JP5383065B2 - Planar electromagnetic actuator and manufacturing method thereof - Google Patents

Description

  The present invention relates to a planar electromagnetic actuator manufactured using a semiconductor manufacturing technique and a manufacturing method thereof, and more particularly to a technique for improving driving efficiency of a movable part.

Conventionally, as this type of planar electromagnetic actuator, as described in Patent Document 1, for example, a semiconductor substrate is anisotropically etched to provide a frame-shaped fixed portion, a movable portion, and a movable portion on the fixed portion. A static magnetic field generating means that integrally forms a torsion bar that is pivotally supported, has a drive coil on the movable portion, and applies a static magnetic field to the drive coil portions at both ends of the movable portion parallel to the axial direction of the torsion bar When a current is supplied to the drive coil from an external drive circuit (for example, a permanent magnet), the drive force (Lorentz force) generated by the interaction between the magnetic field generated in the drive coil and the static magnetic field of the permanent magnet is applied to the movable part. It is the structure which acts and the movable part drives around the axis | shaft of a torsion bar. The current supply to the drive coil on the movable part that rotates is made so that the drive coil and the external connection terminal provided on the fixed part are electrically connected by the lead-out wiring part wired on the torsion bar. Yes.
Japanese Patent No. 2722314

  However, as in Patent Document 1, in the configuration in which wiring is performed on the torsion bar, when the movable portion swings, the stress of the wiring portion (when a protective film (for example, polyimide) is coated on the wiring) The movement (twisting) of the torsion bar is hindered by the stress of the wiring and the protective film. For this reason, there is a problem that the driving efficiency is lowered as compared with the case where there is no wiring portion on the torsion bar.

  The present invention has been made paying attention to the above problems, and a planar electromagnetic actuator capable of suppressing a decrease in driving efficiency caused by a lead wiring portion that electrically connects a driving coil and an external connection terminal, and a method of manufacturing the same. The purpose is to provide.

For this reason, the present invention provides a driving coil portion that is integrally formed on a semiconductor substrate with a fixed portion, a movable portion, and a torsion bar that pivotally supports the movable portion on the fixed portion so as to swing. And a lead-out wiring portion for wiring through the torsion bar portion so as to electrically connect the driving coil portion to an external electrode terminal disposed on the fixed portion, and a current is supplied to the driving coil portion. In the planar type electromagnetic actuator that drives the movable part by electromagnetic force generated by supplying the lead wire, the lead-out wiring part in the conductive pattern including the drive coil part and the lead-out wiring part is floated.
In such a configuration, the movement of the torsion bar is not restricted by the torsion bar wiring portion of the lead-out wiring portion.

  According to a second aspect of the present invention, in the conductive pattern, the drive coil portion and the lead-out wiring portion may be integrally formed of the same material.

  According to a third aspect of the present invention, the conductive pattern may be formed by forming the torsion bar wiring portion of the lead wiring portion and other conductive pattern portions from different materials, and forming the torsion bar wiring portion from a material having a high Young's modulus. Good.

  According to a fourth aspect of the present invention, the conductive pattern may be formed directly on the semiconductor substrate. Further, as in the fifth aspect, the conductive pattern is formed on a flexible insulating sheet, and the flexible pattern is formed. The structure which adhere | attaches an insulating sheet on the said semiconductor substrate may be sufficient.

Further, according to the manufacturing method of the present invention, as in claim 6 , the fixed portion, the movable portion, and the torsion bar that pivotally supports the movable portion so as to be swingable on the fixed portion are integrally formed on a semiconductor substrate, A conductive pattern comprising a drive coil portion provided on the movable portion and a lead-out wiring portion for wiring through the torsion bar portion so as to electrically connect the drive coil portion to an external electrode terminal disposed on the fixed portion. A planar type electromagnetic actuator for driving the movable part by electromagnetic force generated by supplying a current to the drive coil part, wherein at least the torsion bar wiring part of the lead-out wiring part is made of a material having a high Young's modulus By providing the conductive pattern formed in and swinging the movable part around the axis of the torsion bar, the torsion bar wiring part of the lead wiring part is Serial is peeled from the torsion bar, characterized in that float by.

