JP5430422B2 - 金属ベース回路基板の製造方法及び金属ベース回路基板 - Google Patents
金属ベース回路基板の製造方法及び金属ベース回路基板 Download PDFInfo
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- JP5430422B2 JP5430422B2 JP2010016005A JP2010016005A JP5430422B2 JP 5430422 B2 JP5430422 B2 JP 5430422B2 JP 2010016005 A JP2010016005 A JP 2010016005A JP 2010016005 A JP2010016005 A JP 2010016005A JP 5430422 B2 JP5430422 B2 JP 5430422B2
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- 229910052751 metal Inorganic materials 0.000 title claims description 103
- 239000002184 metal Substances 0.000 title claims description 103
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000004080 punching Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 11
- 235000013372 meat Nutrition 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 50
- 239000011889 copper foil Substances 0.000 description 50
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000003754 machining Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Led Device Packages (AREA)
Description
図1は、金属ベース回路基板にLEDを実装した要部平面図、図2は、金属ベース回路基板にLEDを実装した要部断面図、図3は、金属ベース回路基板の要部断面図である。
[金属ベース回路基板の製造方法]
図4(a)は、凸部形成工程及び剥離工程を示し、(b)は、搭載部形成工程を示す断面図である。
[実施例1の効果]
本発明実施例1では、絶縁層5を介して回路用の銅箔パターン7を備えた金属ベース3の一側面に、前記絶縁層5及び銅箔パターン7の無い電子部品搭載部9を形成する金属ベース回路基板1の製造方法であって、前記金属ベース3の他側面から肉厚方向の途中までパンチ16を打ち込み該金属ベース3の一側面にダイ19の穴17内へ押し込まれ先端周縁部23aの断面が湾曲形状の凸部23を半抜き形成して前記ダミーの銅箔パターン21の有る箇所で絶縁層5及びダミーの銅箔パターン21の一部を打ち抜く凸部形成工程S1と、前記打ち抜けかれた絶縁層5及びダミーの銅箔パターン21の一部である抜きカス27を前記凸部23の湾曲形状を利用して剥離除去し凸部23先端を露出させる剥離工程S2と、前記凸部23をプレス成型して前記電子部品搭載部9を形成する搭載部形成工程S3とを備えた。
[その他]
上記各実施例において、絶縁層5、銅箔パターン7、ダミーの銅箔パターン21、捨て銅箔11及び電子部品搭載部9は、金属ベース3の両面に設けることもできる。
3,3C 金属ベース
5 絶縁層
7 回路用の銅箔パターン(金属箔)
9,9C 電子部品搭載部
11 捨て銅箔
13 LED(電子部品)
17 ダイの穴
19 ダイ
21 ダミーの銅箔パターン
23,23A,23B 凸部
25,25C 打ち込み凹部
27,27A,27B 抜きカス(絶縁層及び金属箔の一部)
Claims (6)
- 絶縁層を介して回路用の金属箔を備えた金属ベースの一側面に、前記絶縁層及び金属箔の無い電子部品搭載部を形成する金属ベース回路基板の製造方法であって、
前記金属ベースの他側面から肉厚方向の途中までパンチを打ち込み該金属ベースの一側面にダイの穴内へ押し込まれ少なくとも先端周縁部の断面が湾曲形状の凸部を半抜き形成して前記絶縁層を打ち抜く凸部形成工程と、
前記打ち抜かれた絶縁層を前記凸部の湾曲形状を利用して剥離除去し凸部先端を露出させる剥離工程と、
前記凸部をプレス成型して前記電子部品搭載部を形成する搭載部形成工程と、
を備えたことを特徴とする金属ベース回路基板の製造方法。 - 請求項1記載の金属ベース回路基板の製造方法であって、
前記金属ベースは、前記打ち抜かれた絶縁層の前記剥離除去を補助するダミーの金属箔を有する、
ことを特徴とする金属ベース回路基板の製造方法。 - 請求項1又は2記載の金属ベース回路基板の製造方法であって、
前記凸部形成工程は、前記パンチの径及びダイの穴の径の選択及びパンチの押し込み量の選択により前記凸部の先端を半球状又は先端周縁部の断面にコーナーアールを備えた台状に形成する、
ことを特徴とする金属ベース回路基板の製造方法。 - 請求項1〜3のいずれかに記載の金属ベース回路基板の製造方法であって、
前記搭載部形成工程は、前記電子部品搭載部を凹状又は平坦状に形成した、
ことを特徴とする金属ベース回路基板の製造方法。 - 請求項1〜4のずれかに記載の金属ベース回路基板の製造方法であって、
前記搭載部形成工程は、前記他側面に前記パンチの打ち込みにより形成された打ち込み凹部内に前記凸部側の肉を戻しつつ電子部品搭載部を凹状又は平坦状に形成した、
