JP2005177876A - Microstructure and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microstructure driven by stable torsional oscillation with little unnecessary oscillation caused by disturbance or the like. <P>SOLUTION: This microstructure 1 has a movable plate 6 supported by one or more beam-like elastic support parts 3 torsionally oscillatably around a torsion axis C. In this case, a plurality of through holes 5A, 5B arranged in a torsion axis direction are formed in the beam-like elastic support parts 3 to provide the structure easy to twist while hardly bending in a direction of translation of the movable plate 6 (a direction perpendicular to the torsion axis C). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to the field of micromachines. More specifically, the present invention relates to a microactuator, a micro optical deflector, and the like that have a member that vibrates in the torsion axis.

  In recent years, as represented by high integration of semiconductor devices, with the development of microelectronics, various devices have been miniaturized with high functionality. The same applies to an apparatus using a micromachine device (for example, a micro optical deflector having a member that vibrates torsionally in the center of a torsion axis, a micro mechanical quantity sensor, a micro actuator, or the like). For example, optical scanning is performed using the optical deflector. Laser beam printers, image display devices such as head-mounted displays, and light input devices for input devices such as bar code readers are also highly functional and miniaturized, and further miniaturization makes it easy to carry, for example. Application to products in various forms is desired. Now, with the application to such portable products at the top, for micromachine devices, in addition to further miniaturization for practical application, the stability and impact resistance of torsional vibration against noise such as external vibration There is a particular demand for higher performance.

  For example, Non-Patent Document 1 is disclosed as a proposal for these requirements.

(Conventional example)
FIG. 10 is a top view of the hard disk head gimbal of the second conventional example disclosed in Non-Patent Document 1. FIG. This gimbal is attached to the tip of a hard disk head suspension and is used to elastically allow the magnetic head to move between the roll and the pitch. The gimbal 2020 has a support frame 2031 that is rotatably supported by roll torsion bars 2022 and 2024 on the inner side. In addition, a head support 2030 that is rotatably supported by pitch torsion bars 2026 and 2028 is formed inside the support frame 2031. The torsion axes of the roll torsion bars 2022 and 2024 and the pitch torsion bars 2026 and 2028 (see the orthogonal chain lines in FIG. 29) are orthogonal to each other, and are responsible for the roll and pitch movement of the head support 2030, respectively. Yes.

  FIG. 11 is a cross-sectional view taken along a cutting line 2006 in FIG. As shown in FIG. 11, the torsion bar 2022 has a T-shaped cross section, and the gimbal 2020 has a rib structure.

  As shown in FIG. 11, the torsion bar having the T-shaped cross section has a large cross-sectional secondary moment, although the cross-sectional secondary pole moment is small, compared to a torsion bar having a cross-sectional shape such as a circular cross section or a rectangular cross section. There is a feature. For this reason, it is possible to provide a torsion bar that is not easily bent while being relatively easily twisted. That is, it is possible to provide a torsion bar having high rigidity in a direction perpendicular to the torsion axis while ensuring sufficient compliance in the torsion direction.

Thus, by using the torsion bar having this T-shaped cross section, it is possible to provide a micro gimbal that has sufficient compliance in the roll and pitch directions, has sufficient rigidity in the other directions, and can be further miniaturized. There is sex.
10th International Conference on Solid-State Sensors and Actuators (Transducers '99) pp.1002-1005

  However, the conventional example has the following problems.

  1. A torsion bar having a T-shaped cross section is fragile due to stress concentration at the portion 2050 in FIG. 11 when twisted.

  2. In the torsion bar having a T-shaped cross section, the center of torsion and the center of the center of gravity axis do not coincide. Therefore, an excitation force in a direction perpendicular to the torsion axis is generated during the swinging. Therefore, an unnecessary movement occurs during driving.

  3. Since polysilicon has a larger internal loss than single crystal silicon, the mechanical Q value is lowered. Therefore, the vibration amplitude cannot be increased when driving using mechanical resonance. In addition, energy efficiency is low due to large loss.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a micromachine or a micro structure that can be applied to a microactuator having a member that swings around an axis, a micro optical deflector, and the like, and a method for manufacturing the same. .

  Accordingly, the present invention is a microstructure comprising a support substrate and a movable plate, and the movable plate is supported by an elastic support portion so as to be capable of torsional vibration about the torsion axis. The part has at least two or more through holes, and the through holes are arranged in the torsional axis direction.

