JP5401683B2 - 両面鏡面半導体ウェーハおよびその製造方法 - Google Patents

両面鏡面半導体ウェーハおよびその製造方法 Download PDF

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JP5401683B2
JP5401683B2 JP2008199649A JP2008199649A JP5401683B2 JP 5401683 B2 JP5401683 B2 JP 5401683B2 JP 2008199649 A JP2008199649 A JP 2008199649A JP 2008199649 A JP2008199649 A JP 2008199649A JP 5401683 B2 JP5401683 B2 JP 5401683B2
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polishing
double
wafer
protective film
semiconductor wafer
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JP2010040643A5 (enExample
JP2010040643A (ja
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健夫 加藤
友裕 橋井
和成 高石
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Sumco Corp
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Sumco Corp
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008199649A 2008-08-01 2008-08-01 両面鏡面半導体ウェーハおよびその製造方法 Active JP5401683B2 (ja)

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JP2008199649A JP5401683B2 (ja) 2008-08-01 2008-08-01 両面鏡面半導体ウェーハおよびその製造方法

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JP2010040643A JP2010040643A (ja) 2010-02-18
JP2010040643A5 JP2010040643A5 (enExample) 2011-09-15
JP5401683B2 true JP5401683B2 (ja) 2014-01-29

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2486782A4 (en) 2010-02-25 2015-12-02 Univ Meiji METHOD FOR DIAGNOSIS OF THE NUTRITION OF A PLANT, METHOD FOR RESTORING THE NUTRITION OF A PLANT, DEVICE FOR DIAGNOSIS OF THE NUTRITION OF A PLANT AND DEVICE FOR RECOVERING THE NUTRITION OF A PLANT
JP2013220516A (ja) * 2012-04-18 2013-10-28 Sumitomo Metal Mining Co Ltd ウェハ基板及びその製造方法
JP6232754B2 (ja) * 2013-06-04 2017-11-22 株式会社Sumco 貼合せｓｏｉウェーハの製造方法
JP6234957B2 (ja) * 2015-04-20 2017-11-22 信越半導体株式会社 エピタキシャルウェーハの製造方法
JP2018037671A (ja) * 2017-10-18 2018-03-08 株式会社Sumco シリコンウェーハの研磨方法
JP2023177967A (ja) * 2022-06-03 2023-12-14 信越半導体株式会社 単結晶シリコンウェーハのドライエッチング方法、単結晶シリコンウェーハの製造方法、及び単結晶シリコンウェーハ
KR102834279B1 (ko) * 2023-10-12 2025-07-15 에스케이실트론 주식회사 에피택셜 웨이퍼 및 에피택셜 웨이퍼의 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3169120B2 (ja) * 1995-07-21 2001-05-21 信越半導体株式会社 半導体鏡面ウェーハの製造方法
JPH10303154A (ja) * 1997-04-25 1998-11-13 Sumitomo Sitix Corp 半導体用シリコンウェーハの鏡面研磨方法
CN1610069A (zh) * 2003-05-15 2005-04-27 硅电子股份公司 抛光半导体晶片的方法

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