JP2002190564A - Hybrid ic and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hybrid IC which is easy to handle and hard to be affected from the outside, and its manufacturing method. SOLUTION: The hybrid IC 10 is provided with a printed wiring board 11, electronic components 13 mounted on one surface of the printed wiring board 11, and resin 12 for sealing the electronic components 13, which is formed in a mounting region of the electronic components 13 on the one surface of the printed wiring board 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC having a plurality of electronic components mounted on a single printed wiring board and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a hybrid IC of this type is known as shown in FIG. FIG. 20 is a configuration diagram of a conventional hybrid IC. The hybrid IC 101 is connected to a printed wiring board 104 having a multilayer or single-layered insulating substrate 102 and a pattern 103 formed on the insulating substrate 102, and various electronic components 105 mounted on the printed wiring board 104. Terminal 106 and electronic component 1
05 is sealed. The insulating substrate 102 is formed of a rigid substrate such as a ceramic substrate or a glass epoxy substrate.

[0003]

However, in the conventional hybrid IC 101, various electronic components 10
5 and the resin 107 formed the unevenness, so that it was difficult to hold by a component suction device or the like. For example, in a hybrid IC that forms a protection circuit for a secondary battery,
It is necessary that the secondary battery has strong resistance to liquid leakage. Therefore, a hybrid IC having higher water resistance and chemical resistance than the conventional hybrid IC 101 has been desired.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a hybrid IC which is easy to handle and is hardly affected by the outside world, and a method of manufacturing the same.

[0005]

According to one aspect of the present invention, there is provided a printed wiring board, an electronic component mounted on one surface of the printed wiring board, and the printed wiring board. A hybrid IC, comprising: a resin that is formed on at least one surface of the electronic component at a mounting area and seals the electronic component.

According to the present invention, since the resin is formed on one surface of the printed wiring board, the surface has little irregularities and is easy to handle. Further, since the resin is formed on one surface of the printed wiring board and in the mounting region of the electronic component, all the electronic components mounted on the printed wiring board are embedded in the resin. Therefore, various influences from the outside can be reduced in accordance with the properties of the resin such as water resistance and chemical resistance. Further, since the resin is interposed between the lead terminals of the electronic component, it is possible to prevent generation of static electricity between the lead terminals.

A second aspect of the present invention proposes the hybrid IC according to the first aspect, wherein the resin is formed on the entire surface of the one surface of the printed wiring board.

According to the present invention, since the resin is formed on the entire surface of the printed wiring board, the surface has few irregularities and the handling becomes easier. Further, all the electronic components mounted on the printed wiring board can be reliably sealed.

According to a third aspect of the present invention, in the hybrid IC according to any one of the first and second aspects, a through hole is formed in the printed wiring board, and the through hole is provided for sealing the electronic component. A resin characterized by being integrally filled with the above resin.

According to the present invention, since the resin is filled in the through hole, the resin for sealing electronic parts is integrally filled in the through hole. Adhesion with is improved.

According to a fourth aspect, in the hybrid IC according to any one of the first to third aspects, a through hole is formed in the printed wiring board, and a closing member for closing the through hole is provided. We propose the one that is characterized by

According to the present invention, since the through hole by the closing member is closed, when the resin is formed on one surface of the printed wiring board, the resin flows out to the other surface via the through hole. Can prevent adhesion of dirt.

According to a fifth aspect of the present invention, there is provided the hybrid IC according to the fourth aspect, wherein the closing member is made of a resin different from the electronic component sealing resin.

According to the present invention, since the closing member is made of a resin, the adhesion between the resin and the resin for sealing electronic components is improved. Thereby, the adhesion between the resin for sealing electronic components and the printed wiring board is improved.

According to a sixth aspect of the present invention, there is provided the hybrid IC according to any one of the first to fifth aspects, further comprising a terminal electrode formed on the other surface of the printed wiring board. I do.

According to the present invention, since the terminal electrodes are formed on the surface of the printed wiring board, the external dimensions of the hybrid IC can be reduced.

Further, according to claim 7, a step of mounting an electronic component on one surface of the printed wiring board including one or more hybrid IC patterns, and at least an electronic component on the one surface of the printed wiring board. A method for manufacturing a hybrid IC, comprising the steps of: forming a resin in a component mounting region to seal an electronic component; and cutting the printed wiring board and the resin into unit dimensions of the hybrid IC. suggest.

According to the present invention, a resin is formed on a mounting surface of a printed wiring board on which electronic components are mounted, and the printed wiring board is cut into unit dimensions of the hybrid IC. Can be easily and reliably manufactured. In particular, even when a plurality of hybrid ICs are manufactured at once, it is not necessary to perform the resin forming process for each hybrid IC, so that the manufacturing efficiency is improved.

According to an eighth aspect of the present invention, there is provided a method of manufacturing a hybrid IC according to the seventh aspect, wherein the printed wiring board includes a terminal electrode formed on the other surface.

