JP5340760B2 - 流体制御方法及び流体制御装置 - Google Patents
流体制御方法及び流体制御装置 Download PDFInfo
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- JP5340760B2 JP5340760B2 JP2009030366A JP2009030366A JP5340760B2 JP 5340760 B2 JP5340760 B2 JP 5340760B2 JP 2009030366 A JP2009030366 A JP 2009030366A JP 2009030366 A JP2009030366 A JP 2009030366A JP 5340760 B2 JP5340760 B2 JP 5340760B2
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- fluid
- fluid control
- acid
- control method
- concentration
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Images
Classifications
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/85—Investigating moving fluids or granular solids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/40—Static mixers
- B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
- B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
- B01F25/432—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa
- B01F25/4323—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction with means for dividing the material flow into separate sub-flows and for repositioning and recombining these sub-flows; Cross-mixing, e.g. conducting the outer layer of the material nearer to the axis of the tube or vice-versa using elements provided with a plurality of channels or using a plurality of tubes which can either be placed between common spaces or collectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/80—Forming a predetermined ratio of the substances to be mixed
- B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
- F15D—FLUID DYNAMICS, i.e. METHODS OR MEANS FOR INFLUENCING THE FLOW OF GASES OR LIQUIDS
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- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/33—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
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- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Accessories For Mixers (AREA)
- Weting (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009030366A JP5340760B2 (ja) | 2009-02-12 | 2009-02-12 | 流体制御方法及び流体制御装置 |
PCT/JP2010/051973 WO2010092985A1 (ja) | 2009-02-12 | 2010-02-10 | 流体制御方法及び流体制御装置 |
KR1020117018132A KR20110114613A (ko) | 2009-02-12 | 2010-02-10 | 유체제어방법 및 유체제어장치 |
US13/201,155 US20110315228A1 (en) | 2009-02-12 | 2010-02-10 | Fluid control method and fluid control device |
CN2010800072264A CN102316967A (zh) | 2009-02-12 | 2010-02-10 | 流体控制方法及流体控制装置 |
TW099104628A TWI494729B (zh) | 2009-02-12 | 2010-02-12 | Fluid control method and fluid control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009030366A JP5340760B2 (ja) | 2009-02-12 | 2009-02-12 | 流体制御方法及び流体制御装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010184203A JP2010184203A (ja) | 2010-08-26 |
JP2010184203A5 JP2010184203A5 (US20030204162A1-20031030-M00001.png) | 2012-02-16 |
JP5340760B2 true JP5340760B2 (ja) | 2013-11-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009030366A Expired - Fee Related JP5340760B2 (ja) | 2009-02-12 | 2009-02-12 | 流体制御方法及び流体制御装置 |
Country Status (6)
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5180263B2 (ja) * | 2010-07-23 | 2013-04-10 | 倉敷紡績株式会社 | 基板処理装置 |
