JP5436596B2 - パッケージキャリアおよびその製造方法 - Google Patents
パッケージキャリアおよびその製造方法 Download PDFInfo
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- JP5436596B2 JP5436596B2 JP2012042238A JP2012042238A JP5436596B2 JP 5436596 B2 JP5436596 B2 JP 5436596B2 JP 2012042238 A JP2012042238 A JP 2012042238A JP 2012042238 A JP2012042238 A JP 2012042238A JP 5436596 B2 JP5436596 B2 JP 5436596B2
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- Prior art keywords
- insulating cover
- heat
- package carrier
- patterned metal
- layer
- Prior art date
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- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000010410 layer Substances 0.000 claims description 74
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 25
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 16
- 239000002335 surface treatment layer Substances 0.000 claims description 14
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 230000004308 accommodation Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- WZZBNLYBHUDSHF-DHLKQENFSA-N 1-[(3s,4s)-4-[8-(2-chloro-4-pyrimidin-2-yloxyphenyl)-7-fluoro-2-methylimidazo[4,5-c]quinolin-1-yl]-3-fluoropiperidin-1-yl]-2-hydroxyethanone Chemical compound CC1=NC2=CN=C3C=C(F)C(C=4C(=CC(OC=5N=CC=CN=5)=CC=4)Cl)=CC3=C2N1[C@H]1CCN(C(=O)CO)C[C@@H]1F WZZBNLYBHUDSHF-DHLKQENFSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
の文字のような形状をしており、絶縁カバー110は、さらに、複数のロック部119を有する。注意すべきこととして、本発明の別の実施形態において、絶縁カバー110は、ロック部119を備えていなくてもよい。また、絶縁カバー110は、例えば、射出成形(injection molding)によって形成される。
20 ボンディングワイヤ
30 成形コンパウンド
100、100b パッケージキャリア
110 絶縁カバー
112 内表面
114 外表面
116 収容空間
118 開口
119 ロック部
120 パターン化金属層
130 表面処理層
140a、140b 放熱素子
142 突出部
144 フィン
150 導熱層
Claims (10)
- 互いに向かい合う内表面および外表面と、複数の開口と、収容空間とを有する絶縁カバーを提供することと、
前記絶縁カバーの前記外表面にパターン化金属層を形成することと、
前記パターン化金属層の上に表面処理層を形成することと、
前記絶縁カバーの前記収容空間内に放熱素子を形成し、前記絶縁カバーに構造的に接続することと、
を含み、
前記放熱素子の表面に導熱層を形成して、前記絶縁カバーの前記開口が前記導熱層の一部を露出するパッケージキャリアの製造方法。 - 前記絶縁カバーが、複数の触媒粒子を含み、前記パターン化金属層を形成する方法が、前記触媒粒子の一部を活性化して、前記パターン化金属層を形成することを含む請求項1記載のパッケージキャリアの製造方法。
- 前記パターン化金属層を形成する方法が、化学めっき法、又はスパッタリングのいずれかである請求項1記載のパッケージキャリアの製造方法。
- 前記絶縁カバーを形成する方法が、射出成形を含む請求項1記載のパッケージキャリアの製造方法。
- 前記放熱素子が、ヒートシンクまたはヒートパイプを含む請求項1記載のパッケージキャリアの製造方法。
- 前記導熱層の材料が、銅、金または銀を含む請求項1記載のパッケージキャリアの製造方法。
- 少なくとも1つの発熱素子を保持するパッケージキャリアであって、
互いに向かい合う内表面および外表面と、複数の開口と、収容空間とを有する絶縁カバーと、
前記絶縁カバーの前記外表面に配置されたパターン化金属層と、
前記パターン化金属層の上に配置された表面処理層と、
前記絶縁カバーの前記収容空間内に配置され、前記絶縁カバーに構造的に接続された放熱素子と、
前記放熱素子の表面に配置された導熱層と、
を含み、
前記導熱層の一部が、前記放熱素子と前記絶縁カバーの間に設置され、
前記絶縁カバーの前記開口が、前記導熱層の一部を露出し、
前記少なくとも1つの発熱素子が、前記開口のうち対応する開口によって露出した前記部分の前記導熱層に配置されたパッケージキャリア。 - 前記放熱素子が、ヒートシンクまたはヒートパイプを含む請求項7記載のパッケージキャリア。
- 前記導熱層の材料が、銅、金または銀を含む請求項7記載のパッケージキャリア。
- 前記絶縁カバーが、複数の触媒粒子を含む請求項7記載のパッケージキャリア。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100115471A TWI446591B (zh) | 2011-05-03 | 2011-05-03 | 封裝載板及其製作方法 |
TW100115471 | 2011-05-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012235090A JP2012235090A (ja) | 2012-11-29 |
JP5436596B2 true JP5436596B2 (ja) | 2014-03-05 |
Family
ID=47089542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012042238A Expired - Fee Related JP5436596B2 (ja) | 2011-05-03 | 2012-02-28 | パッケージキャリアおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9153521B2 (ja) |
JP (1) | JP5436596B2 (ja) |
CN (1) | CN102769075B (ja) |
