JP5337646B2 - Method for manufacturing piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric device that prevents variation in oscillation frequency. <P>SOLUTION: The method of manufacturing the piezoelectric device includes: a sealing part-step part forming process of forming, a sealing part provided to surround the outer periphery of one principal surface of an element mounting member provided with a pair of piezoelectric vibrating element mounting pads on the one principal surface, and a step part provided to surround the outer periphery more inside than the sealing part, by a photosensitive polymer material; a piezoelectric vibrating element mounting process of mounting a piezoelectric vibrating element on the pair of piezoelectric element mounting pads with a conductive adhesive; a piezoelectric vibrating element fixing process of storing the element mounting member in the inner space of a curing furnace, and heating and curing the conductive adhesive to conductively fix the piezoelectric vibrating element mounting pads and piezoelectric vibrating element; and a lid member joining process of joining a lid member and the sealing part of the element mounting member together. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric device used in an electronic apparatus or the like.

FIG. 7 is a cross-sectional view showing a conventional piezoelectric device. Hereinafter, a piezoelectric vibrator will be described as an example of a piezoelectric device.
As shown in FIG. 7, the conventional piezoelectric vibrator 300 mainly includes an element mounting member 310, a piezoelectric vibration element 320, and a lid member 330 as an example.
On one main surface of the element mounting member 310, two pairs of piezoelectric vibration element mounting pads 311 are provided.
The element mounting member 310 is made of a material made of silicon. The piezoelectric vibration element mounting pad 311 is connected to an external connection electrode terminal 312 provided on the other main surface of the element mounting member 310 via a via conductor (not shown).
On the piezoelectric vibration element mounting pads 311, a piezoelectric vibration element 320 having a pair of excitation electrodes 322 electrically connected via a conductive adhesive DS on the front and back main surfaces is mounted.
A sealing portion HB is provided on the main surface of the element mounting member 310 so as to surround the piezoelectric vibration element 320.
The lid member 330 includes a lid body 330a, a wall 330b, and a flange 330c, and a recessed space K1 is formed.
The lid member 330 is covered on the main surface of the sealing portion HB, and the flange portion 330c and the sealing portion HB are joined. Thereby, the recessed space K1 is hermetically sealed.
The step portion DB is provided inside the sealing portion HB of the element mounting member 310. The step portion DB plays a role of preventing the lid member 330 from being displaced and causing the lid member 330 to contact the piezoelectric vibration element 320 and causing the piezoelectric vibration element 320 to break (for example, Patent Documents). 1).

In addition, such a piezoelectric vibration element 320 has a lead adhesive electrode 324 extending from one side of the excitation electrode 322 provided on each of the front and back main surfaces of the piezoelectric element plate 321 and a conductive adhesive on the piezoelectric vibration element mounting pad 311. Cantilevered with DS. At this time, an end opposite to the one side on which the extraction electrode 324 is provided is a front end 323 that is a free end of the piezoelectric vibration element 320 (for example, see Patent Document 2).
The piezoelectric device 300 solves the problem of positional deviation of the lid member 330 disclosed in Patent Document 1, for example.

  In addition, the conventional piezoelectric device manufacturing method includes a piezoelectric vibration element mounting step of mounting the piezoelectric vibration element 320 on the element mounting member 310 made of silicon, and a sealing portion HB provided on the element mounting member 310 and a lid member 330. A method including a lid member joining step for joining the flange portion 330c of the other has been proposed (see, for example, Patent Document 3).

JP 2001-102891 A JP 2008-252782 A JP 2006-279872 A

However, the conventional piezoelectric device 300 is provided with the sealing portion HB and the stepped portion DB separately. This is because the sealing portion HB is made of metal and the stepped portion DB is made of an insulating resin, so that it needs to be provided separately. For this reason, the number of processes increases, which causes a decrease in productivity of the piezoelectric device 300.
In addition, since the stepped portion DB is formed by applying or printing the insulating resin in the piezoelectric device 300 manufactured in this way, the variation in the application position and the printing position of the insulating resin and the spread of the insulating resin are increased. As a result, the dimensional variation and the positional deviation of the stepped portion DB occur, the piezoelectric vibrating element 320 and the stepped portion DB come into contact with each other, and the oscillation frequency of the piezoelectric device 300 fluctuates.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a piezoelectric device that prevents fluctuations in the oscillation frequency of the piezoelectric device and improves productivity.

