JP5433051B2 - スクリーン印刷用メッシュ部材およびスクリーン印刷版 - Google Patents
スクリーン印刷用メッシュ部材およびスクリーン印刷版 Download PDFInfo
- Publication number
- JP5433051B2 JP5433051B2 JP2012138165A JP2012138165A JP5433051B2 JP 5433051 B2 JP5433051 B2 JP 5433051B2 JP 2012138165 A JP2012138165 A JP 2012138165A JP 2012138165 A JP2012138165 A JP 2012138165A JP 5433051 B2 JP5433051 B2 JP 5433051B2
- Authority
- JP
- Japan
- Prior art keywords
- screen printing
- bus bar
- electrode corresponding
- mesh member
- area ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007650 screen-printing Methods 0.000 title claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 description 44
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 18
- 239000004332 silver Substances 0.000 description 18
- 239000000839 emulsion Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000593 degrading effect Effects 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photovoltaic Devices (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
2 孔(開口部)
3 印刷パターン部
5 スクリーン印刷版
6 スキージ
8 印刷対象物
Claims (5)
- 太陽電池の表面電極となるフィンガー電極およびバスバー電極をスクリーン印刷で形成するときに用いられるスクリーン印刷用メッシュ部材であって、このメッシュ部材は圧延金属箔にエッチングで孔開け加工されたものであり、フィンガー電極対応部では、横長型に形成された個々の孔が当該横長方向と直交する方向に列設され、当該横長方向長さが、印刷パターン予定部の幅より大きく、その端部が印刷パターン予定部の外側まで延びて形成されており、一方バスバー電極対応部では、同一形状の孔が縦方向および横方向に複数並んで配設されており、且つフィンガー電極対応部における開口面積率がバスバー電極対応部における開口面積率よりも大きく形成されたものであることを特徴とするスクリーン印刷用メッシュ部材。
- フィンガー電極対応部の開口面積率が65〜85%であり、バスバー電極対応部の開口面積率が25〜70%である請求項1に記載のスクリーン印刷用メッシュ部材。
- フィンガー電極対応部の開口面積率に対するバスバー電極対応部の開口面積率の比が、0.30〜0.80である請求項1または2に記載のスクリーン印刷用メッシュ部材。
- 請求項1〜3のいずれかに記載のスクリーン印刷用メッシュ部材を備えて構成されるスクリーン印刷版。
- フィンガー電極対応部の印刷パターンの幅が35〜75μmである請求項4に記載のスクリーン印刷版。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012138165A JP5433051B2 (ja) | 2012-06-19 | 2012-06-19 | スクリーン印刷用メッシュ部材およびスクリーン印刷版 |
PCT/JP2013/066785 WO2013191194A1 (ja) | 2012-06-19 | 2013-06-19 | スクリーン印刷用メッシュ部材およびスクリーン印刷版 |
TW102121734A TWI549833B (zh) | 2012-06-19 | 2013-06-19 | Screen printing with mesh components and screen printing version |
KR1020147035297A KR101717337B1 (ko) | 2012-06-19 | 2013-06-19 | 스크린 인쇄용 메쉬 부재 및 스크린 인쇄판 |
CN201380032179.2A CN104411504B (zh) | 2012-06-19 | 2013-06-19 | 丝网印刷用网眼部件以及丝网印刷版 |
KR1020177006459A KR101756069B1 (ko) | 2012-06-19 | 2013-06-19 | 스크린 인쇄용 메쉬 부재 및 스크린 인쇄판 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012138165A JP5433051B2 (ja) | 2012-06-19 | 2012-06-19 | スクリーン印刷用メッシュ部材およびスクリーン印刷版 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014000740A JP2014000740A (ja) | 2014-01-09 |
JP5433051B2 true JP5433051B2 (ja) | 2014-03-05 |
Family
ID=49768788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012138165A Expired - Fee Related JP5433051B2 (ja) | 2012-06-19 | 2012-06-19 | スクリーン印刷用メッシュ部材およびスクリーン印刷版 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5433051B2 (ja) |
KR (2) | KR101717337B1 (ja) |
CN (1) | CN104411504B (ja) |
TW (1) | TWI549833B (ja) |
WO (1) | WO2013191194A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106335299A (zh) * | 2015-07-14 | 2017-01-18 | 正中科技股份有限公司 | 太阳能电池正银电极可设计型印刷钢版结构 |
JP2017222079A (ja) * | 2016-06-15 | 2017-12-21 | 株式会社コベルコ科研 | スクリーン印刷用の金属箔およびそれを備えるスクリーン印刷版 |