Further, according to the manufacturing method of the present invention, as in claim 7 , a fixed portion, a movable portion, and a torsion bar that pivotally supports the movable portion so as to be able to swing on the fixed portion are integrally formed on a semiconductor substrate, A conductive pattern comprising a drive coil portion provided on the movable portion and a lead-out wiring portion for wiring through the torsion bar portion so as to electrically connect the drive coil portion to an external electrode terminal disposed on the fixed portion. In a method for manufacturing a planar electromagnetic actuator having an electromagnetic force generated by supplying a current to the drive coil unit and driving the movable unit, a conductive pattern including the drive coil unit and the lead-out wiring unit is flexible. A sheet portion corresponding to the torsion bar wiring portion of the lead-out wiring portion in the flexible insulating sheet is formed on the upper side of the torsion bar. In such a state, the flexible insulating sheet is bonded to the movable portion and the fixed portion of the semiconductor substrate, whereby the torsion bar wiring portion of the lead-out wiring portion is floated from the torsion bar. .

According to the planar type electromagnetic actuator of the present invention, since the lead wiring part in the conductive pattern composed of the drive coil part and lead wiring part formed by using the semiconductor manufacturing technology is floated, the movement of the torsion bar is restrained by the lead wiring part. It will not be done. Therefore, the same swing angle of the movable part as in the conventional case can be obtained with a small supply current, and the drive efficiency of the electromagnetic actuator can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view of a first embodiment of a planar electromagnetic actuator according to the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG.
The planar electromagnetic actuator 1 of this embodiment includes a movable part 4 pivotally supported by a frame-like fixed part 2 via a pair of torsion bars 3 and 3, and a drive coil 5A that generates a magnetic field when energized. And, for example, permanent magnets 6 and 6 as a static magnetic field generating means for applying a static magnetic field to the drive coil 5A. A driving force (Lorentz force) is applied to both end edges of the movable portion 4 parallel to the axial direction of the bars 3 and 3 to rotate the movable portion 4.

  The fixed part 2, the torsion bars 3, 3 and the movable part 4 are integrally formed by anisotropically etching a semiconductor substrate such as a silicon substrate.

As shown in FIG. 1, the drive coil 5A is wound along the periphery of the movable part 4 and a pair of external connections formed on the fixed part 2 by a lead wiring part 5B wired through the torsion bars 3 and 3 part. Electrically connected to terminals 7 and 7. These drive coil 5A, lead wiring part 5B, and external connection terminals 7 and 7 are formed on a SiO ₂ insulating layer 8 (shown in FIG. 2) provided on the surface of the silicon substrate except for the torsion bars 3 and 3 as will be described later. Formed and electrically insulated from the silicon substrate. As shown in FIG. 2, the lead wire portion 5B is provided with its torsion bar wire portion floating from the torsion bars 3 and 3 from which the SiO ₂ insulating layer 8 has been removed. The drive coil 5A and the lead-out wiring portion 5B are composed of a conductive pattern 5 formed using a semiconductor manufacturing technique such as photolithography. This embodiment shows an example in which the conductive pattern 5 including the drive coil 5A and the lead-out wiring portion 5B is formed of gold that does not require a protective film and is not easily corroded. In FIG. 2, reference numeral 9 denotes a reflection mirror for optical scanning. Needless to say, however, in the case of an electromagnetic actuator used for an application that does not require optical scanning, it is not necessary to provide the reflection mirror 9.

  The permanent magnets 6 and 6 are provided outside the fixed portion 2 so that opposite magnetic poles face each other across the movable portion 4 as shown in the figure. An electromagnet can also be used as the static magnetic field generating means.

The operation of the planar type electromagnetic actuator of this embodiment will be described.
The driving principle of the movable portion 4 is the same as in the prior art. When a current is supplied from an external drive circuit (not shown) to the drive coil 5A on the movable portion 4 via the external connection terminals 7 and 7 and the lead wiring portion 5B, a magnetic field is generated. Occur. Due to the interaction between this magnetic field and the static magnetic field generated by the permanent magnets 6 and 6, a driving force (Lorentz force) in opposite directions is generated at both end edges of the movable part 4 parallel to the axial direction of the torsion bars 3 and 3. The movable part 4 rotates around the torsion bars 3 and 3 as the axis center. With this turning operation, the torsion bars 3 and 3 are twisted to generate a spring force in the torsion bars 3 and 3, and the movable portion 4 is rotated to a position where the spring force and the generated driving force are balanced. If an alternating current such as a sine wave is passed through the drive coil 5A, the movable part 4 can be swung. As a result, if the movable mirror 4 is provided with the reflecting mirror 9 as shown in FIG. 2, the light beam can be deflected and scanned, and the frequency of the alternating current supplied to the drive coil 5A is set to the resonance of the oscillating motion of the movable member 4. If the frequency is set, an optical scanning device capable of continuous scanning at a constant period can be realized.

