JP2007142182A - Module with built-in electronic components - Google Patents

Module with built-in electronic components Download PDF

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JP2007142182A
JP2007142182A JP2005334353A JP2005334353A JP2007142182A JP 2007142182 A JP2007142182 A JP 2007142182A JP 2005334353 A JP2005334353 A JP 2005334353A JP 2005334353 A JP2005334353 A JP 2005334353A JP 2007142182 A JP2007142182 A JP 2007142182A
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Prior art keywords
substrate
sealing resin
electronic component
module
solder
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JP2005334353A
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Japanese (ja)
Inventor
Masanori Nano
匡紀 南尾
Noboru Takeuchi
登 竹内
Toshiyuki Fukuda
敏行 福田
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2005334353A priority Critical patent/JP2007142182A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module with built-in electronic components for preventing short-circuiting failure from occurring in packaging reflow on a printed-wiring board without using any special sealing resins. <P>SOLUTION: Lands 12, 12 are formed on a surface 11 for mounting components on a substrate 10, electrodes 21, 21 in chips 20 are placed on it for connection and fixing by solders 15, 15. The chips 20 are sealed by a sealing resin 30. The sealing resin 30 contains hygroscopic fillers 40, 40. The hygroscopic fillers 40, 40 absorb moisture in the sealing resin 30, thus preventing short-circuiting failure where two electrodes 21, 21 are short-circuited by the melting and flowing of the solders 15, 15 when performing the packaging reflow of the module with built-in electronic components onto the printed-wiring board, or the like. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子部品内蔵モジュールに関し、特に複数の電子部品が基板に搭載されて樹脂により封止されている電子部品内蔵モジュールに関するものである。   The present invention relates to an electronic component built-in module, and more particularly to an electronic component built-in module in which a plurality of electronic components are mounted on a substrate and sealed with resin.

携帯電話や携帯音楽再生機などのように、電子機器は軽薄短小を合い言葉にどんどんと小型軽量化されている。このため、電子機器に使われる部品も小型軽量化が必須であり、この方向に開発が進んでいる。このような開発の一つとして、半導体集積回路と抵抗やコンデンサ等の部品を一つの基板にまとめて搭載して所定の機能を有するモジュール製品（半導体装置）の開発を挙げることができる。   Electronic devices, such as mobile phones and portable music players, are becoming smaller and lighter according to the word “light and thin”. For this reason, parts used in electronic devices must also be reduced in size and weight, and development is progressing in this direction. One of such developments is the development of a module product (semiconductor device) having a predetermined function by collectively mounting a semiconductor integrated circuit and components such as resistors and capacitors on one substrate.

このようなモジュール製品としては、例えば特許文献１から５に挙げられているモジュールのように、基板に半導体チップと、チップコンデンサやチップ抵抗などのチップ部品とを搭載して、電池保護機能等を発揮するモジュールが知られている。このようなモジュールは、搭載された半導体チップやチップ部品を保護するために樹脂によって全体を封止することが行われている。   As such a module product, for example, as in the modules listed in Patent Documents 1 to 5, a semiconductor chip and a chip component such as a chip capacitor or a chip resistor are mounted on a substrate, and a battery protection function or the like is provided. Modules that perform are known. In such a module, the whole is sealed with a resin in order to protect the mounted semiconductor chip and chip component.

このようなモジュール製品は、プリント配線基板などの実装基板にリフローによってはんだ付けされるが、特許文献５に記載されているように、実装リフローの際にモジュール内のはんだ付け部品（チップ部品）においてはんだの再溶融が生じ、これによって短絡が生じるという問題がある。特許文献５においては、この短絡現象は、はんだが再溶融するとその溶融膨張圧力が部品とレジン（樹脂）の界面、またはレジンとモジュール基板の界面を剥離させ、そこにはんだがフラッシュ状に流れ込みチップ部品の両端の端子が繋がってしまうことにより生じる、と記載されている。この現象を防止するため、特許文献５では、内部部品を保護可能な保護力（機械的強度）とはんだの再溶融膨張圧力を緩和可能な柔軟性とを兼ね備えた樹脂を封止樹脂として用いることを開示している。
特開２００２−１９０５６４号公報 特開２００２−１９０５６５号公報 特開２００２−１９０４８６号公報 特開２００５−１０９１３５号公報 特開２００２−２０８６６８号公報 特開平３−１６７２５０号公報 特開平４−８１４１７号公報 Such a module product is soldered to a mounting board such as a printed wiring board by reflow. However, as described in Patent Document 5, in a soldering component (chip part) in the module at the time of mounting reflow, There is a problem that remelting of the solder occurs, which causes a short circuit. In Patent Document 5, when the solder is remelted, this short circuit phenomenon causes the melt expansion pressure to peel off the interface between the component and the resin (resin), or the interface between the resin and the module substrate, and the solder flows into the flash into the chip. It is described that it occurs when terminals at both ends of a component are connected. In order to prevent this phenomenon, in Patent Document 5, a resin having both a protective force (mechanical strength) capable of protecting internal components and a flexibility capable of relaxing the remelt expansion pressure of solder is used as a sealing resin. Is disclosed.
JP 2002-190564 A JP 2002-190565 A JP 2002-190486 A JP 2005-109135 A JP 2002-208668 A JP-A-3-167250 Japanese Patent Laid-Open No. 4-81417

しかしながら、特許文献５に開示された樹脂は特殊な樹脂であり、従来の封止樹脂に替えてこの特殊樹脂を採用するためには、モールドのし易さや封止後の歩留まり、長期の安定使用性など多くのクリアすべき課題があり、コストも上昇するという問題があった。   However, the resin disclosed in Patent Document 5 is a special resin, and in order to adopt this special resin in place of the conventional sealing resin, the ease of molding, the yield after sealing, and long-term stable use There were many issues to be cleared, such as sex, and there was a problem of increased costs.

本発明は、かかる点に鑑みてなされたものであり、その目的とするところは、特殊な封止樹脂を用いること無しに、プリント配線基板での実装リフロー時に短絡不良が生じるのを防止する電子部品内蔵モジュールを提供することにある。   The present invention has been made in view of the above points, and an object of the present invention is to prevent an occurrence of a short-circuit failure during mounting reflow on a printed wiring board without using a special sealing resin. It is to provide a component built-in module.

