JP5360404B2 - Manufacturing method of component-embedded substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a component built-in substrate constituted by providing a resin layer on a circuit board on which an electronic component is mounted, and to suppress the warpage of the circuit board in a heat treatment process. <P>SOLUTION: A support base having a plurality of projections provided on one principal surface is prepared and after the circuit board is installed on the support base, the resin layer is installed on the support board to cover the circuit board and the projections. Through anchor effect of the projections, the resin layer is securely restrained by the support base, so the warpage of the circuit substrate is suppressed. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a method for manufacturing a component-embedded substrate, and more particularly, to a method for manufacturing a component-embedded substrate that suppresses the occurrence of warping of a circuit substrate in a heat treatment step. The present invention also relates to a support for manufacturing a component-embedded substrate.

  In recent years, a component-embedded substrate incorporating an electronic component has been widely used in the electronic equipment field due to the demand for high-density mounting of electronic components. The component-embedded substrate has a structure in which, for example, a resin layer is provided on a circuit substrate made of glass epoxy or ceramic on which electronic components are mounted, and a wiring pattern is formed on the resin layer. A large number of electronic components can be mounted by mounting electronic components also on the wiring pattern formed on the resin layer.

  However, in such a component-embedded substrate, the circuit substrate is warped in a heat treatment step during manufacturing, for example, a step of curing the resin layer or a step of heat-pressing a metal foil for wiring patterns on the resin layer. There was a case. This warpage of the circuit board is caused by a difference in linear expansion between the circuit board and the resin layer. If the circuit board warps, the shape of the via hole formed in the resin layer becomes slanted or distorted. As a result, there is a problem that conduction between the via and the land electrode cannot be obtained, and contact resistance increases due to a decrease in contact area.

  For this reason, conventionally, in the manufacture of a component-embedded substrate, some measures have to be taken to suppress warping of the circuit board.

  For example, in the method of manufacturing a resin-embedded substrate disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 2006-49762), an electronic component (semiconductor component) is fixed on a metal plate having a predetermined thickness with an adhesive, After sequentially laminating an interlayer insulation layer (semi-cured resin) and a wiring layer, heating and pressing, and further forming vias, the metal plate is finally processed thinly by etching or polishing to form a wiring layer. We are using.

  That is, in the method for manufacturing a resin-embedded substrate disclosed in Patent Document 1, a metal plate having a predetermined thickness and hardness is used, and in the manufacturing process, warpage is suppressed and the flatness of an interlayer insulating layer and a wiring layer is reduced. It is used as a jig for securing, and the completed resin-embedded substrate is thinly processed and used for the wiring layer.

JP 2006-49762 A

  However, the conventional method for manufacturing a resin-embedded substrate disclosed in Patent Document 1 has a problem that the metal plate has to be processed thinly by etching or polishing, which is complicated to manufacture and increases the cost. It was.

  The present invention has been made to solve the above-described problems of the conventional method for manufacturing a resin-embedded substrate. As a means for this, the method for manufacturing a resin-embedded substrate according to the present invention includes a circuit board on which an electronic component is mounted. Preparing a support base having a plurality of protrusions on one main surface, applying a mold release agent to one main surface and the protrusions of the support base, The step of installing the circuit board on the part of the main surface where the protrusion is not provided, and the liquid or semi-cured resin layer is installed on the support base to cover the circuit board and the protrusion And a step of curing the resin layer, and a step of separating the circuit board covered with the cured resin from the support base.

  In addition, you may make it provide a protrusion in the outer periphery of one main surface of a support substrate, and outer periphery vicinity. Moreover, you may make a protrusion removable from the other main surface side of a support stand. Furthermore, the protrusion may be a screw or a pin.

  According to the method for manufacturing a resin-embedded substrate of the present invention having the above contents, it is possible to reliably suppress the warp of the circuit board without going through a complicated process.

It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is a perspective view which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention, It is sectional drawing which shows the dashed-dotted line AA part of FIG. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. It is sectional drawing which shows one process in the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
[First Embodiment]
1-12 shows each process of the manufacturing method of the resin built-in board | substrate concerning the 1st Embodiment of this invention. FIG. 1 is a cross-sectional view showing one process. FIG. 2 is a perspective view showing another process, and FIG. 3 is a cross-sectional view taken along a chain line AA in FIG. 4 to 12 are cross-sectional views showing another process. 1 and FIGS. 5 to 12, the electronic components mounted on the circuit board are shown side surfaces without showing the internal cross section.