ことを特徴とする金属ベース回路基板の製造方法。 - 請求項1〜5のいずれかに記載の金属ベース回路基板の製造方法により製造される金属ベース回路基板であって、
前記絶縁層を介して回路用の金属箔を備えた金属ベースの一側面に、前記絶縁層及び金属箔の無い電子部品搭載部を備えた、
ことを特徴とする金属ベース回路基板。
Priority Applications (4)
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JP2010016005A JP5430422B2 (ja) | 2010-01-27 | 2010-01-27 | 金属ベース回路基板の製造方法及び金属ベース回路基板 |
KR1020127016989A KR101373119B1 (ko) | 2010-01-27 | 2011-01-13 | 금속베이스회로기판의 제조방법 및 금속베이스회로기판 |
PCT/JP2011/000157 WO2011093019A1 (ja) | 2010-01-27 | 2011-01-13 | 金属ベース回路基板の製造方法及び金属ベース回路基板 |
CN201180006953.3A CN102714924B (zh) | 2010-01-27 | 2011-01-13 | 金属底座电路基板的制造方法以及金属底座电路基板 |
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JP2010016005A JP5430422B2 (ja) | 2010-01-27 | 2010-01-27 | 金属ベース回路基板の製造方法及び金属ベース回路基板 |
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JP2011155153A JP2011155153A (ja) | 2011-08-11 |
JP5430422B2 true JP5430422B2 (ja) | 2014-02-26 |
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JP (1) | JP5430422B2 (ja) |
KR (1) | KR101373119B1 (ja) |
CN (1) | CN102714924B (ja) |
WO (1) | WO2011093019A1 (ja) |
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DE102019118966A1 (de) * | 2019-07-12 | 2021-01-14 | Automotive Lighting Reutlingen Gmbh | Verfahren zum Herstellen einer Schaltungsträgerplatte und Schaltungsträgerplatte |
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US5220487A (en) * | 1992-01-27 | 1993-06-15 | International Business Machines Corporation | Electronic package with enhanced heat sinking |
JPH11284092A (ja) * | 1998-03-27 | 1999-10-15 | Mitsui High Tec Inc | 半導体装置 |
JP3772707B2 (ja) * | 2001-08-10 | 2006-05-10 | 豊田合成株式会社 | 3族窒化物化合物半導体発光素子の製造方法 |
WO2004027866A2 (fr) * | 2002-09-23 | 2004-04-01 | Johnson Controls Technology Company | Procede d'etablissement d'une liaison dans un substrat metallique integre |
CN2713647Y (zh) * | 2004-07-27 | 2005-07-27 | 葛世潮 | 功率型白光发光二极管 |
JP4486451B2 (ja) | 2004-09-07 | 2010-06-23 | スタンレー電気株式会社 | 発光装置、その発光装置に使用するリードフレーム、及びリードフレームの製造方法 |
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- 2011-01-13 CN CN201180006953.3A patent/CN102714924B/zh active Active
- 2011-01-13 WO PCT/JP2011/000157 patent/WO2011093019A1/ja active Application Filing
- 2011-01-13 KR KR1020127016989A patent/KR101373119B1/ko active IP Right Grant
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WO2011093019A1 (ja) | 2011-08-04 |
CN102714924B (zh) | 2015-03-11 |
JP2011155153A (ja) | 2011-08-11 |
KR20120092685A (ko) | 2012-08-21 |
KR101373119B1 (ko) | 2014-03-12 |
CN102714924A (zh) | 2012-10-03 |
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