  The method for manufacturing a piezoelectric device of the present invention is a sealing provided so as to surround the outer periphery of one main surface of an element mounting member in which two pairs of piezoelectric vibration element mounting pads are provided on one main surface. A step of forming a sealing portion and a step portion formed of a photosensitive polymer material, and a pair of piezoelectric elements using a conductive adhesive, and a step portion provided so as to surround the inside of the sealing portion. A piezoelectric vibration element mounting process for mounting the piezoelectric vibration element on the vibration element mounting pad, and an element mounting member is accommodated in the internal space of the curing furnace, the conductive adhesive is heated and cured, and the piezoelectric vibration element mounting pad and the piezoelectric vibration element And a lid member joining step for joining the lid member and the sealing portion of the element mounting member.

  In addition, the integrated circuit element mounting step of mounting the integrated circuit element on the integrated circuit element mounting pad of the element mounting member is performed after the lid member joining step.

  According to the piezoelectric device manufacturing method of the present invention, two pairs of piezoelectric vibration element mounting pads are provided so as to surround the outer periphery of one main surface of the element mounting member provided on one main surface. Forming the sealing portion and the step portion at the same time by forming the sealing portion and the step portion provided so as to surround the inside of the sealing portion with a polymer material and the step portion forming step. Can do. Therefore, it is not necessary to provide the sealing part and the step part separately, so that the productivity of the piezoelectric device can be improved.

  Further, the photosensitive polymer material at the sealing portion and the stepped portion is exposed, and the unexposed portion other than the sealing portion and the stepped portion is developed to remove the photosensitive polymer material at the unexposed portion, and the sealing portion and Since the step portion is formed at the same time, the length of the long side of the step portion, the length of the short side of the step portion, and the thickness of the step portion can be easily adjusted. Thereby, the dimensional variation and position shift of a level difference part can be prevented. Therefore, since the piezoelectric vibration element does not come into contact with the stepped portion, fluctuations in the oscillation frequency can be prevented.

It is a disassembled perspective view which shows the piezoelectric device formed with the manufacturing method of the piezoelectric device which concerns on embodiment of this invention. It is AA sectional drawing of FIG. (A) is sectional drawing which shows the state which formed the photosensitive polymer material in the main surface of an element mounting member, (b) forms the sealing part and bump for a fulcrum from the photosensitive polymer material of (a). FIG. 6C is a cross-sectional view showing a state before the piezoelectric vibration element is mounted on the piezoelectric vibration element mounting pad via the conductive adhesive, and FIG. It is sectional drawing which shows the state which mounted the piezoelectric vibration element on the element mounting pad, and adhered the conductive adhesive, (e) is sectional drawing which shows the state which the cover member and the element mounting member joined. (A) is the perspective view which used the silicon wafer as an example which shows the sealing part and fulcrum bump formation process of the manufacturing method of the piezoelectric device of this invention, (b) is photosensitive to the silicon wafer of (a). It is the perspective view which showed the state which formed the photopolymer, (c) removed the photosensitive polymer material formed in the silicon wafer of (b), and showed the state which formed the bump part for sealing parts and fulcrum It is a perspective view. It is a disassembled perspective view which shows another example of the piezoelectric device formed with the manufacturing method of the piezoelectric device which concerns on embodiment of this invention. It is BB sectional drawing of FIG. It is sectional drawing which shows the conventional piezoelectric device.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described. In addition, the illustrated dimensions are partially exaggerated.

(First embodiment)
FIG. 1 is an exploded perspective view showing a piezoelectric device formed by a method for manufacturing a piezoelectric device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG.

In the present embodiment, a piezoelectric vibrator will be described as an example of a piezoelectric device.
As shown in FIGS. 1 and 2, the piezoelectric vibrator 100 according to the first embodiment of the present invention mainly includes an element mounting member 110, a piezoelectric vibration element 120, and a lid member 130. The piezoelectric vibrator 100 has a structure in which the piezoelectric vibration element 120 is mounted on the element mounting member 110 and is hermetically sealed by a lid member 130 provided with a recessed space K1 (see FIG. 2).