  In the present embodiment, as shown in FIG. 2, in the structure in which the lead wiring portion 5B is lifted from the torsion bars 3 and 3, the torsional stress of the lead wiring portion 5B does not directly act on the torsion bars 3 and 3, The movement of the torsion bars 3 and 3 is not restricted by the stress of the wiring part 5B. For this reason, the movable part 4 can be rotated with a large deflection angle even with the same supply current as compared with the conventional structure. In other words, when the movable part 4 is driven with the same deflection angle as in the prior art, a small amount of current is required, so that the drive efficiency of the electromagnetic actuator 1 is improved and power consumption can be reduced.

Next, the manufacturing method of the electromagnetic actuator of this invention which has the structure which floated the torsion bar wiring part of the extraction | drawer wiring part 5B is demonstrated.
A sacrificial layer etching method will be described as a first method.
FIG. 3 shows an example in which a SiO ₂ film 8 as an insulating layer formed by oxidation of a silicon substrate is used as a sacrificial layer. An SOI (Silicon On Insulator) substrate was used as the semiconductor substrate.

A case where the conductive pattern 5 (the drive coil 5A and the lead-out wiring portion 5B) is formed of a metal material such as gold that does not cause corrosion as in the electromagnetic actuator 1 of FIG. 1 will be described.
The process up to the step of removing the SiO ₂ insulating layer 8 in the torsion bars 3 and 3 is performed in the same manner as in the prior art. For example, after forming the SiO ₂ insulating layer 8 a top surface of the silicon substrate is thermally oxidized, a thin film of gold is formed by a known film formation technique such as sputtering SiO ₂ insulating layer 8 over the entire surface, the resist thereon coating Then, a resist pattern is formed leaving the resist of the wiring portions of the drive coil 5A, the lead wiring portion 5B, and the external electrode terminal portions 7 and 7. Using this as a mask, the gold thin film is etched to form the drive coil 5A, the lead-out wiring portion 5B, and the external connection terminals 7 and 7 on the SiO ₂ insulating layer 8. Next, the portions corresponding to the fixed portion 2, the torsion bars 3, 3 and the movable portion 4 on the lower surface of the silicon substrate are covered with a resist mask, and the fixed portion 2, the pair of torsion bars 3, 3 and the movable portion are subjected to anisotropic etching. 4 is formed, and a planar shape as shown in FIG. 1 is formed. When the reflection mirror 9 is provided, the reflection mirror 9 made of aluminum or the like may be formed on the back surface side of the movable portion 4 by vapor deposition or the like. Thereby, the electromagnetic actuator in the state of FIG. 3 is completed.

In the present embodiment, further, except for the SiO ₂ insulating layer 8 of the torsion bar 3, 3 parts, after masking the entire SiO ₂ insulating layer 8 with a resist by wet etching or dry etching, the torsion bar 3, 3 parts The SiO ₂ insulating layer 8 is removed. As a result, as shown in FIG. 2, a space 10 is formed between the torsion bar wiring portion of the lead wiring portion 5B and the torsion bars 3 and 3, and the torsion bar wiring portion of the lead wiring portion 5B is replaced by the torsion bar 3 , 3 is formed.

In the above example, an example in which the SiO ₂ insulating layer 8 is used as the sacrificial layer has been described. However, an organic substance such as a resist may be provided as the sacrificial layer separately from the SiO ₂ insulating layer 8 and removed.

In this case, before forming the wiring patterns of the drive coil 5A, the lead wiring part 5B and the external connection terminals 7 and 7 in the above, a resist is applied to the entire surface of the SiO ₂ insulating layer 8, and then the torsion bar 3 is etched. , A resist is left as a sacrificial layer only on the three portions of the SiO ₂ insulating layer 8. Thereafter, the drive coil 5A, the lead wiring part 5B, and the external connection terminals 7 and 7 are formed. At this stage, as shown in FIG. 4A, an electromagnetic actuator is obtained in which the resist sacrificial layer 11 (shaded portion in the figure) remains between the torsion bars 3 and 3 and the lead wiring part 5B. Thereafter, by removing the resist sacrificial layer 11, a space 10 is formed in the torsion bar wiring portion of the lead wiring portion 5B as shown in FIG. 4B, and the torsion bar wiring portion of the lead wiring portion 5B is torsioned. The electromagnetic actuator 1 is formed in a state of floating from the bars 3 and 3.

