JP5307815B2 - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JP5307815B2
JP5307815B2 JP2010521026A JP2010521026A JP5307815B2 JP 5307815 B2 JP5307815 B2 JP 5307815B2 JP 2010521026 A JP2010521026 A JP 2010521026A JP 2010521026 A JP2010521026 A JP 2010521026A JP 5307815 B2 JP5307815 B2 JP 5307815B2
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JP
Japan
Prior art keywords
polishing
polishing pad
grooves
transparent window
workpiece
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JP2010521026A
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English (en)
Japanese (ja)
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JP2010536583A (ja
JP2010536583A5 (enExample
Inventor
ネウェル，ケリー
Original Assignee
キャボット マイクロエレクトロニクス コーポレイション
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Publication of JP2010536583A publication Critical patent/JP2010536583A/ja
Publication of JP2010536583A5 publication Critical patent/JP2010536583A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010521026A 2007-08-16 2008-08-13 研磨パッド Active JP5307815B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US95629307P 2007-08-16 2007-08-16
US60/956,293 2007-08-16
PCT/US2008/009687 WO2009025748A1 (en) 2007-08-16 2008-08-13 Polishing pad

Publications (3)

Publication Number Publication Date
JP2010536583A JP2010536583A (ja) 2010-12-02
JP2010536583A5 JP2010536583A5 (enExample) 2011-01-27
JP5307815B2 true JP5307815B2 (ja) 2013-10-02

Family

ID=40378437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010521026A Active JP5307815B2 (ja) 2007-08-16 2008-08-13 研磨パッド

Country Status (10)

Country Link
US (1) US20110183579A1 (enExample)
EP (1) EP2193010B1 (enExample)
JP (1) JP5307815B2 (enExample)
KR (1) KR101203789B1 (enExample)
CN (1) CN101778701B (enExample)
IL (1) IL203461A (enExample)
MY (1) MY154071A (enExample)
SG (1) SG183738A1 (enExample)
TW (1) TWI411495B (enExample)
WO (1) WO2009025748A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8047899B2 (en) * 2007-07-26 2011-11-01 Macronix International Co., Ltd. Pad and method for chemical mechanical polishing
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
JP5426469B2 (ja) * 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
CN102501187A (zh) * 2011-11-04 2012-06-20 厦门大学 区域压力调整抛光盘
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
JP2014104521A (ja) * 2012-11-26 2014-06-09 Toyo Tire & Rubber Co Ltd 研磨パッド
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
CN104044087B (zh) * 2014-06-18 2016-09-07 蓝思科技股份有限公司 一种蓝宝石抛光用铜盘及其修盘方法
CN106607749B (zh) * 2015-10-22 2019-01-22 中芯国际集成电路制造(上海)有限公司 一种阻挡型化学机械研磨垫及研磨装置
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
US20220023991A1 (en) * 2018-11-27 2022-01-27 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
KR20230161943A (ko) * 2021-03-26 2023-11-28 후지보 홀딩스 가부시키가이샤 연마 패드
JP7659172B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
JP7659171B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
CN113246015B (zh) * 2021-05-25 2022-09-20 万华化学集团电子材料有限公司 具有终点检测窗的抛光垫及其应用
CN115837633A (zh) * 2022-12-08 2023-03-24 上海芯谦集成电路有限公司 检测窗抛光垫沟槽的加工方法、抛光层及抛光垫
CN120588104B (zh) * 2025-08-08 2025-10-10 万华化学集团电子材料有限公司 抛光垫及晶圆抛光装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP2002001652A (ja) * 2000-06-22 2002-01-08 Nikon Corp 研磨パッド及び研磨装置及び素子製造方法
DE60228784D1 (de) * 2001-04-25 2008-10-23 Jsr Corp Lichtduchlässiges Polierkissen für eine Halbleiterschleife
WO2004028744A1 (en) * 2002-09-25 2004-04-08 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7442116B2 (en) * 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
JP4877448B2 (ja) * 2003-11-04 2012-02-15 Ｊｓｒ株式会社 化学機械研磨パッド
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
KR20060051345A (ko) * 2004-09-22 2006-05-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 유선형의 투시창을 구비한 씨엠피 패드
JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
KR20070018711A (ko) * 2005-08-10 2007-02-14 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 표면 요철이 감소된 창을 구비한 연마 패드
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法

Also Published As

Publication number Publication date
SG183738A1 (en) 2012-09-27
CN101778701B (zh) 2012-06-27
EP2193010B1 (en) 2020-01-08
KR101203789B1 (ko) 2012-11-21
WO2009025748A1 (en) 2009-02-26
TW200922748A (en) 2009-06-01
JP2010536583A (ja) 2010-12-02
MY154071A (en) 2015-04-30
EP2193010A1 (en) 2010-06-09
CN101778701A (zh) 2010-07-14
EP2193010A4 (en) 2013-10-16
US20110183579A1 (en) 2011-07-28
IL203461A (en) 2014-11-30
TWI411495B (zh) 2013-10-11
KR20100068255A (ko) 2010-06-22

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