JP5741056B2 (ja) * | 2011-02-25 | 2015-07-01 | 栗田工業株式会社 | ガス溶解水の製造装置 |
KR101958387B1 (ko) * | 2011-07-28 | 2019-03-20 | 주식회사 동진쎄미켐 | 근적외선 분광기를 이용한 구리막 식각 공정 제어방법 및 구리막 식각액 조성물의 재생방법 |
CN104094383A (zh) * | 2011-08-22 | 2014-10-08 | 1366科技公司 | 用于硅晶片的湿法酸化学蚀刻的制剂 |
JP5752530B2 (ja) * | 2011-08-31 | 2015-07-22 | 倉敷紡績株式会社 | 基板処理装置 |
CN102814143A (zh) * | 2012-09-13 | 2012-12-12 | 中国海洋石油总公司 | 即时混配装置 |
JP5642137B2 (ja) * | 2012-10-25 | 2014-12-17 | 日機装株式会社 | 溶液の調製装置および溶液の調製方法 |
TWI574789B (zh) * | 2012-11-13 | 2017-03-21 | 氣體產品及化學品股份公司 | 漿料供應及/或化學品摻合物供應設備、方法、使用方法及製造方法 |
US9770804B2 (en) | 2013-03-18 | 2017-09-26 | Versum Materials Us, Llc | Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture |
CN105301174B (zh) * | 2014-07-16 | 2017-07-18 | 中国科学院苏州纳米技术与纳米仿生研究所 | 用于微流控芯片的试剂滴定方法及装置、微流控芯片 |
MX2017005936A (es) * | 2014-11-07 | 2018-02-13 | Oxy Solutions As | Aparato para disolver gas en un líquido. |
SG11201805697WA (en) * | 2016-01-28 | 2018-08-30 | Clearbridge Biomedics Pte Ltd | Multi-stage target cell enrichment using a microfluidic device |
CN106249773A (zh) * | 2016-08-31 | 2016-12-21 | 张源兴 | 混合酸中单项酸检测控制装置 |
CN106841088A (zh) * | 2017-01-17 | 2017-06-13 | 西安景辉信息科技有限公司 | 一种油料水分测定仪用传感器及其实施方法 |
IL268548B1 (en) | 2017-02-06 | 2024-06-01 | E F A Eng For All Ltd | Portable digital diagnostic device |
JP6909620B2 (ja) * | 2017-04-20 | 2021-07-28 | 株式会社Screenホールディングス | 基板処理方法 |
JP7110558B2 (ja) * | 2017-09-01 | 2022-08-02 | 日産自動車株式会社 | 混合燃料供給装置及び混合燃料供給方法 |
JP6899760B2 (ja) * | 2017-12-18 | 2021-07-07 | 三菱重工機械システム株式会社 | 液体混合装置 |
JP2019158794A (ja) * | 2018-03-16 | 2019-09-19 | シスメックス株式会社 | 検体処理方法、検体処理チップおよび検体処理装置 |
CN108869410A (zh) * | 2018-06-11 | 2018-11-23 | 中国科学院工程热物理研究所 | 一种叶片以及用于叶片的流体控制方法 |
JP2020055214A (ja) * | 2018-10-02 | 2020-04-09 | 東芝テック株式会社 | 液体吐出ヘッド及びプリンタ |
CN111640661B (zh) * | 2019-03-01 | 2024-01-30 | 东京毅力科创株式会社 | 基板处理方法、基板处理装置以及存储介质 |
CN112763450A (zh) * | 2020-12-14 | 2021-05-07 | 中国原子能科学研究院 | 一种同时测定水溶液中硝酸铝和硝酸浓度的方法 |
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JP4110304B2 (ja) * | 1998-06-30 | 2008-07-02 | 株式会社フジキン | 流体制御装置および流体制御装置組立て方法 |
JP3921565B2 (ja) * | 1998-07-10 | 2007-05-30 | 株式会社フジキン | 流体制御装置 |
JP3010489B1 (ja) * | 1999-03-10 | 2000-02-21 | メルト技研株式会社 | ホットメルト剤用可変tダイ |
DE19959249A1 (de) * | 1999-12-08 | 2001-07-19 | Inst Mikrotechnik Mainz Gmbh | Modulares Mikroreaktionssystem |
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2009
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2010
- 2010-02-10 WO PCT/JP2010/051973 patent/WO2010092985A1/ja active Application Filing
- 2010-02-10 CN CN2010800072264A patent/CN102316967A/zh active Pending
- 2010-02-10 US US13/201,155 patent/US20110315228A1/en not_active Abandoned
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WO2010092985A1 (ja) | 2010-08-19 |
TW201044130A (en) | 2010-12-16 |
TWI494729B (zh) | 2015-08-01 |
KR20110114613A (ko) | 2011-10-19 |
CN102316967A (zh) | 2012-01-11 |
JP2010184203A (ja) | 2010-08-26 |
US20110315228A1 (en) | 2011-12-29 |
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