims abstract description 127
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 118
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000011347 resin Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 37
- 238000009713 electroplating Methods 0.000 claims abstract description 20
- 230000012010 growth Effects 0.000 claims abstract description 8
- 238000000206 photolithography Methods 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 238000003754 machining Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 235000016496 Panda oleosa Nutrition 0.000 claims description 5
- 240000000220 Panda oleosa Species 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 120
- 239000002131 composite material Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 238000000708 deep reactive-ion etching Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical group [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 210000003423 ankle Anatomy 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007773 growth pattern Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000858 nanotransfer moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0095—Aspects relating to the manufacture of substrate-free structures, not covered by groups B81C99/008 - B81C99/009
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/08—Perforated or foraminous objects, e.g. sieves
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
- F16H55/02—Toothed members; Worms
- F16H55/06—Use of materials; Use of treatments of toothed members or worms to affect their intrinsic material properties
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B13/00—Gearwork
- G04B13/02—Wheels; Pinions; Spindles; Pivots
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B13/00—Gearwork
- G04B13/02—Wheels; Pinions; Spindles; Pivots
- G04B13/021—Wheels; Pinions; Spindles; Pivots elastic fitting with a spindle, axis or shaft
- G04B13/022—Wheels; Pinions; Spindles; Pivots elastic fitting with a spindle, axis or shaft with parts made of hard material, e.g. silicon, diamond, sapphire, quartz and the like
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B19/00—Indicating the time by visual means
- G04B19/04—Hands; Discs with a single mark or the like
- G04B19/042—Construction and manufacture of the hands; arrangements for increasing reading accuracy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/035—Microgears
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0197—Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/19—Gearing
- Y10T74/1987—Rotary bodies
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07120883A EP2060534A1 (fr) | 2007-11-16 | 2007-11-16 | Pièce de micromécanique composite silicium - métal et son procédé de fabrication |
EP07120883.9 | 2007-11-16 | ||
PCT/EP2008/065347 WO2009062943A1 (fr) | 2007-11-16 | 2008-11-12 | Pièce de micromécanique composite silicium-métal et son procédé de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011514846A JP2011514846A (ja) | 2011-05-12 |
JP5478498B2 true JP5478498B2 (ja) | 2014-04-23 |
Family
ID=39420509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010533559A Active JP5478498B2 (ja) | 2007-11-16 | 2008-11-12 | シリコン/金属複合体マイクロメカニカル構成要素およびこれを製造する方法 |
Country Status (10)
Country | Link |
---|---|
US (2) | US8486279B2 (fr) |
EP (2) | EP2060534A1 (fr) |
JP (1) | JP5478498B2 (fr) |
KR (1) | KR20100084527A (fr) |
CN (1) | CN101861281B (fr) |
AT (1) | ATE511494T1 (fr) |
HK (1) | HK1144190A1 (fr) |
RU (1) | RU2474532C2 (fr) |
TW (1) | TWI436939B (fr) |
WO (1) | WO2009062943A1 (fr) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2230207A1 (fr) * | 2009-03-13 | 2010-09-22 | Nivarox-FAR S.A. | Moule pour galvanoplastie et son procédé de fabrication |