上記の課題を解決するため、本発明の第１の電子部品内蔵モジュールは、基板と、複数存しているとともに前記基板に搭載されてはんだによって固定されており、抵抗、コンデンサおよびコイルのうちの少なくとも１つである電子部品と、前記電子部品を封止している封止樹脂とを備えた電子部品内蔵モジュールであって、前記封止樹脂には吸湿性フィラーが含有されている構成とした。このような構成とすることにより、電子部品内蔵モジュールをプリント配線基板等に実装リフローする際にはんだが流れて２つの電極部間をはんだが繋いでしまうことを防ぐことができる。ここで、複数の電子部品のそれぞれは抵抗、コンデンサおよびコイルの何れかである。吸湿性フィラーは水分を取り込んで保持するフィラーであり、多孔質の吸湿性シリカやシリカゲル、ゼオライト、高吸水性ポリマーなどのように水分を吸着するものでよいし、水と化学的に反応して水分を取り込むものでもよい。   In order to solve the above-mentioned problem, the first electronic component built-in module of the present invention includes a substrate, a plurality of modules, and is mounted on the substrate and fixed by solder, and includes a resistor, a capacitor, and a coil. An electronic component built-in module comprising at least one electronic component and a sealing resin sealing the electronic component, wherein the sealing resin contains a hygroscopic filler. . By adopting such a configuration, it is possible to prevent solder from flowing between the two electrode portions when the electronic component built-in module is mounted and reflowed on a printed wiring board or the like. Here, each of the plurality of electronic components is one of a resistor, a capacitor, and a coil. The hygroscopic filler is a filler that takes in and retains moisture, and may adsorb moisture such as porous hygroscopic silica, silica gel, zeolite, and a superabsorbent polymer, or may react chemically with water. It may be one that takes in moisture.

前記封止樹脂は、エポキシ樹脂にシリコーン重合体を混合させたもの、およびエポキシ樹脂にシリコーン重合体を付加させたものの少なくとも一方であることが好ましい。   The sealing resin is preferably at least one of an epoxy resin mixed with a silicone polymer and an epoxy resin added with a silicone polymer.

前記封止樹脂内の前記吸湿性フィラーの含有量は、前記エポキシ樹脂に対して５ｗｔ％以上３５ｗｔ％以下であることが好ましい。さらに、５ｗｔ％以上２０ｗｔ％以下であることがより好ましい。   The content of the hygroscopic filler in the sealing resin is preferably 5 wt% or more and 35 wt% or less with respect to the epoxy resin. Further, it is more preferably 5 wt% or more and 20 wt% or less.

本発明の第２の電子部品内蔵モジュールは、基板と、複数存しているとともに前記基板に搭載されてはんだによって固定されており、抵抗、コンデンサおよびコイルのうちの少なくとも１つである電子部品と、前記電子部品を封止している封止樹脂とを備えた電子部品内蔵モジュールであって、前記基板は有機基板であり、前記基板には吸湿性フィラーが含有されている構成である。有機基板とは樹脂を構成要素の一つとしている基板である。基板に吸湿性フィラーが含有されているというのは、有機基板の中に練り込まれていたり、基板上に塗布されていて一体化していることなどをいう。   The second electronic component built-in module of the present invention includes a substrate, a plurality of electronic components mounted on the substrate and fixed by solder, and being an at least one of a resistor, a capacitor, and a coil. An electronic component built-in module including a sealing resin for sealing the electronic component, wherein the substrate is an organic substrate, and the substrate contains a hygroscopic filler. An organic substrate is a substrate having a resin as one of the constituent elements. The fact that the substrate contains a hygroscopic filler means that the substrate is kneaded into the organic substrate or is applied and integrated on the substrate.

本発明の第３の電子部品内蔵モジュールは、基板と、複数存しているとともに前記基板に搭載されてはんだによって固定されており、抵抗、コンデンサおよびコイルのうちの少なくとも１つである電子部品と、前記電子部品を封止している封止樹脂とを備えた電子部品内蔵モジュールであって、前記基板はセラミック基板であり、前記基板には吸湿性フィラーが含有されている構成である。基板に吸湿性フィラーが含有されているというのは、セラミックの構成材料の一部に吸湿性フィラーが用いられていることや、基板上に塗布されていて一体化していることなどをいう。   The third electronic component built-in module of the present invention includes a substrate, a plurality of electronic components mounted on the substrate and fixed by solder, and being an at least one of a resistor, a capacitor, and a coil. An electronic component built-in module comprising a sealing resin for sealing the electronic component, wherein the substrate is a ceramic substrate, and the substrate contains a hygroscopic filler. The fact that the substrate contains a hygroscopic filler means that the hygroscopic filler is used as a part of the ceramic constituent material, or that the hygroscopic filler is applied and integrated on the substrate.

本発明の電子部品内蔵モジュールは、電子部品内蔵モジュールをプリント配線基板等に実装リフローする際にはんだが流れて２つの電極部間をはんだが繋いでしまうことを防ぐことができる。   The electronic component built-in module of the present invention can prevent solder from flowing between the two electrode portions when the electronic component built-in module is mounted and reflowed on a printed wiring board or the like.

特許文献５では、プリント配線基板への実装リフロー時に短絡不良が生じるのは、はんだが再溶融する際の溶融膨張圧力に原因があるとしていたが、本願発明者らは原因は封止樹脂の熱膨張圧力にもあると考えた。そこで、封止樹脂の熱膨張圧力と短絡不良との関係を調べたところ、封止樹脂中の水分が短絡不良の発生に大きく関係していることが判明した。この封止樹脂中の水分が短絡不良の発生に関係していることは、本願発明者らが初めて見出したことである。   In Patent Document 5, it is said that the short-circuit failure occurs at the time of reflow mounting on a printed wiring board is caused by the melt expansion pressure when the solder is re-melted. We thought that there was also expansion pressure. Therefore, when the relationship between the thermal expansion pressure of the sealing resin and the short circuit failure was examined, it was found that the moisture in the sealing resin was greatly related to the occurrence of the short circuit failure. The inventors of the present application have found that the moisture in the sealing resin is related to the occurrence of short circuit failure.

