JPH05259637A - Method of forming through hole - Google Patents
Method of forming through holeInfo
- Publication number
- JPH05259637A JPH05259637A JP5343592A JP5343592A JPH05259637A JP H05259637 A JPH05259637 A JP H05259637A JP 5343592 A JP5343592 A JP 5343592A JP 5343592 A JP5343592 A JP 5343592A JP H05259637 A JPH05259637 A JP H05259637A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- conductive paste
- printed
- screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、スルーホールに係り、
配線基板の孔にスルーホールを形成する方法に関する。BACKGROUND OF THE INVENTION The present invention relates to a through hole,
The present invention relates to a method of forming a through hole in a hole of a wiring board.
【０００２】[0002]
【従来の技術】従来、ハイブリッドＩＣに使用する配線
基板は配線基板の表裏に形成された回路パターンを接続
するために配線基板に孔を開け、その孔にスルーホール
を形成して表裏の回路パターンを接続していた。図４は
従来のスルーホール形成方法を示す断面図、図５は従来
の配線基板の一面を吸引したスルーホールの断面図、図
６は従来の配線基板の両面を吸引したスルーホールの断
面図である。図４において、１は配線基板で、２は配線
基板に設けた孔である。スクリーン４を孔２の上面に置
いて導電ペーストを印刷すれば、導電ペーストはスクリ
ーン４の円形の転写部５から孔２の上面に転写され、円
形の導電ペースト３を形造る。図５において、配線基板
１の裏面から真空吸引すれば円形の導電ペースト３は配
線基板１の孔２の壁面に付着しスルーホールの上部６を
形成する。次に、図示しないが、配線基板１の裏面から
導電ペーストを印刷すれば、導電ペーストはスクリーン
４の円形の転写部５から孔２の下面に転写され、円形の
導電ペースト３を形造る。配線基板１の上面から真空吸
引すれば円形の導電ペースト３は配線基板１の孔２の壁
面に付着し、先に形成されたスルーホールの上部６と合
体して、図６に示すごとく、スルーホール７が形成され
る。スルーホール７の中央部８はスルーホールの上部６
とスルーホールの下部が合体するためスルーホールの厚
みが厚くなる。スルーホール７を孔２に形成した後、配
線基板１を焼成すると導電ペーストの中の有機物が無く
なり収縮するためスルーホール７の中央部８にクラック
等が入り断線する等の問題があった。2. Description of the Related Art Conventionally, a wiring board used for a hybrid IC has holes formed in the wiring board for connecting circuit patterns formed on the front and back sides of the wiring board, and through holes are formed in the holes to form circuit patterns on the front and back sides. Was connected. 4 is a cross-sectional view showing a conventional through-hole forming method, FIG. 5 is a cross-sectional view of a through-hole sucking one side of a conventional wiring board, and FIG. 6 is a cross-sectional view of a through-hole sucking both sides of a conventional wiring board. is there. In FIG. 4, 1 is a wiring board, and 2 is a hole provided in the wiring board. When the screen 4 is placed on the upper surface of the hole 2 and the conductive paste is printed, the conductive paste is transferred from the circular transfer portion 5 of the screen 4 to the upper surface of the hole 2 to form the circular conductive paste 3. In FIG. 5, when vacuum suction is applied from the back surface of the wiring board 1, the circular conductive paste 3 adheres to the wall surface of the hole 2 of the wiring board 1 to form the upper portion 6 of the through hole. Next, although not shown, if a conductive paste is printed from the back surface of the wiring board 1, the conductive paste is transferred from the circular transfer portion 5 of the screen 4 to the lower surface of the hole 2 to form the circular conductive paste 3. When vacuum suction is applied from the upper surface of the wiring board 1, the circular conductive paste 3 adheres to the wall surface of the hole 2 of the wiring board 1 and merges with the upper portion 6 of the through hole previously formed, and as shown in FIG. Hole 7 is formed. The central portion 8 of the through hole 7 is the upper portion 6 of the through hole.