As shown in FIGS. 1 and 2, the piezoelectric vibration element 120 is formed by adhering an excitation electrode 122 to a crystal element plate 121, and an alternating voltage from the outside passes through the excitation electrode 122. When applied to 121, excitation occurs in a predetermined vibration mode and frequency.
The quartz base plate 121 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on both the front and back main surfaces of the crystal base plate 121.
Such a piezoelectric vibration element 120 includes a lead electrode 124 extending from an excitation electrode 122 attached to both main surfaces of the piezoelectric vibration element 120 and a piezoelectric vibration element described later formed on a main surface of an element mounting member 110 described later. Mounting is performed by electrically and mechanically connecting the mounting pad 111 via a conductive adhesive DS (see FIG. 2). At this time, an end opposite to the one side where the extraction electrode 124 is provided is defined as a distal end portion 123 which is a free end of the piezoelectric vibration element 120.

The element mounting member 110 shown in FIGS. 1 and 2 is made of silicon and has a flat plate shape. The element mounting member 110 includes a piezoelectric vibration element mounting pad 111, an external connection electrode terminal 112, a sealing portion HB, and a step portion DB.
A sealing portion HB of a photosensitive polymer material provided so as to surround the outer peripheral edge of one main surface of the element mounting member 110 and a collar portion 130c of the lid member 130 described later are joined.
The step portion DB is provided on one main surface of the element mounting member 110 so as to surround the inside of the sealing portion HB.
Further, the two pairs of piezoelectric vibration element mounting pads 111 are provided on the main surface of the element mounting member 110 inside the stepped portion DB provided so as to surround.
Further, two pairs of piezoelectric vibration element mounting pads 111 are provided on one main surface of the element mounting member 110, and external connection electrode terminals 112 are provided at the four corners of the other main surface of the element mounting member 110. Is provided.
The piezoelectric vibration element mounting pad 111 is connected to an external connection electrode terminal 112 provided on the other main surface of the element mounting member 110 via a via conductor (not shown).

As shown in FIG.1 and FIG.2, level | step-difference part DB is provided so that the inner side may be enclosed rather than the sealing part HB. That is, the stepped portion DB is provided outside the piezoelectric vibration element mounting pad 111 and surrounding the sealing portion HB.
Moreover, the thickness of the sealing part HB is 20-30 micrometers, for example, and the thickness of level | step-difference part DB is 35-100 micrometers, for example. That is, the thickness of the stepped portion DB is larger than the thickness of the sealing portion HB.

As shown in FIG. 2, the lid member 130 is mainly composed of a lid main body portion 130 a, a wall portion 130 b, and a flange portion 130 c, and the lid main body portion 130 a and the wall portion so as to contain the piezoelectric vibration element 120. A recess space K1 is formed by 130b.
The lid member 130 is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), silicon, or the like.
Specifically, the lid member 130 is placed on the sealing portion HB of the element mounting member 110 and is bonded to the sealing portion HB by applying a load in a thermostatic chamber in an atmosphere of 300 to 400 ° C., for example. Is done.

  The conductive adhesive DS contains conductive powder as a conductive filler in a binder such as silicone resin. Examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten ( W), platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is used. Yes.

Next, a method for manufacturing the piezoelectric device will be described with reference to FIG.
FIG. 3A is a cross-sectional view showing a state in which a photosensitive polymer material is formed on the main surface of the element mounting member, and FIG. 3B shows a sealing portion from the photosensitive polymer material of FIG. And FIG. 3C is a cross-sectional view showing a state before the piezoelectric vibration element is mounted on the piezoelectric vibration element mounting pad via the conductive adhesive. FIG. 3D is a cross-sectional view illustrating a state in which the piezoelectric vibration element is mounted on the piezoelectric vibration element mounting pad and the conductive adhesive is fixed, and FIG. 3E illustrates the lid member and the element mounting member. It is sectional drawing which shows the state joined. FIG. 4A is a perspective view using a silicon wafer as an example showing a sealing part / step difference forming step of the piezoelectric device manufacturing method of the present invention, and FIG. 4B is a perspective view of FIG. FIG. 4C is a perspective view showing a state in which a photosensitive polymer is formed on the silicon wafer of FIG. 4C, and FIG. 4C is a perspective view showing a sealing portion and a step formed by removing the photosensitive polymer material formed on the silicon wafer of FIG. It is the perspective view which showed the state which formed the part.

(Sealing / step formation process)
As shown in FIGS. 3A and 3B, the sealing portion / step difference forming step is an element made of silicon in which two pairs of piezoelectric vibration element mounting pads 111 are provided on one main surface. A photosensitive polymer material includes a sealing portion HB provided so as to surround the outer periphery of one main surface of the mounting member 110 and a step portion DB provided so as to surround the inner side of the sealing portion HB. It is a process of forming simultaneously by KP.

