JP5411036B2 - Wiring board manufacturing method - Google Patents

Description

 The present invention provides a wiring board comprising: a wiring provided on a surface of a substrate having a through hole provided with no electrode; and a through wiring provided on an inner surface of the through hole and electrically connected to the wiring. It relates to a manufacturing method.

Conventionally, the following method has been disclosed as a method for manufacturing a double-sided wiring board in which wirings are formed on both surfaces of a substrate and these wirings are electrically connected to each other through through holes.
A first wiring pattern is formed on the surface of the substrate provided with the through hole by a conductive paste such as a silver paste having flowability by a screen printing method or the like. At this time, printing is also performed on the through hole.
As described above, when the conductive paste is printed on the surface of the substrate, the conductive paste immediately flows down the inner surface of the through hole and stops at the center of the through hole.

After heating the board | substrate with which the 1st wiring pattern was formed and drying an electrically conductive paste, a board | substrate is turned upside down and a back surface side is arrange | positioned upward.
Next, a second wiring pattern is formed on the back surface of the substrate with a conductive paste having flowability by screen printing or the like. At this time, printing is also performed on the through hole.
Thus, when the conductive paste is printed on the back surface of the substrate, the conductive paste immediately flows down the inner surface of the through hole, and the tip of the conductive paste from the back surface of the substrate is conductive from the front surface side of the substrate. The conductive paste contacts the tip of the paste and slightly overlaps the conductive paste.
By performing a drying process in this state, the conductive paste on the front side of the substrate and the conductive paste on the back side of the substrate are fixed in a state of being electrically connected through a through hole (for example, Patent Document 1-3).

Japanese Patent Laid-Open No. 8-236891 Japanese Patent Laid-Open No. 2003-6589 JP 2004-310718 A

In the conventional method for manufacturing a double-sided wiring board, if the force for applying the conductive paste to the substrate at the time of printing is weak, the conductive paste is not sufficiently filled in the through hole. Then, the conductive paste printed on the through hole flows down into the through hole. Then, since the conductive paste such as silver paste has a heavy specific gravity of conductive particles such as silver particles contained therein, the conductive paste falls without staying inside the through hole. Therefore, the conductive paste printed on the front or back surface of the substrate and the conductive paste that has flowed down into the through hole are at the boundary between the front or back surface of the substrate and the through hole (opening end of the through hole). As a result, the conductive paste does not remain inside the through hole, and as a result, there is a problem that no wiring is formed inside the through hole. Even if the conductive paste remains on the inner surface of the through hole, the amount of the conductive paste is small, and the conductive paste shrinks due to drying. There is a problem that the formed wiring and the wiring formed on the inner surface of the through hole are disconnected at the opening end of the through hole.
In addition, the conductive paste may cover the opening of the through hole without falling down from the through hole. In this case, since air accumulates in the through hole, there is a problem that the conductive paste does not remain on the inner surface of the through hole.

 Therefore, the present inventors have formed the wiring pattern made of the conductive paste by printing, and provided the uncoated portion of the conductive paste including at least the central portion of the through hole in the wiring pattern, thereby solving the above-mentioned problem. I found that it can be solved. That is, the present inventors formed a wiring pattern made of a conductive paste by printing so that an uncoated portion of the conductive paste is opposed to the opening of the through hole. It was found that the conductive paste can be sufficiently applied.

 However, in the manufacture of such a double-sided wiring board, after forming a through hole in the substrate, the conductive paste is printed on both sides of the base material, and the conductive paste is also printed on the through hole. In this case, the conductive paste is filled. At this time, in printing of the conductive paste on the through hole, the misalignment of the uncoated portion may occur due to the displacement of the plate. Therefore, there is a problem that the conductive paste cannot be sufficiently applied to the inner side surface of the through hole.

 The present invention has been made in view of the above circumstances, in which a wiring is formed on one surface of a substrate with a conductive paste, and a conductive paste is formed on an inner surface of a through-hole formed in the substrate. It is an object of the present invention to provide a method of manufacturing a wiring board capable of reliably forming a through wiring electrically connected to a wiring formed on the other surface of the wiring board.

The method for manufacturing a wiring board according to the present invention includes a board, a wiring provided on the board, a land portion connected to the wiring, and an inner surface of a through hole of the board, and is electrically connected to the wiring. And a through-wiring for electrically connecting to the other surface, wherein the conductive paste is printed on one surface of the substrate provided with at least two through-holes by printing. And a land portion pattern made of the conductive paste that includes the open end of the through-hole and is connected to the wiring pattern, and the land portion pattern has an unexposed portion of the conductive paste. A step of forming a conductive pattern made of the conductive paste on the inner surface of the through-hole by providing a plurality of slit-forming regions provided in parallel in the form of slits in the application portion. And the step B of curing the wiring pattern, the land portion pattern, and the conductive pattern to form the wiring, the land portion, and the through wiring, and in the step A, of the at least two through holes. From the position where the slit forming region is arranged so that the center of _one uncoated portion β ₁ of the plurality of uncoated portions overlaps the center of one through hole α ₁ , the slit forming region is As the uncoated portion β ₁ begins to deviate from the position overlapping the through hole α ₁ by shifting in the width direction of the slit, an uncoated portion β ₂ different from the uncoated portion β ₁ and forming the land portion pattern having the slit forming region that satisfies the relationship begin overlapping the through hole alpha ₂ adjacent to the hole alpha _1.

According to the method for manufacturing a wiring board of the present invention, in step A, among the uncoated portions of the plurality of conductive pastes at the center of _one through hole α1 of at least two through holes provided in the board. The position where the slit forming region is shifted from the position where the slit forming region is arranged so that the center of _one uncoated portion β ₁ of the _first portion is overlapped with the width direction, and the uncoated portion β ₁ is overlapped with the through hole α _1. according start out from the land portion pattern uncoated portions beta ₂ separate from the non-coated portions beta ₁ has a slit forming region that satisfies the relationship of start overlapping the through hole alpha ₂ adjacent to the through-hole alpha ₁ Therefore, even when a positional deviation of the region for forming the land pattern of the printing plate occurs, at least a part of the uncoated portion (air holes) of the conductive paste overlaps the opening of the through hole. The application portion (air hole) makes it difficult for air to accumulate in the through hole, and the conductive paste flows smoothly into the through hole, and an appropriate amount of conductive paste can be applied to the inner surface of the through hole. it can. Therefore, since no disconnection occurs in the through wiring formed by curing the conductive pattern made of the conductive paste applied to the inner side surface of the through hole, the conductivity of the through wiring can be further improved.

It is a schematic plan view which shows one Embodiment of the wiring board produced by the manufacturing method of the wiring board of this invention, (a) is a top view, (b) is a bottom view. It is a schematic plan view which shows one Embodiment of the manufacturing method of the wiring board of this invention. It is a schematic diagram showing one embodiment of the method for manufacturing a wiring board of the present invention and representing the entire image of the printing plate. In one Embodiment of the manufacturing method of the wiring board of this invention, 1st embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 1st embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 1st embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 1st embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, it shows 2nd embodiment of the process A, and is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, it shows 2nd embodiment of the process A, and is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, it shows 2nd embodiment of the process A, and is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, it shows 2nd embodiment of the process A, and is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, it shows 2nd embodiment of the process A, and is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, it shows 2nd embodiment of the process A, and is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, it shows 2nd embodiment of the process A, and is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 3rd embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 3rd embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 3rd embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 3rd embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 3rd embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 3rd embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern. In one Embodiment of the manufacturing method of the wiring board of this invention, 3rd embodiment of the process A is shown and it is a schematic diagram which shows the detail of the area | region which forms a land part pattern.