  Next, an electromagnetic actuator in the case where the conductive pattern 5 (drive coil 5A, lead-out wiring portion 5B) is formed of a metal material that may be corroded and requires a protective film, such as aluminum or copper, will be described.

FIG. 5 shows a plan view of such an electromagnetic actuator as a second embodiment of the present invention.
The electromagnetic actuator 20 has the same configuration as that of the electromagnetic actuator 1 of FIG. 1 except that the conductive pattern 5 including the drive coil 5A and the lead wiring portion 5B is covered with a protective film 21 made of, for example, polyimide. In FIG. 5, the permanent magnets 6 and 6 are not shown. The same elements as those in FIG. 1 are denoted by the same reference numerals.

The formation of the protective film 21 is the same as in the prior art. For example, after forming the SiO ₂ insulating layer 8, photosensitive polyimide is applied to the entire upper surface of the silicon substrate. Here, for example, when positive polyimide is used, the external connection terminals 7, 7, the movable portion 4 and the torsion bars 3, 3, and the portion corresponding to the lead-out wiring portion of the fixed portion 2 are masked. And UV exposure. In the case of positive type photosensitive polyimide, the exposed portion is dissolved in the developer, and therefore the photosensitive polyimide in the portion other than the mask portion is removed by development. Next, external connection terminals 7 and 7, drive coil 5A, lead wiring part 5B are formed, and thereafter, in the same manner as described above, except for external connection terminals 7 and 7, movable part 4 and torsion bars 3 and 3 parts, A protective film of photosensitive polyimide is formed on the portion corresponding to the lead-out wiring portion of the fixed portion 2. Thereby, the drive coil 5A and the lead-out wiring part 5B covered with the protective film 21 as shown in FIG. 6 are formed.

Also in this case, if the SiO ₂ insulating layer 8 on the surface of the torsion bars 3 and 3 is removed as in the case of the first embodiment, as shown in FIG. 6, the torsion bars 3 and 3 and the lead wiring portion 5B A space portion 10 is formed between the torsion bar wiring portion and the torsion bar wiring portion of the lead-out wiring portion 5B is lifted from the torsion bars 3 and 3. FIG. 6 shows a cross-sectional view taken along the line BB in FIG.

  Further, in the case of the electromagnetic actuator 20 provided with the protective film 21, the sacrificial layer 11 such as a resist may be provided as shown in FIG.

Next, as a second method, a method of peeling the torsion bar wiring portion of the lead wiring portion 5B from the torsion bar will be described.
In this case, at least the torsion bar wiring part of the lead wiring part 5B is formed of a metal material having a high Young's modulus, such as titanium (Ti) or tungsten (W). In addition, you may integrally form the drive coil 5A and the lead wiring part 5B of the conductive pattern 5 with a metal material with a high Young's modulus.

In this method, after the electromagnetic actuator is formed, the movable portion 4 is driven to swing so that the torsion bar wiring portion of the lead wiring portion 5B is peeled off from the surface of the torsion bars 3 and 3. As a result, as shown in FIGS. 8 and 9, the torsion bar wiring portion of the lead-out wiring portion 5 </ b> B is lifted from the torsion bars 3 and 3, and the space portion 10 is formed therebetween. FIG. 8 shows an example in which the protective film 21 is not provided on the torsion bar wiring part of the lead wiring part 5B, and FIG. 9 shows an example in which the protective film 21 is provided also on the torsion bar wiring part of the lead wiring part 5B. The SiO ₂ insulating layer 8 is not provided and the protective film 21 is an insulating layer.

  In FIG. 9, it is desirable to use a material with low adhesiveness as the protective film 21. In this case, the entire protective film may be made of a material with low adhesiveness, and the protective film for the torsion bar wiring portion of the lead-out wiring portion 5B. Only a material with weak adhesiveness may be used.

  Next, as a third method, a flexible printed circuit board (hereinafter referred to as FPC) in which the drive coil 5A and the conductive pattern 5 of the lead-out wiring portion 5B are formed on a flexible insulating sheet is separately manufactured. A method for attaching to the substrate will be described.

