JP5396597B2 - 保護被膜のための接着層 - Google Patents
保護被膜のための接着層 Download PDFInfo
- Publication number
- JP5396597B2 JP5396597B2 JP2007101225A JP2007101225A JP5396597B2 JP 5396597 B2 JP5396597 B2 JP 5396597B2 JP 2007101225 A JP2007101225 A JP 2007101225A JP 2007101225 A JP2007101225 A JP 2007101225A JP 5396597 B2 JP5396597 B2 JP 5396597B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- layer
- silicon
- thickness
- carbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012790 adhesive layer Substances 0.000 title claims description 77
- 239000011253 protective coating Substances 0.000 title description 22
- 239000010410 layer Substances 0.000 claims description 79
- 229910052710 silicon Inorganic materials 0.000 claims description 47
- 239000010703 silicon Substances 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 34
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 31
- 229910052799 carbon Inorganic materials 0.000 claims description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 21
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 43
- 238000000576 coating method Methods 0.000 description 37
- 230000007797 corrosion Effects 0.000 description 37
- 238000005260 corrosion Methods 0.000 description 37
- 239000011248 coating agent Substances 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 24
- 239000010408 film Substances 0.000 description 17
- 238000012360 testing method Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000000151 deposition Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000001050 lubricating effect Effects 0.000 description 4
- 238000003969 polarography Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000001659 ion-beam spectroscopy Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000013068 control sample Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 238000007736 thin film deposition technique Methods 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000007737 ion beam deposition Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/40—Protective measures on heads, e.g. against excessive temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
Landscapes
- Magnetic Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/400,957 | 2006-04-10 | ||
| US11/400,957 US7495865B2 (en) | 2006-04-10 | 2006-04-10 | Adhesion layer for protective overcoat |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007299511A JP2007299511A (ja) | 2007-11-15 |
| JP2007299511A5 JP2007299511A5 (enExample) | 2010-05-27 |
| JP5396597B2 true JP5396597B2 (ja) | 2014-01-22 |
Family
ID=38574974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007101225A Expired - Fee Related JP5396597B2 (ja) | 2006-04-10 | 2007-04-09 | 保護被膜のための接着層 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7495865B2 (enExample) |
| JP (1) | JP5396597B2 (enExample) |
| CN (2) | CN104616669A (enExample) |
| SG (1) | SG136897A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100053817A1 (en) * | 2008-09-04 | 2010-03-04 | Robert Glenn Biskeborn | Coated magnetic head and methods for fabrication thereof |
| JP2010108532A (ja) * | 2008-10-28 | 2010-05-13 | Toshiba Storage Device Corp | ヘッドスライダ |
| US20110058279A1 (en) * | 2009-07-31 | 2011-03-10 | Flint Eric | Overcoat having a low silicon/carbon ratio |
| US20110032640A1 (en) * | 2009-08-10 | 2011-02-10 | Hitachi Global Storage Technologies Netherlands B.V. | Multi-layer, thin film overcoat for magnetic media disk |
| US8611043B2 (en) | 2011-06-02 | 2013-12-17 | International Business Machines Corporation | Magnetic head having polycrystalline coating |
| US8472134B2 (en) | 2011-08-02 | 2013-06-25 | HGST Netherlands B.V. | Air bearing surface overcoat with soft intermediate film, and methods of producing the same |
| EP2878862B1 (en) * | 2012-07-25 | 2016-09-21 | NOK Corporation | Fluorine-resin sealing ring |
| US9093102B1 (en) | 2013-03-12 | 2015-07-28 | Western Digital Technologies, Inc. | Systems and methods for tuning seed layer hardness in components of magnetic recording systems |
| US9570101B2 (en) | 2013-08-28 | 2017-02-14 | Seagate Technology Llc | Magnetic adhesion layer and method of forming same |
| US9805748B1 (en) | 2014-06-24 | 2017-10-31 | Western Digital (Fremont), Llc | System and method for providing a protective layer having a graded intermediate layer |
