JP5459944B2 - 表面形状測定装置および応力測定装置、並びに、表面形状測定方法および応力測定方法 - Google Patents

表面形状測定装置および応力測定装置、並びに、表面形状測定方法および応力測定方法 Download PDF

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Publication number
JP5459944B2
JP5459944B2 JP2007237381A JP2007237381A JP5459944B2 JP 5459944 B2 JP5459944 B2 JP 5459944B2 JP 2007237381 A JP2007237381 A JP 2007237381A JP 2007237381 A JP2007237381 A JP 2007237381A JP 5459944 B2 JP5459944 B2 JP 5459944B2
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Japan
Prior art keywords
light
stress
unit
substrate
surface shape
Prior art date
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Expired - Fee Related
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JP2007237381A
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English (en)
Japanese (ja)
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JP2008145417A (ja
Inventor
久美子 赤鹿
正浩 堀江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2007237381A priority Critical patent/JP5459944B2/ja
Priority to KR1020070108786A priority patent/KR100967470B1/ko
Priority to US11/979,116 priority patent/US7612873B2/en
Priority to TW096141970A priority patent/TWI360647B/zh
Publication of JP2008145417A publication Critical patent/JP2008145417A/ja
Application granted granted Critical
Publication of JP5459944B2 publication Critical patent/JP5459944B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2007237381A 2006-11-13 2007-09-13 表面形状測定装置および応力測定装置、並びに、表面形状測定方法および応力測定方法 Expired - Fee Related JP5459944B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007237381A JP5459944B2 (ja) 2006-11-13 2007-09-13 表面形状測定装置および応力測定装置、並びに、表面形状測定方法および応力測定方法
KR1020070108786A KR100967470B1 (ko) 2006-11-13 2007-10-29 표면 형상 측정 장치 및 응력 측정 장치, 및 표면 형상측정 방법 및 응력 측정 방법
US11/979,116 US7612873B2 (en) 2006-11-13 2007-10-31 Surface form measuring apparatus and stress measuring apparatus and surface form measuring method and stress measuring method
TW096141970A TWI360647B (en) 2006-11-13 2007-11-07 Surface form measuring apparatus and stress measur

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006306471 2006-11-13
JP2006306471 2006-11-13
JP2007237381A JP5459944B2 (ja) 2006-11-13 2007-09-13 表面形状測定装置および応力測定装置、並びに、表面形状測定方法および応力測定方法

Publications (2)

Publication Number Publication Date
JP2008145417A JP2008145417A (ja) 2008-06-26
JP5459944B2 true JP5459944B2 (ja) 2014-04-02

Family

ID=39448847

Family Applications (1)

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JP2007237381A Expired - Fee Related JP5459944B2 (ja) 2006-11-13 2007-09-13 表面形状測定装置および応力測定装置、並びに、表面形状測定方法および応力測定方法

Country Status (4)

Country Link
JP (1) JP5459944B2 (zh)
KR (1) KR100967470B1 (zh)
CN (1) CN100550335C (zh)
TW (1) TWI360647B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7964858B2 (en) * 2008-10-21 2011-06-21 Applied Materials, Inc. Ultraviolet reflector with coolant gas holes and method
WO2015030176A1 (ja) * 2013-08-30 2015-03-05 富士フイルム株式会社 応力表示部材および応力表示部材を用いたひずみ測定方法
KR101510143B1 (ko) * 2013-11-06 2015-04-08 주식회사 고영테크놀러지 기판 검사 시의 측정영역 보상 방법
JP6363382B2 (ja) * 2014-04-14 2018-07-25 大塚電子株式会社 膜厚測定装置及び方法
CN104062049B (zh) * 2014-06-13 2016-02-03 京东方科技集团股份有限公司 一种基板检测方法和装置
TWI502177B (zh) * 2014-12-12 2015-10-01 Univ Nan Kai Technology 利用光波加減量測橢圓角之外差干涉架構
CN108827514A (zh) * 2018-07-19 2018-11-16 天津大学 一种激光无损表征二氧化硅薄膜残余应力的方法
CN113295106B (zh) * 2021-05-26 2022-07-15 清华大学 一种双光梳散斑干涉测量系统及测量方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59203906A (ja) * 1983-05-04 1984-11-19 Mitsubishi Electric Corp 平面の傾斜検出装置
JPS63223508A (ja) * 1987-03-13 1988-09-19 Canon Inc 傾斜角測定方法
JP2000009553A (ja) * 1998-06-26 2000-01-14 Toshiba Corp 薄膜評価装置、薄膜評価方法、半導体シミュレーション装置、半導体シミュレーション方法、薄膜評価プログラムを格納したコンピュータ読み取り可能な記録媒体、及びシミュレーションプログラムを格納したコンピュータ読み取り可能な記録媒体
JP4027605B2 (ja) * 2001-01-26 2007-12-26 株式会社リコー 光学面の形状測定方法および装置および記録媒体
JP2003148925A (ja) * 2001-11-12 2003-05-21 Lasertec Corp 深さ測定装置及び膜厚測定装置
US6678055B2 (en) * 2001-11-26 2004-01-13 Tevet Process Control Technologies Ltd. Method and apparatus for measuring stress in semiconductor wafers
JP3995579B2 (ja) * 2002-10-18 2007-10-24 大日本スクリーン製造株式会社 膜厚測定装置および反射率測定装置
JP4547669B2 (ja) * 2004-12-14 2010-09-22 株式会社ニコン 高さ測定装置
JP2007127566A (ja) * 2005-11-07 2007-05-24 Dainippon Screen Mfg Co Ltd 基板測定装置

Also Published As

Publication number Publication date
CN100550335C (zh) 2009-10-14
CN101183656A (zh) 2008-05-21
KR20080043223A (ko) 2008-05-16
TW200834048A (en) 2008-08-16
JP2008145417A (ja) 2008-06-26
TWI360647B (en) 2012-03-21
KR100967470B1 (ko) 2010-07-07

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