JP5296313B2 - 集積回路 - Google Patents
集積回路 Download PDFInfo
- Publication number
- JP5296313B2 JP5296313B2 JP2006518914A JP2006518914A JP5296313B2 JP 5296313 B2 JP5296313 B2 JP 5296313B2 JP 2006518914 A JP2006518914 A JP 2006518914A JP 2006518914 A JP2006518914 A JP 2006518914A JP 5296313 B2 JP5296313 B2 JP 5296313B2
- Authority
- JP
- Japan
- Prior art keywords
- voltage
- island
- integrated circuit
- supply power
- voltage island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000000926 separation method Methods 0.000 claims description 25
- 238000009826 distribution Methods 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 11
- 238000004891 communication Methods 0.000 claims description 9
- 239000000872 buffer Substances 0.000 claims description 8
- 208000035795 Hypocalcemic vitamin D-dependent rickets Diseases 0.000 description 50
- 208000033584 type 1 vitamin D-dependent rickets Diseases 0.000 description 50
- 238000002955 isolation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Description
Claims (9)
- 集積回路に設けられた電圧アイランドを備え、
前記電圧アイランドが、
前記電圧アイランドに供給される第1の供給電力を受け取り前記電圧アイランド内で使用する第2の供給電力を生じるスイッチング要素と、
前記スイッチング要素に接続され、前記第2の供給電力を前記電圧アイランド内に分配する電力分配ネットワークと、
前記電圧アイランドへの入力データを電圧シフトまたは分離する第1の電圧シフト・分離手段と、
前記電圧アイランドからの出力データを電圧シフトまたは分離する第2の電圧シフト・分離手段とを有する、集積回路。 - 前記第1の供給電力及び前記第2の供給電力が、前記第1の電圧シフト・分離手段及び前記第2の電圧シフト・分離手段に供給される、請求項1に記載の集積回路。
- 前記第1の電圧シフト・分離手段及び前記第2の電圧シフト・分離手段との間に第1の論理回路、状態保存ラッチ及び第2の論理回路が接続されており、前記第1の論理回路及び前記第2の論理回路に前記第2の供給電力が供給され、前記状態保存ラッチに前記第1の供給電力及び前記第2の供給電力が供給される、請求項2に記載の集積回路。
- 前記電圧アイランド外にある第3の論理回路及び第4の論理回路相互間を接続する信号ラインが前記電圧アイランド内に設けられ、前記信号ライン上の信号レベルを増大する電圧バッファが前記電圧アイランドに設けられ、前記電圧バッファに前記第1の供給電圧が供給される、請求項1に記載の集積回路。
- 集積回路に設けられた電圧アイランドと、
前記集積回路のうち前記電圧アイランドとは別の場所に設けられた電力管理状態デバイスを備え、
前記電圧アイランドが、
前記電圧アイランドに供給される第1の供給電力を受け取り前記電圧アイランド内で使用する第2の供給電力を生じるスイッチング要素と、
前記スイッチング要素に接続され、前記第2の供給電力を前記電圧アイランド内に分配する電力分配ネットワークと、
前記電圧アイランドへの入力データを電圧シフトまたは分離する第1の電圧シフト・分離手段と、
前記電圧アイランドからの出力データを電圧シフトまたは分離する第2の電圧シフト・分離手段と、
前記第1の電圧シフト・分離手段及び前記第2の電圧シフト・分離手段との間に接続された第1の論理回路、状態保存ラッチ及び第2の論理回路とを備え、
前記第1の論理回路及び前記第2の論理回路に前記第2の供給電力が供給され、
前記状態保存ラッチに前記第1の供給電力及び前記第2の供給電力が供給され、
前記電力管理状態デバイスからのFENCEN制御信号の第1状態に応答して、前記第1の電圧シフト・分離手段及び前記第2の電圧シフト・分離手段が、前記電圧アイランドと前記集積回路との間のデータ入力通信及びデータ出力通信をディスエーブルし、
前記電力管理状態デバイスからのFENCEN制御信号の第2状態に応答して、前記第1の電圧シフト・分離手段及び前記第2の電圧シフト・分離手段が、前記電圧アイランドと前記集積回路との間のデータ入力通信及びデータ出力通信を確立する、集積回路。 - 前記第1の供給電力及び前記第2の供給電力が、前記第1の電圧シフト・分離手段及び前記第2の電圧シフト・分離手段に供給される、請求項5に記載の集積回路。
- 前記集積回路のうち前記電圧アイランドとは別の場所に設けられた第3の論理回路及び第4の論理回路相互間を接続する信号ラインが前記電圧アイランド内に設けられ、前記信号ライン上の信号レベルを増大する電圧バッファが前記電圧アイランドに設けられ、前記電圧バッファに前記第1の供給電圧が供給される、請求項5に記載の集積回路。
- 前記電力管理状態デバイスからのDISABLE制御信号の第1状態に応答して、前記スイッチング要素が前記第2の供給電力を前記第1の供給電力から切断し、
前記電力管理状態デバイスからのDISABLE制御信号の第2状態に応答して、前記スイッチング要素が前記第2の供給電力を前記第1の供給電力に結合する、請求項5に記載の集積回路。 - 前記電力管理状態デバイスからのFENCEN制御信号の第1状態に応答して、前記状態保存ラッチが該ラッチの状態を保存し、
