CN102015870B - 包含可再生聚酰胺树脂组合物的便携式电子装置外壳 - Google Patents

包含可再生聚酰胺树脂组合物的便携式电子装置外壳 Download PDF

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Publication number
CN102015870B
CN102015870B CN2009801164665A CN200980116466A CN102015870B CN 102015870 B CN102015870 B CN 102015870B CN 2009801164665 A CN2009801164665 A CN 2009801164665A CN 200980116466 A CN200980116466 A CN 200980116466A CN 102015870 B CN102015870 B CN 102015870B
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polyamide
weight
device housing
section
circular cross
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Expired - Fee Related
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CN2009801164665A
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English (en)
Chinese (zh)
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CN102015870A (zh
Inventor
G·托普洛斯
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2009801164665A 2008-05-08 2009-05-06 包含可再生聚酰胺树脂组合物的便携式电子装置外壳 Expired - Fee Related CN102015870B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12687908P 2008-05-08 2008-05-08
US61/126879 2008-05-08
PCT/US2009/042938 WO2009137548A1 (en) 2008-05-08 2009-05-06 Portable electronic device cover comprising renewable polyamide resin composition

Publications (2)

Publication Number Publication Date
CN102015870A CN102015870A (zh) 2011-04-13
CN102015870B true CN102015870B (zh) 2013-07-24

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CN2009801164665A Expired - Fee Related CN102015870B (zh) 2008-05-08 2009-05-06 包含可再生聚酰胺树脂组合物的便携式电子装置外壳

Country Status (6)

Country Link
US (1) US9193866B2 (https=)
EP (1) EP2274375A1 (https=)
JP (1) JP5411254B2 (https=)
KR (1) KR20110004902A (https=)
CN (1) CN102015870B (https=)
WO (1) WO2009137548A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体
US8465287B2 (en) * 2010-04-21 2013-06-18 Jeffrey M Drazan Alternative energy powered electronic reader having preloaded educational data
US20130048136A1 (en) * 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Copolyamide compositions derived from triacylglycerides
US8845934B2 (en) * 2011-09-12 2014-09-30 Sabic Global Technologies B.V. Compatibilized biopolyamide-poly(arylene ether) thermoplastic resin
WO2013052269A2 (en) * 2011-09-20 2013-04-11 Ticona Llc Housing for a portable electronic device
EP2802615A4 (en) * 2012-01-12 2015-08-12 Shakespeare Co Llc TRANSLUCENT COPOLYMERS
US20140066568A1 (en) * 2012-08-28 2014-03-06 E I Du Pont De Nemours And Company Polyamide resin blends
CN103044901B (zh) * 2012-12-17 2014-11-19 株洲时代新材料科技股份有限公司 一种高流动性无卤阻燃增强尼龙复合材料及其制备方法
HU4487U (en) * 2014-08-01 2015-01-28 Molnár Marianna Juhászné Protective device to reduce the impact of electromagnetic radiation
CN109070525A (zh) * 2016-05-06 2018-12-21 纳幕尔杜邦公司 作为减轻创伤的护身服的轻重量的经涂覆的织物
US10763911B1 (en) 2020-04-03 2020-09-01 Open Mind Developments Corporation Protective covering for an electronic device
CN113480845B (zh) * 2021-07-16 2022-08-23 江西省铭新科技有限公司 一种利用废旧布料制备的再生pa塑料粒子及其方法
KR20240002343A (ko) 2022-06-29 2024-01-05 신동호 숙성을 겸한 떡찜기

Citations (1)

* Cited by examiner, † Cited by third party
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WO2007080754A1 (ja) * 2006-01-13 2007-07-19 Mitsubishi Engineering-Plastics Corporation 携帯電子機器用ポリアミド樹脂組成物および携帯電子機器用成形品

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US3869429A (en) * 1971-08-17 1975-03-04 Du Pont High strength polyamide fibers and films
JP2610671B2 (ja) * 1988-12-26 1997-05-14 ポリプラスチックス 株式会社 繊維強化熱可塑性樹脂組成物
DE3926904A1 (de) * 1989-08-16 1991-02-21 Basf Ag Verfahren zur herstellung von verstaerkten, zaehmodifizierten thermoplastischen formmassen
JPH10219026A (ja) * 1997-01-31 1998-08-18 Nitto Boseki Co Ltd ガラス繊維強化樹脂組成物
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TW200714669A (en) * 2005-09-22 2007-04-16 Fujitsu Ltd Plant-based resin containing composition and plant-based resin containing molded body using the same
JP2009517500A (ja) * 2005-11-23 2009-04-30 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 炭素繊維強化ポリアミド樹脂組成物
JP2007291161A (ja) * 2006-04-21 2007-11-08 Toray Ind Inc 熱可塑性樹脂組成物およびそれからなる成形品
JP5282371B2 (ja) * 2006-05-16 2013-09-04 三菱化学株式会社 共重合ポリアミド樹脂
CN101432364B (zh) * 2006-05-30 2011-06-01 三菱工程塑料株式会社 聚酰胺树脂组合物和成型品
EP2077300A1 (en) * 2006-10-23 2009-07-08 Sony Corporation Resin composition, shaped article and process for producing the same, and electronic equipment
US20080119603A1 (en) 2006-11-22 2008-05-22 Georgios Topoulos Mobile telephone housing comprising polyamide resin composition
US8859665B2 (en) * 2006-12-05 2014-10-14 E I Du Pont De Nemours And Company Polyamide housings for portable electronic devices
EP1942147B1 (de) * 2006-12-28 2009-04-01 Ems-Chemie Ag Mit flachen Glasfasern verstärkte Polyamidformmassen sowie daraus hergestellte Spritzgussteile
FR2912753B1 (fr) * 2007-02-16 2012-10-12 Arkema France Copolyamide, composition comprenant un tel copolyamide et leur utilisation
JP5279415B2 (ja) * 2007-09-03 2013-09-04 ユニチカ株式会社 樹脂組成物およびそれを用いた成形体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080754A1 (ja) * 2006-01-13 2007-07-19 Mitsubishi Engineering-Plastics Corporation 携帯電子機器用ポリアミド樹脂組成物および携帯電子機器用成形品

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Publication number Publication date
JP5411254B2 (ja) 2014-02-12
JP2011520014A (ja) 2011-07-14
US9193866B2 (en) 2015-11-24
CN102015870A (zh) 2011-04-13
EP2274375A1 (en) 2011-01-19
WO2009137548A1 (en) 2009-11-12
KR20110004902A (ko) 2011-01-14
US20090281229A1 (en) 2009-11-12

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