  In the method for manufacturing a resin-embedded substrate of this embodiment, first, as shown in FIG. 1, a circuit substrate 1 on which an electronic component 2 is mounted is prepared. The circuit board 1 has, for example, a flat plate shape or a square shape, and is made of glass epoxy or ceramic. Although not shown, land electrodes and wiring electrodes are formed on one main surface of the circuit board 1, and terminal electrodes of the electronic component 2 are connected and fixed to the land electrodes using solder or a conductive adhesive. As the electronic component 2, a semiconductor, a capacitor, a resistor, a coil, and the like are appropriately mounted as necessary for the circuit configuration.

  Next, as shown in FIGS. 2 and 3, a support base 3 having a plurality of protrusions 4 provided on one main surface is prepared. The support base 3 has, for example, a plate shape or a square shape, and is made of stainless steel, aluminum, or the like. The protrusion 4 is a screw having a thread on the outer periphery of the cylindrical main body or a pin having no thread, and is made of stainless steel, aluminum, or the like. The protrusion 4 is attached to a hole formed so as to penetrate the support base 3 in a detachable state from the other main surface side of the support base 3. FIG. 2 is an example in which eight protrusions 4 are provided in the outer periphery of the support base 3 and in the vicinity of the outer periphery. In addition, the number of the protrusions 4 provided is arbitrary and is not limited to eight. Moreover, the screw | thread which comprises the protrusion 4 is not limited to a cylindrical thing, The cone-shaped thing which has a taper may be sufficient. Moreover, the pin which comprises the protrusion 4 is not limited to a cylindrical thing, A cone-shaped thing which has a taper may be sufficient, Furthermore, a triangular prism shape, a triangular pyramid shape, a quadrangular prism shape, a quadrangular pyramid shape Or the like.

  Next, as shown in FIG. 4, a release agent 5 is applied to the one main surface of the support 3 and the protrusions 4. As the mold release agent 5, for example, a fluorine-based material or a silicon-based material can be used.

  Next, as shown in FIG. 5, the circuit board 1 on which the electronic component 2 is mounted is installed in a portion where the protrusion 4 on the one main surface of the support base 3 is not provided.

  Next, as shown in FIG. 6, a resin that is heated and semi-cured (semi-molten) on the support base 3 so as to cover the circuit board 1 and the protrusions 4 on which the electronic component 2 is mounted. Layer 6 is installed. As the resin layer 6, for example, an epoxy resin can be used.

  Next, as shown in FIG. 7, after the metal foil 7 is installed on the resin layer 6, the resin layer 6 is heated and cured. As the metal foil 7, for example, a copper foil can be used.

  Next, as shown in FIG. 8, for example, holes are formed at positions where vias of the metal foil 7 are formed by photolithography and etching, and then the cured resin layer 6 is irradiated with a laser, so that one side of the circuit board 1 is formed. A via hole 8 reaching a land electrode (not shown) formed on the main surface is formed. In addition, the formation method of the hole 8 is not limited to laser irradiation, The method of drilling etc. can also be used.

  Next, as shown in FIG. 9, vias 9 are formed in the holes 8 so as to conduct to the land electrodes (not shown) of the circuit board 1. The via 9 can be formed by, for example, a method of performing electroplating after forming a seed layer in the hole 8 by electroless plating or a method of filling the hole 8 with a conductive paste and curing it. In addition, as a metal which comprises the via | veer 9, copper and silver can be used, for example.

  Next, as shown in FIG. 10, the metal foil 7 placed on the resin layer 6 is patterned by a method such as etching to form a wiring pattern 7a.

  Next, by removing the protrusion 4 from the support base 3, the circuit board 1 covered with the resin layer 6 is separated from the support base 3 as shown in FIG. 11. The support base 3 and the protrusions 4 can be reused.

