JP5411254B2 - 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー - Google Patents

再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー Download PDF

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Publication number
JP5411254B2
JP5411254B2 JP2011508622A JP2011508622A JP5411254B2 JP 5411254 B2 JP5411254 B2 JP 5411254B2 JP 2011508622 A JP2011508622 A JP 2011508622A JP 2011508622 A JP2011508622 A JP 2011508622A JP 5411254 B2 JP5411254 B2 JP 5411254B2
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polyamide
weight
resin composition
section
device cover
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Japanese (ja)
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JP2011520014A5 (https=
JP2011520014A (ja
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トポウロス ゲオルギオス
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2011508622A 2008-05-08 2009-05-06 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー Expired - Fee Related JP5411254B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12687908P 2008-05-08 2008-05-08
US61/126,879 2008-05-08
PCT/US2009/042938 WO2009137548A1 (en) 2008-05-08 2009-05-06 Portable electronic device cover comprising renewable polyamide resin composition

Publications (3)

Publication Number Publication Date
JP2011520014A JP2011520014A (ja) 2011-07-14
JP2011520014A5 JP2011520014A5 (https=) 2012-06-21
JP5411254B2 true JP5411254B2 (ja) 2014-02-12

Family

ID=40810269

Family Applications (1)

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JP2011508622A Expired - Fee Related JP5411254B2 (ja) 2008-05-08 2009-05-06 再生可能なポリアミド樹脂組成物を含む携帯用電子デバイスカバー

Country Status (6)

Country Link
US (1) US9193866B2 (https=)
EP (1) EP2274375A1 (https=)
JP (1) JP5411254B2 (https=)
KR (1) KR20110004902A (https=)
CN (1) CN102015870B (https=)
WO (1) WO2009137548A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体
US8465287B2 (en) * 2010-04-21 2013-06-18 Jeffrey M Drazan Alternative energy powered electronic reader having preloaded educational data
US20130048136A1 (en) * 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Copolyamide compositions derived from triacylglycerides
US8845934B2 (en) * 2011-09-12 2014-09-30 Sabic Global Technologies B.V. Compatibilized biopolyamide-poly(arylene ether) thermoplastic resin
WO2013052269A2 (en) * 2011-09-20 2013-04-11 Ticona Llc Housing for a portable electronic device
EP2802615A4 (en) * 2012-01-12 2015-08-12 Shakespeare Co Llc TRANSLUCENT COPOLYMERS
US20140066568A1 (en) * 2012-08-28 2014-03-06 E I Du Pont De Nemours And Company Polyamide resin blends
CN103044901B (zh) * 2012-12-17 2014-11-19 株洲时代新材料科技股份有限公司 一种高流动性无卤阻燃增强尼龙复合材料及其制备方法
HU4487U (en) * 2014-08-01 2015-01-28 Molnár Marianna Juhászné Protective device to reduce the impact of electromagnetic radiation
US20190128647A1 (en) * 2016-05-06 2019-05-02 E.I. Du Pont De Nemours And Company Light weight coated fabrics as trauma reducing body armor
US10763911B1 (en) 2020-04-03 2020-09-01 Open Mind Developments Corporation Protective covering for an electronic device
CN113480845B (zh) * 2021-07-16 2022-08-23 江西省铭新科技有限公司 一种利用废旧布料制备的再生pa塑料粒子及其方法
KR20240002343A (ko) 2022-06-29 2024-01-05 신동호 숙성을 겸한 떡찜기

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282755A (https=) 1961-08-31 1900-01-01
US3869429A (en) 1971-08-17 1975-03-04 Du Pont High strength polyamide fibers and films
JP2610671B2 (ja) * 1988-12-26 1997-05-14 ポリプラスチックス 株式会社 繊維強化熱可塑性樹脂組成物
DE3926904A1 (de) * 1989-08-16 1991-02-21 Basf Ag Verfahren zur herstellung von verstaerkten, zaehmodifizierten thermoplastischen formmassen
JPH10219026A (ja) * 1997-01-31 1998-08-18 Nitto Boseki Co Ltd ガラス繊維強化樹脂組成物
EP1022313A4 (en) * 1997-09-08 2002-05-22 Unitika Ltd POLYAMIDE RESIN COMPOSITION
US6004784A (en) 1998-09-14 1999-12-21 General Electric Co. Fermentation medium and method for producing α, ω -alkanedicarboxylic acids
US6066480A (en) 1998-09-21 2000-05-23 General Electric Company Method for high specific bioproductivity of α,ω-alkanedicarboxylic acids
US6689835B2 (en) * 2001-04-27 2004-02-10 General Electric Company Conductive plastic compositions and method of manufacture thereof
JPWO2007034905A1 (ja) * 2005-09-22 2009-03-26 富士通株式会社 植物系樹脂含有組成物及びそれを用いた植物系樹脂含有成形体
DE602006013351D1 (de) * 2005-11-23 2010-05-12 Du Pont Kohlefaserverstärkte polyamidharzzusammensetzung
KR20140090220A (ko) * 2006-01-13 2014-07-16 미쓰비시 엔지니어링-플라스틱스 코포레이션 휴대 전자 기기용 폴리아미드 수지 조성물 및 휴대 전자 기기용 성형품
JP2007291161A (ja) * 2006-04-21 2007-11-08 Toray Ind Inc 熱可塑性樹脂組成物およびそれからなる成形品
JP5282371B2 (ja) * 2006-05-16 2013-09-04 三菱化学株式会社 共重合ポリアミド樹脂
EP2025716A4 (en) * 2006-05-30 2011-05-18 Mitsubishi Eng Plastics Corp POLYAMIDE RESIN COMPOSITION AND FORM BODY
US20100059715A1 (en) * 2006-10-23 2010-03-11 Sony Corporation Resin composition, shaped article and method of manufacturing the same, and electronic device
US20080119603A1 (en) * 2006-11-22 2008-05-22 Georgios Topoulos Mobile telephone housing comprising polyamide resin composition
US8859665B2 (en) * 2006-12-05 2014-10-14 E I Du Pont De Nemours And Company Polyamide housings for portable electronic devices
DE502006003349D1 (de) * 2006-12-28 2009-05-14 Ems Chemie Ag Mit flachen Glasfasern verstärkte Polyamidformmassen sowie daraus hergestellte Spritzgussteile
FR2912753B1 (fr) * 2007-02-16 2012-10-12 Arkema France Copolyamide, composition comprenant un tel copolyamide et leur utilisation
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体

Also Published As

Publication number Publication date
US9193866B2 (en) 2015-11-24
CN102015870B (zh) 2013-07-24
US20090281229A1 (en) 2009-11-12
JP2011520014A (ja) 2011-07-14
EP2274375A1 (en) 2011-01-19
CN102015870A (zh) 2011-04-13
KR20110004902A (ko) 2011-01-14
WO2009137548A1 (en) 2009-11-12

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