As shown in FIG. 3A, a photosensitive polymer material KP is printed or applied to the main surface of the element mounting member 110 made of silicon. Further, the thickness of the photosensitive polymer material KP formed on the main surface of the element mounting member 110 is made uniform by a spin coating method or the like. The thickness of the photosensitive polymer material KP at this time is, for example, 35 to 100 μm.
The photosensitive polymer material KP is made of, for example, photosensitive polyimide.
Next, the sealing portion HB and the stepped portion DB are exposed while a main surface of the element mounting member 110 is covered with a photomask (not shown), and unexposed portions other than the sealing portion HB and the stepped portion DB are developed. By doing so, the photosensitive polymer material KP in an unexposed part is removed. At this time, the thickness of the sealing portion HB is adjusted by adjusting the exposure time of the sealing portion HB.
By doing so, as shown in FIG. 3B, the sealing portion HB and the stepped portion DB are formed in the element mounting member 110. At this time, the thickness of the sealing portion HB is, for example, 20 to 30 μm, and the thickness of the stepped portion DB is, for example, 35 to 100 μm.

(Piezoelectric vibrator mounting process)
As shown in FIG. 3C, the piezoelectric vibration element mounting process is a process of mounting the piezoelectric vibration element 120 on the pair of piezoelectric vibration element mounting pads 111 by the conductive adhesive DS.

  The substrate portion 110a of the element mounting member 110 is provided with two pairs of piezoelectric vibration element mounting pads 111. A conductive adhesive DS is applied on the piezoelectric vibration element mounting pad 111, and the piezoelectric vibration element mounting is performed. The piezoelectric vibration element 120 is mounted in a form in which a lead electrode 124 extending from the excitation electrode 122 formed on the surface of the piezoelectric vibration element 120 is attached to the conductive adhesive DS applied to the pad 111.

(Piezoelectric vibration element fixing process)
As shown in FIG. 3D, the piezoelectric vibration element fixing step is a step in which the conductive adhesive DS is heated and cured, and the piezoelectric vibration element mounting pad 111 and the piezoelectric vibration element 120 are conductively fixed.

A curing furnace (not shown) includes a furnace body, a heating unit, a supply unit, and a control unit.
The furnace body has an internal space and serves to store the element mounting member 110.
The heating unit plays a role of heating the internal space to a predetermined temperature. For example, a halogen lamp or a xenon lamp is used as the heating unit.
The supply unit serves to supply gas to the internal space. For example, nitrogen is used as the gas.
The control unit controls the temperature and oxygen concentration of the internal space of the furnace body, the temperature increase rate of the heating unit, and the gas supply amount of the supply unit.
The element mounting member 110 is accommodated in a curing furnace (not shown), and the conductive adhesive DS is heated and cured by raising the temperature to about 250 ° C.

(Cover member joining process)
As shown in FIG. 3E, the lid member joining step is a step of joining the lid member 130 and the sealing portion HB of the element mounting member 110.
By putting the lid member 130 in a thermostatic bath (not shown) while applying a load, the lid member 130 and the sealing portion HB of the element mounting member 110 are joined. As a result, the inside of the recessed space K1 of the lid member 130 is hermetically sealed.

  The load applied to the lid member 130 is, for example, 9806.65N. Moreover, the temperature in a thermostat (not shown) is 300 to 400 degreeC, for example.

As shown in FIG. 4A, the element mounting member 110 may be a silicon wafer WH arranged in a matrix.
Further, as shown in FIG. 4B, when the silicon wafer WH is used, a photosensitive polymer material KP is printed or applied to the main surface of each element mounting member 110. Further, the thickness of the photosensitive polymer material KP formed on the main surface of the element mounting member 110 is made uniform by a spin coating method or the like.
Next, a main surface of the element mounting member 110 is covered with a photomask (not shown), the sealing portion HB and the stepped portion DB are exposed, and unexposed portions other than the sealing portion HB and the stepped portion DB are developed. Then, the photosensitive polymer material KP in the unexposed area is removed. By doing in this way, as shown in FIG.4 (c), the sealing part HB and level | step difference part DB are formed in each element mounting member 110. FIG.
Further, the silicon wafer WH is divided into each element mounting member 110 by a dicing blade, a laser, or the like after mounting the piezoelectric vibration element 120 on each element mounting member 110 and joining the lid member 130. By doing in this way, the some piezoelectric device 100 can be obtained.