An embodiment of a method for manufacturing a wiring board according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

FIG. 1 is a schematic plan view showing an embodiment of a wiring board manufactured by the method for manufacturing a wiring board according to the present invention, wherein (a) is a top view and (b) is a bottom view.
The wiring substrate 10 of this embodiment includes a substrate 11, a wiring 12 provided on one surface 11a of the substrate 11, a wiring 13 provided on the other surface 11b of the substrate 11, and one surface 11a of the substrate 11. The land portions 14 and 15 connected to the wiring 12, the land portions 16 and 17 connected to the other surface 11 b of the substrate 11, and the inner surfaces of the through holes 18 and 19 of the substrate 11. And a through wiring 20 that electrically connects the land portion 14 and the land portion 16, and a through wiring 21 that electrically connects the land portion 15 and the land portion 17.

 The wiring 12 is formed in a coil shape on one surface 11a of the substrate 11 with the land portion 14 as a starting end and the land portion 15 as an end. The land portion 14 and the land portion 15 are provided with a predetermined interval.

The through holes 18 and 19 are circular pores in a plan view provided so as to penetrate the substrate 11 in the thickness direction. That is, the through holes 18 and 19 are provided perpendicular to the one surface 11 a and the other surface 11 b of the substrate 11.
Further, the through hole 18 and the through hole 19 are provided at a predetermined interval.

 The land portions 14 and 15 are regions to which conductive paste is applied in order to form the through wirings 20 and 21 in the through holes 18 and 19. The land portions 14 and 15 are electrically conductive with respect to the through holes 18 and 19 in this region. This is a region that allows positional deviation in the application of the adhesive paste. That is, the land portion 14 is provided so as to include at least the opening end portion 18 a of the through hole 18. Similarly, the land portion 15 is provided so as to include at least the opening end portion 19 a of the through hole 19.

 The wiring 13 is formed on the other surface 11 b of the substrate 11 in a straight line shape having a land portion 16 as a starting end and a land portion 17 as a terminating end. The land portion 16 and the land portion 17 are provided at a predetermined interval.

 The land portions 16 and 17 are regions to which conductive paste is applied in order to form the through wirings 20 and 21 in the through holes 18 and 19. The land portions 16 and 17 are electrically conductive with respect to the through holes 18 and 19 in this region. This is a region that allows positional deviation in the application of the adhesive paste. That is, the land portion 16 is provided so as to include at least the opening end portion 18 a of the through hole 18. Similarly, the land portion 17 is provided so as to include at least the opening end portion 19 a of the through hole 19.

 The wiring 12 provided on one surface 11 a of the substrate 11 and the wiring 13 provided on the other surface 11 b of the substrate 11 are electrically connected via the through wirings 20 and 21, The wiring 13 forms one circuit.

 As the substrate 11, at least in the surface layer portion, a woven fabric made of inorganic fibers such as glass fibers or alumina fibers, a nonwoven fabric, a mat, paper, or a combination thereof, or a woven fabric made of organic fibers such as polyester fibers or polyamide fibers. Cloth, non-woven fabric, mat, paper, etc., or a combination thereof, or a covering member formed by impregnating them with a resin varnish, polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate , Ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, poly Ether sulfone Resin substrates, plastic substrates such as (glass) epoxy resin substrates, or mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing, or various types of easy adhesion processing. Selected from known materials such as those subjected to surface treatment.

The wirings 12, 13 and the land portions 14, 15, 16, 17 are formed by screen printing in a predetermined pattern using a conductive paste.
The through wirings 20 and 21 are formed of conductive paste simultaneously with the formation of the land portions 14 and 15 and the land portions 16 and 17.

 As the conductive paste, a silver paste in which silver fine particles are blended in a resin composition, a carbon paste in which carbon fine particles are blended in a resin composition, or the like is used.

If a thermosetting resin is used as the resin composition, the conductive paste becomes a thermosetting type capable of forming a coating film forming the wirings 12 and 13 at 200 ° C. or less, for example, about 100 to 150 ° C. In addition to the thermosetting type, known conductive pastes such as an ultraviolet curable type, an osmotic drying type using a thermoplastic resin, and a solvent volatile type are used as the conductive paste in the present invention.
The “curing” of the conductive paste in the present invention means that the conductive paste using a thermosetting resin is heated and cured, the osmotic drying type conductive paste is dried and cured, and the solvent volatilization. The solvent is volatilized and hardened from the conductive paste of the mold.

The ultraviolet curable conductive paste contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved.
Examples of the ultraviolet curable conductive paste include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 masses of conductive fine particles. % Or more and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or a thermoplastic resin Or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate, etc.) containing 10% by mass or more of a polyester resin, that is, a crosslinkable type or a crosslinkable / A thermoplastic combination type is preferably used.

Next, with reference to FIGS. 1-21, the manufacturing method of this wiring board 10 is illustrated, and the manufacturing method of the wiring board of this invention is demonstrated.
First, through holes 18 and 19 that penetrate the substrate 11 in the thickness direction are formed in the substrate 11 at predetermined positions on the substrate 11 by a drill or a laser. At this time, the through hole 18 and the through hole 19 are formed at a predetermined interval.

Next, as shown in FIG. 2, the wiring pattern 12 </ b> A made of a conductive paste and the open end portions 18 a of the through holes 18, 19 are printed on one surface 11 a of the substrate 11 provided with the through holes 18, 19. , 19a and land patterns 14A and 15A made of conductive paste connected to the wiring pattern 12A (hereinafter referred to as “land pattern”) 14A and 15A. A slit forming region is provided in which a plurality of uncoated portions (not shown) of the conductive paste are provided in a slit shape in parallel at intervals.
Thereby, a part of the conductive paste applied to form the land pattern 14A, 15A on the one surface 11a of the substrate 11 (the conductive paste applied to form the land pattern 14A, 15A). Of the through holes 18 and 19) flow down into the through holes 18 and 19, and the conductive patterns 20 </ b> A made of the conductive paste are formed on the inner surfaces of the through holes 18 and 19. A part of 21A is formed (step A).

 Here, the uncoated portion of the conductive paste is a portion of the land pattern 14A, 15A where the conductive paste is not coated.

In this step A, the thickness of the wiring pattern 12A and the land pattern 14A, 15A formed on the one surface 11a of the substrate 11 is preferably 2.5 μm to 75 μm, more preferably 17 μm to 27 μm. is there.
In the process A, the thickness of the conductive patterns 20A and 21A formed on the inner side surfaces of the through holes 18 and 19 is preferably 2.5 μm to 75 μm, more preferably 17 μm to 27 μm.

The printing method used in step A is not particularly limited as long as it is a method capable of printing a viscous conductive paste, and depending on the thickness of the substrate, for example, screen printing, gravure printing, flexographic printing, offset printing, etc. The printing method using the printing plate is applied.
For example, when screen printing is applied, the printing plate is shown in FIG. 3 as a schematic diagram showing the entire image, and the screen plate 30 explained in FIG. Is used. Specifically, the screen plate 30 forms a screen base 31, a wiring formation region 32 for forming the wiring pattern 12 </ b> A, and land patterns 14 </ b> A and 15 </ b> A provided along one surface 31 a of the screen base 31. Land portion forming regions 33 and 34 to be formed. The wiring formation region 32 and the land portion formation regions 33 and 34 are portions where the conductive paste is applied.