| CN110564334B (zh) * | 2018-06-05 | 2022-01-04 | 德莎欧洲股份公司 | 低温反应固化型粘合剂的耐湿热性和耐化学试剂腐蚀性的提高 |
| US10971176B2 (en) | 2019-02-21 | 2021-04-06 | International Business Machines Corporation | Tunnel magnetoresistive sensor with adjacent gap having chromium alloy seed layer and refractory material layer |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4130847A (en) | 1977-03-31 | 1978-12-19 | International Business Machines Corporation | Corrosion resistant thin film head assembly and method for making |
| US4647494A (en) | 1985-10-31 | 1987-03-03 | International Business Machines Corporation | Silicon/carbon protection of metallic magnetic structures |
| US5175658A (en) | 1990-12-27 | 1992-12-29 | International Buiness Machines Corporation | Thin film magnetic head having a protective coating and method for making same |
| US5271802A (en) | 1990-12-27 | 1993-12-21 | International Business Machines Corporation | Method for making a thin film magnetic head having a protective coating |
| US5159508A (en) | 1990-12-27 | 1992-10-27 | International Business Machines Corporation | Magnetic head slider having a protective coating thereon |
| EP0689233B1 (en) * | 1994-06-24 | 2008-10-15 | Sumitomo Electric Industries, Limited | Wafer and method of producing same |
| JP3081893B2 (ja) | 1994-12-19 | 2000-08-28 | シーゲイト テクノロジー インコーポレーテッド | ディスクドライブ用のスライダ、ディスクドライブ、ならびにディスクドライブ用のヘッドを作る方法 |
| US5948532A (en) | 1996-12-10 | 1999-09-07 | International Business Machines Corporation | Cermet adhesion layer with carbonaceous wear layer for head/disk interfaces |
| US5858182A (en) * | 1997-03-20 | 1999-01-12 | Headway Technoloies, Inc. | Bilayer carbon overcoating for magnetic data storage disks and magnetic head/slider constructions |
| US6184572B1 (en) | 1998-04-29 | 2001-02-06 | Novellus Systems, Inc. | Interlevel dielectric stack containing plasma deposited fluorinated amorphous carbon films for semiconductor devices |
| US6136421A (en) | 1998-07-21 | 2000-10-24 | Seagate Technology Llc | Magneto-resistance recording media comprising multilayered protective overcoats |
| US6583953B1 (en) | 1999-07-12 | 2003-06-24 | Mark Lauer | Silicon carbide overcoats for information storage systems and method of making |
| US6580170B2 (en) * | 2000-06-22 | 2003-06-17 | Texas Instruments Incorporated | Semiconductor device protective overcoat with enhanced adhesion to polymeric materials |
| US6638608B1 (en) | 2001-03-16 | 2003-10-28 | Seagate Technology Llc | Protection overcoat for recording media |
| US6664685B2 (en) | 2001-11-16 | 2003-12-16 | Seagate Technology Llc | High adhesion, wear resistant coatings for spindle motors in disk drive/storage applications |
| US6961213B2 (en) | 2002-06-24 | 2005-11-01 | Seagate Technology Llc | Disk drive spindle motor having hydrodynamic bearing working surface with low friction layer formed on wear resistant layer |
| JP3585917B2 (ja) * | 2002-07-11 | 2004-11-10 | Ｔｄｋ株式会社 | 薄膜磁気ヘッド、その製造方法及びそれを用いた磁気ディスク装置 |
| WO2004014644A1 (ja) * | 2002-08-07 | 2004-02-19 | Kabushiki Kaisha Toyota Chuo Kenkyusho | 密着層を備える積層体及び保護膜を備える積層体 |
| JP4169743B2 (ja) * | 2003-02-19 | 2008-10-22 | 富士通株式会社 | 磁気ヘッドスライダ |
| US7175926B2 (en) | 2004-02-12 | 2007-02-13 | Seagate Technology Llc | Dual-layer carbon-based protective overcoats for recording media by filtered cathodic ARC deposition |
| JP2007523497A (ja) * | 2004-02-20 | 2007-08-16 | アクテル・コーポレイシヨン | 炭素含有アンチヒューズ材料を使用した再プログラム可能な金属−金属間のアンチヒューズ |
| US20060012014A1 (en) * | 2004-07-15 | 2006-01-19 | International Business Machines Corporation | Reliability of low-k dielectric devices with energy dissipative layer |
| JP2006107673A (ja) * | 2004-10-08 | 2006-04-20 | Shinka Jitsugyo Kk | 磁気ヘッド及びその製造方法、並びにヘッドサスペンションアセンブリ |
-
2006
- 2006-04-10 US US11/400,957 patent/US7495865B2/en active Active
-
2007
- 2007-03-26 SG SG200702706-3A patent/SG136897A1/en unknown
- 2007-04-09 JP JP2007101225A patent/JP5396597B2/ja not_active Expired - Fee Related
- 2007-04-09 CN CN201510079514.5A patent/CN104616669A/zh active Pending
- 2007-04-09 CN CNA2007100968883A patent/CN101055723A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US7495865B2 (en) | 2009-02-24 |
| SG136897A1 (en) | 2007-11-29 |
| CN104616669A (zh) | 2015-05-13 |
| US20070236837A1 (en) | 2007-10-11 |
| CN101055723A (zh) | 2007-10-17 |
| JP2007299511A (ja) | 2007-11-15 |
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