封止樹脂中の水分は実装リフロー時に気化しようとするため、封止樹脂の熱膨張圧力を大きくする方向に働くと考えられる。封止樹脂の熱膨張圧力が高くなると溶融はんだにかかる圧力が大きくなってはんだが流れて短絡不良が生じやすいと考えられ、さらに溶融はんだの存する部分になんらかの原因で空隙が生じた場合はそこに水蒸気が入ってはんだがさらに流れやすくなると思われる。このようなことから、短絡不良を防止するためには封止樹脂中の水分を減らす必要があると考え、本願発明を想到するに至った。なお、短絡不良防止のために封止樹脂中の水分を減らすという課題は、本願発明者らが見出した新規の課題である。   It is considered that the moisture in the sealing resin tends to evaporate at the time of mounting reflow, and thus acts to increase the thermal expansion pressure of the sealing resin. If the thermal expansion pressure of the sealing resin increases, the pressure applied to the molten solder increases and the solder flows, and it is considered that short-circuit failure is likely to occur, and if there is a gap in the part where the molten solder exists for some reason, It seems that water vapor enters and solder flows more easily. For this reason, in order to prevent short circuit failure, it is considered necessary to reduce the moisture in the sealing resin, and the present invention has been conceived. In addition, the subject of reducing the water | moisture content in sealing resin for short circuit failure prevention is a novel subject which the present inventors discovered.

以下、本発明の実施形態を図面に基づいて詳細に説明する。以下の図面においては、説明の簡潔化のため、実質的に同一の機能を有する構成要素を同一の参照符号で示す。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity.

（実施形態１）
実施形態１は、基板に半導体チップと複数のチップ部品とが搭載されて樹脂封止された電子部品内蔵モジュールに関するものである。ここでチップ部品というのは、抵抗やコンデンサおよびコイルのようないわゆる受動素子と呼ばれる電子部品であって、表面実装用に小型となっており外表面に電極を設けた電子部品のことである。 (Embodiment 1)
Embodiment 1 relates to an electronic component built-in module in which a semiconductor chip and a plurality of chip components are mounted on a substrate and sealed with resin. Here, the chip component is an electronic component called a so-called passive element such as a resistor, a capacitor, and a coil, and is an electronic component that is small for surface mounting and has an electrode on the outer surface.

図１は本実施形態の電子部品内蔵モジュールの概略の平面図である。基板１０の中央部分に集積回路が形成された半導体チップ２５が搭載され、その周りに複数のチップ部品２０，２０，…が搭載されている。そしてこれらは封止樹脂３０によって封止されている。本実施形態では、この半導体チップ２５は高周波増幅素子であり、従ってモジュールは高周波モジュールである。   FIG. 1 is a schematic plan view of the electronic component built-in module of the present embodiment. A semiconductor chip 25 on which an integrated circuit is formed is mounted on the central portion of the substrate 10, and a plurality of chip components 20, 20,. These are sealed with a sealing resin 30. In the present embodiment, the semiconductor chip 25 is a high-frequency amplification element, and thus the module is a high-frequency module.

本実施形態では基板１０は有機基板であり、ここではＢＴ基板を用いている。半導体チップ２５は、図５に示すように、基板１０の上に搭載されており、チップ部品２０，２０，…や外部接続端子３２，３２，３２と電気的に接続されている。この接続は基板１０の表面の配線、基板１０内部に形成されている配線３４，３４，…、埋め込み配線３６，３６，…およびボンディングワイヤなどによって行われる。   In this embodiment, the substrate 10 is an organic substrate, and here, a BT substrate is used. As shown in FIG. 5, the semiconductor chip 25 is mounted on the substrate 10 and is electrically connected to the chip components 20, 20,... And the external connection terminals 32, 32, 32. This connection is made by wiring on the surface of the substrate 10, wirings 34, 34,... Formed in the substrate 10, embedded wirings 36, 36,.

チップ部品２０，２０，…のそれぞれは、抵抗、コンデンサおよびコイルのうちの一つであり、基板１０上にはこれら３種類のうち少なくとも１つが搭載されている。モジュールの種類によっては、３種類とも搭載されているものもあれば、抵抗とコンデンサだけが搭載されているものもある。   Each of the chip components 20, 20,... Is one of a resistor, a capacitor, and a coil, and at least one of these three types is mounted on the substrate 10. Some types of modules have all three types installed, while others have only resistors and capacitors.

チップ部品２０は、図２に示すように２つの電極部２１，２１とこれらに挟まれた本体部２２とからなっている。チップ部品２０は全体として略直方体であるが、電極部２１，２１のほうが本体部２２よりも高さや奥行きが少し大きい。本体部２２外面は通常セラミックであり、電極部２１，２１の表面はＮｉＳｎやＮｉＡｕなどからなっている。   As shown in FIG. 2, the chip component 20 includes two electrode portions 21 and 21 and a main body portion 22 sandwiched between them. The chip component 20 has a substantially rectangular parallelepiped shape as a whole, but the electrode portions 21 and 21 are slightly larger in height and depth than the main body portion 22. The outer surface of the main body 22 is usually ceramic, and the surfaces of the electrode portions 21 and 21 are made of NiSn, NiAu, or the like.

次に一つのチップ部品２０とその近傍に着目して、短絡不良の防止に関して説明する。   Next, focusing on one chip component 20 and the vicinity thereof, prevention of short circuit failure will be described.

図３は図１のＡ−Ａ線断面図であり、一つのチップ部品２０の搭載部分の断面を表している。基板１０のチップ部品２０を搭載する部品搭載面１１にはランド（接続電極）１２，１２が形成されている。ランド１２，１２はチップ部品２０の電極部２１，２１と接続されている。そして、電極部２１，２１は、はんだ１５，１５によりランド１２，１２に固定されている。本実施形態では、はんだ１５，１５は鉛を含まないＳｎ−Ａｇ−Ｃｕはんだを用いている。   FIG. 3 is a cross-sectional view taken along line AA of FIG. 1 and shows a cross section of a mounting portion of one chip component 20. Lands (connection electrodes) 12 and 12 are formed on the component mounting surface 11 on which the chip component 20 of the substrate 10 is mounted. The lands 12 and 12 are connected to the electrode portions 21 and 21 of the chip component 20. The electrode portions 21 and 21 are fixed to the lands 12 and 12 by solders 15 and 15. In the present embodiment, the solders 15 and 15 are Sn-Ag-Cu solder not containing lead.