 Further, in the land portion forming regions 33 and 34, when the screen plate 30 is disposed at a predetermined position on the one surface 11a of the substrate 11, the portions overlapping the through holes 18 and 19 are blocked by emulsion or the like. An uncoated portion of the conductive paste (hereinafter referred to as “uncoated portion”) is provided. The land portion forming regions 33 and 34 are provided with slit forming regions provided with a plurality of slit-shaped uncoated portions.

“First embodiment of step A”
With reference to FIGS. 4-7, 1st embodiment of the process A is described.
In this embodiment, a case where three through holes 18 and 19 corresponding to the land portions 14 and 15 formed on one surface 11a of the substrate 11 are provided at equal intervals will be described.
Here, in order to simplify the description, the relationship between the uncoated portion and the through hole 18 in the land portion formation region 33 will be described.

The land portion forming region 33 of the screen plate 30 is provided with a slit forming region in which three slit-shaped uncoated portions 35 (35A, 35B, 35C) are provided in parallel at equal intervals.
Here, the land portion formation region 33, in the region (Fig. 4 to be surrounded by the most slit disposed outside uncoated portion 35 (35B, 35C), the vertical is L, transverse of M ₁ rectangular Is defined as a slit formation region.
Moreover, the shape of the uncoated part 35 is a rectangular shape in plan view, the widths W of all the uncoated parts 35 are equal, and the lengths L of all the uncoated parts 35 are equal. Yes. That is, three uncoated portions 35 having a rectangular shape in plan view are provided at equal intervals. The portion other than the uncoated portion 35 in the land portion forming region 33 is a portion through which the conductive paste is transmitted to form a schematic shape of the land portion pattern 14A.

 In this embodiment, the land portion forming region 33 is provided with slit forming regions in which three slit-shaped uncoated portions 35 are provided at equal intervals. The uncoated portion 35 provided from one edge of the land portion formation region 33 to the other edge along the (lateral direction of the paper surface) is in the x direction (vertical direction of the paper surface) of the land portion formation region 33. It is said that it is arrange | positioned at equal intervals along.

Further, as the screen plate 30, the center of the central through hole 18A among the three through holes 18 is overlapped with the center of the slit forming region, that is, the center of the central uncoated part 35A among the three uncoated parts 35. In the land portion formation region 33, (1) the diameter of the through hole 18 is D, and (2) the pitch of two adjacent through holes 18 among the three through holes 18 (the distance between the centers of the through holes 18). ) Is P ₁ , (3) the width of the uncoated portion 35 is W, and (4) the pitch of two adjacent uncoated portions 35 among the three uncoated portions 35 (center along the length direction of the uncoated portion 35) (Distance between lines) is P ₂ , (5) along the x direction of the land portion forming region 33, on the center side of the slit forming region in the uncoated portion 35 B adjacent to the uncoated portion 35 A (right adjacent in the x direction). Adjacent to the through hole 18A from the end (right adjacent to the x direction) The distance to the through hole 18B is N ₁ , and (6) slit formation in the uncoated portion 35C adjacent to the uncoated portion 35A (left adjacent in the x direction) along the x direction of the land portion forming region 33. The distance from the end on the center side of the region to the through-hole 18C adjacent to the through-hole 18A (left adjacent in the x direction) is N ₂ , (7) the length of the uncoated portion 35 is L, and (8) the through-hole 18, the overlap amount (width) of the unapplied portion 35 required with respect to 18 is γ, and (9) the width of the positional deviation allowed in the length direction of the unapplied portion of the conductive paste in the land pattern 14A, That is, in the land portion formation region 33, if the width of the positional deviation allowed in the length direction of the uncoated part 35 is 2δ (the positional deviation width in one direction of the y direction is δ), a part of the through hole 18 is formed. The width of the uncoated part 35 so that the conductive paste always enters Since W needs to be smaller than the diameter D of the through hole 18, D> W. In addition, when the uncoated portion 35A is displaced in the x direction of the land portion forming region 33 and deviates from the through hole 18A, the uncoated portion 35B or the uncoated portion 35C overlaps the through hole 18B or the through hole 18C. The overlap (width) γ of the uncoated portion 35 required for the through hole 18 is subtracted from the distance (1/2) D + (1/2) W where the uncoated portion 35A is removed from the through hole 18A in advance. Therefore, it is necessary to dispose each uncoated portion 35B or uncoated portion 35C at a distance from the through hole 18B or the through hole 18C, and therefore N ₁ = N ₂ = (1/2) D + ( 1/2) W-γ. Further, in the y direction of the land portion formation region 33, for example, even if the uncoated portion 35 </ b> A is misaligned, the length L of the uncoated portion 35 is set to the length of the through hole 18 in order to reliably overlap the through hole 18 </ b> A. What has a slit formation area | region which satisfy | fills the relationship of L> = D + 2 (delta) between the distance (diameter D of the through-hole 18) of ay direction is used.

In this way, the slit forming area of the screen plate 30 is formed from the position where the slit forming area of the land portion forming area 33 is arranged so that the center of the through hole 18A overlaps the center of the uncoated part 35A. As the formation region shifts in the width direction (right side in the x direction) of the land portion formation region 33, the uncoated portion 35A is adjacent to the uncoated portion 35A (x direction) as it begins to deviate from the position overlapping the through hole 18A. The uncoated portion 35B (on the right side of) begins to overlap the through hole 18B adjacent to the through hole 18A (on the right side in the x direction), or in the width direction (left side in the x direction) of the land portion formation region 33 As the unapplied portion 35A starts to deviate from the position where it overlaps with the through hole 18A, the unapplied portion 35C adjacent to the unapplied portion 35A (next to the left in the x direction) is adjacent to the through hole 18A. Fit (left of the x-direction) satisfies the relationship of start overlapping the through hole 18C.
Accordingly, even when the land portion forming region 33 of the screen plate 30 is misaligned in printing the conductive paste on the one surface 11a of the substrate 11, at least a part of the uncoated portion 35 is an opening portion of the through hole 18. It overlaps with (a region inside the opening end 18a of the through hole 18).

Specifically, when the slit forming region of the land portion forming region 33 is shifted from the state shown in FIG. 4 by (1/2) D to the right side in the x direction (the state shown in FIG. 5), the through hole 18A Although the amount of the uncoated portion 35A overlapping decreases, the amount of the uncoated portion 35B overlapping the through hole 18B increases.
Accordingly, when the slit forming region of the land portion forming region 33 is further shifted to the right in the x direction, the through hole 18A and the uncoated portion 35A do not overlap, while the opening portion of the through hole 18B (the opening end of the through hole 18). The region inside the portion 18a) and the uncoated portion 35B completely overlap.

Further, when the slit forming region of the land portion forming region 33 is shifted from the state shown in FIG. 4 by D on the right side in the x direction (the state shown in FIG. 6), the through hole 18B is formed at the center of the uncoated portion 35B. As the center overlaps, the amount by which the uncoated portion 35C overlaps the through hole 18A increases.
That is, from the state shown in FIG. 5 to the state shown in FIG. 6, (1) the process in which the through hole 18A and the uncoated portion 35A do not overlap, while the opening of the through hole 18B and the uncoated portion 35B overlap. (2) A process of starting to overlap the uncoated portion 35C with the through hole 18A is performed while the opening of the through hole 18B and the uncoated portion 35B are overlapped.

 Further, when the slit forming region of the land portion forming region 33 is shifted (3/2) D to the right side in the x direction from the state shown in FIG. 4 (the state shown in FIG. 7), the uncoated portion is formed in the through hole 18B. Although the amount of overlap of 35B decreases, the center of the through hole 18A overlaps the center of the uncoated portion 35C.