前記電力管理状態デバイスからのFENCEN制御信号の第2状態に応答して、前記状態保存ラッチが復元する、請求項5に記載の集積回路。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/604,277 US7131074B2 (en) | 2003-07-08 | 2003-07-08 | Nested voltage island architecture |
US10/604,277 | 2003-07-08 | ||
PCT/US2004/021943 WO2005008725A2 (en) | 2003-07-08 | 2004-07-08 | Nested voltage island architecture |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007531244A JP2007531244A (ja) | 2007-11-01 |
JP5296313B2 true JP5296313B2 (ja) | 2013-09-25 |
Family
ID=33564147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006518914A Expired - Fee Related JP5296313B2 (ja) | 2003-07-08 | 2004-07-08 | 集積回路 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7131074B2 (ja) |
EP (1) | EP1649493B1 (ja) |
JP (1) | JP5296313B2 (ja) |
KR (1) | KR100827056B1 (ja) |
CN (1) | CN100592302C (ja) |
WO (1) | WO2005008725A2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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US7000214B2 (en) * | 2003-11-19 | 2006-02-14 | International Business Machines Corporation | Method for designing an integrated circuit having multiple voltage domains |
US7589584B1 (en) * | 2005-04-01 | 2009-09-15 | Altera Corporation | Programmable voltage regulator with dynamic recovery circuits |
JP4846272B2 (ja) * | 2005-06-07 | 2011-12-28 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
JP4621113B2 (ja) * | 2005-10-28 | 2011-01-26 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
US7705626B2 (en) * | 2006-08-02 | 2010-04-27 | International Business Machines Corporation | Design structure to eliminate step response power supply perturbation |
US7511528B2 (en) * | 2006-08-02 | 2009-03-31 | International Business Machines Corporation | Device and method to eliminate step response power supply perturbation |
CN101593741A (zh) * | 2009-04-22 | 2009-12-02 | 上海宏力半导体制造有限公司 | 片上系统芯片 |
EP2293330B1 (en) * | 2009-09-08 | 2017-06-07 | OCT Circuit Technologies International Limited | On-chip power switches implementation. |
US8502590B2 (en) | 2009-12-14 | 2013-08-06 | The Boeing Company | System and method of controlling devices operating within different voltage ranges |
US8810224B2 (en) * | 2011-10-21 | 2014-08-19 | Qualcomm Incorporated | System and method to regulate voltage |
US9172373B2 (en) * | 2013-09-06 | 2015-10-27 | Globalfoundries U.S. 2 Llc | Verifying partial good voltage island structures |
KR101538458B1 (ko) | 2014-01-03 | 2015-07-23 | 연세대학교 산학협력단 | 3차원 매니코어 프로세서를 위한 전압섬 형성 방법 |
US9570374B2 (en) * | 2014-01-03 | 2017-02-14 | Rockwell Automation Technologies, Inc. | Systems and methods for coupling a semiconductor device of an automation device to a heat sink |
US10812081B1 (en) * | 2019-09-27 | 2020-10-20 | Apple Inc. | Output signal control during retention mode operation |
CN115004366A (zh) * | 2020-01-23 | 2022-09-02 | 华为技术有限公司 | 一种芯片装置和无线通信装置 |
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US3021842A (en) * | 1958-11-05 | 1962-02-20 | John F Flood | Hypodermic needle guide |