  The present invention also includes a step of forming a mask layer on both surfaces of the silicon substrate, and removing the mask layer on the first surface of the mask layer, leaving the outer portions of the support substrate, the elastic support portion, and the movable plate. Removing the mask layer in the through-hole portion of the elastic support portion; performing dry etching on the silicon substrate to separate the silicon substrate into a support substrate, an elastic support portion, and a movable plate; And a step of forming a through hole in the portion, and a step of removing the mask layer of the silicon substrate.

  As described above, the microstructure of the present invention is easily twisted by forming a plurality of through holes arranged in the direction of the torsional axis in the elastic support portion, and in the direction in which the movable plate is caused to translate and vibrate (on the torsional axis). It is possible to obtain a micro structure that is driven by stable torsional vibration with less unnecessary vibration due to disturbance or the like.

  In addition, since there is no sharp notch in the cross section perpendicular to the torsion axis of the elastic support part, stress concentration on the elastic support part can be relaxed during torsional vibration, preventing breakage of the elastic support part, It is possible to increase the displacement angle (or downsizing) and extend the life of the microstructure.

  Therefore, it is possible to realize a micro structure having a long life with a small deflection angle and less unnecessary vibration.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
(Overall description, mirror)
FIG. 1 is a perspective view showing the configuration of the micro optical deflector according to the first embodiment of the present invention. In FIG. 1, the micro optical deflector 1 has a structure in which both ends of a movable plate 6 are supported on a support substrate 2 by two elastic support portions 3. The elastic support portion 3 supports the movable plate 6 elastically about the C axis (that is, the torsion axis) so as to be able to be torsionally vibrated in the E direction. Further, as shown in FIG. 1, a recess 5 is formed in the elastic support portion 3. Further, one surface of the movable plate 6 is a reflective surface 4, and incident light incident on the reflective surface 4 is deflected by a predetermined displacement angle by twisting of the movable plate 6 in the E direction.

  The micro optical deflector 1 which is an example of the microstructure can provide the actuator by the microstructure and the driving means since the movable plate 6 can be torsionally vibrated by providing the driving means. The driving means drives the support substrate and the movable plate relatively, and in the present embodiment, the driving means is a magnet or a coil described later. When a magnet or a coil is used, an electromagnetic actuator can be provided.

(magnet)
Further, the movable plate 6 is provided with a permanent magnet 7, for example, a rare earth-based permanent magnet containing samarium-iron-nitrogen, on the side opposite to the surface on which the reflecting surface 4 is formed (hereinafter referred to as the back surface). . The permanent magnet 7 is magnetized with a different polarity across the torsion shaft.

(Integrated, mirror substrate)
The support substrate 2, the movable plate 6, the reflecting surface 4, the elastic support portion 3, and the recess 5 are all integrally formed of single crystal silicon by a micromachining technique that applies a semiconductor manufacturing technique.

(Description of coil substrate)
In addition, a coil substrate 8 is installed in parallel with the support substrate 2 so that a coil 9 as magnetism generating means is disposed in the vicinity of the permanent magnet 7 at a desired distance. As shown in FIG. 1, the coil 9 is integrally formed on the surface of the coil substrate 8 by electroplating, for example, copper in a spiral shape.

(Operation)
The operation of the micro optical deflector 1 of this embodiment will be described with reference to FIG. FIG. 2 is a cross-sectional view taken along line AA of the micro optical deflector 1 of FIG. As shown in FIG. 2, the permanent magnet 7 is magnetized so as to have different polarities across the torsion shaft, and the direction thereof is as illustrated, for example. When the coil 9 is energized, the magnetic flux Φ is generated in the direction of FIG. Attraction and repulsion are generated in the magnetic poles of the permanent magnet 7 in the direction related to the magnetic flux, respectively, and torque T acts on the movable plate 6 elastically supported around the torsion axis. Similarly, if the direction of the current applied to the coil 9 is reversed, the torque T works in the opposite direction. Therefore, as shown in FIG. 2, it is possible to drive the movable plate 6 at an arbitrary angle according to the current supplied to the coil 9.

(resonance)
Further, the movable plate 6 can be continuously torsionally vibrated by passing an alternating current through the coil 9. At this time, if the frequency of the alternating current is made to substantially coincide with the resonance frequency of the movable plate 6 and the movable plate 6 is resonated, a larger angular displacement can be obtained with less input energy.