 Here, the case where the slit forming region of the land portion forming region 33 is shifted to the right side in the x direction from the state shown in FIG. 4 is illustrated, but the same applies to the case where the slit forming region is shifted to the left side in the x direction.

It should be noted that the relational expression between the above N ₁ and N ₂ and the above diameter D and width W: N ₁ = N ₂ = (1/2) D + (1/2) W−γ The amount of overlap (width) γ of the uncoated part 35 required in other words, in other words, the amount of overlap of the uncoated part 35 with respect to the through hole 18 necessary for smoothly flowing the conductive paste into the through hole 18. When the (width) γ is increased, when the slit formation region of the land portion formation region 33 is shifted from the state shown in FIG. 4 to the right side or the left side in the x direction, it is adjacent to the uncoated portion 35A with a smaller shift amount. The matching uncoated portions 35B and 35C overlap the through holes 18B and 18C adjacent to the through hole 18A.

 Further, in step A, the land portion pattern 14A is formed so that the through hole 18A is disposed at the center of the slit forming region formed in the land portion pattern 14A (land portion forming region 33). If the plate is displaced during the application (printing) of the conductive paste, the slit formation region of the land portion formation region 33 may be misaligned with respect to the through hole 18. The size needs to allow the deviation.

 Therefore, with respect to the center of the slit forming region of the land portion forming region 33, one direction of the expected slit forming region of the land portion forming region 33 in the y direction (the vertical direction of the paper surface, the length direction of the uncoated portion 35). Where δ is the width of the misalignment and D is the diameter of the through hole 18, the length L of the uncoated portion 35 needs to satisfy the relational expression L ≧ D + 2δ.

Further, in this embodiment, with reference to the center of the slit forming region of the land portion forming region 33, the width of the positional deviation in one direction of the slit forming region of the land portion forming region 33 in the x direction is set to (3/2). ) If the width of the uncoated portion 35 is W, the length from the left end to the right end when the three uncoated portions 35A, 35B, and 35C are bundled together in the x direction of the land portion forming region 33. M ₁ needs to satisfy the relational expression of M ₁ ≧ W + 2 × (3/2) D = W + 3D.

If a larger positional shift in the x direction is anticipated, the right side of the uncoated portion 35B in the x direction of the land portion formation region 33 is satisfied so as to satisfy the same relationship as the uncoated portions 35A, 35B, and 35C. An unapplied part 35D is provided adjacently, and an unapplied part 35E is provided on the left side of the unapplied part 35C.
When the uncoated portions 35D and 35E are provided in this way, the uncoated portions 35A, 35B, 35C, 35D, and 35E are provided at equal intervals, so that the center of the slit forming region of the land portion forming region 33 is used as a reference. The width of the positional deviation in the x direction of the slit formation region of the expected land portion formation region 33 is (3/2) D × 2 = 3D. Therefore, if the width of the uncoated portion 35 is W, the length from the left end to the right end when the five uncoated portions 35A, 35B, 35C, 35D, and 35E are bundled together in the x direction of the land portion forming region 33. M ₂ needs to satisfy the relational expression of M ₂ ≧ W + 2 × 3D = W + 6D.

Further, in order to prevent the land portion pattern 14A from being disconnected at the edge by the uncoated portion of the conductive paste formed by the uncoated portion 35, the length X in the x direction of the land portion forming region 33 is , Larger than the above length M ₁ or M ₂ (X> M ₁ or X> M ₂ ). Similarly, the length Y in the y direction of the land portion forming region 33 is larger than the length L of the uncoated portion 33a (Y> L).
When the slit forming area is defined as described above, the mesh area 33 may be an area larger than the slit forming area, and the shape thereof is not particularly limited, and may be a circle or an ellipse.

 When the land pattern 14A made of a conductive paste is formed on one surface 11a of the substrate 11 provided with the through holes 18 by printing using such a screen plate 30, the land pattern 14A has a conductive The non-application | coated part of an adhesive paste is provided in the slit shape, and the slit formation area | region provided in parallel by three at equal intervals. That is, since the conductive paste does not pass through the unapplied portion 35 of the land portion formation region 33, the conductive paste is not applied to the portion, and the portion becomes an uncoated portion.

Accordingly, when the center of the through hole 18A is arranged so as to overlap the center of the slit forming region in the land pattern 14A formed by the land portion forming region 33 by using the screen plate 30, (1) the through hole D is the diameter of 18, (2) P _{1 is} the pitch of two adjacent through-holes 18 among the three through-holes 18, (3) W is the width of the uncoated part, and (4) Of the three uncoated parts The pitch of two adjacent uncoated portions is P ₂ , and (5) the uncoated portion in the uncoated portion adjacent to the central uncoated portion (right adjacent in the x direction) along the x direction of the land pattern 14A. The distance from the center side end of 35B to the through hole 18B adjacent to the through hole 18A (right adjacent to the x direction) is N ₁ , and (6) the center uncoated along the x direction of the land pattern 14A Next to part from the center side of the end of the uncoated portion 35C in the left of) the uncoated portion of the x-direction, the distance to the through hole 18A and the adjacent (in the x-direction left of) through holes 18C N _2, Not (7) The length of the coated portion is L, (8) the overlap amount (width) of the uncoated portion required for the through hole 18 is γ, and (9) in the land pattern 14A, in the length direction of the uncoated portion. A slit forming region satisfying the relationship of D> W, N ₁ = N ₂ = (1/2) D + (1/2) W−γ, L ≧ D + 2δ, where the allowable positional deviation width is 2δ. The land portion pattern 14A is formed.

 As described above, when the land portion pattern 14A made of a conductive paste is formed by printing using the screen plate 30, the land portion of the screen plate 30 is formed in the printing of the conductive paste on the one surface 11a of the substrate 11. Even if the region 33 is misaligned, the conductive paste for forming the conductive pattern 20 </ b> A can be sufficiently applied to the inner surface of the through-hole 18.

 In other words, even if the land portion formation region 33 of the screen plate 30 is shifted from the position shown in FIG. 4 to the position shown in FIGS. Since the portion overlaps the opening of the through hole 18 (the region inside the opening end 18a of the through hole 18), the conductive paste for forming the conductive pattern 20A is sufficiently applied to the inner surface of the through hole 18. Can do.

"Second embodiment of step A"
With reference to FIGS. 8-14, 2nd embodiment of the process A is described.
Here, in order to simplify the description, the relationship between the uncoated portion and the through hole 18 in the land portion formation region 33 will be described.
In this embodiment, a case will be described in which three through holes 18 corresponding to the land portions 14 formed on one surface 11a of the substrate 11 are provided at intervals.

The land portion forming region 33 of the screen plate 30 is provided with a slit forming region in which two slit-shaped uncoated portions 36 (36A, 36B) are provided in parallel with a distance therebetween.
Here, in the land portion forming region 33, a region surrounded by two slit-shaped uncoated portions 36 (in FIG. 8, a rectangular region having a vertical L and a horizontal M) is defined as a slit forming region.
Further, the shape of the uncoated part 36 is a rectangular shape in plan view, the widths W of the two uncoated parts 36 are equal, and the lengths L of the two uncoated parts 36 are equal. Yes. The portions other than the uncoated portion 36 in the land portion formation region 33 are portions that transmit the conductive paste and form a schematic shape of the land portion pattern 14A.

 Further, in this embodiment, the land portion forming region 33 is provided with a slit forming region in which two slit-shaped uncoated portions 36 are provided in parallel at an interval. The uncoated portion 36 provided from one edge portion of the land portion formation region 33 to the other edge portion along the y direction (lateral direction of the paper surface) of the land portion formation region 33 is formed in the x direction (vertical direction of the paper surface). It is said that it is arranged in parallel at intervals along the direction.