  Thus, according to the method for manufacturing a piezoelectric device of the present invention, two pairs of piezoelectric vibration element mounting pads 111 surround the outer periphery of one main surface of the element mounting member 110 provided on one main surface. The sealing part / step part forming step of forming the sealing part HB provided in this way and the step part DB provided so as to surround the inside of the sealing part with the photosensitive polymer material KP The sealing part HB and the step part DB can be formed simultaneously. Therefore, it is not necessary to provide the sealing portion HB and the stepped portion DB separately, so that the productivity of the piezoelectric device 100 can be improved.

  Moreover, the photosensitive polymer material KP of the sealing part HB and the step part DB is exposed, and the unexposed part other than the sealing part HB and the step part DB is developed to remove the photosensitive polymer material in the unexposed part. Since the sealing portion HB and the stepped portion DB are formed simultaneously, the length of the long side of the stepped portion DB, the length of the short side of the stepped portion DB, and the thickness of the stepped portion DB can be easily adjusted. Thereby, the dimension variation and position shift of level | step-difference part DB can be prevented. Therefore, since the piezoelectric vibration element 120 does not contact the stepped portion DB, fluctuations in the oscillation frequency can be prevented.

(Second Embodiment)
Next, a piezoelectric device according to a second embodiment of the present invention will be described. A piezoelectric oscillator will be described as an example of the piezoelectric device in the present embodiment.
FIG. 5 is an exploded perspective view showing another example of the piezoelectric device formed by the piezoelectric device manufacturing method according to the embodiment of the present invention. 6 is a cross-sectional view taken along line BB in FIG. In addition, the illustrated dimensions are partially exaggerated.
In the piezoelectric device 200 according to the second embodiment of the present invention, the integrated circuit element 240 is mounted in the second recessed space K2 provided by the substrate portion 210a and the second frame portion 210c of the element mounting member 210. This is different from the first embodiment.

  As shown in FIGS. 5 and 6, the piezoelectric oscillator 200 according to the second embodiment of the present invention mainly includes an element mounting member 210, a piezoelectric vibration element 120, a lid member 130, and an integrated circuit element 240. . In the piezoelectric oscillator 200, the piezoelectric vibration element 120 is mounted on the element mounting member 210, and an integrated circuit element 240 is mounted in a second recessed space K 2 formed in the element mounting member 210. 120 is hermetically sealed by the lid member 130.

As shown in FIGS. 5 and 6, the integrated circuit element 240 is provided with an oscillation circuit or the like that generates an oscillation output from the piezoelectric vibration element 120 on the circuit formation surface, and an output signal generated by the oscillation circuit. Is output to the outside of the piezoelectric oscillator 200 via the external connection electrode terminal 212 and used as a reference signal such as a clock signal, for example.
In addition, in the integrated circuit element 240, in order to compensate the fluctuation of the oscillation frequency of the oscillation circuit due to the temperature change by applying the control voltage according to the ambient temperature to the variable capacitance element, the temperature is generated by the cubic function generating circuit and the storage element unit. A compensation circuit unit is provided, and a temperature sensor is connected to the cubic function generation circuit.
This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit.
The integrated circuit element 240 is mounted on the integrated circuit element mounting pad 213 formed on the substrate portion 210a exposed in the second recessed space K2 of the element mounting member 210 via a conductive bonding material such as solder.

As shown in FIGS. 5 and 6, the element mounting member 210 includes a substrate part 210a, a frame part 210b, a piezoelectric vibration element mounting pad 211, an external connection electrode terminal 212, an integrated circuit element mounting pad 213, a sealing member. It is mainly comprised by the stop part HB and level | step-difference part DB. The element mounting member 210 is made of silicon.
A frame portion 210b is provided on the other main surface of the substrate portion 210a of the element mounting member 210 to form a second recessed space K2.
A sealing portion HB provided so as to surround the outer periphery of one main surface of the substrate portion 210a of the element mounting member 210 and a lid member 130 described later are joined.
The step portion DB is provided on one main surface of the substrate portion 210a of the element mounting member 210 so as to surround the inside of the sealing portion HB. The step portion DB and the sealing portion HB are provided by the sealing portion / step portion forming step of the first embodiment.
The two pairs of piezoelectric vibration element mounting pads 211 are provided on the main surface of the element mounting member 210 inside the stepped portion DB provided so as to surround.
In addition, two pairs of piezoelectric vibration element mounting pads 211 are provided on one main surface of the substrate portion 210a of the element mounting member 210, and are formed at the four corners of the other main surface of the frame portion 210b of the element mounting member 210. Are provided with external connection electrode terminals 212.
As shown in FIGS. 5 and 6, a plurality of integrated circuit element mounting pads 213 and two pairs of piezoelectric vibration element measurement pads are provided on the other main surface of the substrate portion 210 a exposed in the second recess space K <b> 2. (Not shown) is formed.
The piezoelectric vibration element 120 is mounted on the piezoelectric vibration element mounting pad 111 of the element mounting member 210 by the piezoelectric vibration element mounting step of the first embodiment.
In this state, the piezoelectric vibration element fixing step of the first embodiment is performed, and the conductive adhesive DS is cured to fix the piezoelectric vibration element 120 to the piezoelectric vibration element mounting pad 211.