US3582214A (en) * | 1969-10-31 | 1971-06-01 | James W Loomis | Tool alignment apparatus and method |
US4000948A (en) * | 1975-07-14 | 1977-01-04 | Miller C Frederick | Target method and systems for bonding machines |
US4651732A (en) * | 1983-03-17 | 1987-03-24 | Frederick Philip R | Three-dimensional light guidance system for invasive procedures |
US4571243A (en) * | 1983-05-18 | 1986-02-18 | Edward C. Froning | Needle guidance system |
US5300080A (en) * | 1991-11-01 | 1994-04-05 | David Clayman | Stereotactic instrument guided placement |
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US6041249A (en) * | 1997-03-13 | 2000-03-21 | Siemens Aktiengesellschaft | Device for making a guide path for an instrument on a patient |
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US6308307B1 (en) * | 1998-01-29 | 2001-10-23 | Texas Instruments Incorporated | Method for power routing and distribution in an integrated circuit with multiple interconnect layers |
US6480989B2 (en) * | 1998-06-29 | 2002-11-12 | Lsi Logic Corporation | Integrated circuit design incorporating a power mesh |
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JP2001110184A (ja) * | 1999-10-14 | 2001-04-20 | Hitachi Ltd | 半導体装置 |
US6615395B1 (en) * | 1999-12-20 | 2003-09-02 | International Business Machines Corporation | Method for handling coupling effects in static timing analysis |
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US6631502B2 (en) * | 2002-01-16 | 2003-10-07 | International Business Machines Corporation | Method of analyzing integrated circuit power distribution in chips containing voltage islands |
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JP4493597B2 (ja) * | 2003-11-05 | 2010-06-30 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Iddq電流測定のためのホット・スイッチ可能な電圧バス |
-
2003
- 2003-07-08 US US10/604,277 patent/US7131074B2/en not_active Expired - Lifetime
-
2004
- 2004-07-08 EP EP04777801.4A patent/EP1649493B1/en not_active Expired - Lifetime
- 2004-07-08 WO PCT/US2004/021943 patent/WO2005008725A2/en active Application Filing
- 2004-07-08 CN CN200480019236A patent/CN100592302C/zh not_active Expired - Fee Related
- 2004-07-08 JP JP2006518914A patent/JP5296313B2/ja not_active Expired - Fee Related
- 2004-07-08 KR KR1020067000054A patent/KR100827056B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1649493A2 (en) | 2006-04-26 |
WO2005008725A2 (en) | 2005-01-27 |
KR100827056B1 (ko) | 2008-05-02 |
US7131074B2 (en) | 2006-10-31 |
WO2005008725A3 (en) | 2006-11-23 |
CN100592302C (zh) | 2010-02-24 |
US20050010887A1 (en) | 2005-01-13 |
KR20060034270A (ko) | 2006-04-21 |
CN101142576A (zh) | 2008-03-12 |
EP1649493A4 (en) | 2010-04-14 |
JP2007531244A (ja) | 2007-11-01 |
EP1649493B1 (en) | 2016-03-16 |
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