本実施形態の電子部品内蔵モジュールを製造するに当たっては、基板１０のランド１２，１２にはんだペーストを印刷してはんだを設置し、その上にチップ部品２０の電極部２１，２１を置いて加熱しはんだをリフローさせて両者を接続させる。従って、ランド１２，１２と電極部２１，２１との間にははんだ１５，１５が介在し、電極部２１，２１の側壁および上面にまではんだ１５，１５が濡れ上がり、いわゆるはんだフィレットが形成される。なお、チップ部品２０の本体部２２は外面がセラミックであってはんだとの濡れ性が悪いため、このリフロー時には本体部２２の外面にはんだ１５が載ることはない。このようにはんだ１５をリフローさせた後に封止樹脂３０によって樹脂封止を行う。本実施形態では、封止樹脂３０はエポキシ系樹脂にシリコーン重合体を混合させたものを用いており、吸湿性フィラー４０，４０，…を添加しているが、これについては後述する。   In manufacturing the electronic component built-in module according to the present embodiment, solder paste is printed on the lands 12 and 12 of the substrate 10 to install solder, and the electrode portions 21 and 21 of the chip component 20 are placed thereon and heated. Reflow the solder and connect them together. Therefore, the solders 15 and 15 are interposed between the lands 12 and 12 and the electrode parts 21 and 21, and the solders 15 and 15 are wetted to the side walls and the upper surface of the electrode parts 21 and 21, so-called solder fillets are formed. The In addition, since the outer surface of the main body portion 22 of the chip component 20 is ceramic and has poor wettability with solder, the solder 15 is not placed on the outer surface of the main body portion 22 during this reflow. After reflowing the solder 15 in this way, resin sealing is performed with the sealing resin 30. In this embodiment, the sealing resin 30 uses a mixture of an epoxy resin and a silicone polymer, and is added with hygroscopic fillers 40, 40,...

ここで、シリコーン重合体はＳｉ−Ｏ結合により繋がっている分子鎖を主骨格としたポリマーであり、電子部品内蔵モジュールを配線基板に実装させる際にリフローさせるときに封止樹脂３０にクラックが生じないように添加している。封止樹脂３０にクラックが生じるとクラック内にはんだが流れて短絡する虞があるからである。なお、今後実装リフローというのはプリント配線基板などへの実装する際のはんだリフローのことを指す。   Here, the silicone polymer is a polymer whose main skeleton is a molecular chain connected by Si—O bonds, and a crack is generated in the sealing resin 30 when the electronic component built-in module is reflowed when mounted on a wiring board. It is added so that there is no. This is because if a crack occurs in the sealing resin 30, solder may flow in the crack and cause a short circuit. In the future, mounting reflow refers to solder reflow when mounting on a printed wiring board or the like.

具体的なシリコーン重合体としては、例えばシリコーンゲルやシリコーンオイル、シリコーンゴムなどを挙げることができるが、特許文献６および７に挙げられている物質が好ましい。特許文献６では、炭化水素基と、炭化水素基、エポキシ含有基およびポリオキシアルキレン基含有基のいずれか一つとがそれぞれ主鎖のＳｉに結合している組成物がエポキシ樹脂と結合（付加）しているものと自硬化性シリコーンゴムおよび／またはゲルとが混合されて封止樹脂全体を構成している。また、特許文献７では、アミノ基当量が７００以上のアミノシリコーンを付加したビフェニル骨格を持つエポキシ樹脂と、当該エポキシ樹脂中においてビニル変性シリコーンとハイドロジエンシリコーンとを反応させたシリコーンとを混合させて封止樹脂としている。なお、シリコーン重合体はこれらの重合体に限定されず、エポキシ樹脂にシリコーン重合体を混合させたもののみでも良いし、エポキシ樹脂にシリコーン重合体を付加させたもののみでも良く、実装リフロー時のクラックの発生が抑止できるものであればどのようなものでも構わない。エポキシ樹脂への混合および付加の少なくともいずれか一方の割合は、エポキシ樹脂に対して１０ｗｔ％以上４０ｗｔ％以下が好ましい。１０ｗｔ％よりも少ないと、実装リフロー時にクラックが生じる虞があり、４０ｗｔ％よりも多いと封止樹脂の強度などの特性低下が生じる虞がある。なお、実装リフロー時の温度やリフロー時間などを厳密に制御することにより、シリコーン重合体を混合あるいはエポキシ樹脂に付加させていなくてもクラックの発生を防止することは可能であるが、製造コストが増加してしまう。   Specific examples of the silicone polymer include silicone gels, silicone oils, and silicone rubbers, but the substances listed in Patent Documents 6 and 7 are preferable. In Patent Document 6, a composition in which a hydrocarbon group and any one of a hydrocarbon group, an epoxy-containing group, and a polyoxyalkylene group-containing group are bonded to Si of the main chain is bonded (added) to an epoxy resin. And the self-curing silicone rubber and / or gel are mixed to constitute the entire sealing resin. Further, in Patent Document 7, an epoxy resin having a biphenyl skeleton to which an aminosilicone having an amino group equivalent of 700 or more is added and a silicone obtained by reacting a vinyl-modified silicone and a hydrogenated silicone in the epoxy resin are mixed. It is a sealing resin. The silicone polymer is not limited to these polymers, and may be only one in which a silicone polymer is mixed with an epoxy resin, or only one in which a silicone polymer is added to an epoxy resin. Any material can be used as long as the generation of cracks can be suppressed. The ratio of at least one of mixing and addition to the epoxy resin is preferably 10 wt% or more and 40 wt% or less with respect to the epoxy resin. If it is less than 10 wt%, cracks may occur during mounting reflow, and if it exceeds 40 wt%, characteristics such as the strength of the sealing resin may be deteriorated. In addition, it is possible to prevent the occurrence of cracks even if the silicone polymer is not mixed or added to the epoxy resin by strictly controlling the temperature and reflow time during mounting reflow, but the manufacturing cost is low. It will increase.