  In this method, the semiconductor substrate is anisotropically etched to form the fixed portion 2, the torsion bars 3, 3 and the movable portion 4, while the driving coil 5 </ b> A and the lead wiring portion are formed on the flexible insulating sheet as shown in FIG. 10. The FPC 31 on which the 5B conductive pattern 5 is formed is manufactured separately. And the sheet | seat part corresponding to the torsion bar wiring part of the extraction | drawer wiring part 5B of FPC31 produced was bent to the upper side of the torsion bars 3 and 3 as shown in FIG. The fixing part 2 is adhered with an adhesive 32. As a result, the torsion bar wiring portion of the lead-out wiring portion 5B has a structure floating from the torsion bars 3 and 3, and the space portion 10 is formed therebetween.

  In the above-described embodiment, an example of a one-dimensional drive electromagnetic actuator has been described, but it goes without saying that the present invention can also be applied to a two-dimensional drive electromagnetic actuator.

12 and 13 show an example of a two-dimensional drive type electromagnetic actuator.
FIG. 12 is a plan view of an embodiment of a planar electromagnetic actuator of a two-dimensional drive type. 13 is a cross-sectional view taken along the line CC of FIG. In addition, the same code | symbol is attached | subjected to the same element as embodiment of FIG.

  The two-dimensional drive electromagnetic actuator 40 of the present embodiment includes a frame-shaped outer movable portion 4A that is pivotally supported on the fixed portion 2 via outer torsion bars 3A and 3A as a movable portion, and an outer movable portion 4A. Are provided with outer torsion bars 3A and 3A and inner movable parts 4B that are pivotally supported via inner torsion bars 3B and 3B whose axial directions are perpendicular to each other. The conductive pattern includes an outer drive coil 5A provided on the outer movable portion 4A (indicated by a single line in the drawing for simplification of the drawing) and a pair of external connection terminals provided with the outer drive coil 5A on the fixed portion 2. 7A, an outer conductive pattern 5 comprising an outer lead wiring portion 5B electrically connected to 7A, and an inner drive coil 5A ′ (shown by a single line in the figure for simplification of the drawing) provided on the inner movable portion 4B. The inner drive coil 5A ′ includes an inner conductive pattern 5 ′ including an inner lead wiring portion 5B ′ that electrically connects the pair of external connection terminals 7B and 7B provided on the fixed portion 2.

  In the outer conductive pattern 5, the outer drive coil 5A is wound along the periphery of the frame-shaped outer movable portion 4A, and the outer lead-out wiring portion 5B is one of the outer torsion bars 3A and 3A (the lower side in the figure). The outer drive coil 5A is connected to the external connection terminals 7A and 7A.

  In the inner conductive pattern 5 ', the inner drive coil 5A' is wound around the inner movable portion 4B in the same manner as in FIG. 1, and the inner lead wiring portion 5B 'is formed on both inner torsion bars 3B and 3B. It is pulled out to the fixed portion 2 side through the other portion (upper side in the drawing) of the portion 4A and the outer torsion bars 3A, 3A, and the inner drive coil 5A 'is connected to the external connection terminals 7B, 7B.

Then, as shown in FIG. 13, the lead-out wiring portions 5B and 5B 'of both the conductive patterns 5 and 5' have their torsion bar wiring portions etched on the sacrificial layer of the SiO ₂ insulating layer 8 formed on the semiconductor substrate. It is provided in a state where it floats from the outer torsion bars 3A, 3A and the inner torsion bars 3B, 3B through the space portion 10 formed by this. In addition, this embodiment is an example at the time of forming each conductive pattern with metal materials, such as gold | metal | money which does not need a protective film and does not corrode like the embodiment of FIG.

  Although not shown, a pair of static magnetic field generating means (permanent magnets, electromagnets, etc.) facing opposite magnetic poles across the outer movable portion 4A and the inner movable portion 4B on the outside of the fixed portion 2 are orthogonal to each other. And both end edges of the outer movable coil 4A parallel to the axial direction of the outer torsion bars 3A, 3A and both ends of the outer movable coil 4A parallel to the axial direction of the inner torsion bars 3B, 3B. This is a configuration in which a static magnetic field is applied to the inner drive coil 5A ′ portion of the portion.

  FIG. 12 shows an example in which the torsion bar wiring portion of the lead-out wiring portion is lifted from the torsion bar by the above-described first method (method by sacrificial layer etching), but the two-dimensional drive type electromagnetic actuator is also described above. Needless to say, the second method (the method of peeling by the swinging motion of the movable part) and the third method (the method of attaching the FPC) can be applied as appropriate.

