JP5353695B2 - モジュール基板および、これを搭載した電子機器 - Google Patents

モジュール基板および、これを搭載した電子機器 Download PDF

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Publication number
JP5353695B2
JP5353695B2 JP2009515114A JP2009515114A JP5353695B2 JP 5353695 B2 JP5353695 B2 JP 5353695B2 JP 2009515114 A JP2009515114 A JP 2009515114A JP 2009515114 A JP2009515114 A JP 2009515114A JP 5353695 B2 JP5353695 B2 JP 5353695B2
Authority
JP
Japan
Prior art keywords
wiring board
intermediate layer
wiring
board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009515114A
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English (en)
Japanese (ja)
Other versions
JPWO2008142918A1 (ja
Inventor
淳哉 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2009515114A priority Critical patent/JP5353695B2/ja
Publication of JPWO2008142918A1 publication Critical patent/JPWO2008142918A1/ja
Application granted granted Critical
Publication of JP5353695B2 publication Critical patent/JP5353695B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP2009515114A 2007-05-18 2008-04-04 モジュール基板および、これを搭載した電子機器 Expired - Fee Related JP5353695B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009515114A JP5353695B2 (ja) 2007-05-18 2008-04-04 モジュール基板および、これを搭載した電子機器

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007132709 2007-05-18
JP2007132709 2007-05-18
JP2009515114A JP5353695B2 (ja) 2007-05-18 2008-04-04 モジュール基板および、これを搭載した電子機器
PCT/JP2008/056785 WO2008142918A1 (fr) 2007-05-18 2008-04-04 Substrat de module et dispositif électronique ayant le substrat de module monté dessus

Publications (2)

Publication Number Publication Date
JPWO2008142918A1 JPWO2008142918A1 (ja) 2010-08-05
JP5353695B2 true JP5353695B2 (ja) 2013-11-27

Family

ID=40031634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009515114A Expired - Fee Related JP5353695B2 (ja) 2007-05-18 2008-04-04 モジュール基板および、これを搭載した電子機器

Country Status (2)

Country Link
JP (1) JP5353695B2 (fr)
WO (1) WO2008142918A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2860577A4 (fr) 2012-06-05 2015-12-30 Nec Corp Unité d'affichage d'appareil électronique et appareil terminal portable comprenant une unité d'affichage
JP6424570B2 (ja) * 2014-11-04 2018-11-21 株式会社村田製作所 電子部品内蔵基板およびその製造方法
MX2018005866A (es) 2015-11-12 2018-08-15 Possehl Electronics Deutschland Gmbh Estructura conductora que tiene un componente que se aloja amortiguado contra vibraciones.
US10503209B2 (en) 2016-08-18 2019-12-10 Lenovo (Singapore) Pte. Ltd. Electronic device with structural layer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10503622A (ja) * 1994-07-29 1998-03-31 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 内部振動吸収回路物品
JP2003152356A (ja) * 2001-11-09 2003-05-23 Casio Comput Co Ltd 基板保持構造
JP2006040744A (ja) * 2004-07-28 2006-02-09 Matsushita Electric Ind Co Ltd 基板接続部材とそれを用いた三次元接続構造体並びに三次元接続構造体の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186058A (ja) * 2004-12-27 2006-07-13 Matsushita Electric Ind Co Ltd 部品内蔵モジュールとその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10503622A (ja) * 1994-07-29 1998-03-31 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー 内部振動吸収回路物品
JP2003152356A (ja) * 2001-11-09 2003-05-23 Casio Comput Co Ltd 基板保持構造
JP2006040744A (ja) * 2004-07-28 2006-02-09 Matsushita Electric Ind Co Ltd 基板接続部材とそれを用いた三次元接続構造体並びに三次元接続構造体の製造方法

Also Published As

Publication number Publication date
JPWO2008142918A1 (ja) 2010-08-05
WO2008142918A1 (fr) 2008-11-27

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