Further, as the screen plate 30, the x of the land portion forming region 33 among the three through holes 18 is formed at the center of the uncoated portion 36 </ b> A on the left side in the x direction of the land portion forming region 33 of the two uncoated portions 36. When the center of the through hole 18A on the left end in the direction is arranged so as to overlap, in the land portion forming region 33, (1) the diameter of the through hole 18 is D, and (2) of the three through holes 18, the land portion forming region 33 The pitch (distance between the centers of the through holes 18) between the through hole 18A at the left end in the x direction and the central through hole 18B is P ₁₁ , (3) Of the three through holes 18, the right end in the x direction of the land portion formation region 33 a through hole 18C of the _P 12 (distance between the centers of the through-hole 18) the pitch of the central through hole 18B, (4) width W of the uncoated portion 36, (5) two pitches of uncoated portion 36 (Distance between center lines along the length direction of the uncoated portion 36) P ₁₃ , (6) The x direction of the land portion forming region 33 among the three through holes 18 from the center side end of the slit forming region in the uncoated portion 36B along the x direction of the land portion forming region 33. The distance to the right end through hole 18C is N ₁ , (7) From the right end of the land portion forming region 33 in the uncoated portion 36B along the x direction of the land portion forming region 33, of the three through holes 18 The distance to the central through hole 18B is N ₂ , (8) the length of the uncoated part 36 is L, and (9) the overlapping amount (width) of the uncoated part 36 required for the through hole 18 is γ, (10) In the land portion pattern 14A, the width of the positional deviation allowed in the length direction of the uncoated portion of the conductive paste, that is, in the land portion formation region 33, allowed in the length direction of the uncoated portion 36. If the width of the positional deviation to be made is 2δ, As in the first embodiment, the relationship of D> W, N ₁ = N ₂ = (1/2) D + (1/2) W−γ, L ≧ D + 2δ is satisfied, and the through hole 18A and its neighbor are satisfied. P ₁₁ > D is satisfied so that the through-hole 18B positioned at the position does not overlap, and the uncoated portion 36B is positioned on the right side of the through-hole 18B adjacent to the through-hole 18A and on the left side of the through-hole 18C. By doing this, P ₁₃ > P ₁₁ so that the uncoated portion 36B can overlap the left and right through holes 18B or 18C even if the uncoated portion 36A is displaced from side to side and is disengaged from the through hole 18A. Those having a slit forming region satisfying the above relationship are used.

In this way, the slit forming region of the land portion forming region 33 is located from the position where the slit forming region of the land portion forming region 33 is arranged so that the center of the through hole 18A overlaps the center of the uncoated portion 36A. As the slit forming region shifts in the width direction (right side or left side in the x direction) of the land portion forming region 33 and the uncoated portion 36A begins to come off from the position overlapping the through hole 18A, it is adjacent to the uncoated portion 36A. The unapplied portion 36B that fits (right adjacent to the x direction) satisfies the relationship that it begins to overlap the through hole 18B or the through hole 18C disposed on the right side of the through hole 18A.
Therefore, in the printing of the conductive paste on the one surface 11 a of the substrate 11, even if the land portion forming region 33 is misaligned with the land portion forming region 33, at least a part of the uncoated portion 36 is not in the through hole 18. It overlaps with the opening (region inside the opening end 18a of the through hole 18).

Specifically, when the slit formation region of the land portion formation region 33 is shifted (1/2) D to the right side in the x direction from the state shown in FIG. 8 (the state shown in FIG. 9), Although the amount of the uncoated portion 36A overlapping decreases, the amount of the uncoated portion 36B overlapping the through hole 18C increases.
Therefore, when the slit forming region of the land portion forming region 33 is further shifted to the right in the x direction, the through hole 18A and the uncoated portion 36A do not overlap, while the opening portion of the through hole 18C (the opening end of the through hole 18). The region inside the portion 18a) and the uncoated portion 36B completely overlap.

 Further, when the slit forming region of the land portion forming region 33 is shifted from the state shown in FIG. 8 by D on the right side in the x direction (the state shown in FIG. 10), the through hole 18C is formed at the center of the uncoated portion 36B. As the center overlaps, the uncoated portion 36A does not overlap the through hole 18A.

 Further, when the slit forming region of the land portion forming region 33 is shifted (3/2) D to the right side in the x direction from the state shown in FIG. 8 (the state shown in FIG. 11), the uncoated portion is formed in the through hole 18C. The amount of overlap of 36B decreases.

It should be noted that the relational expression between the above N ₁ and N ₂ and the above diameter D and width W: N ₁ = N ₂ = (1/2) D + (1/2) W−γ The amount of overlap (width) γ of the uncoated portion 36 required in other words, in other words, the amount of overlap of the uncoated portion 36 with respect to the through hole 18 necessary for smoothly flowing the conductive paste into the through hole 18. When the (width) γ is increased, when the slit forming region of the land portion forming region 33 is shifted to the right side in the x direction from the state shown in FIG. It will overlap with 18C.

On the other hand, when the slit formation region of the land portion formation region 33 is shifted from the state shown in FIG. 8 by (1/2) D to the left side in the x direction (state shown in FIG. 12), the uncoated portion is formed in the through hole 18A. Although the amount of overlapping 36A decreases, the amount of uncoated portion 36B overlapping the through hole 18B increases.
Accordingly, when the slit forming region of the land portion forming region 33 is further shifted to the left in the x direction, the through hole 18A and the uncoated portion 36A do not overlap each other, while the opening portion of the through hole 18B (the opening end of the through hole 18). The region inside the portion 18a) and the uncoated portion 36B completely overlap.

 Further, when the slit forming region of the land portion forming region 33 is shifted from the state shown in FIG. 8 by D on the left side in the x direction (the state shown in FIG. 13), the through hole 18B is formed at the center of the uncoated portion 36B. As the center overlaps, the uncoated portion 36A does not overlap the through hole 18A.

 Further, when the slit forming region of the land portion forming region 33 is shifted (3/2) D to the right side in the x direction from the state shown in FIG. 8 (the state shown in FIG. 14), the uncoated portion is formed in the through hole 18B. The amount of overlap of 36B decreases.

It should be noted that the relational expression between the above N ₁ and N ₂ and the above diameter D and width W: N ₁ = N ₂ = (1/2) D + (1/2) W−γ The amount of overlap (width) γ of the uncoated portion 36 required in other words, in other words, the amount of overlap of the uncoated portion 36 with respect to the through hole 18 necessary for smoothly flowing the conductive paste into the through hole 18. When the (width) γ is increased, when the slit forming region of the land portion forming region 33 is shifted to the left in the x direction from the state shown in FIG. It overlaps with 18B.

 In the process A, the land portion pattern 14A is formed so that the center of the through hole 18A overlaps the center of the uncoated portion 36A. Actually, the through hole 18 is applied during application (printing) of the conductive paste. On the other hand, when the slit formation region of the land portion formation region 33 is arranged, a positional deviation may occur, and therefore the land portion formation region 33 needs to have a size that allows the positional deviation.

 Therefore, an expected slit formation region of the land portion formation region 33 is based on the position where the slit formation region of the land portion formation region 33 is arranged so that the center of the through hole 18A overlaps the center of the uncoated portion 36A. When the width of the positional deviation in one direction in the y direction (the vertical direction of the paper surface, the length direction of the uncoated portion 36) is δ and the diameter of the through hole 18 is D, the length L of the uncoated portion 36 is L It is necessary to satisfy the relational expression ≧ D + 2δ.