The top view which shows one Embodiment of the one-dimensional drive type electromagnetic actuator which concerns on this invention. AA arrow sectional drawing of FIG. Explanatory drawing of the method by the sacrifice layer etching which is the 1st manufacturing method of this invention. Explanatory drawing of another method by sacrificial layer etching. The top view which shows another embodiment of the one-dimensional drive electromagnetic actuator which concerns on this invention. BB arrow sectional drawing of FIG. Explanatory drawing of another method by sacrificial layer etching with respect to the electromagnetic actuator of FIG. Explanatory drawing of the method of peeling by movable part rocking | fluctuation operation | movement which is the 2nd manufacturing method of this invention. Explanatory drawing of the method of peeling by movable part rocking | fluctuation operation | movement with a protective film. The figure which shows the example of a flexible printed circuit board. Explanatory drawing of the method of affixing the flexible printed circuit board which is the 3rd manufacturing method of this invention. The top view which shows embodiment of the two-dimensional drive type electromagnetic actuator which concerns on this invention. CC sectional view taken on the line of FIG.

Explanation of symbols

1, 20, 40 Electromagnetic actuator 2 Fixed part 3 Torsion bar 4 Movable part 5 Conductive pattern 5A Drive coil 5B Lead-out wiring part 6 Permanent magnet 7 External connection terminal 8 SiO ₂ insulating layer (sacrificial layer)
9 Reflecting mirror 10 Space 11 Resist sacrificial layer 21 Protective film 31 Flexible printed circuit board (FPC)
32 Adhesive

Claims (7)

A fixed portion, a movable portion, and a torsion bar that pivotally supports the movable portion so as to swing on the fixed portion are integrally formed on a semiconductor substrate, and a drive coil portion provided on the movable portion, and the drive coil portion Generated by supplying a current to the drive coil unit having a conductive pattern including a lead-out wiring part that is wired through the torsion bar part so as to be electrically connected to the external electrode terminal arranged in the fixing part. In a planar electromagnetic actuator that drives the movable part by electromagnetic force,
A planar electromagnetic actuator characterized in that a lead wiring portion in the conductive pattern composed of the drive coil portion and the lead wiring portion is floated.   The planar electromagnetic actuator according to claim 1, wherein the conductive pattern is formed by integrally forming the drive coil portion and the lead wiring portion with the same material.   2. The planar electromagnetic according to claim 1, wherein the conductive pattern is formed by forming a torsion bar wiring portion of the lead wiring portion and other conductive pattern portions from different materials, and forming the torsion bar wiring portion from a material having a high Young's modulus. Actuator.   The planar electromagnetic actuator according to claim 1, wherein the conductive pattern is formed directly on the semiconductor substrate.   3. The planar electromagnetic actuator according to claim 1, wherein the conductive pattern is formed on a flexible insulating sheet, and the flexible insulating sheet is bonded to the semiconductor substrate. A fixed portion, a movable portion, and a torsion bar that pivotally supports the movable portion so as to swing on the fixed portion are integrally formed on a semiconductor substrate, and a drive coil portion provided on the movable portion, and the drive coil portion Generated by supplying a current to the drive coil unit having a conductive pattern including a lead-out wiring part that is wired through the torsion bar part so as to be electrically connected to the external electrode terminal arranged in the fixing part. In a method for manufacturing a planar electromagnetic actuator that drives the movable part by electromagnetic force,
At least the torsion bar wiring part of the lead wiring part is provided with a conductive pattern formed of a material having a high Young's modulus, and the torsion bar wiring part of the lead wiring part is swung around the axis of the torsion bar. A method of manufacturing a planar electromagnetic actuator, wherein the planar electromagnetic actuator is separated from the torsion bar and floats. A fixed portion, a movable portion, and a torsion bar that pivotally supports the movable portion so as to swing on the fixed portion are integrally formed on a semiconductor substrate, and a drive coil portion provided on the movable portion, and the drive coil portion Generated by supplying a current to the drive coil unit having a conductive pattern including a lead-out wiring part that is wired through the torsion bar part so as to be electrically connected to the external electrode terminal arranged in the fixing part. In a method for manufacturing a planar electromagnetic actuator that drives the movable part by electromagnetic force,
The conductive pattern including the drive coil portion and the lead wiring portion is formed on a flexible insulating sheet, and a sheet portion corresponding to the torsion bar wiring portion of the lead wiring portion in the flexible insulating sheet is formed on the torsion bar. The flexible insulating sheet is bonded to the movable portion and the fixed portion of the semiconductor substrate while being bent upward, so that the torsion bar wiring portion of the lead-out wiring portion is floated from the torsion bar. A method of manufacturing a planar type electromagnetic actuator.

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