JP5398141B2 - 白色発光型ｌｅｄランプおよびそれを用いたバックライト並びに液晶表示装置 - Google Patents

白色発光型ｌｅｄランプおよびそれを用いたバックライト並びに液晶表示装置 Download PDF

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Publication number
JP5398141B2
JP5398141B2 JP2007537571A JP2007537571A JP5398141B2 JP 5398141 B2 JP5398141 B2 JP 5398141B2 JP 2007537571 A JP2007537571 A JP 2007537571A JP 2007537571 A JP2007537571 A JP 2007537571A JP 5398141 B2 JP5398141 B2 JP 5398141B2
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Japan
Prior art keywords
phosphor
light emitting
led lamp
activated
emitting
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Expired - Fee Related
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JP2007537571A
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English (en)
Japanese (ja)
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JPWO2007037120A1 (ja
Inventor
井 努 石
川 康 博 白
内 肇 竹
井 亮 酒
屋 恭 正 大
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Toshiba Corp
Toshiba Materials Co Ltd
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Toshiba Corp
Toshiba Materials Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
    • C09K11/641—Chalcogenides
    • C09K11/642—Chalcogenides with zinc or cadmium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/57—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing manganese or rhenium
    • C09K11/572—Chalcogenides
    • C09K11/574—Chalcogenides with zinc or cadmium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/58—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing copper, silver or gold
    • C09K11/582—Chalcogenides
    • C09K11/584—Chalcogenides with zinc or cadmium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7737—Phosphates
    • C09K11/7738—Phosphates with alkaline earth metals
    • C09K11/7739—Phosphates with alkaline earth metals with halogens
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7787—Oxides
    • C09K11/7789—Oxysulfides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
JP2007537571A 2005-09-29 2006-09-12 白色発光型ｌｅｄランプおよびそれを用いたバックライト並びに液晶表示装置 Expired - Fee Related JP5398141B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007537571A JP5398141B2 (ja) 2005-09-29 2006-09-12 白色発光型ｌｅｄランプおよびそれを用いたバックライト並びに液晶表示装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005285621 2005-09-29
JP2005285621 2005-09-29
PCT/JP2006/318054 WO2007037120A1 (ja) 2005-09-29 2006-09-12 白色発光型ｌｅｄランプおよびそれを用いたバックライト並びに液晶表示装置
JP2007537571A JP5398141B2 (ja) 2005-09-29 2006-09-12 白色発光型ｌｅｄランプおよびそれを用いたバックライト並びに液晶表示装置

Publications (2)

Publication Number Publication Date
JPWO2007037120A1 JPWO2007037120A1 (ja) 2009-04-02
JP5398141B2 true JP5398141B2 (ja) 2014-01-29

Family

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JP2007537571A Expired - Fee Related JP5398141B2 (ja) 2005-09-29 2006-09-12 白色発光型ｌｅｄランプおよびそれを用いたバックライト並びに液晶表示装置

Country Status (4)

Country Link
US (1) US7935975B2 (enExample)
JP (1) JP5398141B2 (enExample)
TW (1) TW200805705A (enExample)
WO (1) WO2007037120A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7857992B2 (en) * 2005-03-14 2010-12-28 Kabushiki Kaisha Toshiba White light-emitting lamp, backlight using same, display and illuminating device
JPWO2009144922A1 (ja) * 2008-05-30 2011-10-06 株式会社東芝 白色ｌｅｄおよびそれを用いたバックライトならびに液晶表示装置
JP5284006B2 (ja) * 2008-08-25 2013-09-11 シチズン電子株式会社 発光装置
US8628744B2 (en) * 2009-11-09 2014-01-14 Tufts University Sulfur-tolerant water-gas shift catalysts
DE102010028246A1 (de) * 2010-04-27 2011-10-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
EP3483496B1 (en) 2011-11-07 2020-07-29 Kabushiki Kaisha Toshiba White light source and white light source system including the same
CN104718633B (zh) 2012-10-04 2017-09-26 株式会社东芝 白色发光装置、照明装置、以及牙科用照明装置
US20140145584A1 (en) * 2012-11-27 2014-05-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Hemispherical remoter phosphor and methods of forming the same
JP6097084B2 (ja) * 2013-01-24 2017-03-15 スタンレー電気株式会社 半導体発光装置
JP6273463B2 (ja) * 2013-12-03 2018-02-07 パナソニックＩｐマネジメント株式会社 蛍光体材料および発光装置
JP6017104B1 (ja) * 2015-07-07 2016-10-26 大電株式会社 青緑色発光蛍光体、発光素子、発光装置、及び白色光発光装置
CN107735480A (zh) * 2015-07-07 2018-02-23 大电株式会社 蓝绿色发光荧光体、发光元件、发光装置以及白色光发光装置
JP6459880B2 (ja) * 2015-09-30 2019-01-30 日亜化学工業株式会社 発光装置及びその製造方法
EP3412259B1 (en) * 2016-02-01 2021-06-09 Toshiba Materials Co., Ltd. Light source for myopia-suppressing article
DE102017120642A1 (de) * 2017-09-07 2019-03-07 Osram Opto Semiconductors Gmbh Leuchtdiode, Verwendung einer Leuchtdiode, Verfahren zum Betreiben einer Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
DE102017130574A1 (de) * 2017-12-19 2019-06-19 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Konversionselements und Konversionselement