According to the present invention, the hybrid IC according to claim 6 can be easily and reliably manufactured. Other functions and effects are the same as those of the fourth aspect.

According to a ninth aspect, in the method for manufacturing a hybrid IC according to any one of the seventh and eighth aspects,
The resin forming step includes a pressure reducing step of reducing the atmosphere to a vacuum pressure, a coating step of applying a resin on one surface of the printed wiring board in a vacuum pressure atmosphere, a pressure increasing step of increasing the atmosphere, and And a resin curing step of curing the resin.

According to the present invention, since the resin application step is performed in a vacuum pressure atmosphere, voids formed inside the resin are in a vacuum pressure state. Therefore,
When the atmosphere is pressurized, the gap is filled with resin due to the differential pressure. Thereby, no void is generated in the resin. In particular, the resin can be filled also in the gap between the electronic component and the printed wiring board, which is hardly filled with the resin. Here, the vacuum means a pressure state which is widely lower than the atmospheric pressure.

In a tenth aspect of the present invention, there is provided a method of manufacturing a hybrid IC according to the ninth aspect, wherein a series of steps from the pressure reducing step to the pressure increasing step is repeatedly performed a plurality of times.

In the step of raising the pressure, there may be a case where the resin is filled with a differential pressure into a gap between the electronic component and the printed wiring board, so that a concave portion is formed on the resin surface. According to the present invention, since the resin is applied again on the resin after the pressure increasing step, the resin surface can be formed in a desired shape. In addition, since the depressurizing step and the step-up step are repeated, filling of the gap between the electronic component and the printed wiring board with the resin is improved.

Furthermore, in claim 11, claims 7 to 1
0 In the method for manufacturing a hybrid IC according to any one of the preceding aspects, prior to the step of forming the resin, a sheet covering a through hole formed in the printed wiring board is formed on a surface of the printed wiring board opposite to the resin forming surface. We propose one that is characterized by sticking.

Furthermore, in claim 12, claims 7 to 1
0. The method of manufacturing a hybrid IC according to claim 1, wherein a closing member for closing the through hole is provided in a through hole formed in the printed wiring board prior to the step of forming the resin. I do.

In the resin printing process, when a resin is applied to a printed wiring board having a through hole formed therein, the resin may flow out to the surface opposite to the application surface via the through hole. This phenomenon is particularly remarkable when the resin is formed by differential pressure filling. According to the eleventh aspect of the present invention, since the sheet covering the through hole is attached to the surface opposite to the surface on which the resin is formed, it is possible to prevent excess resin from adhering to the opposite surface. In addition, the sheet can prevent the pattern of the printed wiring board from being stained or damaged. Further, according to the invention of claim 12,
Since the through hole is closed by the closing member in advance, it is possible to prevent extra resin from adhering to the surface opposite to the surface on which the resin is formed. Here, the through hole is
It includes not only a conductor pattern that connects conductive patterns on both surfaces of the printed wiring board or a conductor pattern formed on the inner layer to each other, but also a simple hole that is not used for conductive connection.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A hybrid IC according to a first embodiment of the present invention and a method for manufacturing the same will be described with reference to the drawings. 1 is an external perspective view of the hybrid IC according to the first embodiment, FIG. 2 is a cross-sectional view of the hybrid IC according to the first embodiment, and FIG.
FIG. 2 is a plan view of the hybrid IC according to the first embodiment.

In this embodiment, a battery protection module used as a hybrid IC in a battery pack in an electronic device such as a mobile phone or a handy video camera will be described. This battery pack includes a secondary battery such as a lithium ion battery, and a battery protection module for preventing overcharge and overdischarge of the secondary battery. This battery protection module requires high durability especially against liquid leakage of the secondary battery.

As shown in FIG. 1, this hybrid IC
10 has a substantially rectangular parallelepiped overall shape. In the hybrid IC 10, a rectangular printed wiring board 11 and a resin 12 formed on one surface side of the printed wiring board 11 are integrally formed.

As shown in FIGS. 2 and 3, the printed wiring board 1
1 is an organic material such as a phenol resin, a polyester resin, an epoxy resin, a fluororesin, or a ceramic;
A substrate 11a using an inorganic material such as metal or glass;
It has a pattern 11b formed on the upper surface of the substrate 11a and a terminal electrode 11c formed on the lower surface of the substrate 11a. Various electronic components 13 are mounted on the pattern 11b. The pattern 11b and the terminal electrode 11c are connected to the connection conductor 11 formed on the inner wall surface of the through hole 11d.
e are interconnected. Further, a hole 11f is formed in the substrate 11a. The holes 11f are provided for improving the handling in the manufacturing process, and do not contribute to the circuit of the hybrid IC 10. In this embodiment, an epoxy-based printed wiring board 11 is used.