And the lower part of the through hole are united, the thickness of the through hole becomes thicker. When the wiring board 1 is fired after the through holes 7 are formed in the holes 2, organic substances in the conductive paste are lost and the conductive paste shrinks, so that there is a problem that a crack or the like is formed in the central portion 8 of the through hole 7 and disconnection occurs.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記従来の
技術の問題点に鑑みなされたもので、スルーホールの厚
みを薄く均一にすることでスルーホールに発生するクラ
ックを防止する。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art. By making the thickness of the through hole thin and uniform, cracks occurring in the through hole can be prevented.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
に本発明では、印刷用スクリーンに中心部に非転写部を
設けた同心円の転写部を複数個設け、配線基板の孔の一
面より前記スクリーンにて導電ペーストを印刷し、前記
配線基板の他面より前記導電ペーストを真空吸引して孔
の壁面に付着させ、同様に配線基板の孔の他面より導電
ペーストを印刷し、前記配線基板の一面より前記導電ペ
ーストを真空吸引して孔の壁面に付着するようにしたス
ルーホール形成方法を提供するものである。In order to solve the above problems, the present invention provides a printing screen with a plurality of concentric transfer parts each having a non-transfer part at the center thereof, and the transfer part is provided from one surface of a hole of a wiring board. The conductive paste is printed on the screen, the conductive paste is vacuum-sucked from the other surface of the wiring board to adhere to the wall surface of the hole, and the conductive paste is printed from the other surface of the hole of the wiring board in the same manner. The present invention provides a through hole forming method in which the conductive paste is vacuum-sucked from one surface to adhere to the wall surface of the hole.
【０００５】[0005]
【作用】上記構成によれば、スクリーンに同心円の転写
部を設ける。配線基板の孔の上面より導電ペーストを印
刷し、配線基板の裏面より真空吸引して印刷した導電ペ
ーストを孔の壁面に付着させる。配線基板の孔の下面よ
り導電ペーストを印刷し、配線基板の上面より真空吸引
して印刷した導電ペーストを孔の壁面に付着させること
で厚みの薄い均一なスルーホールを形成する。According to the above construction, the screen is provided with the concentric transfer portion. The conductive paste is printed on the upper surface of the hole of the wiring board, and the printed conductive paste is attached to the wall surface of the hole by vacuum suction from the back surface of the wiring board. A conductive paste is printed from the lower surface of the hole of the wiring board, vacuum suction is applied from the upper surface of the wiring board, and the printed conductive paste is attached to the wall surface of the hole to form a thin and uniform through hole.
【０００６】[0006]
【実施例】本発明の実施例を添付図面を参照して詳細に
説明する。図１は本発明のスルーホール形成方法の一実
施例を示す断面図、図２は本発明のスルーホール形成方
法の一実施例のスルーホールの断面図、図３は本発明の
スルーホール形成方法の他の例を示す断面図である。図
において、１は配線基板で、２は配線基板に設けた孔で
ある。４はスクリーンで、同心円状に転写部１５が設け
られ、スクリーン４の中心部は円状の非転写部１２が設
けられている。スクリーン４を孔２の上面に置いて導電
ペーストを印刷すれば、導電ペーストはスクリーン４の
同心円状の転写部１５から孔２の上面に転写され、同心
円状の導電ペースト１１を形造る。図２において、配線
基板１の裏面から真空吸引すれば同心円状の導電ペース
ト１１は配線基板１の孔２の壁面に付着しスルーホール
の上部１３を形成する。次に、図示しないが、配線基板
１の裏面から導電ペーストを印刷すれば、導電ペースト
はスクリーン４の同心円状の転写部１５から孔２の下面
に転写され、同心円状の導電ペースト１１を形造る。配
線基板１の上面から真空吸引すれば同心円状の導電ペー
スト１１は配線基板１の孔２の壁面に付着し、先に形成
されたスルーホールの上部１３と合体して、図３に示す
ごとく、スルーホール１４が形成される。スルーホール
１４は導電ペーストの中心部にインク（導電ペースト）
がないので薄くかつ均一な厚みに仕上がる。Embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is a sectional view showing an embodiment of a through hole forming method of the present invention, FIG. 2 is a sectional view of a through hole of an embodiment of the through hole forming method of the present invention, and FIG. 3 is a through hole forming method of the present invention. It is sectional drawing which shows the other example. In the figure, 1 is a wiring board, and 2 is a hole provided in the wiring board. A screen 4 is provided with a concentric transfer portion 15 and a circular non-transfer portion 12 is provided at the center of the screen 4. When the screen 4 is placed on the upper surface of the hole 2 and the conductive paste is printed, the conductive paste is transferred from the concentric transfer portion 15 of the screen 4 to the upper surface of the hole 2 to form the concentric conductive paste 11. In FIG. 2, when vacuum suction is applied from the back surface of the wiring board 1, the concentric conductive paste 11 adheres to the wall surface of the hole 2 of the wiring board 1 to form the upper portion 13 of the through hole. Next, although not shown, if a conductive paste is printed from the back surface of the wiring board 1, the conductive paste is transferred from the concentric transfer portion 15 of the screen 4 to the lower surface of the hole 2 to form the concentric conductive paste 11. . When vacuum suction is applied from the upper surface of the wiring board 1, the concentric conductive paste 11 adheres to the wall surface of the hole 2 of the wiring board 1 and is combined with the upper portion 13 of the through hole previously formed, as shown in FIG. Through holes 14 are formed. The through hole 14 is made of ink (conductive paste) at the center of the conductive paste.