ここで、ランド１２，１２の厚みと介在するはんだ１５の厚みと電極部２１の本体部２２よりも外方に飛び出している分とが合算されて、部品搭載面１１と本体部２２の下面との間の隙間となり、部品搭載面１１と本体部２２との距離ａとなる。そして、この隙間にも封止樹脂が入り込む。   Here, the thickness of the lands 12 and 12, the thickness of the intervening solder 15, and the portion protruding outward from the main body portion 22 of the electrode portion 21 are added together, and the component mounting surface 11 and the lower surface of the main body portion 22 And a distance a between the component mounting surface 11 and the main body portion 22. The sealing resin also enters this gap.

このようにして樹脂封止されて電子部品内蔵モジュールが出来上がる。基板１０の部品搭載面１１と反対側の面にはプリント配線基板などの外部基板との接続がなされる外部接続端子（不図示）が形成されており、プリント配線基板など外部基板とはんだにより接続固定される。この接続固定の際もはんだリフロー（実装リフロー）が行われる。この実装リフローの際に上述のように電子部品内蔵モジュール内で短絡が生じる問題があった。   Thus, the resin-encapsulated module is completed with resin sealing. An external connection terminal (not shown) that is connected to an external board such as a printed wiring board is formed on the surface opposite to the component mounting surface 11 of the board 10 and is connected to the external board such as the printed wiring board by soldering. Fixed. Solder reflow (mounting reflow) is also performed at the time of this connection fixation. As described above, there has been a problem that a short circuit occurs in the electronic component built-in module during the mounting reflow.

既に説明したように特許文献５では、プリント配線基板への実装リフロー時に短絡不良が生じるのは、はんだが再溶融する際の溶融膨張圧力に原因があるとしていたが、実装リフロー時にはその熱によって封止樹脂の熱膨張も生じる。従って、本願発明者らは、はんだの溶融膨張圧力に加えて封止樹脂の熱膨張圧力も考慮して検討を行えば、封止樹脂の種類を変更すること無しに短絡不良の防止が行えるのではないかと考え、その中でも封止樹脂中の水分の影響が大きいのではないかと考えた。   As already described, in Patent Document 5, it is said that the short circuit failure occurs during reflow mounting on a printed wiring board due to the melt expansion pressure when the solder is remelted. Thermal expansion of the stop resin also occurs. Therefore, the inventors of the present application can prevent a short circuit failure without changing the type of the sealing resin, if considering the thermal expansion pressure of the sealing resin in addition to the melt expansion pressure of the solder. I thought that the influence of moisture in the sealing resin might be great.

短絡不良は図４に示すように、電極部２１，２１上面に載っているはんだ１５，１５が本体部２２上面上を流れて両電極部２１，２１間の繋いでしまう現象（はんだブリッジ）である。   As shown in FIG. 4, the short circuit failure is a phenomenon (solder bridge) in which the solder 15, 15 placed on the upper surfaces of the electrode portions 21, 21 flows on the upper surface of the main body portion 22 and is connected between the electrode portions 21, 21. is there.

ここで、チップ部品２０の上方に存している封止樹脂３０は、実装リフロー時に熱膨張する。封止樹脂３０の上側は開放空間であるので自由に膨張できるが、下側へはチップ部品２０が邪魔になり膨張がある程度阻まれる。従って、封止樹脂３０は全体として上方へ膨張していく。つまり、溶融しているはんだ１５近辺では封止樹脂３０がはんだ１５を上方に引っ張っていると考えられる。封止樹脂３０中に水分が含まれている場合は、水分が気化しようとして膨張するので、水分が含まれていない場合に比べて封止樹脂３０全体の熱膨張圧力はかなりの程度大きくなるものと考えられる。さらに、封止樹脂３０と溶融しているはんだ１５との界面において空隙が生じると、そこで水分が気化してはんだ１５に大きな圧力をかけて一気にはんだブリッジが生じることも考えられる。   Here, the sealing resin 30 existing above the chip component 20 is thermally expanded during mounting reflow. Since the upper side of the sealing resin 30 is an open space, it can expand freely, but the chip component 20 interferes with the lower side and the expansion is blocked to some extent. Accordingly, the sealing resin 30 expands upward as a whole. That is, it is considered that the sealing resin 30 pulls the solder 15 upward in the vicinity of the molten solder 15. When the sealing resin 30 contains moisture, the moisture expands in an attempt to vaporize, so that the thermal expansion pressure of the entire sealing resin 30 is considerably higher than when no moisture is contained. it is conceivable that. Furthermore, when a void is generated at the interface between the sealing resin 30 and the molten solder 15, it is conceivable that moisture is vaporized there and a large pressure is applied to the solder 15 to form a solder bridge at a stretch.

このような推定を基にして、封止樹脂３０中の水分を減らすべく封止樹脂３０に吸湿性フィラー４０，４０，…を含有させてはんだブリッジの発生状況を検討した。吸湿性フィラー４０，４０，…としては平均粒径が３０μｍ以下のシリカゲルを用いた。ここで平均粒径が３０μｍというのは、フィラー粒子の粒径の平均が３０μｍであり且つ４０μｍ以上の粒径のフィラーを含んでいないことをいう。平均粒径を３０μｍよりも大きくすると、部品搭載面１１とチップ部品２０の本体部２２との間に封止樹脂３０が入らなくなってくるから望ましくない。また、平均粒径を１５μｍ以下にすると、部品搭載面１１と本体部２２との間に封止樹脂３０がスムースに入るのでより好ましい。ここで平均粒径が１５μｍというのは、フィラー粒子の粒径の平均が１５μｍであり且つ２０μｍ以上の粒径のフィラーを含んでいないことをいう。実際には平均粒径が１０μｍのフィラー粒子を用いた。この場合１５μｍ以上の粒径のフィラーは含まれていない。   Based on such estimation, in order to reduce moisture in the sealing resin 30, hygroscopic fillers 40, 40,... As the hygroscopic fillers 40, 40,..., Silica gel having an average particle size of 30 μm or less was used. Here, the average particle size of 30 μm means that the average particle size of the filler particles is 30 μm and does not contain a filler having a particle size of 40 μm or more. If the average particle size is larger than 30 μm, it is not desirable because the sealing resin 30 does not enter between the component mounting surface 11 and the main body portion 22 of the chip component 20. Moreover, when the average particle size is 15 μm or less, the sealing resin 30 smoothly enters between the component mounting surface 11 and the main body portion 22, which is more preferable. Here, the average particle size of 15 μm means that the average particle size of the filler particles is 15 μm and does not contain a filler having a particle size of 20 μm or more. Actually, filler particles having an average particle diameter of 10 μm were used. In this case, a filler having a particle size of 15 μm or more is not included.

