CN101778701B - 抛光垫 - Google Patents

抛光垫 Download PDF

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Publication number
CN101778701B
CN101778701B CN2008801027610A CN200880102761A CN101778701B CN 101778701 B CN101778701 B CN 101778701B CN 2008801027610 A CN2008801027610 A CN 2008801027610A CN 200880102761 A CN200880102761 A CN 200880102761A CN 101778701 B CN101778701 B CN 101778701B
Authority
CN
China
Prior art keywords
polishing pad
polishing
resistance
groove
transparency window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2008801027610A
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English (en)
Chinese (zh)
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CN101778701A (zh
Inventor
凯利·纽厄尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of CN101778701A publication Critical patent/CN101778701A/zh
Application granted granted Critical
Publication of CN101778701B publication Critical patent/CN101778701B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN2008801027610A 2007-08-16 2008-08-13 抛光垫 Active CN101778701B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US95629307P 2007-08-16 2007-08-16
US60/956,293 2007-08-16
PCT/US2008/009687 WO2009025748A1 (en) 2007-08-16 2008-08-13 Polishing pad

Publications (2)

Publication Number Publication Date
CN101778701A CN101778701A (zh) 2010-07-14
CN101778701B true CN101778701B (zh) 2012-06-27

Family

ID=40378437

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801027610A Active CN101778701B (zh) 2007-08-16 2008-08-13 抛光垫

Country Status (10)

Country Link
US (1) US20110183579A1 (enExample)
EP (1) EP2193010B1 (enExample)
JP (1) JP5307815B2 (enExample)
KR (1) KR101203789B1 (enExample)
CN (1) CN101778701B (enExample)
IL (1) IL203461A (enExample)
MY (1) MY154071A (enExample)
SG (1) SG183738A1 (enExample)
TW (1) TWI411495B (enExample)
WO (1) WO2009025748A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8047899B2 (en) * 2007-07-26 2011-11-01 Macronix International Co., Ltd. Pad and method for chemical mechanical polishing
WO2011008499A2 (en) * 2009-06-30 2011-01-20 Applied Materials, Inc. Leak proof pad for cmp endpoint detection
JP5426469B2 (ja) * 2010-05-10 2014-02-26 東洋ゴム工業株式会社 研磨パッドおよびガラス基板の製造方法
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
CN102501187A (zh) * 2011-11-04 2012-06-20 厦门大学 区域压力调整抛光盘
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
JP2014104521A (ja) * 2012-11-26 2014-06-09 Toyo Tire & Rubber Co Ltd 研磨パッド
US9649742B2 (en) 2013-01-22 2017-05-16 Nexplanar Corporation Polishing pad having polishing surface with continuous protrusions
CN104044087B (zh) * 2014-06-18 2016-09-07 蓝思科技股份有限公司 一种蓝宝石抛光用铜盘及其修盘方法
CN106607749B (zh) * 2015-10-22 2019-01-22 中芯国际集成电路制造(上海)有限公司 一种阻挡型化学机械研磨垫及研磨装置
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
TWI650202B (zh) * 2017-08-22 2019-02-11 智勝科技股份有限公司 研磨墊、研磨墊的製造方法及研磨方法
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
US20220023991A1 (en) * 2018-11-27 2022-01-27 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
KR20230161943A (ko) * 2021-03-26 2023-11-28 후지보 홀딩스 가부시키가이샤 연마 패드
JP7659172B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
JP7659171B2 (ja) * 2021-03-26 2025-04-09 富士紡ホールディングス株式会社 研磨パッド
CN113246015B (zh) * 2021-05-25 2022-09-20 万华化学集团电子材料有限公司 具有终点检测窗的抛光垫及其应用
CN115837633A (zh) * 2022-12-08 2023-03-24 上海芯谦集成电路有限公司 检测窗抛光垫沟槽的加工方法、抛光层及抛光垫
CN120588104B (zh) * 2025-08-08 2025-10-10 万华化学集团电子材料有限公司 抛光垫及晶圆抛光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020020816A (ko) * 1999-08-17 2002-03-15 갤반 마틴 일체식 창을 갖는 성형된 연마 패드
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
CN1614749A (zh) * 2003-11-04 2005-05-11 Jsr株式会社 化学机械抛光垫
CN1684798A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的具有窗口的抛光垫片
KR20070018711A (ko) * 2005-08-10 2007-02-14 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 표면 요철이 감소된 창을 구비한 연마 패드

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
JP2002001652A (ja) * 2000-06-22 2002-01-08 Nikon Corp 研磨パッド及び研磨装置及び素子製造方法
DE60228784D1 (de) * 2001-04-25 2008-10-23 Jsr Corp Lichtduchlässiges Polierkissen für eine Halbleiterschleife
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
JP4877448B2 (ja) * 2003-11-04 2012-02-15 Ｊｓｒ株式会社 化学機械研磨パッド
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US7182670B2 (en) * 2004-09-22 2007-02-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a streamlined windowpane
KR20060051345A (ko) * 2004-09-22 2006-05-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 유선형의 투시창을 구비한 씨엠피 패드
JP4620501B2 (ja) * 2005-03-04 2011-01-26 ニッタ・ハース株式会社 研磨パッド
JP2007118106A (ja) * 2005-10-26 2007-05-17 Toyo Tire & Rubber Co Ltd 研磨パッド及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020020816A (ko) * 1999-08-17 2002-03-15 갤반 마틴 일체식 창을 갖는 성형된 연마 패드
CN1684798A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的具有窗口的抛光垫片
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
CN1614749A (zh) * 2003-11-04 2005-05-11 Jsr株式会社 化学机械抛光垫
KR20070018711A (ko) * 2005-08-10 2007-02-14 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 표면 요철이 감소된 창을 구비한 연마 패드

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-159340A 2005.06.16

Also Published As

Publication number Publication date
SG183738A1 (en) 2012-09-27
EP2193010B1 (en) 2020-01-08
KR101203789B1 (ko) 2012-11-21
WO2009025748A1 (en) 2009-02-26
TW200922748A (en) 2009-06-01
JP2010536583A (ja) 2010-12-02
MY154071A (en) 2015-04-30
EP2193010A1 (en) 2010-06-09
CN101778701A (zh) 2010-07-14
EP2193010A4 (en) 2013-10-16
US20110183579A1 (en) 2011-07-28
IL203461A (en) 2014-11-30
TWI411495B (zh) 2013-10-11
KR20100068255A (ko) 2010-06-22
JP5307815B2 (ja) 2013-10-02

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SE01 Entry into force of request for substantive examination
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Address after: Illinois, USA

Patentee after: CMC Materials Co.,Ltd.

Address before: Illinois, USA

Patentee before: CABOT MICROELECTRONICS Corp.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Illinois, America

Patentee after: CMC Materials Co.,Ltd.

Address before: Illinois, America

Patentee before: CMC Materials Co.,Ltd.

CP01 Change in the name or title of a patent holder