KR20180046809A (ko) * | 2016-10-28 | 2018-05-09 | 삼성에스디아이 주식회사 | 태양전지용 핑거 전극의 제조방법 |
KR20180046810A (ko) * | 2016-10-28 | 2018-05-09 | 삼성에스디아이 주식회사 | 태양전지용 핑거 전극 및 이의 제조방법 |
KR20180063750A (ko) * | 2016-12-02 | 2018-06-12 | 삼성에스디아이 주식회사 | 태양전지용 핑거 전극의 제조방법 |
TWI609236B (zh) * | 2017-01-20 | 2017-12-21 | 維銘有限公司 | 網版及其製作方法 |
KR20180090669A (ko) | 2017-02-03 | 2018-08-13 | 삼성에스디아이 주식회사 | 태양전지용 핑거 전극의 제조방법 및 이에 의해 제조된 태양전지용 핑거 전극 |
JP2018154028A (ja) * | 2017-03-17 | 2018-10-04 | 株式会社コベルコ科研 | ラインパターン印刷方法及びラインパターン印刷用スクリーン版 |
KR101893306B1 (ko) * | 2017-09-13 | 2018-08-29 | 김상진 | 솔라셀의 표면전극 형성을 위한 금속박판 스크린제판 및 그 제조방법 |
KR20190118036A (ko) * | 2018-04-09 | 2019-10-17 | 삼성에스디아이 주식회사 | 태양전지용 핑거 전극의 제조방법 및 이에 의해 제조된 태양전지용 핑거 전극 |
WO2020016624A1 (en) * | 2018-07-16 | 2020-01-23 | Saati S.P.A. | Asymmetric metal screen for fine line screen printing and screen for printing fine lines comprising said metal screen |
CN109016807B (zh) * | 2018-07-24 | 2023-12-01 | 浙江爱旭太阳能科技有限公司 | 用于正电极镂空成型的晶硅太阳能电池网版 |
CN115431628B (zh) * | 2021-06-03 | 2024-04-30 | 仓和精密制造(苏州)有限公司 | 无网结网版制作方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8703107D0 (en) * | 1987-02-11 | 1987-03-18 | Era Patents Ltd | Screen for printing electrical circuits |
JP2006341547A (ja) * | 2005-06-10 | 2006-12-21 | Sharp Corp | 印刷用マスク、スクリーン印刷方法および光電変換素子の製造方法ならびに光電変換素子 |
JP4859414B2 (ja) | 2005-08-30 | 2012-01-25 | 京セラ株式会社 | スクリーン印刷方法及び太陽電池素子 |
JP2008135654A (ja) * | 2006-11-29 | 2008-06-12 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2009272405A (ja) * | 2008-05-02 | 2009-11-19 | Mitsubishi Electric Corp | 太陽電池素子およびその製造方法 |
JP5172480B2 (ja) * | 2008-06-04 | 2013-03-27 | シャープ株式会社 | 光電変換装置およびその製造方法 |
JP2011156673A (ja) * | 2010-01-29 | 2011-08-18 | Riso Kagaku Corp | 印刷装置 |
JP5547672B2 (ja) | 2010-02-26 | 2014-07-16 | 株式会社コベルコ科研 | スクリーン印刷用メッシュ部材 |
JP5288633B2 (ja) * | 2010-03-24 | 2013-09-11 | パナソニック株式会社 | 太陽電池の電極形成システムおよび太陽電池の電極形成方法 |
CN201859886U (zh) * | 2010-05-13 | 2011-06-08 | 无锡尚德太阳能电力有限公司 | 太阳电池、网版及其太阳电池组件 |
JP5325839B2 (ja) * | 2010-06-16 | 2013-10-23 | 株式会社コベルコ科研 | スクリーン印刷用メッシュ部材 |
JP5584530B2 (ja) * | 2010-06-29 | 2014-09-03 | 株式会社コベルコ科研 | スクリーン印刷用メッシュ部材 |
JP5833298B2 (ja) * | 2010-09-03 | 2015-12-16 | 株式会社ノリタケカンパニーリミテド | 太陽電池の製造方法と該方法に用いられる電極形成用ペースト材料 |
-
2012
- 2012-06-19 JP JP2012138165A patent/JP5433051B2/ja not_active Expired - Fee Related
-
2013
- 2013-06-19 KR KR1020147035297A patent/KR101717337B1/ko active IP Right Grant
- 2013-06-19 CN CN201380032179.2A patent/CN104411504B/zh not_active Expired - Fee Related
- 2013-06-19 KR KR1020177006459A patent/KR101756069B1/ko active IP Right Grant
- 2013-06-19 WO PCT/JP2013/066785 patent/WO2013191194A1/ja active Application Filing
- 2013-06-19 TW TW102121734A patent/TWI549833B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2013191194A1 (ja) | 2013-12-27 |
KR20150011833A (ko) | 2015-02-02 |
CN104411504A (zh) | 2015-03-11 |
CN104411504B (zh) | 2016-07-06 |
KR101756069B1 (ko) | 2017-07-07 |
TWI549833B (zh) | 2016-09-21 |
JP2014000740A (ja) | 2014-01-09 |
KR20170029660A (ko) | 2017-03-15 |
KR101717337B1 (ko) | 2017-03-16 |
TW201418041A (zh) | 2014-05-16 |
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