As the electronic component 13, for example, an IC,
It includes semiconductor elements such as transistors, FETs, and diodes, and passive components such as capacitors, inductors, resistors, and filter elements.

The resin 12 is formed on the entire upper surface of the printed wiring board 11. The resin 12 is formed at such a height that all the electronic components 13 are embedded in the resin 12. The resin 12 fills the through holes 11d and the holes 11f. The resin 12 is made of a thermosetting resin having an insulating property. Examples of the thermosetting resin include urea-based, melamine-based, phenol-based, epoxy-based, unsaturated polyester-based, alkyd-based, and urethane-based resins. Further, as the resin 12, a resin having good water resistance, acid resistance, alkali resistance, heat resistance, corrosion resistance, and the like is preferable according to the use of the hybrid IC 10. Further, the resin 12 preferably has good thermal conductivity in consideration of heat radiation of the electronic component 13. For example, a component having the same thermal conductivity as the exterior of the electronic component 13 can be used. Further, the resin 12
It is preferable that the thermal expansion coefficient be equal to that of the electronic component 13. In the present embodiment, the same epoxy resin as that used for the exterior of the electronic component 13 is used as the resin 12. Further, it is preferable that the resin 12 has a small particle size so as to be easily filled in the gap between the substrate 11b and the electronic component 13. Specifically, the minimum particle size of the resin 12 is
The condition is that the distance is smaller than the distance between the substrate 11b and the electronic component 13. The resin 12 preferably has an average particle size smaller than the distance between the substrate 11b and the electronic component 13, and more preferably has a maximum particle size smaller than the distance between the substrate 11b and the electronic component 13. In the present embodiment, the particle size 25
A μm resin was used.

Next, a method of manufacturing the hybrid IC 10 will be described with reference to FIGS. FIG. 4 to FIG. 6 are views for explaining a manufacturing process of the hybrid IC according to the first embodiment.

First, as shown in FIG. 4, a component mounting pattern 11b is formed on one surface, and the above-mentioned terminal electrode 11c is formed on the other surface. A printed wiring board 20 in which conductors 11e and holes 11f are formed is prepared, and an electronic component 21 is mounted on the printed wiring board 20. The printed wiring board 20 has a plurality of (20 in FIG. 4) patterns of the hybrid ICs 10 formed in a matrix. Further, a mark 20a for confirming a cutting position in a cutting step described later is printed on a peripheral portion of the printed wiring board 20. Note that a cutout or a concave portion may be provided instead of printing such as the mark 20a.

Next, the flux residue adhering to the printed wiring board 20 is removed by an ultrasonic cleaning method or the like. This is because if the flux is attached to the printed wiring board 20, the adhesive strength between the resin and the printed wiring board 20 is reduced.

Here, before or after mounting the electronic component 21, the sheet 31 is attached to the entire surface of the printed wiring board 20 on the side opposite to the mounting surface. This sheet 31
Are preferably those having good adhesion to the application surface. Further, it is preferable that the sheet 31 has a heat resistance that does not cause deformation in a heating step described later. In the present embodiment, a polyester-based heat release sheet is used as the sheet 31.

Next, the printed wiring board 20 is heated to remove excess water contained in the printed wiring board 20 and the like. If the water remains, the water in the resin evaporates when the hybrid IC is reflowed. At this time, cracks may occur in the printed wiring board 20 due to the generated water vapor pressure. Then, when the solder flows into the crack, a short circuit of the pattern or the like may occur. For this reason, the water removal step is effective.

Next, as shown in FIG.
Is placed on a support base 32 having a horizontal upper surface, and a frame 33 is arranged on the periphery of the printed wiring board 20. Next, the space around the printed wiring board 20 is evacuated. At this time, the vacuum pressure is set to, for example, about 2 Torr (= 266.644 Pa). Next, in this vacuum state, a thermosetting resin 22 is injected into the printed wiring board 20 in this state. At this time,
Since the resin 22 has low viscosity and fluidity, the frame 33
It spreads all over the inside. The peripheral portion of the resin 22 is curved by surface tension, and the upper surface is substantially horizontal.

Next, the pressure around the printed wiring board 20 is increased to atmospheric pressure. Thereby, the resin 22 is filled in, for example, a gap generated between the electronic component 21 and the printed wiring board 20, a through-hole formed in the substrate, and a hole. At this time, since the sheet 31 is attached to the printed wiring board 20, the resin 22 does not flow out to the bottom surface of the substrate through the through holes or holes.

It is preferable that the series of steps of pressure reduction, resin application, and pressure increase be repeated a plurality of times as necessary. That is, the resin is filled into the gap between the printed wiring board 20 and the electronic component 21 and the inside of the through hole due to the differential pressure in the pressure increasing step, and as a result, a concave portion is formed on the surface of the resin. Thus, by further applying a resin, the resin surface can be formed in a shape with less unevenness. In addition, by repeatedly reducing and increasing the pressure, the filling of the resin into the gap between the printed wiring board 20 and the electronic component 21, the inside of the through hole, and the like can be ensured.