 Further, in this embodiment, the expected land portion formation region 33 with reference to the position where the slit formation region of the land portion formation region 33 is arranged so that the center of the through hole 18A overlaps the center of the uncoated portion 36A. Since the width of the positional deviation in one direction of the slit forming region in the x direction is set to (3/2) D, if the width of the uncoated portion 36 is W, two unaligned portions are formed in the x direction of the land portion forming region 33. The length M from the left end to the right end when the application portions 36A and 36B are made into one lump needs to satisfy the relational expression M ≧ W + 2 × (3/2) D = W + 3D.

Further, in order to prevent the land portion pattern 14A from being disconnected at the edge by an uncoated portion of the conductive paste formed by the uncoated portion 36, the length X in the x direction of the land portion forming region 33 is , Larger than the above length M (X> M). Similarly, the length Y in the y direction of the land portion formation region 33 is larger than the length L of the uncoated portion 36 (Y> L).
When the slit forming area is defined as described above, the land portion forming area 33 may be an area larger than the slit forming area, and the shape thereof is not particularly limited, and may be a circle or an ellipse. Good.

 When the land pattern 14A made of a conductive paste is formed on one surface 11a of the substrate 11 provided with the through holes 18 by printing using such a screen plate 30, the land pattern 14A has a conductive An uncoated portion of the conductive paste is formed in a slit shape, and two slit forming regions are provided in parallel at an interval. That is, since the conductive paste does not pass through the unapplied portion 36 of the land portion formation region 33, the conductive paste is not applied to the portion, and the portion becomes an uncoated portion.

Therefore, by using the screen plate 30, in the land portion pattern 14A formed by the land portion forming region 33, of the two uncoated portions, the center of the uncoated portion on the left side in the x direction of the land portion pattern 14A is When the center of the through-hole 18A is overlapped, (1) the diameter of the through-hole 18 is D, and (2) of the three through-holes 18, the through-hole 18A at the left end in the x direction of the land pattern 14A and the center The pitch between the through hole 18B is P ₁₁ , and (3) of the three through holes 18, the pitch between the through hole 18C at the right end in the x direction of the land pattern 14A and the central through hole 18B is P ₁₂ , (4) the width of the uncoated portion W, (5) the pitch of the two non-coated portions P _13, along the x direction ₍₆₎ the land part pattern 14A, the land portion pattern 1 in the non-application portion of the right side From the center end of the A, among the three through holes 18, _N 1 the distance to the x-direction the right end of the through hole 18C of the land part pattern 14A, along the x direction (7) land part pattern 14A, right The distance from the right end of the land portion pattern 14A in the uncoated portion to the central through hole 18B among the three through holes 18 is N ₂ , (8) the length of the uncoated portion is L, (9) When the overlap amount (width) of the uncoated portion required for the through hole 18 is γ, and (10) the width of the positional deviation allowed in the length direction of the uncoated portion in the land pattern 14A is 2δ. , D> W, N ₁ = N ₂ = (½) D + (½) W−γ, L ≧ D + 2δ, P ₁₁ > D, and P ₁₃ > P _11. The land portion pattern 14A is formed.

 As described above, when the land portion pattern 14A made of a conductive paste is formed by printing using the screen plate 30, the land portion of the screen plate 30 is formed in the printing of the conductive paste on the one surface 11a of the substrate 11. Even if the region 33 is misaligned, the conductive paste for forming the conductive pattern 20 </ b> A can be sufficiently applied to the inner surface of the through-hole 18.

 In other words, even if the land portion formation region 33 of the screen plate 30 is shifted from the position shown in FIG. 8 to the position shown in FIGS. 9 to 14 with respect to the through-hole 18, at least one of the uncoated portions 36. Since the portion overlaps the opening of the through hole 18 (the region inside the opening end 18a of the through hole 18), the conductive paste for forming the conductive pattern 20A is sufficiently applied to the inner surface of the through hole 18. Can do.

“Third embodiment of step A”
With reference to FIGS. 15-21, 3rd embodiment of the process A is described.
Here, in order to simplify the description, the relationship between the uncoated portion and the through hole 18 in the land portion formation region 33 will be described.
In this embodiment, a case will be described in which two through holes 18 corresponding to the land portions 14 formed on one surface 11a of the substrate 11 are provided at intervals.

The land portion forming region 33 of the screen plate 30 is provided with a slit forming region in which three slit-shaped uncoated portions 37 (37A, 37B, 37C) are provided in parallel at intervals.
Here, in the land portion formation region 33, a region surrounded by the slit-shaped uncoated portions 37 (37A, 37C) provided on the outermost side (in FIG. 15, a rectangle having a length L and a width M). Region) is a slit formation region.
Further, the shape of the uncoated portion 37 is a rectangular shape in plan view, the widths W of the three uncoated portions 37 are equal, and the lengths L of the three uncoated portions 37 are equal. Yes. The portions other than the unapplied portion 37 in the land portion forming region 33 are portions that transmit the conductive paste and form a schematic shape of the land portion pattern 14A.

 In this embodiment, the land portion forming region 33 is provided with a slit forming region in which three slit-shaped uncoated portions 37 are provided in parallel at intervals. The uncoated portion 37 provided from one edge portion of the land portion forming region 33 to the other edge portion along the y direction (lateral direction of the paper surface) of the land portion forming region 33 is formed in the x direction (vertical direction of the paper surface). It is said that it is arranged in parallel at intervals along the direction.

Further, as the screen plate 30, among the three uncoated portions 37, the center of the uncoated portion 37 </ b> A at the left end in the x direction of the land portion forming region 33 is located at the x of the land portion forming region 33 among the two through holes 18. When the center of the through-hole 18A on the left side in the direction is overlapped, in the land portion formation region 33, (1) the diameter of the through-hole 18 is D, and (2) the pitch between the two through-holes 18A and 18B (through-hole (Center distance of 18) is P ₂₁ , (3) the width of the uncoated portion 37 is W, and (4) of the three uncoated portions 37, the uncoated portion 37A at the left end in the x direction of the land portion forming region 33 P ₂₂ is the pitch (distance between the center lines along the length direction of the uncoated portion 37) with the center uncoated portion 37B, and (5) of the three uncoated portions 37, the right end of the land portion forming region 33 in the x direction The pitch between the uncoated portion 37C and the central uncoated portion 37B (None centerline distance along the length of the coating section 37) P _23, along the x direction ₍₆₎ the land portion formation region 33, from the center end of the mesh region 33 of uncoated portion 37B, The distance to the through hole 18B is N ₁ , and (7) the distance from the right end of the land portion forming region 33 in the uncoated portion 37C to the through hole 18B is N ₂ along the x direction of the land portion forming region 33. (8) The length of the uncoated portion 37 is L, (9) the overlapping amount (width) of the uncoated portion 37 required for the through-hole 18 is γ, and (10) the land pattern 14A is conductive. If the width of the positional deviation allowed in the length direction of the uncoated portion of the adhesive paste, that is, the width of the positional deviation allowed in the length direction of the uncoated portion 37 in the land portion formation region 33 is 2δ, Similar to one embodiment, D> W, P ₂₁ > P ₂₂ , N ₁ = N ₂ = (1/2) D + (1/2) W−γ, L ≧ D + 2δ is satisfied, and P ₂₂ > so that the uncoated portion 37B does not overlap the through hole 18A. Those having a slit forming region satisfying the relationship of (1/2) (D + W) are used.