検討は、封止樹脂３０に吸湿性フィラー４０，４０，…を混合して作成した電子部品内蔵モジュールを８５℃／６５％ＲＨの状況下に１２時間放置して吸湿させた後に実装リフロー（２７０℃）を２回行って（２回目のリフローの前にも吸湿工程を入れている）、はんだブリッジの発生状況を調べるというやり方とした。この条件は、プリント配線基板などへの実装に用いるはんだの融点は約２２０℃であり、実装リフローの温度は確実且つ短時間に実装を行うために２６０〜２７０℃に現状では設定されていることと、プリント配線基板などが両面基板の場合は、実装リフローが２回行われることとを考慮して設定した。また、吸湿条件は、吸湿がほぼ飽和する条件とした。   The study was conducted by mounting the electronic component built-in module prepared by mixing the hygroscopic filler 40, 40,... Into the sealing resin 30 and leaving the module in a state of 85 ° C./65% RH for 12 hours to absorb moisture, and then mounting reflow (270 (° C.) was performed twice (a moisture absorption step was also inserted before the second reflow), and the state of occurrence of solder bridges was examined. This condition is that the melting point of solder used for mounting on a printed circuit board is about 220 ° C., and the temperature of mounting reflow is currently set to 260 to 270 ° C. in order to perform mounting reliably and in a short time. In the case where the printed wiring board or the like is a double-sided board, it is set in consideration that the mounting reflow is performed twice. Further, the moisture absorption conditions were such that the moisture absorption was almost saturated.

封止樹脂３０中の吸湿性フィラー４０，４０，…の量を重量比（エポキシ樹脂の重量に対する吸湿性フィラーの重量の比）にして０ｗｔ％から徐々に増やしていくと、０から５ｗｔ％までは重量比が大きくなるに連れてはんだブリッジの発生率が減少していき、５ｗｔ％以上にするとはんだブリッジがほとんど発生しなくなった。しかし、２０ｗｔ％よりも多くなると、封止樹脂３０への混合が困難になり始め封止樹脂３０としての特性バランスが崩れやすくなり、３５ｗｔ％を越えると全てを封止樹脂３０中に混合することが非常に困難になった。従って吸湿性フィラー４０，４０，…の封止樹脂３０への添加量は３５ｗｔ％以下が好ましく、２０ｗｔ％以下がより好ましい。   When the amount of the hygroscopic filler 40, 40, ... in the sealing resin 30 is gradually increased from 0 wt% by weight ratio (ratio of the weight of the hygroscopic filler with respect to the weight of the epoxy resin), from 0 to 5 wt% As the weight ratio increased, the generation rate of solder bridges decreased. When the weight ratio was 5 wt% or more, almost no solder bridges were generated. However, if it exceeds 20 wt%, mixing into the sealing resin 30 becomes difficult, and the characteristic balance as the sealing resin 30 tends to be lost, and if it exceeds 35 wt%, all of it is mixed in the sealing resin 30. Became very difficult. Therefore, the addition amount of the hygroscopic fillers 40, 40,... To the sealing resin 30 is preferably 35 wt% or less, and more preferably 20 wt% or less.

このように、吸湿性フィラー４０，４０，…を封止樹脂３０に添加すると、推定していたとおりはんだブリッジの発生が抑制されるという結果が得られた。すなわち、本実施形態では吸湿性フィラー４０，４０，…を封止樹脂３０に含有させたので、特殊な封止樹脂を用いること無しに実装リフロー時における短絡不良の発生が防止できるようになった。このように吸湿性フィラー４０，４０，…を封止樹脂３０に含有させることで、今までの実装リフロー条件をそのまま用いて短絡不良が生じない実装を行うことができる。実装リフローの前の電子部品内蔵モジュールの吸湿状態がどのような状態であっても、本実施形態の電子部品内蔵モジュールは確実にはんだブリッジの発生を抑制できるので、手間およびコストのかかる吸湿性のコントロールを行う必要がない。   As described above, when the hygroscopic fillers 40, 40,... Were added to the sealing resin 30, the result was obtained that solder bridge formation was suppressed as estimated. That is, in this embodiment, since the hygroscopic fillers 40, 40,... Are contained in the sealing resin 30, it is possible to prevent occurrence of a short circuit failure during mounting reflow without using a special sealing resin. . As described above, by incorporating the hygroscopic fillers 40, 40,... Into the sealing resin 30, mounting without causing a short circuit failure can be performed using the mounting reflow conditions so far as they are. Regardless of the moisture absorption state of the electronic component built-in module before mounting reflow, the electronic component built-in module according to the present embodiment can reliably suppress the occurrence of solder bridges. There is no need to control.

また、本実施形態の電子部品内蔵モジュールを作製する方法は、例えば特許文献１ないし５に記載された方法を挙げることができるが、半導体チップの接続方法や樹脂封止の方法などは、これらの文献中の方法に特に限定されるものではない。   In addition, as a method of manufacturing the electronic component built-in module according to the present embodiment, for example, methods described in Patent Documents 1 to 5 can be given. However, a semiconductor chip connection method, a resin sealing method, and the like can be used. It is not particularly limited to the method in the literature.

（実施形態２）
実施形態２に係る電子部品内蔵モジュールは、実施形態１に係る電子部品内蔵モジュールとは基板が異なるだけであるので、異なる部分を説明する。 (Embodiment 2)
Since the electronic component built-in module according to the second embodiment is different from the electronic component built-in module according to the first embodiment only in the substrate, only different parts will be described.

本実施形態の基板は、セラッミク基板である。セラミック基板は有機基板に比べると吸湿性が非常に低く、この点で封止樹脂の実装リフロー時の熱膨張が実施形態１の場合よりも小さいと考えられる。実験による検討結果は実施形態１と同じであった。従って、実施形態１と同じように、封止樹脂に吸湿性フィラーを含有させた電子部品内蔵モジュールは、実施形態１と同様の短絡不良（はんだブリッジ）防止の効果を奏した。   The substrate of this embodiment is a ceramic substrate. The ceramic substrate has a very low hygroscopicity as compared with the organic substrate, and in this respect, it is considered that the thermal expansion at the time of mounting reflow of the sealing resin is smaller than that in the first embodiment. The experimental results were the same as in the first embodiment. Therefore, as in the first embodiment, the electronic component built-in module in which the hygroscopic filler is contained in the sealing resin has the same effect of preventing short circuit failure (solder bridge) as in the first embodiment.