Next, the resin 22 is cured by heating.
In the present embodiment, the heating was carried out by changing the conditions such as the heating temperature and the time in two steps. Next, the sheet 31 is peeled from the printed wiring board 20. The sheet 31 may be removed after the cutting step described below.

Next, as shown in FIG. 6, the printed wiring board 20 on which the resin 22 is formed is cut into a unit size of a hybrid IC using a dicer 34 or the like. At the time of this cutting, accurate cutting can be performed by performing positioning using the mark 20a formed on the printed wiring board 20.
The hybrid IC 10 is obtained through the above steps.

Hybrid IC 10 according to the present embodiment
According to the method, since the resin 12 is formed on the entire surface of the printed wiring board 11, there is little unevenness on the surface, and the handling is easy.
That is, since the mounting of the hybrid IC 10 on a circuit board or the like can be performed in the same manner as a surface mount component such as a multilayer capacitor, handling becomes easy. For example, since the upper surface of the resin 12 is formed flat, the upper surface can be easily and reliably held by air suction or the like. Further, for example, packing or storage in a tape is easy, and further, it can be adapted to a bulk feeder or the like.
Further, the bending strength of the printed wiring board 10 is improved by the resin 12. Thereby, for example, even if the inspection probe is pressed, the inspection does not bend, so that the inspection becomes easy and reliable.

The hybrid I according to the present embodiment
In C10, since the resin is formed on the entire surface of the printed wiring board 11, all the electronic components 13 mounted on the printed wiring board 11 are embedded in the resin 12. Therefore, various influences from the outside can be reduced corresponding to the properties of the resin 12 such as water resistance and chemical resistance. Also, electronic component 1
Since the resin 12 is interposed between the three lead terminals, the generation of static electricity between the lead terminals can be prevented.

Further, since the upper surface of the hybrid IC 10 according to the present embodiment is formed smoothly with the resin 12, characters without blur can be easily printed on the upper surface. Since the side surface is also smoothly cut by the dicer, information such as characters can be easily printed on the side surface.

Further, in the hybrid IC 10 according to the present embodiment, since all the electronic components 13 are sealed with the resin 12, even when the hybrid IC 10 is mounted near another device such as a battery, the hybrid IC 10 and the device can be used. There is no need to arrange an insulating member such as an insulating tape between them.

Furthermore, since the hybrid IC 10 according to the present embodiment has a substantially rectangular parallelepiped overall shape and has the terminal electrode 11c formed on the bottom surface, it can be used in various mounting methods. That is, the hybrid IC 10 is suitable for surface mounting. In addition, as shown in FIG. Here, the connector 40 has a box-like shape having an opening slightly larger than the side surface of the hybrid IC 10. On the inner wall surface of the connector 40, a bent electrode 41 having a spring property corresponding to the terminal electrode 11c of the hybrid IC 10 is provided.
It has. Further, a projection 42 for preventing falling off is provided near the opening on the wall surface facing the wall surface on which the bending electrode 41 is provided. In order to accommodate the hybrid IC 10 in the connector 40, the terminal electrode 11c of the hybrid IC 10 may be pushed toward the bent electrode 41 as shown in FIG. Hybrid IC
When the connector 10 is housed in the connector 40, the bending electrode 41 and the terminal electrode 1
1c is securely connected. In addition, the elastic force of the bent electrode 41 and the protrusion 42 cause the hybrid IC 1
0 is held in the connector 40.

Further, in the method of manufacturing a hybrid IC according to the present embodiment, since a so-called vacuum printing method is used in the resin forming step, no void is generated in the resin. In particular, the resin can be filled also in the gap between the electronic component and the printed wiring board, which is hardly filled with the resin.

Further, in the method of manufacturing a hybrid IC according to the present embodiment, a resin is formed on a printed wiring board on which a plurality of hybrid IC patterns are formed, and then the printed wiring board is cut into unit parts. are doing. That is, since it is not necessary to perform the resin forming process for each hybrid IC, the manufacturing efficiency is improved.

Further, in the method of manufacturing a hybrid IC according to the present embodiment, a sheet is attached to a printed wiring board prior to the resin forming step. This prevents the resin from flowing out through the through hole to the surface of the printed wiring board opposite to the surface on which the resin is formed, so that the resin does not adhere to the surface. In addition, the sheet can prevent the pattern of the printed wiring board from being stained or damaged.

(Second Embodiment) A hybrid IC according to a second embodiment of the present invention and a method for manufacturing the same will be described with reference to the drawings. FIG. 9 is an external perspective view of the hybrid IC according to the second embodiment.