In this way, the slit formation region of the land portion formation region 33 is located from the position where the slit formation region of the land portion formation region 33 is arranged so that the center of the through hole 18A overlaps the center of the uncoated portion 37A. As the slit forming region shifts in the width direction (the right side or the left side in the x direction) of the land portion forming region 33 and the uncoated portion 37A starts to come off from the position overlapping the through hole 18A, it is adjacent to the uncoated portion 37A. The unapplied portion 37B that fits (right adjacent to the x direction) begins to overlap the through hole 18B disposed to the right of the through hole 18A, or the unapplied portion 37A on the right side (uncoated portion) of the uncoated portion 37A 37B to the right) The unapplied portion 37C satisfies the relationship of starting to overlap with the through hole 18B disposed on the right side of the through hole 18A.
Therefore, even when the land portion forming region 33 of the screen plate 30 is misaligned in the printing of the conductive paste on the one surface 11a of the substrate 11, at least a part of the uncoated portion 37 is an opening portion of the through hole 18. It overlaps with (a region inside the opening end 18a of the through hole 18).

Specifically, when the slit forming region of the land portion forming region 33 is shifted (1/2) D to the right side in the x direction from the state shown in FIG. 15 (the state shown in FIG. 16), Although the amount of the uncoated portion 37A overlapping decreases, the amount of the uncoated portion 37B overlapping the through hole 18B increases.
Accordingly, when the slit forming region of the land portion forming region 33 is further shifted to the right in the x direction, the through hole 18A and the uncoated portion 37A do not overlap, while the through hole 18B has an opening (open end of the through hole 18). The region inside the portion 18a) and the uncoated portion 37B completely overlap.

 Further, when the slit forming region of the land portion forming region 33 is shifted from the state shown in FIG. 15 by D on the right side in the x direction (the state shown in FIG. 17), the through hole 18B is formed at the center of the uncoated portion 37B. As the center overlaps, the uncoated portion 37A does not overlap the through hole 18A.

 Further, when the slit forming region of the land forming region 33 is shifted (3/2) D to the right side in the x direction from the state shown in FIG. 15 (the state shown in FIG. 18), the uncoated portion is formed in the through hole 18B. The amount that 37B overlaps decreases.

It should be noted that the relational expression between the above N ₁ and N ₂ and the above diameter D and width W: N ₁ = N ₂ = (1/2) D + (1/2) W−γ The amount of overlap (width) γ of the unapplied portion 37 required in other words, in other words, the amount of overlap of the unapplied portion 37 with respect to the through-hole 18 necessary for smoothly flowing the conductive paste into the through-hole 18. When the (width) γ is increased, when the slit forming region of the land portion forming region 33 is shifted to the right side in the x direction from the state shown in FIG. It overlaps with 18B.

On the other hand, when the slit formation region of the land portion formation region 33 is deviated (1/2) D to the left in the x direction from the state shown in FIG. 15 (state shown in FIG. 19), the uncoated portion is formed in the through hole 18A. Although the amount of overlapping 37A decreases, the amount of uncoated portion 37C overlapping the through hole 18B increases.
Accordingly, when the slit forming region of the land portion forming region 33 is further shifted to the left in the x direction, the through hole 18A and the uncoated portion 37A do not overlap each other, while the opening portion of the through hole 18B (the opening end of the through hole 18). The region inside the portion 18a) and the uncoated portion 37C completely overlap.

 Further, when the slit forming region of the land portion forming region 33 is shifted from the state shown in FIG. 15 by D on the left side in the x direction (the state shown in FIG. 20), the through hole 18B is formed at the center of the uncoated portion 37C. As the center overlaps, the uncoated portion 37A does not overlap the through hole 18A.

 Further, when the slit formation region of the land portion formation region 33 is shifted (3/2) D to the right side in the x direction from the state shown in FIG. 15 (the state shown in FIG. 21), the uncoated portion is formed in the through hole 18B. The amount that 37C overlaps decreases.

It should be noted that the relational expression between the above N ₁ and N ₂ and the above diameter D and width W: N ₁ = N ₂ = (1/2) D + (1/2) W−γ The amount of overlap (width) γ of the unapplied portion 37 required in other words, in other words, the amount of overlap of the unapplied portion 37 with respect to the through-hole 18 necessary for smoothly flowing the conductive paste into the through-hole 18. When the (width) γ is increased, when the slit formation region of the land portion formation region 33 is shifted to the left side in the x direction from the state shown in FIG. It overlaps with 18B.

 Further, in step A, the land pattern 14A is formed so that the center of the through hole 18A overlaps the center of the uncoated part 37A. Actually, the through hole 18 is applied during application (printing) of the conductive paste. On the other hand, when the slit formation region of the land portion formation region 33 is arranged, a positional deviation may occur, and therefore the land portion formation region 33 needs to have a size that allows the positional deviation.

 Therefore, an expected slit formation region of the land portion formation region 33 is based on the position where the slit formation region of the land portion formation region 33 is arranged so that the center of the through hole 18A overlaps the center of the uncoated portion 37A. When the width of the positional deviation in one direction in the y direction (the vertical direction of the paper surface, the length direction of the uncoated portion 37) is δ and the diameter of the through hole 18 is D, the length L of the uncoated portion 37 is L It is necessary to satisfy the relational expression ≧ D + 2δ.

 Further, in this embodiment, the expected land portion formation region 33 with reference to the position where the slit formation region of the land portion formation region 33 is arranged so that the center of the through hole 18A overlaps the center of the uncoated portion 37A. The width of the positional deviation in one direction of the slit forming region in the x direction is set to (3/2) D. Therefore, if the width of the uncoated portion 37 is W, three non-applied portions are formed in the x direction of the land portion forming region 33. The length M from the left end to the right end when the application portions 37A, 37B, and 37C are made into one lump needs to satisfy the relational expression M ≧ W + 2 × (3/2) D = W + 3D.

Further, in order to prevent the land portion pattern 14A from being disconnected at the edge by the uncoated portion of the conductive paste formed by the uncoated portion 37, the length X in the x direction of the land portion forming region 33 is , Larger than the above length M (X> M). Similarly, the length Y in the y direction of the land portion formation region 33 is larger than the length L of the uncoated portion 37 (Y> L).
When the slit forming area is defined as described above, the land portion forming area 33 may be an area larger than the slit forming area, and the shape thereof is not particularly limited, and may be a circle or an ellipse. Good.

 When the land pattern 14A made of a conductive paste is formed on one surface 11a of the substrate 11 provided with the through holes 18 by printing using such a screen plate 30, the land pattern 14A has a conductive A non-coated portion of the conductive paste is provided in a slit shape, and three slit forming regions are provided in parallel at intervals. That is, since the conductive paste does not pass through the unapplied portion 37 of the land portion formation region 33, the conductive paste is not applied to the portion, and the portion becomes an uncoated portion.

Therefore, by using the screen plate 30, also in the land portion pattern 14A formed by the land portion forming region 33, among the three uncoated portions, the center of the uncoated portion at the left end in the x direction of the land portion pattern 14A is When the center of the through hole 18A on the left side in the x direction of the land portion pattern 14A is overlapped among the two through holes 18, (1) the diameter of the through hole 18 is D, and (2) the two through holes 18A and the through hole 18A are penetrated. The pitch of the holes 18B is P ₂₁ , (3) the width of the uncoated portion is W, and (4) of the three uncoated portions, the uncoated portion at the left end in the x direction of the land pattern 14A, and the uncoated portion at the center P ₂₂ the _{pitch, (5)} of the three non-coated portions, and uncoated portions of the x-direction the right end of the land portion pattern 14A, P ₂₃ the pitch of the central uncoated _{portion, (6)} the land portion putter 14A along the x direction from the center side of the end of the land portion pattern 14A in the uncoated portion of the central, the distance to the through-hole 18B N _1, along the x direction (7) land part pattern 14A, the right end The distance from the right end of the land portion pattern 14A to the through hole 18B in the uncoated portion is N ₂ , (8) the length of the uncoated portion is L, and (9) the through hole 18 is required. The overlap amount (width) of the uncoated portion is γ, (10) In the land portion pattern 14A, the width of the positional deviation allowed in the length direction of the uncoated portion of the conductive paste, that is, in the land portion forming region 33, When the width of the positional deviation allowed in the length direction of the uncoated portion is 2δ, D> W, P ₂₁ > P ₂₂ , N ₁ = N ₂ = (1/2) D + (1/2) W−γ _{, L ≧ D + 2δ, P} 22> (1/2) (D Land part pattern 14A having a slit forming region that satisfies the relationship W) is formed.