EP2230206B1 (fr) | 2009-03-13 | 2013-07-17 | Nivarox-FAR S.A. | Moule pour galvanoplastie et son procédé de fabrication |
EP2263971A1 (fr) | 2009-06-09 | 2010-12-22 | Nivarox-FAR S.A. | Pièce de micromécanique composite et son procédé de fabrication |
EP2309342A1 (fr) * | 2009-10-07 | 2011-04-13 | Nivarox-FAR S.A. | Mobile monté fou en matériau micro-usinable et son procédé de fabrication |
CH702156B1 (fr) * | 2009-11-13 | 2017-08-31 | Nivarox Far Sa | Résonateur balancier-spiral pour une pièce d'horlogerie. |
DE102010004269B4 (de) | 2010-01-09 | 2018-06-28 | Micromotion Gmbh | Verzahnungspaarung und Getriebe, insbesondere Exzentergetriebe, Umlaufrädergetriebe oder Spannungswellengetriebe |
EP2405300A1 (fr) * | 2010-07-09 | 2012-01-11 | Mimotec S.A. | Méthode de fabrication de pièces métalliques multi niveaux par un procédé du type LIGA et pièces obtenues par la méthode |
EP2484628A1 (fr) * | 2011-02-03 | 2012-08-08 | Nivarox-FAR S.A. | Pièce de micromécanique à faible ruguosité de surface |
EP2484629B1 (fr) * | 2011-02-03 | 2013-06-26 | Nivarox-FAR S.A. | Pièce de micromécanique complexe ajourée |
CN102167282A (zh) * | 2011-04-07 | 2011-08-31 | 天津海鸥表业集团有限公司 | 一种硅与金属复合材料的微结构加工方法 |
CH705228A1 (fr) * | 2011-07-06 | 2013-01-15 | Suisse Electronique Microtech | Pièce mécanique en composite silicium-métal et son procéde de fabrication. |
EP2579104B1 (fr) * | 2011-10-07 | 2014-06-25 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Procédé de réalisation d'une pièce d'horlogerie composite |
CH705724B9 (fr) | 2011-11-03 | 2016-05-13 | Sigatec Sa | Pièce de micromécanique, notamment pour l'horlogerie. |
JP6345493B2 (ja) * | 2014-02-25 | 2018-06-20 | シチズン時計株式会社 | ひげぜんまい |
EP2937311B1 (fr) * | 2014-04-25 | 2019-08-21 | Rolex Sa | Procédé de fabrication d'un composant horloger renforcé, composant horloger et pièce d'horlogerie correspondants |
CH709729A2 (fr) * | 2014-06-03 | 2015-12-15 | Swatch Group Res & Dev Ltd | Pièce d'habillage à base de verre photostructurable. |
EP2952979B1 (fr) * | 2014-06-03 | 2017-03-01 | Nivarox-FAR S.A. | Composant horloger à base de verre photostructurable |
CN105402363B (zh) * | 2014-09-09 | 2019-07-23 | 精工电子有限公司 | 机械部件、机芯、钟表以及机械部件的制造方法 |
JP6560250B2 (ja) | 2014-12-12 | 2019-08-14 | シチズン時計株式会社 | 時計部品および時計部品の製造方法 |
EP3035125B1 (fr) | 2014-12-19 | 2018-01-10 | Rolex Sa | Procédé de fabrication d'un composant horloger multi-niveaux |
EP3034461B1 (fr) | 2014-12-19 | 2020-07-01 | Rolex Sa | Fabrication d'un composant horloger multi-niveaux |
EP3181515A1 (fr) | 2015-12-15 | 2017-06-21 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Piece d'horlogerie composite et son procede de fabrication |
EP3202708B1 (fr) | 2016-02-03 | 2023-05-03 | Rolex Sa | Procédé de fabrication d'un composant horloger hybride |
CH712210B1 (fr) * | 2016-03-14 | 2020-02-14 | Nivarox Sa | Procédé de fabrication d'un composant d'affichage d'horlogerie. |
EP3249474B1 (fr) | 2016-05-26 | 2019-03-13 | ETA SA Manufacture Horlogère Suisse | Aiguille d'affichage analogique |
EP3266738B1 (fr) * | 2016-07-06 | 2019-03-06 | The Swatch Group Research and Development Ltd. | Procédé de fabrication d'une pièce d'horlogerie dotée d'un élément d'habillage multi-niveaux |
EP3764167A1 (fr) * | 2019-07-10 | 2021-01-13 | Patek Philippe SA Genève | Procede d'obtention d'un composant horloger dont la surface est au moins partiellement revêtue d'une couche coloree |