(scale)
The micro optical deflector 1 of the present embodiment is driven at, for example, 19 kHz which is the resonance frequency of the movable plate 6 and a mechanical displacement angle ± 10 °. The support substrate 2, the movable plate 6, and the elastic support portion 3 are all configured with an equal thickness of 150 μm, the width of the movable plate 6 in the B direction (A-A direction in FIG. 1) is 1.3 mm, and the length in the torsional axis direction. Is carried out at 1.1 mm. That is, the area of the movable plate is about several mm 2 (particularly, an area of 2 mm 2 or less), and the support substrate with the movable plate is a microstructure.

(Description of detailed configuration of elastic support part)
Hereinafter, the elastic support part 3 and the through holes 5A and 5B, which are features of the present invention, will be described in detail.

  FIG. 3 is a perspective view of the support substrate 2 as seen from the surface on which the reflective surface 4 is formed.

  As shown in FIG. 3, in this embodiment, through holes 5 </ b> A and 5 </ b> B are formed in the elastic support portion 3. Further, the two elastic support portions 3 that support the movable plate 6 are formed with through holes 5A and 5B in a mirror image relationship as shown in FIG.

  Therefore, hereinafter, the elastic support portion 3 and the through holes 5A and 5B surrounded by the broken lines in FIG. 3 will be described with reference to FIGS. 4A is a perspective view in which the elastic support portion 3 surrounded by a broken line in FIG. 3 is particularly enlarged, and FIG. 4B is a cross-sectional view taken along the line S-S in FIG. 4A and 4B show three orthogonal axes A, B, and C, and the C axis is a torsion axis.

  As shown in FIG. 4A, the through holes 5A and 5B are arranged in the direction of the torsion axis, leaving rib-like beam portions between the through holes 5A and 5B so as to cross the torsion axis (that is, the C axis). It is arranged. Therefore, when paying attention to the portion where the through holes 5A and 5B are not formed, the elastic support portion 3 has a structure in which three beam portions are substantially combined.

  Further, as shown in FIG. 4B, the cross section of the elastic support portion 3 has a shape in which three flat rectangular shapes are arranged in parallel in the A-axis direction by the through holes 5A and 5B. Therefore, these rectangular elements have a structure that is not easily bent in the translational direction of the A axis in the drawing. Further, when the cross section secondary pole moments in the cross section shown in FIG. 4B and the cross section perpendicular to the A axis and the B axis in FIG. 4A are compared, the secondary cross section of the cross section in FIG. The polar moment is much smaller. Therefore, the elastic support part 3 is easily twisted only around the C axis.

  In addition, as shown in FIG. 4A, the rib-like beam portion left between the through holes 5A and 5B is configured to be inclined with respect to the C axis. Has a structure that is difficult to bend in the translational direction of the B-axis.

  As described above, the elastic support portion 3 according to the present embodiment has a low compliance only around the C axis, is easily twisted around the C axis, and is not easily bent in the other direction.

(There should be no stress concentration in the cross section)
Furthermore, as shown in FIG. 4B, the elastic support portion 3 has a structure in which a cross section of a plurality of rectangular shapes are arranged in parallel, so that a sharp notch in which stress concentration occurs when twisted around the C axis. There is no part. Therefore, breakage of the elastic support portion 3 can be prevented. This indicates that an angle that can be twisted without breaking without increasing the length of the elastic support portion 3 (hereinafter referred to as an allowable torsion angle) can be increased, and a shorter length can be achieved to achieve a desired displacement angle. The elastic support portion 3 can be used. (Or, a larger displacement angle can be achieved by using a certain length of the elastic support 3.)
(Advantages of micro optical deflector)
In this embodiment, by forming a plurality of through holes arranged along the torsion axis in the elastic support part, only the compliance around the torsion axis of the elastic support part is low and the structure is difficult to bend in the other direction. it can. The micro optical deflector according to the present embodiment configured with such an elastic support portion is easy to twist, and is configured so that unnecessary vibration and displacement are not generated in the direction perpendicular to the torsion axis in response to external vibration or impact. it can.

  In addition, since there is no notch portion that causes stress concentration in the cross-sectional shape perpendicular to the torsion axis, it is possible to prevent breakage of the elastic support portion and to widen the deflection angle, miniaturization, and life of the micro optical deflector. .

  Such an effect is not limited only to the elastic support portion and the cross-sectional shape of the through hole of the present embodiment, and the object of the present invention can be achieved using any elastic support portion and the through hole.