Hybrid IC 50 according to the present embodiment
However, the difference from the first embodiment lies in the shape of the resin portion. That is, the cross section of the resin 52 perpendicular to the longitudinal direction of the printed wiring board 51 has an arc shape in which the upper side of the rectangle projects upward. In other words, the resin 52
The cross section orthogonal to the longitudinal direction of the printed wiring board 51 is a so-called kamaboko type. Other structures are the same as those of the first embodiment. Note that the hybrid IC 50 according to the present embodiment is a battery protection module used for a battery pack, as in the first embodiment.

Next, a method of manufacturing the hybrid IC 50 will be described with reference to FIGS. FIG.
0 to 12 show a hybrid IC according to a second embodiment.
FIG. 4 is a view for explaining the manufacturing process of FIG.

First, as shown in FIG. 10, a printed wiring board 60 on which a predetermined pattern, a through hole and the like are formed is prepared, and an electronic component 61 is mounted on the printed wiring board 60. In the printed wiring board 60, a plurality of (10 in FIG. 10) patterns of the hybrid ICs 50 are formed in a matrix. Here, the patterns are arranged at predetermined intervals in the width direction of the hybrid IC 50. Further, a mark 60a for confirming a cutting position in a cutting step described later is printed on a peripheral portion of the printed wiring board 60. Note that a cutout or a concave portion may be provided instead of printing such as the mark 60a.

Next, the flux residue adhering to the printed wiring board 60 is removed by an ultrasonic cleaning method or the like. This is because if the flux is attached to the printed wiring board 60, the adhesive strength between the resin and the printed wiring board 60 is reduced.

Here, prior to or after the mounting of the electronic component 61, a sheet 31 similar to that of the first embodiment is attached to the entire surface opposite to the mounting surface of the printed wiring board 60. .

Next, as in the first embodiment, the printed wiring board 60 is heated to remove excess water contained in the printed wiring board 60 and the like.

Next, as shown in FIG.
0 is placed on a support base 32 having a horizontal upper surface, and a frame 35 is arranged on the periphery of the printed wiring board 20. This frame 35
Each pattern of each hybrid IC and a predetermined area around the pattern are open. Next, the printed wiring board 60
Vacuum the surrounding space. At this time, the vacuum pressure is set to, for example, about 2 Torr (= 266.644 Pa). Next, in this vacuum state, the printed wiring board 60
Is injected with a thermosetting resin 62. At this time, the resin 62
Has low viscosity and fluidity, so that it spreads over the entire surface of the frame 35. The peripheral portion of the resin 62 is curved by surface tension.

Next, the space around the printed wiring board 60 is raised to atmospheric pressure. As a result, the resin 62 is filled into a gap generated between the electronic component 61 and the printed wiring board 60, a through hole formed in the substrate, and a hole. At this time, since the sheet 31 is attached to the printed wiring board 20, the resin 22 does not flow out to the bottom surface of the substrate through the through holes or holes.

It is preferable that the series of steps of pressure reduction, resin application, and pressure increase be repeated a plurality of times as necessary. That is, the gap is filled between the printed wiring board 60 and the electronic component 61, the inside of the through hole, and the like, due to the differential pressure in the boosting step, and as a result, a concave portion is formed on the surface of the resin. Thus, by further applying a resin, the resin surface can be formed in a shape with less unevenness. In addition, by repeatedly reducing and increasing the pressure, the filling of the resin into the gap between the printed wiring board 60 and the electronic component 61, the inside of the through hole, and the like can be ensured.

Next, the resin 62 is cured by heating.
Next, the sheet 31 is peeled from the printed wiring board 20. The sheet 31 may be removed after the cutting step described below.

Next, as shown in FIG. 12, the printed wiring board 60 on which the resin 62 is formed is cut into the unit size of the hybrid IC using the dicer 34 or the like. At the time of this cutting, accurate cutting can be performed by performing alignment using the mark 60a formed on the printed wiring board 60. The hybrid IC 50 is obtained through the above steps.

Hybrid IC 50 according to the present embodiment
Since the upper surface is curved, it can be smoothly pushed into the connector 40 when housed in the connector 40 as described in the first embodiment. Other functions and effects are the same as those of the first embodiment.

(Third Embodiment) A hybrid IC according to a third embodiment of the present invention and a method of manufacturing the same will be described with reference to the drawings. FIG. 13 is an external perspective view of a hybrid IC according to the third embodiment.

The hybrid IC 70 according to the present embodiment
Are different from those according to the first embodiment in that they have a shape of a resin portion and a terminal electrode plate. The hybrid IC 70 according to the present embodiment is a battery protection module used for a battery pack, as in the first and second embodiments.

As shown in FIG. 13, this hybrid I
C70 includes a rectangular printed wiring board 71 and a printed wiring board 71.
7 formed in a region excluding the end in the length direction of
2 and a terminal electrode plate 73 provided at an end of the printed wiring board 71 in the longitudinal direction.

