JP5448396B2 - 金属用研磨液 - Google Patents

金属用研磨液 Download PDF

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Publication number
JP5448396B2
JP5448396B2 JP2008228271A JP2008228271A JP5448396B2 JP 5448396 B2 JP5448396 B2 JP 5448396B2 JP 2008228271 A JP2008228271 A JP 2008228271A JP 2008228271 A JP2008228271 A JP 2008228271A JP 5448396 B2 JP5448396 B2 JP 5448396B2
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Japan
Prior art keywords
group
polishing
general formula
hydrogen atom
acid
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JP2008228271A
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English (en)
Japanese (ja)
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JP2010062434A (ja
Inventor
将 吉川
上村  哲也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2008228271A priority Critical patent/JP5448396B2/ja
Priority to TW98119029A priority patent/TWI470068B/zh
Publication of JP2010062434A publication Critical patent/JP2010062434A/ja
Application granted granted Critical
Publication of JP5448396B2 publication Critical patent/JP5448396B2/ja
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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2008228271A 2008-09-05 2008-09-05 金属用研磨液 Active JP5448396B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008228271A JP5448396B2 (ja) 2008-09-05 2008-09-05 金属用研磨液
TW98119029A TWI470068B (zh) 2008-09-05 2009-06-08 金屬用研磨液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008228271A JP5448396B2 (ja) 2008-09-05 2008-09-05 金属用研磨液

Publications (2)

Publication Number Publication Date
JP2010062434A JP2010062434A (ja) 2010-03-18
JP5448396B2 true JP5448396B2 (ja) 2014-03-19

Family

ID=42188895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008228271A Active JP5448396B2 (ja) 2008-09-05 2008-09-05 金属用研磨液

Country Status (2)

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JP (1) JP5448396B2 (zh)
TW (1) TWI470068B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3019569B1 (en) * 2013-07-11 2018-05-30 Basf Se Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors
US10217645B2 (en) * 2014-07-25 2019-02-26 Versum Materials Us, Llc Chemical mechanical polishing (CMP) of cobalt-containing substrate
US10465096B2 (en) * 2017-08-24 2019-11-05 Versum Materials Us, Llc Metal chemical mechanical planarization (CMP) composition and methods therefore

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116987A (ja) * 2003-10-10 2005-04-28 Fujimi Inc 研磨用組成物
JP4759219B2 (ja) * 2003-11-25 2011-08-31 株式会社フジミインコーポレーテッド 研磨用組成物
JP2005123482A (ja) * 2003-10-17 2005-05-12 Fujimi Inc 研磨方法
JP2008124223A (ja) * 2006-11-10 2008-05-29 Fujifilm Corp 研磨液

Also Published As

Publication number Publication date
JP2010062434A (ja) 2010-03-18
TWI470068B (zh) 2015-01-21
TW201011098A (en) 2010-03-16

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