（実施形態３）
実施形態３に係る電子部品内蔵モジュールは、実施形態１に係る電子部品内蔵モジュールとは基板と封止樹脂とが異なるので、異なる部分を説明する。 (Embodiment 3)
Since the electronic component built-in module according to the third embodiment is different from the electronic component built-in module according to the first embodiment in the substrate and the sealing resin, different parts will be described.

本実施形態の基板は、有機基板であるＢＴ基板の電子部品を搭載する側の面に吸湿性フィラーを塗布したものである。また、封止樹脂には吸湿性フィラーを含有させていない。このように吸湿性フィラーを封止樹脂に添加するのではなく、有機基板の表面に塗布した場合でも実験による検討結果は実施形態１と同じであった。従って、実施形態１と同じように、短絡不良（はんだブリッジ）防止の効果を奏した。また、吸湿性フィラーは有機基板の表面に塗布しなくても、基板に練り込めば同様の短絡不良防止の効果が得られる。   The substrate of this embodiment is obtained by applying a hygroscopic filler to the surface of the BT substrate, which is an organic substrate, on the electronic component mounting side. Further, the sealing resin does not contain a hygroscopic filler. Thus, even when the hygroscopic filler was not added to the sealing resin but applied to the surface of the organic substrate, the experimental results were the same as those in the first embodiment. Therefore, as in the first embodiment, the effect of preventing a short circuit failure (solder bridge) was achieved. Further, even if the hygroscopic filler is not applied to the surface of the organic substrate, the same effect of preventing short circuit failure can be obtained by kneading into the substrate.

（実施形態４）
実施形態４に係る電子部品内蔵モジュールは、実施形態２に係る電子部品内蔵モジュールとは基板と封止樹脂とが異なるので、異なる部分を説明する。 (Embodiment 4)
Since the electronic component built-in module according to the fourth embodiment is different from the electronic component built-in module according to the second embodiment in the substrate and the sealing resin, different parts will be described.

本実施形態の基板は、セラミック基板の電子部品を搭載する側の面に吸湿性フィラーを塗布したものである。また、封止樹脂には吸湿性フィラーを含有させていない。このように吸湿性フィラーを封止樹脂に添加するのではなく、セラミック基板の表面に塗布した場合でも実験による検討結果は実施形態１と同じであった。従って、実施形態１と同じように、短絡不良（はんだブリッジ）防止の効果を奏した。また、吸湿性フィラーはセラミック基板の表面に塗布しなくても、基板の構成材料の一つとして基板に練り込んで焼成すれば同様の短絡不良防止の効果が得られる。   The substrate of this embodiment is obtained by applying a hygroscopic filler to the surface of the ceramic substrate on which electronic components are mounted. Further, the sealing resin does not contain a hygroscopic filler. In this way, even when the hygroscopic filler is not added to the sealing resin but applied to the surface of the ceramic substrate, the experimental results are the same as those in the first embodiment. Therefore, as in the first embodiment, the effect of preventing a short circuit failure (solder bridge) was achieved. Even if the hygroscopic filler is not applied to the surface of the ceramic substrate, the same effect of preventing short circuit failure can be obtained by kneading into the substrate as one of the constituent materials of the substrate and baking it.

（その他の実施形態）
上記の実施形態は本発明の例示であり、本発明はこれらの例に限定されない。半導体チップ２５の数は１個に限定されず、基板１０における配置の位置も限定されない。例えば半導体チップ２５が２つ以上あっても良いし、基板１０中央以外の位置に配置されていても良いし、基板１０の部品搭載面１１とは反対側の面に搭載されていても良い。基板１０内に埋め込まれていても構わない。チップ部品２０の数も複数であれば特に限定されない。 (Other embodiments)
The above embodiments are examples of the present invention, and the present invention is not limited to these examples. The number of semiconductor chips 25 is not limited to one, and the arrangement position on the substrate 10 is not limited. For example, there may be two or more semiconductor chips 25, they may be arranged at positions other than the center of the substrate 10, or may be mounted on the surface of the substrate 10 opposite to the component mounting surface 11. It may be embedded in the substrate 10. The number of chip components 20 is not particularly limited as long as it is plural.

有機基板はＢＴ基板に限定されず、ＦＲ４基板でも良いしそれ以外の有機基板でも構わない。   The organic substrate is not limited to the BT substrate, and may be an FR4 substrate or another organic substrate.

吸湿性フィラー４０，４０，…は、シリカゲルに限定されず、例えば、シリカ、アルミナ、チタニア、ゼオライト、塩化カルシウム、水酸化ナトリウム、五酸化リン、炭酸カルシウム、水酸化カルシウム、塩化マグネシウム、酸化バリウム、層状構造を有する粘土鉱物、モンモリロナイトなどでもよく、吸湿性を有していて封止樹脂３０に混合できるものであればどのようなものでも構わない。なお、吸湿性フィラー４０，４０，…は破砕形状のものよりも凝集等により形成された球状に近い形状のものが好ましい。破砕形状のフィラーは各フィラー粒子の形状が大きく異なって、このフィラーが添加された封止樹脂の粘度が例えばフィラー粒子のバッチによって大きく変化するので好ましくない。   The hygroscopic fillers 40, 40,... Are not limited to silica gel. For example, silica, alumina, titania, zeolite, calcium chloride, sodium hydroxide, phosphorus pentoxide, calcium carbonate, calcium hydroxide, magnesium chloride, barium oxide, A clay mineral having a layered structure, montmorillonite, or the like may be used, and any material may be used as long as it has hygroscopicity and can be mixed with the sealing resin 30. It is preferable that the hygroscopic fillers 40, 40,... Have a shape close to a sphere formed by agglomeration or the like rather than a crushed shape. The crushed filler is not preferable because the shape of each filler particle is greatly different, and the viscosity of the sealing resin to which the filler is added varies greatly depending on, for example, the batch of filler particles.