As in the first embodiment, the printed wiring board 71 is made of an organic material such as a phenol resin, a polyester resin, an epoxy resin, or a fluorine resin, or a ceramic,
It includes a substrate using an inorganic material such as metal or glass, a pattern formed on the upper surface of the substrate, and a terminal electrode formed on the lower surface of the substrate (each not shown). The terminal electrode plate 73 described above is soldered to one of the patterns formed at the end. Various electronic components are mounted on other patterns. The pattern 11 and the terminal electrode are mutually connected by a connecting conductor formed on the inner wall surface of the through hole. Further, holes are formed in the substrate. This hole is provided for improving handling in the manufacturing process.
It has nothing to do with this circuit. In this embodiment, an epoxy-based printed wiring board 71 is used.

The electronic components include, for example, semiconductor devices such as ICs, transistors, FETs, and diodes, and passive components such as capacitors, inductors, resistors, and filter devices.

The terminal electrode plate 73 is a plate-like member extending in the length direction from the end of the printed wiring board 71. The terminal electrode plate 73 is a member for connection with a terminal of the secondary battery. Since the secondary battery and the terminal electrode plate 73 were connected by welding such as ultrasonic welding or resistance welding in order to reduce the influence on the battery, a nickel plate was used as the terminal electrode plate 73.

The resin 72 is formed on the upper surface of the printed wiring board 71 except for the terminal electrode plate 73. The resin 72 is formed at such a height that all the electronic components are embedded in the resin 72. The long side of the resin 72 is the printed wiring board 71.
And is perpendicular to the upper surface of the printed wiring board 71. The material and the like of the resin 72 are the same as in the first embodiment.

Next, a method of manufacturing the hybrid IC 70 will be described with reference to FIGS. FIG.
4 to 16 show a hybrid IC according to a third embodiment.
FIG. 4 is a view for explaining the manufacturing process of FIG.

First, as shown in FIG. 14, a printed wiring board 80 on which a predetermined pattern, a through hole, and the like are formed is prepared, and an electronic component 81 is mounted on the printed wiring board 80. The printed wiring board 80 has a plurality of (20 in FIG. 14) patterns of hybrid ICs 70 formed in a matrix. Further, a mark 80 for confirming a cutting position in a cutting step described later is provided on a peripheral portion of the printed wiring board 80.
a is printed. Note that a cutout or a concave portion may be provided instead of printing such as the mark 80a.

Next, the flux residue adhering to the printed wiring board 80 is removed by an ultrasonic cleaning method or the like. This is because if the flux is attached to the printed wiring board 80, the adhesive strength between the resin and the printed wiring board 80 is reduced.

Here, prior to or after the mounting of the electronic component 81, the sheet 31 similar to that of the first embodiment is attached to the entire surface opposite to the mounting surface of the printed wiring board 80. .

Next, similarly to the first embodiment, the printed wiring board 80 is heated to remove excess water contained in the printed wiring board 80 and the like.

Next, as shown in FIG.
0 is placed on a support base 32 having a horizontal upper surface, and a frame 36 is arranged on the periphery of the printed wiring board 80. This frame 36
It has a structure in which a resin formation region is opened. That is, the frame 36 is arranged so that the pattern to which the terminal electrode plate 73 is soldered is not exposed. Next, the printed wiring board 8
The surrounding space of 0 is evacuated. At this time, the vacuum pressure is set to, for example, about 2 Torr (= 266.644 Pa). Next, in this vacuum state, the printed wiring board 8 is kept in this state.
Then, a thermosetting resin 82 is injected. At this time, the resin 8
2 has low viscosity and fluidity, so it spreads over the entire surface in the frame 36. The peripheral edge of the resin 82 is slightly curved due to surface tension, and the upper surface is substantially horizontal.

Next, the space around the printed wiring board 80 is raised to atmospheric pressure. As a result, the resin 82 is filled in a gap generated between the electronic component 81 and the printed wiring board 80, a through hole formed in the substrate, and a hole. At this time, since the sheet 31 is attached to the printed wiring board 80, the resin 82 does not flow out to the bottom surface of the substrate through the through holes or holes.

It is preferable that the series of steps of pressure reduction, resin application, and pressure increase be repeated a plurality of times as necessary. In other words, the resin is filled in the gap between the printed wiring board 80 and the electronic component 81 or in the through-hole due to the differential pressure in the boosting step, and as a result, a concave portion is formed on the surface of the resin. Thus, by further applying a resin, the resin surface can be formed in a shape with less unevenness. In addition, by repeatedly reducing and increasing the pressure, the filling of the gap between the printed wiring board 80 and the electronic component 81, the inside of the through-hole, and the like becomes reliable.

Next, the resin 82 is cured by heating.
Next, the sheet 31 is peeled from the printed wiring board 80. The sheet 31 may be removed after the cutting step described below.