Since there is no, it is finished in a thin and uniform thickness.
【０００７】[0007]
【発明の効果】以上のように本発明においては、スルー
ホールが配線基板の孔の壁面に薄く均一に形成されるの
で、従来のように孔の中央部でスルーホールが断線する
ことが無くなる等の効果は大きい。As described above, according to the present invention, since the through hole is formed thinly and uniformly on the wall surface of the hole of the wiring board, there is no possibility that the through hole is disconnected at the central portion of the hole as in the prior art. Has a great effect.
【図１】本発明のスルーホール形成方法の一実施例を示
す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of a through hole forming method of the present invention.
【図２】本発明のスルーホール形成方法の一実施例のス
ルーホールの断面図である。FIG. 2 is a cross-sectional view of a through hole according to an embodiment of the through hole forming method of the present invention.
【図３】本発明のスルーホール形成方法の他の例を示す
断面図である。FIG. 3 is a cross-sectional view showing another example of the through hole forming method of the present invention.
【図４】従来のスルーホール形成方法を示す断面図であ
る。FIG. 4 is a cross-sectional view showing a conventional through hole forming method.
【図５】従来の配線基板の一面を吸引したスルーホール
の断面図である。FIG. 5 is a sectional view of a through hole in which one surface of a conventional wiring board is sucked.
【図６】従来の配線基板の両面を吸引したスルーホール
の断面図である。FIG. 6 is a cross-sectional view of a through hole in which both sides of a conventional wiring board are suctioned.
１ 配線基板 ２ 孔 ３ 円形の導電ペースト ４ スクリーン１ ５ 円形の転写部 ６ スルーホールの上部 ７ スルーホール ８ スルーホールの中央部 11 同心円状の導電ペースト 12 円状の非転写部 13 スルーホールの上部 14 スルーホール 1 wiring board 2 hole 3 circular conductive paste 4 screen 1 5 circular transfer part 6 upper part of through hole 7 through hole 8 central part of through hole 11 concentric conductive paste 12 circular non-transfer part 13 upper part of through hole 14 Through hole
Claims (1)
設けた同心円の転写部を複数個設け、配線基板の孔の一
面より前記スクリーンにて導電ペーストを印刷し、前記
配線基板の他面より前記導電ペーストを真空吸引して孔
の壁面に付着させ、同様に配線基板の孔の他面より導電
ペーストを印刷し、前記配線基板の一面より前記導電ペ
ーストを真空吸引して孔の壁面に付着するようにしたス
ルーホール形成方法。1. A printing screen is provided with a plurality of concentric transfer portions each having a non-transfer portion at the center thereof, and a conductive paste is printed from one surface of a hole of a wiring board onto the other surface of the wiring board. The conductive paste is vacuum-sucked and attached to the wall surface of the hole. Similarly, the conductive paste is printed from the other surface of the hole of the wiring board, and the conductive paste is vacuum-sucked from the one surface of the wiring board to the wall surface of the hole. A method for forming through holes so that they adhere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343592A JPH05259637A (en) | 1992-03-12 | 1992-03-12 | Method of forming through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343592A JPH05259637A (en) | 1992-03-12 | 1992-03-12 | Method of forming through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05259637A true JPH05259637A (en) | 1993-10-08 |
Family
ID=12942771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5343592A Pending JPH05259637A (en) | 1992-03-12 | 1992-03-12 | Method of forming through hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05259637A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011204870A (en) * | 2010-03-25 | 2011-10-13 | Toppan Forms Co Ltd | Method of manufacturing wiring board |
-
1992
- 1992-03-12 JP JP5343592A patent/JPH05259637A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011204870A (en) * | 2010-03-25 | 2011-10-13 | Toppan Forms Co Ltd | Method of manufacturing wiring board |
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