  When the circuit board 1 covered with the resin layer 6 is a single component-embedded substrate, the component-embedded substrate 10 is completed through the above-described steps. However, in an actual manufacturing process, the circuit board 1 is often used as a mother board for manufacturing a plurality of component-embedded boards, and many products are manufactured at a time. In this case, as shown in FIG. 12, the circuit board 1 covered with the resin layer 6 is cut into circuit boards 1a covered with the individual resin layers 6a to complete the component-embedded board 10A. The cutting can be performed using a dicer, for example.

According to the method for manufacturing a component-embedded substrate according to the first embodiment of the present invention, which includes the above steps, when the resin layer 6 is installed on the support table 3 on which the circuit board 1 is installed, Since the resin layer 6 is securely restrained by the support 3 due to the anchor effect of the provided protrusions 4, the circuit board 1 is prevented from warping when the resin layer 6 is subsequently heated and cured. can do. As a result, inconveniences such as poor conduction of vias 9 and an increase in contact resistance, which have conventionally occurred due to the warp of circuit board 1, can be suppressed.
[Second Embodiment]
In the method for manufacturing a resin-embedded substrate according to the first embodiment described above, a plurality of protrusions 4 are provided on one main surface of the support base 3 and then a release agent 5 is applied to the support base 3 and the protrusions 4. (See FIG. 4).

  In the method of manufacturing a resin-embedded substrate according to the second embodiment of the present invention, this is changed, and a release agent 5 is applied to one main surface of the support base 3 in advance, and the protrusion 4 is separately provided. After applying the release agent 5, the protrusion 4 is provided on one main surface of the support 3.

Other processes are the same as those in the first embodiment.
[Third Embodiment]
In the method for manufacturing a resin-embedded substrate according to the first embodiment described above, the circuit board 1 on which the electronic component 2 is mounted is installed on the portion of the support base 3 where the protrusion 4 on the one main surface is not provided. (See FIG. 5) Subsequently, a semi-cured (semi-molten) resin layer 6 is heated on the support base 3 so as to cover the circuit board 1 and the protrusions 4 on which the electronic component 2 is mounted. It is installed (see Fig. 6).

  In the method of manufacturing a resin-embedded substrate according to the third embodiment of the present invention, this is changed, and the liquid resin layer 6 is replaced with an electron instead of the semi-cured (semi-molten) resin layer 6 heated. The circuit board 1 on which the component 2 is mounted and the protrusions 4 are installed on the support base 3 so as to cover them.

  In addition, you may provide a dam in the outer periphery of the support stand 3 so that the liquid resin layer 6 may not flow outside.

  At the stage where the liquid resin 6 is placed on the support 3, the protrusions 4 do not have an anchor effect on the resin 6, but then when the resin 6 is heated and cured, the anchor effect is gradually exerted, The resin layer 6 can be reliably restrained to the support base 3, and it can suppress that the circuit board 1 warps.

  In the method for manufacturing a resin-embedded substrate according to the third embodiment, the other steps are the same as those in the first embodiment.

1: Circuit board 2: Electronic component 3: Support base 4: Projection 5: Release agent 6: Resin layer 7: Metal foil 7a: Wiring pattern 8: Via hole 9: Via 10, 10A: Component built-in substrate

Claims (5)

Preparing a circuit board on which electronic components are mounted;
A step of preparing a support base having a plurality of protrusions on one main surface in a flat plate shape;
Applying a release agent to one main surface of the support base and the protrusion;
A step of installing the circuit board on a portion of the main surface of the support table where the protrusions are not provided;
Installing a liquid or semi-cured resin layer on the support base so as to cover the circuit board and the protrusions;
Curing the resin layer;
A step of separating the circuit board covered with the cured resin from the support base.   2. The method for manufacturing a component-embedded board according to claim 1, wherein the protrusion is provided in the outer periphery of one main surface of the support substrate and in the vicinity of the outer periphery.   The method for manufacturing a component-embedded board according to claim 1, wherein the protrusion is removable from the other main surface side of the support base.   The method for manufacturing a component-embedded substrate according to any one of claims 1 to 3, wherein the protrusion is a screw.   The method for manufacturing a component-embedded substrate according to any one of claims 1 to 3, wherein the protrusion is a pin.