Next, as shown in FIG. 16, the printed wiring board 80 on which the resin 82 has been formed is cut into unit dimensions of the hybrid IC using the dicer 34 or the like. At the time of this cutting, accurate cutting can be performed by performing alignment using the mark 80a formed on the printed wiring board 80. Finally, the hybrid IC 70 is obtained by soldering the terminal electrode plate to the printed wiring board.

According to the hybrid IC according to the present embodiment, since the terminal electrode plate 73 is provided on the printed wiring board, connection with an external device such as a secondary battery becomes easy. Other functions and effects are the same as those of the first embodiment.

Although the first to third embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

For example, in the above-described embodiment, a sheet is attached to the printed wiring board prior to the resin forming step, thereby preventing extra resin from adhering to the side opposite to the electronic component mounting surface. However, when holes such as through holes are not formed in the printed wiring board, there is no need to attach a sheet.

As shown in FIG. 17, the printed wiring board 90 may have a through hole 91 previously closed by a closing member such as a resin. Here, the printed wiring board 90 shown in FIG.
Is filled with a resin 92. In the printed wiring board 90 shown in FIG. 17B, the upper and lower surfaces of the through hole 91 are formed with a conductor such as a pattern or a lid 93 formed by silk printing or the like. In a printed wiring board 90 shown in FIG. 17C, a conductor 94 is filled in a through hole 91. When such a printed wiring board 90 is used, the above-described sheet sticking step is unnecessary. In particular, in the case where the resin 92 is formed in the through hole 91, the adhesion between the resin 92 and the resin for sealing the electronic component is improved, so that the resin for sealing the electronic component and the printed wiring board are not used. The adhesion of is improved.

Further, in each of the above embodiments, a thermosetting resin is used as a resin for sealing electronic parts, but the present invention is not limited to this. Other resins may be used as long as they have at least insulating properties. For example, an ultraviolet curable resin may be used. This ultraviolet curable resin has the property of being cured by irradiation with ultraviolet light. In the case of using this ultraviolet curable resin, an ultraviolet irradiation step may be performed instead of the resin heating step in each of the above-described embodiments. Also, for example, a resin that cures with humidity (moisture), such as a silicon-based resin, or a resin that is solid at room temperature but is fluidized by applying heat and pressure, then solidifies when returned to room temperature, may be used. Good.

Further, in selecting the resin, from the viewpoint that the state of the embedded electronic components and the printed wiring board can be visually recognized from the outside, and from the viewpoint of using a light-emitting electronic component, it is preferable to use a light-transmitting material. Resins having properties are preferred. On the other hand, from the viewpoint of concealing a circuit, a resin having no light-transmitting property is preferable. The present invention can be carried out with any resin.

Further, in each of the above embodiments, a printed wiring board having a rigid substrate is used, but a flexible printed wiring board may be used.

Further, in each of the above-described embodiments, the printed wiring board has a through hole and a hole formed therein. However, this hole is provided solely for easy handling such as alignment. It may not be formed.

Further, in each of the above-described embodiments, the resin is injected by injecting the resin in a vacuum pressure atmosphere and then setting the atmosphere to an atmospheric pressure atmosphere. However, the present invention is not limited to this. That is, the resin may be applied and formed only in the atmospheric pressure atmosphere.

Further, in each of the above embodiments, as a method of forming the resin, a method of arranging a frame on the upper surface of the printed wiring board and pouring the resin into the frame has been exemplified, but the present invention is not limited to this. Not something. For example, as shown in FIGS. 18 and 19, a mask 95 in which a hole 95a corresponding to a region where a resin is formed may be used. Specifically, the mask 9
5 may be arranged above printed wiring board 98 and resin 97 may be poured with squeegee 96 to form a resin having a shape substantially corresponding to hole 95 a on the upper surface of printed wiring board 98. In this case, the height of the resin is determined by the thickness of the mask 95.

Further, in each of the above embodiments, the surface treatment is not performed on the resin, but the surface treatment may be performed if necessary. For example, if a metal thin film is formed on the surface of the resin, excellent shielding properties are obtained.

Further, in each of the above embodiments, the protection module for the secondary battery used in the battery pack as the hybrid IC has been described, but the present invention is not limited to this. It can be used for other uses.

[0094]

As described in detail above, in the hybrid IC according to the present invention, the resin is formed on one surface of the printed wiring board, so that the surface has little irregularities and is easy to handle. Further, since the resin is formed on one surface of the printed wiring board and in the mounting region of the electronic component, all the electronic components mounted on the printed wiring board are embedded in the resin. Therefore, various influences from the outside can be reduced in accordance with the properties of the resin such as water resistance and chemical resistance. Also,
Since the resin is interposed between the lead terminals of the electronic component, static electricity can be prevented from being generated between the lead terminals.