As shown in FIG.5 and FIG.6, level | step difference part DB is provided so that the inner side may be enclosed rather than the sealing part HB. That is, the stepped portion DB is provided outside the piezoelectric vibration element mounting pad 211 and surrounding the inside of the sealing portion HB.
Moreover, the thickness of the sealing part HB is 20-30 micrometers, for example, and the thickness of level | step-difference part DB is 35-100 micrometers, for example. That is, the thickness of the stepped portion DB is larger than the thickness of the sealing portion HB.
Further, the lid member 130 is joined to the sealing portion HB of the substrate portion 210a of the element mounting member 210 by the lid member joining step of the first embodiment. Thereafter, an integrated circuit mounting process is performed for mounting the integrated circuit element 240 on the integrated circuit element mounting pad 213 in the second recessed space K2. Thereby, a piezoelectric device having an oscillation circuit can be manufactured.

  Even when the piezoelectric device 200 according to the second embodiment of the present invention is configured as described above, the piezoelectric vibration element 120 does not contact the stepped portion DB as in the first embodiment. Variations can be prevented. In other words, the piezoelectric oscillator 200 can also be implemented.

In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, the case where quartz is used as the piezoelectric material constituting the piezoelectric vibration element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element may be used.
Further, in the present embodiment described above, the photosensitive polymer material KP of the sealing portion HB and the stepped portion DB is exposed, and unexposed portions other than the sealing portion HB and the stepped portion DB are developed, so The photosensitive polymer material was removed and the sealing portion HB and the stepped portion DB were formed at the same time. However, the photosensitive polymer material KP other than the sealing portion HB and the stepped portion DB was exposed to expose the sealing portion HB and the stepped portion. By developing the unexposed portion that becomes DB, the photosensitive polymer material at the exposed portion may be removed, and the sealing portion HB and the stepped portion DB may be formed simultaneously.

110, 210: Element mounting member 210a: Substrate part 210b: Frame part K1: Recessed space (first recessed space)
111, 211 ... Piezoelectric vibration element mounting pad 112,212 ... External connection electrode terminal 213 ... Integrated circuit element mounting pad K2 ... Second recess space 120 ... Piezoelectric vibration element 121 ... -Crystal base plate 122 ... Excitation electrode 123 ... Tip part 124 ... Lead electrode 130 ... Lid member 130a ... Lid body part 130b ... Wall part 130c ... Gutter 240- ..Integrated circuit element DS ... conductive adhesive 100, 200 ... piezoelectric device HB ... sealed portion DB ... stepped portion KP ... photosensitive polymer material

Claims (2)

A sealing portion provided so as to surround the outer periphery of one main surface of the element mounting member provided with two pairs of piezoelectric vibration element mounting pads on one main surface, and inside the sealing portion And a stepped portion forming step for forming a stepped portion provided so as to surround the photosensitive polymer material,
A piezoelectric vibration element mounting step of mounting the piezoelectric vibration element on the two pairs of piezoelectric vibration element mounting pads by a conductive adhesive;
A piezoelectric vibration element fixing step of accommodating the element mounting member in an internal space of a curing furnace, heat-curing the conductive adhesive, and conductively fixing the piezoelectric vibration element mounting pad and the piezoelectric vibration element;
A method for manufacturing a piezoelectric device, comprising: a lid member joining step for joining the lid member and the sealing portion of the element mounting member.   2. The method of manufacturing a piezoelectric device according to claim 1, wherein the integrated circuit element mounting step of mounting the integrated circuit element on the integrated circuit element mounting pad of the element mounting member is performed after the lid member bonding step.

Images