封止樹脂３０はエポキシ樹脂が好ましいが、エポキシ系樹脂以外の樹脂、例えばシリコーン系の樹脂などでも構わない。また、封止樹脂３０に吸湿性フィラー４０，４０，…以外のフィラーを添加しても構わない。   The sealing resin 30 is preferably an epoxy resin, but may be a resin other than an epoxy resin, such as a silicone resin. Further, fillers other than the hygroscopic fillers 40, 40,... May be added to the sealing resin 30.

接続電極１２と電極部２１とを接続固定するはんだ１５は鉛を含まないはんだが好ましいが、Ｓｎ−Ａｇ−Ｃｕはんだに限定されず、Ｓｎ−ＳｂはんだやＳｎ−Ｂｉはんだ等でも構わない。   The solder 15 that connects and fixes the connection electrode 12 and the electrode portion 21 is preferably a solder that does not contain lead, but is not limited to Sn—Ag—Cu solder, and may be Sn—Sb solder, Sn—Bi solder, or the like.

以上説明したように、本発明に係る電子部品内蔵モジュールは、実装リフロー時に短絡不良が生じることを防止し、電子機器の部品としてのモジュール等として有用である。   As described above, the electronic component built-in module according to the present invention prevents a short circuit failure from occurring during mounting reflow, and is useful as a module or the like as a component of an electronic device.

電子部品内蔵モジュールの平面図である。It is a top view of an electronic component built-in module. チップ部品の正面図である。It is a front view of a chip component. 図１のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. はんだブリッジの状態を示す断面図である。It is sectional drawing which shows the state of a solder bridge. 電子部品内蔵モジュールの断面図である。It is sectional drawing of an electronic component built-in module.

符号の説明Explanation of symbols

１０ 基板
１１ 部品搭載面
１２ ランド（接続電極）
１５ はんだ
２０ チップ部品
２１ 電極部
２２ 本体部
３０ 封止樹脂
４０ 吸湿性フィラー 10 substrate 11 component mounting surface 12 land (connection electrode)
15 Solder 20 Chip Part 21 Electrode 22 Main Body 30 Sealing Resin 40 Hygroscopic Filler

Claims (9)

基板と、
複数存しているとともに前記基板に搭載されてはんだによって固定されており、抵抗、コンデンサおよびコイルのうちの少なくとも１つである電子部品と、
前記電子部品を封止している封止樹脂と
を備えた電子部品内蔵モジュールであって、
前記封止樹脂には吸湿性フィラーが含有されている、電子部品内蔵モジュール。 A substrate,
A plurality of electronic components that are mounted on the substrate and fixed by solder, and are at least one of a resistor, a capacitor, and a coil;
An electronic component built-in module comprising: a sealing resin that seals the electronic component;
An electronic component built-in module in which the sealing resin contains a hygroscopic filler. 前記封止樹脂は、エポキシ樹脂にシリコーン重合体を混合させたもの、およびエポキシ樹脂にシリコーン重合体を付加させたものの少なくとも一方である、請求項１に記載の電子部品内蔵モジュール。   The electronic component built-in module according to claim 1, wherein the sealing resin is at least one of an epoxy resin mixed with a silicone polymer and an epoxy resin added with a silicone polymer. 前記封止樹脂内の前記吸湿性フィラーの含有量は、前記エポキシ樹脂に対して５ｗｔ％以上３５ｗｔ％以下である、請求項２に記載の電子部品内蔵モジュール。   The electronic component built-in module according to claim 2, wherein a content of the hygroscopic filler in the sealing resin is 5 wt% or more and 35 wt% or less with respect to the epoxy resin. 前記封止樹脂内の前記吸湿性フィラーの含有量は、前記エポキシ樹脂に対して５ｗｔ％以上２０ｗｔ％以下である、請求項２に記載の電子部品内蔵モジュール。   The electronic component built-in module according to claim 2, wherein a content of the hygroscopic filler in the sealing resin is 5 wt% or more and 20 wt% or less with respect to the epoxy resin. 前記シリコーン重合体はエポキシ樹脂に対して１０ｗｔ％以上４０ｗｔ％以下混合および付加の少なくとも一方をされている、請求項２から４のいずれか一つに記載の電子部品内蔵モジュール。   5. The electronic component built-in module according to claim 2, wherein the silicone polymer is mixed and added at least 10 wt% to 40 wt% with respect to the epoxy resin. 前記吸湿性フィラーの平均粒径が３０μｍ以下である、請求項１から５のいずれか一つに記載の電子部品内蔵モジュール。   The electronic component built-in module according to claim 1, wherein the hygroscopic filler has an average particle size of 30 μm or less. 吸湿性フィラーの平均粒径が１５μｍ以下である、請求項６に記載の電子部品内蔵モジュール。   The electronic component built-in module according to claim 6, wherein the hygroscopic filler has an average particle size of 15 μm or less. 基板と、
複数存しているとともに前記基板に搭載されてはんだによって固定されており、抵抗、コンデンサおよびコイルのうちの少なくとも１つである電子部品と、
前記電子部品を封止している封止樹脂と
を備えた電子部品内蔵モジュールであって、
前記基板は有機基板であり、
前記基板には吸湿性フィラーが含有されている、電子部品内蔵モジュール。 A substrate,
A plurality of electronic components that are mounted on the substrate and fixed by solder, and are at least one of a resistor, a capacitor, and a coil;
An electronic component built-in module comprising: a sealing resin that seals the electronic component;
The substrate is an organic substrate;
An electronic component built-in module, wherein the substrate contains a hygroscopic filler. 基板と、
複数存しているとともに前記基板に搭載されてはんだによって固定されており、抵抗、コンデンサおよびコイルのうちの少なくとも１つである電子部品と、
前記電子部品を封止している封止樹脂と
を備えた電子部品内蔵モジュールであって、
前記基板はセラミック基板であり、
前記基板には吸湿性フィラーが含有されている、電子部品内蔵モジュール。 A substrate,
A plurality of electronic components that are mounted on the substrate and fixed by solder, and are at least one of a resistor, a capacitor, and a coil;
An electronic component built-in module comprising: a sealing resin that seals the electronic component;
The substrate is a ceramic substrate;
An electronic component built-in module, wherein the substrate contains a hygroscopic filler.
JP2005334353A 2005-11-18 2005-11-18 Module with built-in electronic components Ceased JP2007142182A (en)

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