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002105449A (ja) * 2000-09-28 2002-04-10 Toshiba Corp 緑色発光蛍光体とそれを用いた発光装置
JP2002374006A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
JP2004505470A (ja) * 2000-07-28 2004-02-19 パテント−トロイハント−ゲゼルシヤフト　フユール　エレクトリツシエ　グリユーラムペン　ミツト　ベシユレンクテル　ハフツング 光源として少なくとも１つのｌｅｄを備えた照明ユニット
JP2004088008A (ja) * 2002-08-29 2004-03-18 Okaya Electric Ind Co Ltd 発光ダイオード及びその製造方法
JP2004088011A (ja) * 2002-08-29 2004-03-18 Okaya Electric Ind Co Ltd 発光ダイオード
JP2004331934A (ja) * 2003-05-09 2004-11-25 Kasei Optonix Co Ltd 蛍光体とそれを用いた発光素子
JP2005063837A (ja) * 2003-08-13 2005-03-10 Mitsubishi Chemicals Corp 発光装置及び照明装置ならびに画像表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3950543B2 (ja) * 1998-02-27 2007-08-01 東芝電子エンジニアリング株式会社 Ｌｅｄランプ
JP3949290B2 (ja) * 1998-08-31 2007-07-25 株式会社東芝 表示装置
JP3511987B2 (ja) 1999-09-09 2004-03-29 日亜化学工業株式会社 発光ダイオード
JP3978101B2 (ja) 2002-08-29 2007-09-19 岡谷電機産業株式会社 発光ダイオード及びその製造方法
EP1555306A1 (en) * 2002-09-30 2005-07-20 Kabushiki Kaisha Toshiba Fluorescent material for display unit, process for producing the same and color display unit including the same
JP4880887B2 (ja) * 2004-09-02 2012-02-22 株式会社東芝 半導体発光装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004505470A (ja) * 2000-07-28 2004-02-19 パテント−トロイハント−ゲゼルシヤフト　フユール　エレクトリツシエ　グリユーラムペン　ミツト　ベシユレンクテル　ハフツング 光源として少なくとも１つのｌｅｄを備えた照明ユニット
JP2002105449A (ja) * 2000-09-28 2002-04-10 Toshiba Corp 緑色発光蛍光体とそれを用いた発光装置
JP2002374006A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
JP2004088008A (ja) * 2002-08-29 2004-03-18 Okaya Electric Ind Co Ltd 発光ダイオード及びその製造方法
JP2004088011A (ja) * 2002-08-29 2004-03-18 Okaya Electric Ind Co Ltd 発光ダイオード
JP2004331934A (ja) * 2003-05-09 2004-11-25 Kasei Optonix Co Ltd 蛍光体とそれを用いた発光素子
JP2005063837A (ja) * 2003-08-13 2005-03-10 Mitsubishi Chemicals Corp 発光装置及び照明装置ならびに画像表示装置

Also Published As

Publication number Publication date
US20090272985A1 (en) 2009-11-05
TW200805705A (en) 2008-01-16
WO2007037120A1 (ja) 2007-04-05
JPWO2007037120A1 (ja) 2009-04-02
TWI322514B (enExample) 2010-03-21
US7935975B2 (en) 2011-05-03

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