TW200743228A - Manufacturing method of light-emitting diode base and product thereof - Google Patents

Manufacturing method of light-emitting diode base and product thereof

Info

Publication number
TW200743228A
TW200743228A TW095116060A TW95116060A TW200743228A TW 200743228 A TW200743228 A TW 200743228A TW 095116060 A TW095116060 A TW 095116060A TW 95116060 A TW95116060 A TW 95116060A TW 200743228 A TW200743228 A TW 200743228A
Authority
TW
Taiwan
Prior art keywords
substrate
heat
led
dissipating
manufacturing
Prior art date
Application number
TW095116060A
Other languages
Chinese (zh)
Inventor
bing-shan Wang
Shu-Wen Ceng
Original Assignee
bing-shan Wang
Shu-Wen Ceng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by bing-shan Wang, Shu-Wen Ceng filed Critical bing-shan Wang
Priority to TW095116060A priority Critical patent/TW200743228A/en
Publication of TW200743228A publication Critical patent/TW200743228A/en

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A manufacturing method of light-emitting diode (LED) base comprises: first preparing a heat-dissipating substrate having more than one heat-dissipating plate and a lead substrate having more than one lead block, where each heat-dissipating plate is connected and fixed onto the heat-dissipating substrate by more than one pin and each lead block has a plurality of leads; combining the heat-dissipating substrate and the lead substrate together; forming a plastic base on the leads of each lead block by way of injection molding, so as to produce a LED substrate having more than one semi-finished LED base; and finally performing scribing molding on the LED substrate to produce LED bases.
TW095116060A 2006-05-05 2006-05-05 Manufacturing method of light-emitting diode base and product thereof TW200743228A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095116060A TW200743228A (en) 2006-05-05 2006-05-05 Manufacturing method of light-emitting diode base and product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095116060A TW200743228A (en) 2006-05-05 2006-05-05 Manufacturing method of light-emitting diode base and product thereof

Publications (1)

Publication Number Publication Date
TW200743228A true TW200743228A (en) 2007-11-16

Family

ID=57914267

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116060A TW200743228A (en) 2006-05-05 2006-05-05 Manufacturing method of light-emitting diode base and product thereof

Country Status (1)

Country Link
TW (1) TW200743228A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153521B2 (en) 2011-05-03 2015-10-06 Subtron Technology Co., Ltd. Method of manufacturing a package carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9153521B2 (en) 2011-05-03 2015-10-06 Subtron Technology Co., Ltd. Method of manufacturing a package carrier

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