JP5472632B2 - 半導体パッケージ用ステムおよび半導体パッケージ用ステムの製造方法 - Google Patents

半導体パッケージ用ステムおよび半導体パッケージ用ステムの製造方法 Download PDF

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JP5472632B2
JP5472632B2 JP2010203928A JP2010203928A JP5472632B2 JP 5472632 B2 JP5472632 B2 JP 5472632B2 JP 2010203928 A JP2010203928 A JP 2010203928A JP 2010203928 A JP2010203928 A JP 2010203928A JP 5472632 B2 JP5472632 B2 JP 5472632B2
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stem
eyelet
heat sink
semiconductor package
hole
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JP2012060044A (ja
JP2012060044A5 (enExample
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勝哉 中澤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2010203928A 2010-09-13 2010-09-13 半導体パッケージ用ステムおよび半導体パッケージ用ステムの製造方法 Active JP5472632B2 (ja)

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JP2010203928A JP5472632B2 (ja) 2010-09-13 2010-09-13 半導体パッケージ用ステムおよび半導体パッケージ用ステムの製造方法

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JP2010203928A JP5472632B2 (ja) 2010-09-13 2010-09-13 半導体パッケージ用ステムおよび半導体パッケージ用ステムの製造方法

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JP2012060044A JP2012060044A (ja) 2012-03-22
JP2012060044A5 JP2012060044A5 (enExample) 2013-07-18
JP5472632B2 true JP5472632B2 (ja) 2014-04-16

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118595768A (zh) * 2024-06-25 2024-09-06 烟台市蓬莱区意科聚达电子科技有限公司 一种五金件加工方法及安装座体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3239056B2 (ja) * 1995-11-29 2001-12-17 シャープ株式会社 半導体レーザ装置
JPH11214796A (ja) * 1998-01-22 1999-08-06 Suzuwa:Kk レーザ素子のヒートシンク及びその製造方法
JP2000058962A (ja) * 1998-08-12 2000-02-25 Sony Corp 半導体レーザ装置
JP2005101073A (ja) * 2003-09-22 2005-04-14 Neomax Material:Kk 半導体素子パッケージのステムおよび同ステム用クラッド材
US7508854B2 (en) * 2003-11-14 2009-03-24 Sanyo Electric Co., Ltd. Semiconductor laser device
KR100856280B1 (ko) * 2004-05-25 2008-09-03 삼성전기주식회사 반도체 레이저 다이오드 패키지

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