TW (1) | TWI446591B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11574891B2 (en) | 2021-01-26 | 2023-02-07 | Nanya Technology Corporation | Semiconductor device with heat dissipation unit and method for fabricating the same |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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TW457836B (en) | 1999-06-09 | 2001-10-01 | Phoenix Prec Technology Corp | High heat dissipation type integrated circuit substrate structure and fabrication process |
US6599768B1 (en) * | 2002-08-20 | 2003-07-29 | United Epitaxy Co., Ltd. | Surface mounting method for high power light emitting diode |
TWI222195B (en) | 2003-04-21 | 2004-10-11 | Phoenix Prec Technology Corp | Method for fabricating heat sink of semiconductor packaging substrate |
JP4810097B2 (ja) * | 2005-01-14 | 2011-11-09 | 株式会社リコー | 立体回路基板、電気回路構造体、及び立体回路基板の製造方法 |
KR101305884B1 (ko) | 2006-01-06 | 2013-09-06 | 엘지이노텍 주식회사 | 발광 다이오드 패키지, 이의 제조 방법 및 이를 구비하는백라이트 유닛 |
TW200743228A (en) | 2006-05-05 | 2007-11-16 | bing-shan Wang | Manufacturing method of light-emitting diode base and product thereof |
US7804147B2 (en) | 2006-07-31 | 2010-09-28 | Cree, Inc. | Light emitting diode package element with internal meniscus for bubble free lens placement |
US7687722B2 (en) * | 2006-10-03 | 2010-03-30 | Endicott Interconnect Technologies, Inc. | Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same |
JP2008135532A (ja) * | 2006-11-28 | 2008-06-12 | Kyocera Corp | 放熱部材およびこれを用いた電子部品収納用パッケージおよび電子装置 |
TWI367573B (en) | 2007-01-31 | 2012-07-01 | Young Lighting Technology Inc | Light emitting diode package and manufacturing method thereof |
US7948076B2 (en) * | 2008-03-25 | 2011-05-24 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base heat spreader and vertical signal routing |
CN101605431B (zh) * | 2008-06-12 | 2012-12-05 | 欣兴电子股份有限公司 | 模塑内连装置的制造方法 |
CN101640972B (zh) * | 2008-07-28 | 2011-09-07 | 欣兴电子股份有限公司 | 一种电路板结构 |
JP5388598B2 (ja) * | 2008-11-14 | 2014-01-15 | カルソニックカンセイ株式会社 | 素子の放熱構造 |
EP2421038A1 (en) | 2009-04-10 | 2012-02-22 | Foshan Nationstar Optoelectronics Co., Ltd | Radiation substrate for power led and power led production and manufacturing method thereof |
CN102025020B (zh) * | 2009-09-18 | 2014-03-26 | 上海莫仕连接器有限公司 | 移动通讯装置的模块化天线装置 |
CN201508853U (zh) * | 2009-09-21 | 2010-06-16 | 光宏精密股份有限公司 | 半导体承载结构 |
US20130127037A1 (en) * | 2010-03-31 | 2013-05-23 | Nec Corporation | Semiconductor device built-in substrate |
TWI485823B (zh) * | 2010-07-08 | 2015-05-21 | Subtron Technology Co Ltd | 半導體封裝結構及半導體封裝結構的製作方法 |
CN201805617U (zh) * | 2010-09-03 | 2011-04-20 | 光宏精密股份有限公司 | 立体电路元件 |
-
2011
- 2011-05-03 TW TW100115471A patent/TWI446591B/zh not_active IP Right Cessation
- 2011-06-14 CN CN201110158440.6A patent/CN102769075B/zh not_active Expired - Fee Related
- 2011-06-16 US US13/162,549 patent/US9153521B2/en not_active Expired - Fee Related
-
2012
- 2012-02-28 JP JP2012042238A patent/JP5436596B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2012235090A (ja) | 2012-11-29 |
US20120279962A1 (en) | 2012-11-08 |
TWI446591B (zh) | 2014-07-21 |
TW201246612A (en) | 2012-11-16 |
US9153521B2 (en) | 2015-10-06 |
CN102769075B (zh) | 2016-06-08 |
CN102769075A (zh) | 2012-11-07 |
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