  Further, as in the present embodiment, the micro optical deflector having a large mechanical Q value is formed by integrally forming the support substrate 2, the movable plate 6, the elastic support portion 3, and the through holes 5A and 5B from single crystal silicon. It can be. This indicates that the vibration amplitude per input energy increases when resonance driving is performed, and the micro optical deflector of the present invention can be made small and power-saving with a large deflection angle.

(Whole manufacturing process)
The manufacturing method of the support substrate 2, the elastic support part 3, the movable plate 6, and the through-hole parts 5A and 5B of this embodiment will be described. 7A to 7D are process diagrams showing a manufacturing method by dry etching of the support substrate 2, the elastic support portion 3, the movable plate 6, and the through holes 5A and 5B in the present embodiment. In particular, as shown in FIG. 7A-1, the figure indicated by the subscript −1 is a cross section taken along the line AA in FIG. 1, and the figure indicated by the subscript −2 is FIG. ) Shows a schematic view of the same step in the section taken along the line RR. First, as shown in FIG. 7A, a silicon oxide mask layer 101 is formed on both sides of a flat silicon substrate 104 by thermal oxidation or the like.

Next, as shown in FIG. 7B, the mask layer 101 on the surface on which the reflective surface 4 is formed is formed into the outer shape of the portion where the support substrate 2, the movable plate 6, the elastic support portion 3, and the through holes 5A and 5B are to be formed. Patterning is performed accordingly. This patterning is performed by wet etching using a normal photolithography and a solution that erodes silicon oxide (for example, a mixed solution of HF, NH ₄ F, or the like).

  Next, as shown in FIG. 7C, the silicon substrate 104 is penetrated by dry etching using an ICP-RIE (Inductively Coupled Plasma-Reactive Ion Etching) apparatus, and the shape as shown in FIG. 7C-1 is obtained. The support substrate 2 and the movable plate 6 are formed. At this time, as shown in FIG. 7C-2, the elastic support portion 3 and the through holes 5A and 5B are also formed at the same time.

  Next, as shown in FIG. 7D, the silicon oxide mask layer 101 is removed, and a metal having a high reflectance (for example, aluminum) is vacuum-deposited as the reflective surface 4. By the above manufacturing method, the support substrate 2, the movable plate 6, the reflective surface 4, the elastic support portion 3, and the through holes 5A and 5B are integrally formed.

  Thereafter, a paste-like magnetic body in which a rare earth-based powder containing samarium-iron-nitrogen is mixed with a bonding material is formed on the back surface of the movable plate 6. At this time, for example, the magnetic body can be formed only on the back surface of the movable plate 6 using silk screen printing. Finally, after heat treatment in a magnetic field, magnetization (refer to FIG. 2 for the magnetization direction) is performed to form the permanent magnet 7, and the micro light deflector 1 of FIG. 1 is completed.

(Effects from manufacturing method)
According to the manufacturing method of the micro optical deflector 1 of the present embodiment, since all the structures of the movable plate 6, the elastic support portion 3, and the through holes 5A and 5B can be processed by one etching, it is very inexpensive. Can be manufactured in large quantities. In addition, since it is possible to cope with design changes and the like with a photolithographic mask pattern, it becomes possible to manufacture a micro optical deflector at an even lower cost and with a shorter development period.

(Second Embodiment)
FIG. 5 is a perspective view showing the configuration of the micro optical deflector according to the second embodiment of the present invention. The micro optical deflector 21 of the present embodiment is basically the same in principle as the micro optical deflector 1 of the first embodiment. Moreover, it is integrally formed of single crystal silicon by the same manufacturing process as in the first embodiment.

(Differences from Fig. 1)
The difference from FIG. 1 is the structure of the elastic support portion 3 and the through holes 5A, 5B, 5C, and 5D, and this point will be particularly described here. In FIG. 5, the same parts as those in FIG. As shown in FIG. 5, in this embodiment, four through holes 5 </ b> A, 5 </ b> B, 5 </ b> C, and 5 </ b> D are formed in the elastic support portion 3 in the torsional axis direction. The two elastic support portions 3 that support the movable plate 6 have the same shape.

  Therefore, hereinafter, the elastic support portion 3 and the through holes 5A, 5B, 5C, and 5D surrounded by the broken line in FIG. 5 will be described with reference to FIGS. 6A is an enlarged top view of the elastic support portion 3 surrounded by a broken line in FIG. 5, and FIG. 6B is a cross-sectional view taken along the line S-S in FIG. 6A.