Further, according to the method of manufacturing a hybrid IC according to the present invention, the above-described hybrid IC can be easily and reliably manufactured. In particular, even when manufacturing a plurality of hybrid ICs at once, each hybrid IC
Since there is no need to perform the resin forming process for each C, the production efficiency is improved.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a hybrid IC according to a first embodiment.

FIG. 2 is a cross-sectional view of the hybrid IC according to the first embodiment.

FIG. 3 is a plan view of the hybrid IC according to the first embodiment;

FIG. 4 is a diagram illustrating a manufacturing process of the hybrid IC according to the first embodiment.

FIG. 5 is a diagram illustrating a manufacturing process of the hybrid IC according to the first embodiment.

FIG. 6 is a diagram illustrating a manufacturing process of the hybrid IC according to the first embodiment.

FIG. 7 is a view for explaining one implementation of the hybrid IC according to the first embodiment;

FIG. 8 is a view for explaining one implementation of the hybrid IC according to the first embodiment;

FIG. 9 is an external perspective view of a hybrid IC according to a second embodiment.

FIG. 10 is a diagram illustrating a manufacturing process of the hybrid IC according to the second embodiment.

FIG. 11 is a diagram illustrating a manufacturing process of the hybrid IC according to the second embodiment.

FIG. 12 is a diagram illustrating a manufacturing process of the hybrid IC according to the second embodiment.

FIG. 13 is an external perspective view of a hybrid IC according to a third embodiment.

FIG. 14 is a diagram illustrating a manufacturing process of the hybrid IC according to the third embodiment.

FIG. 15 is a diagram illustrating a manufacturing process of the hybrid IC according to the third embodiment.

FIG. 16 is a diagram illustrating a manufacturing process of the hybrid IC according to the third embodiment.

FIG. 17 is a cross-sectional view illustrating a structure of a printed wiring board according to another example.

FIG. 18 is a diagram illustrating a resin forming process according to another example.

FIG. 19 is a diagram illustrating a resin forming process according to another example.

FIG. 20 is a configuration diagram of a conventional hybrid IC.

[Explanation of symbols]

10, 50, 70 ... hybrid IC, 11, 51, 7
1, 90: printed wiring board, 11a, 71a: wiring board, 1
1b, 71b ... pattern, 11c ... terminal electrode, 11d ...
Through-hole, 11e connection conductor, 11f hole, 12,
52, 72: resin, 13: electronic component, 73: terminal electrode plate

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Succeeded Tejima 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. F-term (reference) 4M109 AA01 BA04 CA06 DB07 DB15 DB16 EA01 EA02 GA02 5F061 AA01 BA04 CA06 CB13 FA02

Claims (12)

[Claims] A printed wiring board; an electronic component mounted on one surface of the printed wiring board; and an electronic component formed on at least one of the electronic component mounting areas on the one surface of the printed wiring board. A hybrid IC comprising a resin for sealing parts. 2. The hybrid IC according to claim 1, wherein said resin is formed on the entire surface of said one surface of the printed wiring board. 3. The printed wiring board has a through hole formed therein, and the through hole is integrally filled with the resin for sealing the electronic component. 2. The hybrid IC according to claim 1. 4. The hybrid IC according to claim 1, wherein the printed wiring board has a through-hole formed therein and a closing member for closing the through-hole. 5. The hybrid IC according to claim 4, wherein the closing member is made of a resin different from the electronic component sealing resin. 6. The hybrid IC according to claim 1, further comprising a terminal electrode formed on the other surface of said printed wiring board. 7. A step of mounting an electronic component on one surface of a printed wiring board including one or more hybrid IC patterns, and a step of mounting the electronic component on at least one electronic component mounting area on the one surface of the printed wiring board. A method for manufacturing a hybrid IC, comprising: a step of forming a resin to seal an electronic component; and a step of cutting the printed wiring board and the resin into unit dimensions of the hybrid IC. 8. The method according to claim 7, wherein the printed wiring board has a terminal electrode formed on the other surface. 9. The resin forming step includes a pressure reducing step of reducing the atmosphere to a vacuum pressure, a coating step of coating the resin on one surface of the printed wiring board in a vacuum pressure atmosphere, and a pressure increasing step of raising the atmosphere. The method for manufacturing a hybrid IC according to claim 7, further comprising: a resin curing step of curing the applied resin. 10. The method for manufacturing a hybrid IC according to claim 9, wherein a series of steps from the pressure reduction step to the pressure increase step is repeated a plurality of times. 11. A sheet for covering a through hole formed in a printed wiring board is attached to a surface of the printed wiring board opposite to a surface on which the resin is formed, prior to the step of forming the resin. The method for manufacturing a hybrid IC according to any one of claims 7 to 10. 12. A through-hole formed in a printed wiring board is provided with a closing member for closing the through-hole, prior to the step of forming the resin.
0. The method of manufacturing a hybrid IC according to claim 1.