EP3839625A1 (fr) * | 2019-12-18 | 2021-06-23 | Nivarox-FAR S.A. | Procede de fabrication d'un composant horloger et composant obtenu selon ce procede |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2137249C1 (ru) * | 1998-03-31 | 1999-09-10 | Санкт-Петербургский государственный электротехнический университет | Способ изготовления микромеханических приборов |
DE19817311B4 (de) * | 1998-04-18 | 2007-03-22 | Robert Bosch Gmbh | Herstellungsverfahren für mikromechanisches Bauelement |
US6887391B1 (en) * | 2000-03-24 | 2005-05-03 | Analog Devices, Inc. | Fabrication and controlled release of structures using etch-stop trenches |
DE10055421A1 (de) * | 2000-11-09 | 2002-05-29 | Bosch Gmbh Robert | Verfahren zur Erzeugung einer mikromechanischen Struktur und mikromechanische Struktur |
US6506620B1 (en) * | 2000-11-27 | 2003-01-14 | Microscan Systems Incorporated | Process for manufacturing micromechanical and microoptomechanical structures with backside metalization |
FR2852111B1 (fr) * | 2003-03-05 | 2005-06-24 | Univ Franche Comte | Dispositif d'horloge utilisant la technologie mems |
JP2006064575A (ja) * | 2004-08-27 | 2006-03-09 | Seiko Epson Corp | 時計用部品、時計用組立部品、および時計 |
US7204737B2 (en) * | 2004-09-23 | 2007-04-17 | Temic Automotive Of North America, Inc. | Hermetically sealed microdevice with getter shield |
EP1722281A1 (fr) * | 2005-05-12 | 2006-11-15 | ETA SA Manufacture Horlogère Suisse | Organe d'affichage analogique en matériau cristallin, pièce d'horlogerie pourvue d'un tel organe d'affichage, et procédé pour sa fabrication |
EP1780612A1 (fr) * | 2005-10-25 | 2007-05-02 | ETA SA Manufacture Horlogère Suisse | Dispositif d'affichage analogique comportant un entraînement par engrenages planétaires |
TWI276805B (en) * | 2005-11-10 | 2007-03-21 | Mjc Probe Inc | Probe of probe card and manufacturing method thereof |
DE602006007807D1 (de) * | 2006-04-07 | 2009-08-27 | Eta Sa Mft Horlogere Suisse | Mechanischer Wechsler zum Drehantreiben eines Rades aus einer einzelnen Richtung |
JP5231769B2 (ja) * | 2007-02-27 | 2013-07-10 | セイコーインスツル株式会社 | 電鋳型、電鋳型の製造方法、時計用部品、および時計 |
CH714952B1 (fr) * | 2007-05-08 | 2019-10-31 | Patek Philippe Sa Geneve | Composant horloger, son procédé de fabrication et application de ce procédé. |
-
2007
- 2007-11-16 EP EP07120883A patent/EP2060534A1/fr not_active Withdrawn
-
2008
- 2008-11-12 WO PCT/EP2008/065347 patent/WO2009062943A1/fr active Application Filing
- 2008-11-12 JP JP2010533559A patent/JP5478498B2/ja active Active
- 2008-11-12 KR KR1020107009432A patent/KR20100084527A/ko not_active Application Discontinuation
- 2008-11-12 AT AT08848955T patent/ATE511494T1/de not_active IP Right Cessation
- 2008-11-12 RU RU2010124426/28A patent/RU2474532C2/ru active
- 2008-11-12 EP EP08848955.4A patent/EP2259997B2/fr active Active
- 2008-11-12 CN CN2008801161499A patent/CN101861281B/zh active Active
- 2008-11-12 US US12/743,210 patent/US8486279B2/en active Active
- 2008-11-14 TW TW097144155A patent/TWI436939B/zh not_active IP Right Cessation
-
2010
- 2010-11-19 HK HK10110805.2A patent/HK1144190A1/xx unknown
-
2013
- 2013-06-14 US US13/917,975 patent/US20130279307A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20130279307A1 (en) | 2013-10-24 |
TW200927640A (en) | 2009-07-01 |
US20100243603A1 (en) | 2010-09-30 |
TWI436939B (zh) | 2014-05-11 |
ATE511494T1 (de) | 2011-06-15 |
CN101861281A (zh) | 2010-10-13 |
RU2010124426A (ru) | 2011-12-27 |
EP2060534A1 (fr) | 2009-05-20 |
EP2259997B1 (fr) | 2011-06-01 |
CN101861281B (zh) | 2012-11-21 |
KR20100084527A (ko) | 2010-07-26 |
EP2259997A1 (fr) | 2010-12-15 |
EP2259997B2 (fr) | 2015-09-30 |
US8486279B2 (en) | 2013-07-16 |
HK1144190A1 (en) | 2011-02-02 |
RU2474532C2 (ru) | 2013-02-10 |
WO2009062943A1 (fr) | 2009-05-22 |
JP2011514846A (ja) | 2011-05-12 |
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