  FIGS. 6A and 6B show three orthogonal axes A, B, and C, and the C axis is a torsion axis.

  As shown in FIG. 6A, the through holes 5A, 5B, 5C, and 5D are arranged in the direction of the torsion axis, leaving rib-shaped beam portions so as to cross the torsion axis (that is, the C axis). . Therefore, when paying attention to the portion where the through holes 5A, 5B, 5C, and 5D are not formed, the elastic support portion 3 has a structure in which four beam portions are substantially combined.

(Explanation of cross-sectional shape)
As shown in FIG. 6 (b), the cross-sectional shape of the elastic support portion 3 by the through holes 5A, 5B, 5C, and 5D is such that a plurality of flat rectangles in the A-axis direction are arranged in parallel. Therefore, these rectangular elements have a structure that is not easily bent in the translational direction of the A axis in the drawing. Further, when the cross-sectional secondary pole moments in the cross section perpendicular to the A-axis and the B-axis are compared, the cross-sectional secondary pole moment in the cross section in FIG. 6B is much smaller. Therefore, the elastic support part 3 is easily twisted only around the C axis.

(Effect of each rib-like silicon part)
In addition, as shown in FIG. 6A, the through holes 5A, 5B, 5C, and 5D have rib-shaped beam portions that remain between the adjacent through holes and are inclined with respect to the torsion shaft. It has a form. Therefore, the elastic support portion 3 has a structure that is not easily bent in the translational direction of the B-axis.

(Description of taper)
Furthermore, as shown in FIG. 6A, the elastic support portion 3 has a width in a direction perpendicular to the torsion axis. In the figure, W1 represents the width of the connection portion with the movable plate 6, W2 represents the width near the center portion, and W3 represents the width of the connection portion with the support substrate 2. In this embodiment, as shown in the figure, the relationship of W2 <W1 and W3 is established, and the elastic support portion 3 has a continuous width from the central portion toward the connection portion with the movable plate 6 and the support substrate 2. Is getting bigger. Therefore, the structure is more difficult to bend in the translational direction of the B axis than when the width is constant.

(Effect of difference from the first embodiment)
As described above, the elastic support portion 3 according to the present embodiment has a low compliance only around the C axis as in the first embodiment, and is easily twisted around the C axis and is not easily bent in the other direction. It has become. In addition, in the present embodiment, the width of the elastic support portion 3 is changed and continuously changed as described above, and a structure that further prevents the B-axis from being bent in the translational direction can be obtained.

(Third embodiment)
FIG. 8 is a diagram showing an embodiment of an optical apparatus using the micro light deflector. Here, an image display device is shown as an optical apparatus. In FIG. 12, reference numeral 201 denotes a micro light deflector group 21 in which two micro light deflectors of the first embodiment are arranged so that their deflection directions are orthogonal to each other. In this embodiment, incident light is directed in the horizontal and vertical directions. It is used as an optical scanner device for raster scanning. Reference numeral 202 denotes a laser light source. Reference numeral 203 denotes a lens or lens group, 204 denotes a writing lens or lens group, and 205 denotes a projection surface. The laser light incident from the laser light source 202 is subjected to predetermined intensity modulation related to the optical scanning timing, and is scanned two-dimensionally by the micro light deflector group 201. The scanned laser beam forms an image on the projection surface 205 by the writing lens 204. That is, the image display apparatus of this embodiment can be applied to a display.

(Fourth embodiment)
FIG. 9 is a diagram showing another embodiment of an optical apparatus using the micro light deflector. Here, an electrophotographic image forming apparatus is shown as an optical apparatus. In FIG. 9, reference numeral 201 denotes a micro light deflector according to the first embodiment, which is used as an optical scanner device that scans incident light in one dimension in this embodiment. Reference numeral 202 denotes a laser light source. 203 is a lens or lens group, 204 is a writing lens or lens group, and 206 is a photoconductor. The laser light emitted from the laser light source is subjected to predetermined intensity modulation related to the optical scanning timing, and is scanned one-dimensionally by the micro light deflector 201. The scanned laser beam forms an image on the photosensitive member 206 by the writing lens 204.

