JP5358052B2 - 電子装置パッケージ及びその製造方法 - Google Patents

電子装置パッケージ及びその製造方法 Download PDF

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Publication number
JP5358052B2
JP5358052B2 JP2005299793A JP2005299793A JP5358052B2 JP 5358052 B2 JP5358052 B2 JP 5358052B2 JP 2005299793 A JP2005299793 A JP 2005299793A JP 2005299793 A JP2005299793 A JP 2005299793A JP 5358052 B2 JP5358052 B2 JP 5358052B2
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JP
Japan
Prior art keywords
substrate
sensor
pair
front surface
sensor array
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005299793A
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English (en)
Japanese (ja)
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JP2006140461A5 (enExample
JP2006140461A (ja
Inventor
ウィリアム・エドワード・バーディック，ジュニア
ジェームズ・ウィルソン・ローズ
ジョン・エリック・トカチク
オデッド・メイラブ
ジェローム・スティーブン・アレンソン
デビッド・マイケル・ホフマン
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General Electric Co
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General Electric Co
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Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2006140461A publication Critical patent/JP2006140461A/ja
Publication of JP2006140461A5 publication Critical patent/JP2006140461A5/ja
Application granted granted Critical
Publication of JP5358052B2 publication Critical patent/JP5358052B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Radiation (AREA)
JP2005299793A 2004-10-28 2005-10-14 電子装置パッケージ及びその製造方法 Expired - Fee Related JP5358052B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/975,952 US7289336B2 (en) 2004-10-28 2004-10-28 Electronic packaging and method of making the same
US10/975,952 2004-10-28

Publications (3)

Publication Number Publication Date
JP2006140461A JP2006140461A (ja) 2006-06-01
JP2006140461A5 JP2006140461A5 (enExample) 2011-06-30
JP5358052B2 true JP5358052B2 (ja) 2013-12-04

Family

ID=36261548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005299793A Expired - Fee Related JP5358052B2 (ja) 2004-10-28 2005-10-14 電子装置パッケージ及びその製造方法

Country Status (2)

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US (1) US7289336B2 (enExample)
JP (1) JP5358052B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7781741B2 (en) * 2005-10-27 2010-08-24 General Electric Company Methods and systems for controlling data acquisition system noise
GB2433648A (en) * 2005-12-21 2007-06-27 Durham Scient Crystals Ltd Radiation detector formed by deposition of bulk semiconductor crystal layers
US8041003B2 (en) * 2009-08-31 2011-10-18 General Electric Company Electronic packaging technique to improve sensor failure robustness
US8659148B2 (en) 2010-11-30 2014-02-25 General Electric Company Tileable sensor array
US8575558B2 (en) 2010-11-30 2013-11-05 General Electric Company Detector array with a through-via interposer
US8824635B2 (en) 2011-10-27 2014-09-02 General Electric Company Detector modules for imaging systems and methods of manufacturing
WO2013188498A2 (en) * 2012-06-12 2013-12-19 Arizona Board Of Regents Acting For And On Behalf Of Arizona State University Imaging system and methods of manufacturing and using the same
US9788804B2 (en) * 2014-07-22 2017-10-17 Samsung Electronics Co., Ltd. Anatomical imaging system with improved detector block module
WO2016066850A1 (en) * 2014-10-31 2016-05-06 Koninklijke Philips N.V. Sensor device and imaging system for detecting radiation signals
US10646176B2 (en) 2015-09-30 2020-05-12 General Electric Company Layered radiation detector
EP3376261B1 (de) * 2017-03-15 2020-04-29 Siemens Healthcare GmbH Röntgendetektor aufweisend ein konverterelement mit umverdrahtungseinheit
US11435461B2 (en) 2019-07-19 2022-09-06 GE Precision Healthcare LLC Method and system to prevent depoling of ultrasound transducer
US11464494B2 (en) 2019-07-19 2022-10-11 GE Precision Healthcare LLC Method and system to revert a depoling effect exhibited by an ultrasound transducer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617730A (en) 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
US4783695A (en) 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
US4933042A (en) 1986-09-26 1990-06-12 General Electric Company Method for packaging integrated circuit chips employing a polymer film overlay layer
JP2637298B2 (ja) * 1991-03-19 1997-08-06 株式会社河合楽器製作所 自動演奏ピアノの打鍵検出装置
JPH08222855A (ja) * 1995-02-17 1996-08-30 Sharp Corp 多層配線板
JP3961092B2 (ja) * 1997-06-03 2007-08-15 株式会社東芝 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
JP3860380B2 (ja) * 1999-04-06 2006-12-20 富士通株式会社 配線基板及びこれを使用したチップモジュール
US6242282B1 (en) 1999-10-04 2001-06-05 General Electric Company Circuit chip package and fabrication method
JP2001242521A (ja) * 2000-02-28 2001-09-07 Fuji Heavy Ind Ltd カメラの組み立て構造、カメラの調整方法、および調整用治具
US6885107B2 (en) * 2002-08-29 2005-04-26 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabrication
JP4150270B2 (ja) * 2003-02-10 2008-09-17 株式会社イトーキ 移動棚装置
US20050167606A1 (en) * 2003-08-20 2005-08-04 Harrison Fiona A. Cadmium-zinc-telluride detectors

Also Published As

Publication number Publication date
US20060092615A1 (en) 2006-05-04
US7289336B2 (en) 2007-10-30
JP2006140461A (ja) 2006-06-01

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