 As described above, when the land portion pattern 14A made of a conductive paste is formed by printing using the screen plate 30, the land portion of the screen plate 30 is formed in the printing of the conductive paste on the one surface 11a of the substrate 11. Even if the region 33 is misaligned, the conductive paste for forming the conductive pattern 20 </ b> A can be sufficiently applied to the inner surface of the through-hole 18.

 In other words, even if the land portion formation region 33 of the screen plate 30 is shifted from the position shown in FIG. 8 to the position shown in FIGS. 15 to 21 with respect to the through hole 18, at least one of the uncoated portions 37. Since the portion overlaps the opening of the through hole 18 (the region inside the opening end 18a of the through hole 18), the conductive paste for forming the conductive pattern 20A is sufficiently applied to the inner surface of the through hole 18. Can do.

 Next, the wiring pattern 12A, the land portion patterns 14A and 15A, and the conductive patterns 20A and 21A are cured to form the wiring 12 and the land portions 14 and 15 on one surface 11a of the substrate 11, and the through holes 18 are formed. A part of the through wiring 20 is formed on the inner side surface, and a part of the through wiring 21 is formed on the inner side surface of the through hole 19 (step B).

In this step B, when a thermosetting conductive paste is used, the substrate 11 on which the wiring pattern 12A, the land pattern 14A, 15A, and part of the conductive pattern 20A, 21A are formed is heated to 100 to 150 ° C. At 20 to 60 minutes.
Further, in the process B, when the ultraviolet curable conductive paste is used, the wiring pattern 12A, the land pattern 14A, 15A, and the conductive patterns 20A, 21A formed on the substrate 11 are irradiated with ultraviolet rays. To do.

 Next, the substrate 11 on which the wiring 12, the land portions 14 and 15, the through wiring 20, and a part of the through wiring 21 are formed is inverted (turned over) so that the wiring 12 faces downward, and the other surface 11 b of the substrate 11 is For example, it is placed on a flat surface such as a work table.

 Thereafter, the wiring 13 and the land portions 16 and 17 are formed on the other surface 11b of the substrate 11 and a part of the through wiring 20 is formed on the inner surface of the through hole 18 in the same manner as in the above-described Step A and Step B. In addition, a part of the through wiring 21 is formed on the inner surface of the through hole 19. Thereby, a part of the through wiring 20 and the through wiring 21 formed from the one surface 11a side of the substrate 11 and a part of the through wiring 20 and the through wiring 21 formed from the other surface 11b side of the substrate 11 are connected. Then, the formation of the through wiring 20 and the through wiring 21 is completed, and the wiring substrate 10 is obtained.

According to the method for manufacturing a wiring board of this embodiment, in step A, one of a plurality of uncoated portions is provided at the center of _one through hole α1 of at least two through holes 18 provided in the board. The slit formation region is shifted in the width direction from the position where the slit formation region of the land portion formation region 33 of the screen plate 30 is arranged so that the centers of the two non-application portions β ₁ overlap, and the uncoated portion β ₁ according start out from a position overlapping the through-hole alpha _1, such as non-coated portions beta ₁ further uncoated portions beta ₂ and satisfies the relationship begin overlapping the through hole alpha ₂ adjacent to the through-hole alpha ₁ Since the land portion pattern having the slit forming region is formed, even when the land portion forming region 33 of the screen plate 30 is misaligned, at least a part of the uncoated portion (air hole) is formed in the through holes 18 and 19. Since it overlaps with the opening, the unapplied portion (air hole) makes it difficult for air to accumulate in the through holes 18 and 19, and the conductive paste flows smoothly into the through holes 18 and 19. , 19 can be coated with an appropriate amount of conductive paste. Therefore, since no breakage occurs in the through wirings 20 and 21 formed by curing the conductive patterns 20A and 21A made of a conductive paste applied to the inner side surfaces of the through holes 18 and 19, the conductivity of the through wirings 20 and 21 is increased. Further improvement can be achieved.

 In this embodiment, a method of manufacturing the wiring substrate 10 is illustrated in which the coil-shaped wiring 12 is formed on one surface 11a of the substrate 11 and the linear wiring 13 is formed on the other surface 11b of the substrate 11. However, the manufacturing method of the wiring board of the present invention is not limited to this. In the method for manufacturing a wiring board according to the present invention, the shape of the wiring formed on one surface and / or the other surface of the substrate may be any shape. Further, in the method of manufacturing a wiring board according to the present invention, a wiring is formed on one of the one surface or the other surface of the substrate, and the surface on which the wiring is formed with the wiring as a base end A through wiring extending over the opposite surface may be formed, and the end of the through wiring may be exposed on the opposite surface. And you may connect the terminal of an electronic component to the edge part of the penetration wiring.

 Moreover, in this embodiment, although the case where the shape of the land part was square shape in planar view was illustrated, the manufacturing method of the wiring board of this invention is not limited to this. In the method for manufacturing a wiring board according to the present invention, the shape of the land portion may be a circular shape in plan view, an elliptical shape, or the like.

DESCRIPTION OF SYMBOLS 10 ... Wiring board, 11 ... Board, 12, 13 ... Wiring, 14, 15, 16, 17 ... Land part, 18, 19 ... Through-hole, 18a, 19a ... Opening End part, 20, 21 ... through wiring, 30 ... screen plate, 31 ... screen base, 32 ... wiring formation area, 33, 34 ... land part formation area, 35, 36, 37 ... Unapplied part.

Claims (1)

A board, a wiring provided on the board, a land portion connected to the wiring, and an inner side surface of the through hole of the board are electrically connected to the wiring and electrically connected to the other surface. And a through wiring for manufacturing a wiring board comprising:
Printed on one surface of a substrate provided with at least two through-holes by a wiring pattern made of a conductive paste and the conductive paste connected to the wiring pattern including the opening end of the through-hole. A land portion pattern, and the land portion pattern is provided with slit-forming regions in which a plurality of uncoated portions of the conductive paste are provided in a slit shape in parallel with a gap therebetween. Forming a conductive pattern made of the conductive paste on the inner surface; and
The wiring pattern, the land portion pattern, and the conductive pattern are cured to form a wiring, a land portion, and a through wiring; and
In the step A, the one of the through holes alpha ₁ in the center of the at least two through holes, so that one non-coated portions beta ₁ in the center of the plurality of uncoated portion overlaps the slit forming As the slit forming region is shifted in the width direction from the position where the region is disposed, and the uncoated portion β ₁ begins to deviate from the position overlapping the through hole α ₁ , the uncoated portion β ₁ wiring board different uncoated portions beta _2, characterized in that to form the land portion pattern having the slit forming region that satisfies the relationship begin overlapping the through hole alpha ₂ adjacent to the through hole alpha ₁ Manufacturing method.

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