  The photoconductor 206 is uniformly charged by a charger (not shown), and an electrostatic latent image is formed on the portion by scanning light on the photoconductor 206. Next, a toner image is formed on the image portion of the electrostatic latent image by a developing device (not shown), and this is transferred and fixed on a paper (not shown), for example, to form an image on the paper.

It is a perspective view which shows the micro optical deflector of the 1st Embodiment of this invention. It is sectional drawing in the AA of FIG. It is a perspective view for demonstrating the support substrate of FIG. 1, a movable board, an elastic support part, a through-hole, and a permanent magnet. (A) is a perspective view for demonstrating the elastic support part of FIG. 1, and a through-hole. (B) is sectional drawing in the SS line | wire of Fig.4 (a). It is a perspective view which shows the micro optical deflector of the 2nd Embodiment of this invention. (A) is a perspective view for demonstrating the elastic support part of FIG. 5, and a through-hole. (B) is sectional drawing in the SS line | wire of Fig.6 (a). It is a figure explaining the manufacturing method of the optical polarizer of FIG. It is a figure which shows one Embodiment of the optical instrument using the micro optical deflector of this invention. It is a figure which shows other embodiment of the optical instrument using the micro optical deflector of this invention. It is a figure which shows the gimbal for hard disk heads of a prior art example. It is sectional drawing of the cymbal for hard disk heads of the prior art example of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,21 Micro optical deflector 2 Support substrate 3 Elastic support part 4 Reflective surface 5A, 5B, 5C, 5D Through-hole 6 Movable plate 7 Permanent magnet 8 Coil substrate 9 Coil 101 Mask layer 102 Aluminum layer 103 Photoresist layer 104 Silicon substrate DESCRIPTION OF SYMBOLS 201 Micro light deflector group 202 Laser light source 203 Lens 204 Writing lens 205 Projection surface 206 Photoconductor 2006 Cutting line 2020 Gimbal 2022 Roll torsion bar 2024 Roll torsion bar 2026 Pitch torsion bar 2028 Pitch torsion bar 2030 Head support 2031 Support frame

Claims (12)

  The movable plate is a microstructure that is supported by one or a plurality of elastic support portions so as to be capable of torsional vibration about a torsion axis with respect to a support substrate, and each of the elastic support portions includes at least two or more elastic support portions. A microstructure having a through hole.   The elastic support portion has a structure in which a plurality of substantial beam portions are connected, and at least one of the substantial beam portions is formed to be inclined or orthogonal to the torsion axis. Item 2. The microstructure according to Item 1.   The cross section of the elastic support portion in a plane perpendicular to the torsion axis is formed of a plurality of substantially rectangular shapes, and the rectangular shapes are flat in the normal direction of the movable plate. The microstructure according to any one of the above.   The microstructure according to claim 1, wherein the torsion shaft passes near the center of gravity of the movable plate.   The width of the elastic support portion perpendicular to the torsional axis and in the horizontal direction with respect to the movable plate is larger toward the support substrate or at least one of the connection portions with the movable plate. The microstructure according to any one of claims 1 to 4.   The microstructure according to any one of claims 1 to 5, wherein the support substrate, the elastic support portion, the movable plate, and the through hole are integrally formed of a single crystal material.   The microstructure according to claim 6, wherein the single crystal material is a silicon single crystal.   8. The micro structure according to claim 1, a driving unit that relatively drives the support substrate and the movable plate, and a reflective surface that reflects light formed on the movable plate. A micro light deflector characterized by that.   9. The micro light deflection according to claim 8, wherein the driving means is a permanent magnet formed on the movable plate and a coil wound on a coil substrate installed in the vicinity of the permanent magnet. vessel.   An optical apparatus comprising the micro light deflector according to claim 8.   A light source, and a micro light deflector or a group of micro light deflectors in which at least one micro light deflector according to any one of claims 8 and 9 for deflecting light emitted from the light source is disposed. An image display apparatus that projects at least a part of the light deflected by the micro light deflector or the group of micro light deflectors onto an image display body.   Forming a mask layer on both surfaces of the silicon substrate; removing the mask layer on the first surface of the mask layer, leaving the outer portions of the support substrate, the elastic support portion, and the movable plate, and penetrating the elastic support portion; The step of removing the mask layer in the hole portion, the silicon substrate is dry-etched to separate the silicon substrate into a support substrate, an elastic support portion, and a movable plate, and a through hole is formed in the elastic support portion And a step of removing the mask layer of the silicon substrate.

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