JP5387833B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5387833B2
JP5387833B2 JP2009179749A JP2009179749A JP5387833B2 JP 5387833 B2 JP5387833 B2 JP 5387833B2 JP 2009179749 A JP2009179749 A JP 2009179749A JP 2009179749 A JP2009179749 A JP 2009179749A JP 5387833 B2 JP5387833 B2 JP 5387833B2
Authority
JP
Japan
Prior art keywords
light emitting
light
emitting device
reflecting surface
emitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009179749A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009246407A (ja
JP2009246407A5 (enExample
Inventor
剛 金子
高司 武田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2009179749A priority Critical patent/JP5387833B2/ja
Publication of JP2009246407A publication Critical patent/JP2009246407A/ja
Publication of JP2009246407A5 publication Critical patent/JP2009246407A5/ja
Application granted granted Critical
Publication of JP5387833B2 publication Critical patent/JP5387833B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2009179749A 2009-07-31 2009-07-31 発光装置 Expired - Fee Related JP5387833B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009179749A JP5387833B2 (ja) 2009-07-31 2009-07-31 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009179749A JP5387833B2 (ja) 2009-07-31 2009-07-31 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2008080280A Division JP5170406B2 (ja) 2008-03-26 2008-03-26 発光装置

Publications (3)

Publication Number Publication Date
JP2009246407A JP2009246407A (ja) 2009-10-22
JP2009246407A5 JP2009246407A5 (enExample) 2012-04-05
JP5387833B2 true JP5387833B2 (ja) 2014-01-15

Family

ID=41307906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009179749A Expired - Fee Related JP5387833B2 (ja) 2009-07-31 2009-07-31 発光装置

Country Status (1)

Country Link
JP (1) JP5387833B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5387845B2 (ja) * 2009-11-20 2014-01-15 セイコーエプソン株式会社 発光装置およびプロジェクター
JP5429479B2 (ja) * 2009-11-24 2014-02-26 セイコーエプソン株式会社 発光装置、およびプロジェクター
JP5299251B2 (ja) * 2009-12-09 2013-09-25 セイコーエプソン株式会社 発光装置およびプロジェクター
JP5894983B2 (ja) * 2010-07-08 2016-03-30 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． リードフレームｌｅｄ照明アセンブリ
JP5644221B2 (ja) 2010-07-14 2014-12-24 セイコーエプソン株式会社 発光装置、照明装置、およびプロジェクター
JP6447580B2 (ja) 2016-06-15 2019-01-09 日亜化学工業株式会社 発光装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07209764A (ja) * 1994-01-18 1995-08-11 Nikon Corp 光源装置
JPH11340574A (ja) * 1998-05-28 1999-12-10 Hitachi Ltd 光半導体装置およびその装置に組み込まれる光半導体素子
JP4565690B2 (ja) * 2000-02-28 2010-10-20 日本碍子株式会社 第二高調波発生装置

Also Published As

Publication number Publication date
JP2009246407A (ja) 2009-10-22

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